KR850003103A - 인쇄회로용 금속성 지지물 및 이의 제조방법 - Google Patents

인쇄회로용 금속성 지지물 및 이의 제조방법 Download PDF

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Publication number
KR850003103A
KR850003103A KR1019840006672A KR840006672A KR850003103A KR 850003103 A KR850003103 A KR 850003103A KR 1019840006672 A KR1019840006672 A KR 1019840006672A KR 840006672 A KR840006672 A KR 840006672A KR 850003103 A KR850003103 A KR 850003103A
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South Korea
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support
heat
necessary
resins
resin
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KR1019840006672A
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KR920002967B1 (ko
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까샹 로베르뜨
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로제르 리오쁘레이
롱-쁠랑 르쎄르쎄
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Publication of KR850003103A publication Critical patent/KR850003103A/ko
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Publication of KR920002967B1 publication Critical patent/KR920002967B1/ko

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H05K3/387—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0236—Plating catalyst as filler in insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/0245—Flakes, flat particles or lamellar particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/0284—Paper, e.g. as reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/0293—Non-woven fibrous reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1157—Using means for chemical reduction
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/125—Inorganic compounds, e.g. silver salt
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/256—Heavy metal or aluminum or compound thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Other Resins Obtained By Reactions Not Involving Carbon-To-Carbon Unsaturated Bonds (AREA)
  • Epoxy Resins (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

내용 없음

Description

인쇄회로용 금속성 지지물 및 이의 제조방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (9)

  1. 기본적으로 셀루로오즈성 섬유물질 및/또는 운모 플레이크로 구성되어 있는 중심코어와, 필요한 경우 불활성 충전제를 함유하는 열 고정수지를 화합하고, 이들 표면의 일면 또는 양면상에 열고정수지 조성물로 부터 수득된 하나 이상의 층이 비전도성 금속 산화물로 충만되고 산화도를 선택하여서 브로하이드라이드로 쉽게 환원을 허용하게 하며 또한 중간체로써 불안정한 금속 수산화물을 형성할 수 있는 것을 특징으로 하는, 인쇄회로의 제조에 의도되며 환원처리한 다음 필요한 경우 전해 방법에 의한 금속화로 금속화될 수 있는 지지물.
  2. 제1항에 있어서, 중심부분에 사용된 열고정 수지가 노볼락 형태의 페놀성 수지인 지지물.
  3. 제1항에 있어서, 외층 또는 층의 열고정 수지가 페놀성 수지, 에폭시 수지, 및 이미드그룹을 함유하는 예비 중합체에서 수득된 수지들로 구성되어 있는 것들로부터 선택되는 지지물.
  4. 제3항에 있어서, 외층 또는 층이 셀루로오즈성 구공지지물로 보강된 열고정 수지로 구성되어 있는 지지물.
  5. 제1항 또는 3항에 있어서, 외층 또는 층의 열고정수지가 이미드그룹을 함유하는 예비중합체로 부터 수득되는 지지물.
  6. 제1항에 있어서, 비 전도성 금속 산화물이 산화제일동인 지지물.
  7. 분말 형태의 경화성수지, 필요한 경우 불활성 분쇄충전제와 함께 셀루로오즈성 섬유 및/또는 운모플레이크로 수성 분산액을 제조한 다음 물의 제거, 일광프레싱 및 건조에 의해 쉬이트를 형성하고, 도포, 분무 또는 도포된 셀루로오즈성 지지물의 석출로 일면 또는 양면상에 이들을 석출하고, 최종적으로 이 전체를 70 내지 250℃사이의 온도에서 10내지 100㎫압력하에서 압축하는 것을 특징으로 하는 지지물의 수득방법.
  8. 셀루로오즈성 섬유 및/또는 운모 플레이크로 제조되며 또한 분말형태의 노볼락 형태의 페놀성 수지, 필요한 경우 불활성 분쇄 충전제, 헥사메틸렌테트라민을 함유하는 상기 수지로 수성 분산액을 제조한 다음 물의 제거, 일광프레싱 및 건조에 의해 쉬이트를 형성하고 또한 비전도성 금속산화로 충만된 열 고정수지 조성물을 도포, 분무 또는 도포된 셀루로오즈성 지지물의 석출로 일면 또는 양면상에 석출하는 것을 특징으로 하는 지지물의 수득방법.
  9. 금속성 지지물을 알카리 금속 보로하이드라이드로 환원처리한 다음 필요한 경우 전해방법애 의해 금속화로 기계적 및/또는 화학적 스트립팅 처리를 수행하는 것을 특징으로 하는 금속화된 지지물.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019840006672A 1983-10-28 1984-10-26 인쇄 회로용 금속화성(metallizable) 기판 및 이의 제조방법 KR920002967B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FR83-17507 1983-10-28
FR83/17507 1983-10-28
FR8317507A FR2554303B1 (fr) 1983-10-28 1983-10-28 Substrats metallisables pour circuits imprimes et leur procede de preparation

Publications (2)

Publication Number Publication Date
KR850003103A true KR850003103A (ko) 1985-05-28
KR920002967B1 KR920002967B1 (ko) 1992-04-11

Family

ID=9293762

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019840006672A KR920002967B1 (ko) 1983-10-28 1984-10-26 인쇄 회로용 금속화성(metallizable) 기판 및 이의 제조방법

Country Status (8)

Country Link
US (2) US4714653A (ko)
EP (1) EP0145613B1 (ko)
JP (1) JPS60126888A (ko)
KR (1) KR920002967B1 (ko)
AT (1) ATE48061T1 (ko)
CA (1) CA1237561A (ko)
DE (1) DE3480513D1 (ko)
FR (1) FR2554303B1 (ko)

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FR2685363B1 (fr) * 1991-12-24 1994-02-04 Rhone Poulenc Fibres Papiers synthetiques a base de fibres, pulpe et liant thermostables et leur procede d'obtention.
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WO2020131678A1 (en) 2018-12-19 2020-06-25 Lubrizol Advanced Materials, Inc. Cleansing composition and method
JP2022525320A (ja) 2019-03-14 2022-05-12 ルブリゾル アドバンスド マテリアルズ， インコーポレイテッド 増強ケイ素沈着組成物およびそのための方法

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Also Published As

Publication number Publication date
KR920002967B1 (ko) 1992-04-11
US4714653A (en) 1987-12-22
ATE48061T1 (de) 1989-12-15
EP0145613B1 (fr) 1989-11-15
EP0145613A1 (fr) 1985-06-19
US4799996A (en) 1989-01-24
JPS60126888A (ja) 1985-07-06
FR2554303A1 (fr) 1985-05-03
FR2554303B1 (fr) 1986-04-18
DE3480513D1 (en) 1989-12-21
CA1237561A (fr) 1988-06-07

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