KR840007042A - 합성 운모 제품 - Google Patents
합성 운모 제품 Download PDFInfo
- Publication number
- KR840007042A KR840007042A KR1019840000366A KR840000366A KR840007042A KR 840007042 A KR840007042 A KR 840007042A KR 1019840000366 A KR1019840000366 A KR 1019840000366A KR 840000366 A KR840000366 A KR 840000366A KR 840007042 A KR840007042 A KR 840007042A
- Authority
- KR
- South Korea
- Prior art keywords
- mica
- mentioned
- lithium
- thermal expansion
- platelets
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- D—TEXTILES; PAPER
- D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
- D21H—PULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
- D21H13/00—Pulp or paper, comprising synthetic cellulose or non-cellulose fibres or web-forming material
- D21H13/36—Inorganic fibres or flakes
- D21H13/38—Inorganic fibres or flakes siliceous
- D21H13/44—Flakes, e.g. mica, vermiculite
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0275—Fibers and reinforcement materials
- H05K2201/0293—Non-woven fibrous reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/901—Printed circuit
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
- Y10T428/251—Mica
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2911—Mica flake
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
- Y10T428/31515—As intermediate layer
- Y10T428/31518—Next to glass or quartz
Landscapes
- Inorganic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Laminated Bodies (AREA)
- Paper (AREA)
- Insulating Bodies (AREA)
- Silicates, Zeolites, And Molecular Sieves (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Reinforced Plastic Materials (AREA)
- Organic Insulating Materials (AREA)
- Compositions Of Oxide Ceramics (AREA)
- Inorganic Insulating Materials (AREA)
Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
Claims (12)
- 주로 합성, 리튬 및/또는 나트륨, 수팽윤운모의 중첩, 이온-교환된 소판(여기서 운모로부터의 리튬 및/또는 나트륨이온은 더 큰 양이온과 교환된다)으로 이루어지고, 운모소판과 수지를 위한 커플링제가 함유된 유기수지로 함침되어 있으며, 이것을 적층시켜 X-Y평 면에서의 열팽창의 평면 등방성 계수를 갖는 적 층판으로 제조할 수 있는 운모종이.
- 제1항에 있어서, 언급된 함침수지가 함침된 종이의 15내지 75%, 바람직하게는 20내지 50%임을 특징으로 하는 종이.
- 제1항 또는 제2항에 있어서, 언급된 운모가 플루오르헥토라이트, 히드록실헥토라이트, 붕소플루오르플로고파이트, 히드록실 붕소 플로고파이트, 및 이들 및 이들과 탈크, 플루오르탈크, 폴리리티오나이트, 플루오르폴리티나이트, 플로고파이트 및 플루오르플로고파이트로부터 선택되는 다른 구조적으로 적합한 종류간의 고용체로 부터 선택됨을 특징으로 하는 운모종이.
- 제3항에 있어서, 운모소판은 리튬 및/또는 나트륨 결정으로 이루어지며, 리튬 및/ 또는 나트륨이온을 칼륨이온으로 거의 교환시켜 운모를 화학적으로 안정화시킴을 특징으로 하는 운모종이.
- 제1항 내지 제4항중 어느 하나에 있어서, 언급된 운모소판이 100이상의 종횡비를 가짐을 특징으로 하는 운모종이.
- 제1항 내지 제5항중 어느 하나에 있어서, 다수의 언급된 운모종이를 응고시킨 기핀과 이의 표면상에 취부되는 1개 이상의 칩-지지체들로 이루어진 인쇄회로 조성품에 사용되는 운모종이.
- 합성, 리튬 및/또는 나트륨, 수-팽윤운모의 중첩, 이온교환된 소판으로 이루어지며, 유기수지로 함침된 다수의 운모종이를 응고시킨 기판(여기서, 기판은 X-Y 평면에서의 열팽창의 평면등방성 계수를 갖는다)과 이의 표면상에 취부되는 1개이상의 칩 지지체들로 이루어짐을 특징으로 하는 인쇄회, 조성품.
- 제7항에 있어서, 기판 열팽창계수와 칩-지체열 팽창계수의 차이가 15유니트이하임을 특징으로 하는 조성물.
- 제7항 도는 8항에 있어서, 언급된, -지지체가 주로 알루미나로 이루어짐을 특징으로 하는 조성물.
- 제7항 내지 9항중 어느 하나에 있어서, 언급된 기판의 열팽창 계수가 65내지 80 ×10-7/℃임을 특징으로 하는 조성품.
- 제7항 내지 제9항중 어느 하나에 있어서, 1개 이상의 홀을 기판을 관통하여 제조하고, 홀벽을 금속화시킴을 특징으로 하는 조성물.
- ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US461566 | 1983-01-27 | ||
US06/461,566 US4559264A (en) | 1983-01-27 | 1983-01-27 | Synthetic mica products |
Publications (1)
Publication Number | Publication Date |
---|---|
KR840007042A true KR840007042A (ko) | 1984-12-04 |
Family
ID=23833095
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019840000366A KR840007042A (ko) | 1983-01-27 | 1984-01-27 | 합성 운모 제품 |
Country Status (6)
Country | Link |
---|---|
US (1) | US4559264A (ko) |
EP (1) | EP0115399B1 (ko) |
JP (1) | JPS59149602A (ko) |
KR (1) | KR840007042A (ko) |
CA (1) | CA1213508A (ko) |
DE (1) | DE3466417D1 (ko) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4762643A (en) * | 1984-10-18 | 1988-08-09 | Armstrong World Industries, Inc. | Binders and fibers combined with flocced mineral materials and water-resistant articles made therefrom |
US4707298A (en) * | 1984-10-18 | 1987-11-17 | Armstrong World Industries, Inc. | Flocced mineral materials and water-resistant articles made therefrom |
US4990405A (en) * | 1985-03-25 | 1991-02-05 | Armstrong World Industries, Inc. | Multi-ply composites and sheets of epoxy and flocced 2:1 layered silicates |
CA1257054A (en) * | 1985-03-25 | 1989-07-11 | Thomas M. Tymon | Flocced mineral materials and water-resistant articles materials made therefrom |
US4851021A (en) * | 1987-02-17 | 1989-07-25 | Armstrong World Industries, Inc. | Multi-ply composites and sheets of epoxy and flocced 2:1 layered silicates and methods for them |
US4624933A (en) * | 1985-12-20 | 1986-11-25 | Corning Glass Works | Sodium fluormica glass-ceramics |
US4675235A (en) * | 1986-01-09 | 1987-06-23 | Corning Glass Works | Laminated synthetic mica articles |
EP0285714A1 (en) * | 1987-04-08 | 1988-10-12 | Corning Glass Works | Laminated synthetic mica articles |
EP0235926B1 (en) * | 1986-01-31 | 1994-04-06 | Toray Industries, Inc. | Composite film and antistatic composite film |
JPS62251136A (ja) * | 1986-04-25 | 1987-10-31 | 三菱樹脂株式会社 | 金属複合積層板 |
US4775586A (en) * | 1987-02-17 | 1988-10-04 | Armstrong World Industries, Inc. | Paper, paper products, films composites and other silicate-polymer, construction materials |
EP0283608A1 (en) * | 1987-03-25 | 1988-09-28 | Corning Glass Works | Laminated products from inorganic papers |
US4921748A (en) * | 1988-11-28 | 1990-05-01 | Armstrong World Industries, Inc. | Fluorhectorite laminate printed circuit substrate |
BE1003845A4 (fr) * | 1988-11-28 | 1992-06-30 | Asturienne Mines Comp Royale | Element de construction muni d'un revetement anti-feu a base de papier mica impregne. |
EP0444574A1 (en) * | 1990-02-28 | 1991-09-04 | Corning Incorporated | Organic-inorganic composites and method of making them |
JPH06123095A (ja) * | 1992-10-12 | 1994-05-06 | Nippon Paper Ind Co Ltd | 電気絶縁積層板用原紙 |
US6991845B2 (en) * | 2002-12-13 | 2006-01-31 | E. I. Du Pont De Nemours And Company | Mica sheet and tape |
WO2008003545A1 (de) * | 2006-07-04 | 2008-01-10 | Continental Automotive Gmbh | Flexibler leiterträger und verwendung eines glasfasergewebes und eines harzes für den flexiblen leiterträger |
US20080026180A1 (en) * | 2006-07-26 | 2008-01-31 | Bush Robert L | Impregnated inorganic paper and method for manufacturing the impregnated inorganic paper |
US8568855B2 (en) | 2011-06-08 | 2013-10-29 | Siemens Energy, Inc. | Insulation materials having apertures formed therein |
CN114163777B (zh) * | 2022-02-11 | 2022-06-28 | 浙江荣泰电工器材股份有限公司 | 一种新能源汽车用内增短纤维的云母复合材料及制备工艺 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3390045A (en) * | 1965-05-27 | 1968-06-25 | Interior Usa | Method of making paper from mica flakes which have been subjected to hot aqua regia |
BE758263A (en) * | 1970-10-30 | 1971-04-30 | Cogebi | Mica paper containing organo-silicic compound- - ds |
DE2963050D1 (en) * | 1978-02-17 | 1982-07-29 | Du Pont | Use of photosensitive stratum to create through-hole connections in circuit boards |
US4239519A (en) * | 1979-03-26 | 1980-12-16 | Corning Glass Works | Inorganic gels and ceramic papers, films, fibers, boards, and coatings made therefrom |
US4335367A (en) * | 1979-08-17 | 1982-06-15 | Tokyo Shibaura Denki Kabushiki Kaisha | Electrically insulated coil |
DE3003477C2 (de) * | 1980-01-29 | 1982-06-09 | Siemens AG, 1000 Berlin und 8000 München | Isolierband zur Herstellung einer mit einer heißhärtenden Epoxidharz-Säureanhydrid-Mischung imprägnierten Isolierhülse für elektrische Leiter |
JPS6022444B2 (ja) * | 1980-11-08 | 1985-06-01 | 日立化成工業株式会社 | 集成マイカ材料,集成マイカプリプレグ材料及び集成マイカ製品 |
-
1983
- 1983-01-27 US US06/461,566 patent/US4559264A/en not_active Expired - Fee Related
- 1983-11-18 CA CA000441443A patent/CA1213508A/en not_active Expired
-
1984
- 1984-01-17 EP EP84300276A patent/EP0115399B1/en not_active Expired
- 1984-01-17 DE DE8484300276T patent/DE3466417D1/de not_active Expired
- 1984-01-27 JP JP59013237A patent/JPS59149602A/ja active Pending
- 1984-01-27 KR KR1019840000366A patent/KR840007042A/ko not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
JPS59149602A (ja) | 1984-08-27 |
EP0115399B1 (en) | 1987-09-23 |
EP0115399A2 (en) | 1984-08-08 |
DE3466417D1 (en) | 1987-10-29 |
EP0115399A3 (en) | 1984-10-03 |
CA1213508A (en) | 1986-11-04 |
US4559264A (en) | 1985-12-17 |
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Legal Events
Date | Code | Title | Description |
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WITN | Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid |