KR860007850A - 접합 마스크와 금속 사이에서 개량된 접착성을 갖는 프린트 배선판 - Google Patents

접합 마스크와 금속 사이에서 개량된 접착성을 갖는 프린트 배선판 Download PDF

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Publication number
KR860007850A
KR860007850A KR1019860000950A KR860000950A KR860007850A KR 860007850 A KR860007850 A KR 860007850A KR 1019860000950 A KR1019860000950 A KR 1019860000950A KR 860000950 A KR860000950 A KR 860000950A KR 860007850 A KR860007850 A KR 860007850A
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KR
South Korea
Prior art keywords
wiring board
printed wiring
semi
copolymer
metal
Prior art date
Application number
KR1019860000950A
Other languages
English (en)
Inventor
링 콩 훙 폴
제임스 라디간 리차드
스코트 로젠 데이빗
Original Assignee
골든시 앤드류스
엠 앤드 티 케미칼즈 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 골든시 앤드류스, 엠 앤드 티 케미칼즈 인코포레이티드 filed Critical 골든시 앤드류스
Publication of KR860007850A publication Critical patent/KR860007850A/ko

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/224—Anti-weld compositions; Braze stop-off compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0577—Double layer of resist having the same pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0759—Forming a polymer layer by liquid coating, e.g. a non-metallic protective coating or an organic bonding layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31692—Next to addition polymer from unsaturated monomers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31692—Next to addition polymer from unsaturated monomers
    • Y10T428/31696—Including polyene monomers [e.g., butadiene, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31692—Next to addition polymer from unsaturated monomers
    • Y10T428/31699—Ester, halide or nitrile of addition polymer

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Paints Or Removers (AREA)

Abstract

내용 없음

Description

접합 마스크와 금속 사이에서 개량된 접착성을 갖는 프린트 배선판
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (11)

  1. 금속을 포함한 기재상에서 자외선 경화성 접합마스크 피막을 갖는 프린트 배선판의 제조방법에 있어서, 마스크와 금속사이에서 개량된 접착성을 갖는 이러한 판을 제조할 수 있는 단계가, 0.01-10중량%의 카르복실-함유, 폴리아크릴산 중합체, 에틸렌-말레산 공중합체 또는 이의 반-산 에스테르, 부타디엔-말레산공중합체 또는 이의 반-산 에스티르와 스티렌-말레산공중합 또는 이의 반-산 에스테르로 부터 선택한 중합체 또는 공중합체를 함유하는 수용액으로 상기 기재에 프리마 필름을 형성시킴을 특징으로 하는 프린트 배선판의 제조방법.
  2. 제1항에 있어서, 접착이 접착용 IPC-SM-840A 클라스 3스탠다드로 이루어짐을 특징으로 하는 제조방법.
  3. 제1항에 있어서, 상기 용액에 판을 침지시키고 회수하여 공기로 건조시켜서 프리마 필름을 제조함을 특징으로 하는 제조방법.
  4. 제1항에 있어서, 자외선 경화성피막이 우레탄 아크릴레이트 또는 에폭시아크릴레이트임을 특징으로 하는 제조방법.
  5. 제1항에 있어서, 상기 용액이 0.025-1중량%의 상기 중합체 또는 공중합체를 함유함을 특징으로 하는 제조방법.
  6. 제1항에 있어서, 상기 공중합체가 부타디엔-말레산 공중합체 또는 이의 반-산 에스테르임을 특징으로 하는 제조방법.
  7. 마스크와 금속사이에 우수한 접착성을 나타내는 프린트 배선판이, (a) 금속을 포함한 기재 (b) 0.01-10중량 %의 카르복실-함유, 폴리아크릴산 중합체, 에틸렌-말레산공중합체 또는 이의 반-산에스테르, 부타디엔-말레산 공중합체 또는 이의 반-산 에스테르와 스티렌-말레산 공중합체 또는 이의 반-산 에스테르로 부터 선택한 중합체 또는 공중합체를 함유하는 수용액으로 부터 생성된 상기 기재상의 프리마 필름으로 이루어짐을 특징으로 하는 프린트 배선판.
  8. 제7항에 있어서, 판이 접착용 IPC-SM-840A-클라스 3스탠다드로 접합됨을 특징으로 하는 프린트 배선판.
  9. 제7항에 있어서, 자외선 경화성 피막이 우레탄 아크릴레이트 또는 에폭시 아크릴레이트 임을 특징으로하는 프린트 배선판.
  10. 제7항에 있어서, 금속이 구리, 주석, 주석-납, 주석-니켈, 금 또는 니켈임을 특징으로 하는 프린트 배선판.
  11. 제7항에 있어서, 상기 공중합체가 부타디엔-말레산 공중합체 또는 이의 반-산 에스테르임을 특징으로 하는 프린트 배선판.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019860000950A 1985-03-15 1986-02-12 접합 마스크와 금속 사이에서 개량된 접착성을 갖는 프린트 배선판 KR860007850A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/712,308 US4615950A (en) 1985-03-15 1985-03-15 Printed circuit boards having improved adhesion between solder mask and metal
US712308 1985-03-15

Publications (1)

Publication Number Publication Date
KR860007850A true KR860007850A (ko) 1986-10-17

Family

ID=24861589

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019860000950A KR860007850A (ko) 1985-03-15 1986-02-12 접합 마스크와 금속 사이에서 개량된 접착성을 갖는 프린트 배선판

Country Status (8)

Country Link
US (1) US4615950A (ko)
EP (1) EP0194653A3 (ko)
JP (1) JPS61234593A (ko)
KR (1) KR860007850A (ko)
AU (1) AU578202B2 (ko)
CA (1) CA1268670A (ko)
DE (1) DE194653T1 (ko)
PH (1) PH22906A (ko)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4713298A (en) * 1985-03-15 1987-12-15 M&T Chemicals Inc. Printed circuit boards having improved adhesion between solder mask and metal
EP0315343A1 (en) * 1987-10-21 1989-05-10 Coates Brothers PLC Solder masks
GB9425030D0 (en) 1994-12-09 1995-02-08 Alpha Metals Ltd Silver plating
GB9425031D0 (en) * 1994-12-09 1995-02-08 Alpha Metals Ltd Printed circuit board manufacture
MY129788A (en) * 1996-01-25 2007-04-30 Innovia Films Ltd Printable film.
US6905587B2 (en) 1996-03-22 2005-06-14 Ronald Redline Method for enhancing the solderability of a surface
EP1796446B1 (en) 1996-11-20 2011-05-11 Ibiden Co., Ltd. Printed circuit board
FR2809406B1 (fr) * 2000-05-29 2006-02-17 Von Roll Isola France S A Materiaux composites flexibles, isolants et thermiquement stables constitues d'un support impregne d'une resine acrylique
EP2227926A1 (en) * 2007-12-04 2010-09-15 E. I. du Pont de Nemours and Company Bendable circuit structure for led mounting and interconnection

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US889027A (en) * 1907-04-02 1908-05-26 Fredrick Alanson Magwire Straw-chute and draft appliance.
US2978356A (en) * 1958-03-18 1961-04-04 Gen Aniline & Film Corp Laminated structure and process for preparing same
BE612386A (ko) * 1961-01-09
US3447460A (en) * 1966-07-28 1969-06-03 Dow Chemical Co Process for making laminated printing plates
US3620878A (en) * 1968-07-26 1971-11-16 Grace W R & Co Bonding with ethylene copolymer adhesive and adhesion promoting agent
UST889027I4 (en) 1970-11-20 1971-08-31 Defensive publication
US3749637A (en) * 1971-01-20 1973-07-31 Du Pont Laminates containing cross-linked ethylene/carboxylic acid copolymer adhesives
JPS4983501A (ko) * 1972-12-18 1974-08-12
DE2300371C3 (de) * 1973-01-05 1979-04-19 Basf Ag, 6700 Ludwigshafen Photopolymerisierbare Druckplatte für den Flexodruck
CA1035889A (en) * 1973-10-13 1978-08-01 Tsutomu Watanabe Flexible adhesive composition and method for utilizing same
DE2448850C2 (de) * 1974-10-14 1986-03-13 Hoechst Ag, 6230 Frankfurt Verfahren zum Übertragen einer trockenen thermoplastischen photopolymerisierbaren Schicht und Schichtübertragungsmaterial
CH623664A5 (ko) * 1977-04-18 1981-06-15 Alusuisse
DE3114931A1 (de) * 1981-04-13 1982-10-28 Hoechst Ag, 6000 Frankfurt Durch strahlung polymerisierbares gemisch und daraus hergestelltes photopolymerisierbares kopiermaterial
JPS59201044A (ja) * 1983-04-28 1984-11-14 Japan Synthetic Rubber Co Ltd 耐熱性フイルムホトレジスト積層物
AU3118784A (en) * 1984-02-23 1985-08-29 W.R. Grace & Co. Acrylate-capped polyurethane use as solder mask

Also Published As

Publication number Publication date
DE194653T1 (de) 1987-03-19
EP0194653A2 (en) 1986-09-17
US4615950A (en) 1986-10-07
EP0194653A3 (en) 1989-07-26
PH22906A (en) 1989-01-24
AU5480186A (en) 1986-09-18
AU578202B2 (en) 1988-10-13
CA1268670A (en) 1990-05-08
JPS61234593A (ja) 1986-10-18

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