KR840004307A - Longitudinal current chisel integrated master logic device coexisting with linear element and manufacturing method thereof - Google Patents

Longitudinal current chisel integrated master logic device coexisting with linear element and manufacturing method thereof Download PDF

Info

Publication number
KR840004307A
KR840004307A KR1019830001145A KR830001145A KR840004307A KR 840004307 A KR840004307 A KR 840004307A KR 1019830001145 A KR1019830001145 A KR 1019830001145A KR 830001145 A KR830001145 A KR 830001145A KR 840004307 A KR840004307 A KR 840004307A
Authority
KR
South Korea
Prior art keywords
type
layer
impurity layer
type impurity
logic device
Prior art date
Application number
KR1019830001145A
Other languages
Korean (ko)
Other versions
KR860000254B1 (en
Inventor
임순권
Original Assignee
강진구
삼성반도체통신 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 강진구, 삼성반도체통신 주식회사 filed Critical 강진구
Priority to KR1019830001145A priority Critical patent/KR860000254B1/en
Publication of KR840004307A publication Critical patent/KR840004307A/en
Application granted granted Critical
Publication of KR860000254B1 publication Critical patent/KR860000254B1/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Bipolar Integrated Circuits (AREA)

Abstract

내용 없음No content

Description

선형소자와 공존하는 종방향 전류 주임형 집적주임논리 소자 및 그 제조방법Longitudinal current chisel integrated master logic device coexisting with linear element and manufacturing method thereof

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.

제9도는 본발명에 따른 단면공정도,9 is a cross-sectional process diagram according to the present invention,

제10도는 본 발명에 따라 제조된 선형소자와 공존하는 종방향 전류 주입형 집적주입 논리소자의 리시도.10 is a view of a longitudinal current injection integrated injection logic device coexisting with a linear device fabricated in accordance with the present invention.

Claims (3)

P형 기판상에 고능도 N형 매몰층과 상기 고능도 N형 매몰층상에 N형 에피택셜층과 P형 불순물층 및 N형 불순물층을 형성시키는 선형소자와 공존하는 집적주입 논리소자의 제조방법에 있어서 P형 기판(10)상에 고능도 N형 매몰층(11)을 확산하고 상기 고능도 N형 매몰층(11)상에 P형 인잭터 레일(12)과 N형 불순몰층(13)상에 N형 에피택셜층(14)를 성장시키고 상기 에피택셜층(14)상에 P형 불순물층(16)을 확산하며 상기 P형 불순물층(16)중 상기 N형 불순물층(13)의 상부에 고종도 N형 불순물층을 확산시킴을 특징으로 하는 선형소자와 공존하는 종방향 전류 주입형 집적 주입논리소자의 제조방법.A manufacturing method of an integrated injection logic device coexisting with a linear device for forming an N-type epitaxial layer, a P-type impurity layer, and an N-type impurity layer on a high-performance N-type buried layer on a P-type substrate Diffuses the high-performance N-type buried layer 11 on the P-type substrate 10 and the P-type injector rail 12 and the N-type impurity layer 13 on the high-performance N-type buried layer 11. The N-type epitaxial layer 14 is grown on the epitaxial layer 14, and the P-type impurity layer 16 is diffused on the epitaxial layer 14 and the N-type impurity layer 13 of the P-type impurity layer 16 is formed. A method for manufacturing a longitudinal current injection type integrated injection logic device coexisting with a linear device, characterized by diffusing a high-concentration N-type impurity layer thereon. 제1항에 있어서 N형 불순물층(13)을 이온 주입방식으로 형성시킴을 특징으로 하는 선형소자와 공존하는 종방향 전류주입형 집적주입 논리소자의 제조방법.The method of manufacturing a longitudinal current injection type integrated injection logic device according to claim 1, wherein the N-type impurity layer (13) is formed by an ion implantation method. P형 기판상에 고농도 N형 매몰층과 상기 고농도 N형 매몰층상에 N형 에피택셜층과 P형 불순물층 및 N형 불순물층을 형성시켜 제조하는 선형소자와 공존하는 집적주입 논리소자에 있어서 P형 기판(10)상에 고농도 N형 매몰층(11)을 확산시키고 상기 고농도 N형 매몰층 (11)상에 P형 에형인잭터레일 (12)을 확산시키고 N형 불순물층 (13)을 형성시키며 상기 P형 인잭터레일(12)과 N형 불순물층(13)상에 N형 에피택셜층(14)을 성장시키고 상기 에피택셜층(14)상에 P형 불순물층(16)을 확산하며 상기 P형 불순물층(16)중 상기 N형 불순물층(13)의 상부에 고농도 N형 불순물층을 확산시켜 매몰된 P형 인잭터레일(12)과 N형 에피택셜층(14) 및 P형 불순물층(16)으로 구성되는 종방향 전류주입형 PNP 트랜지스터가 구성됨을 특징으로 하는 선형소자와 공존하는 종방향 전류주입형 집적주입 논리소자.In an integrated injection logic device coexisting with a linear device fabricated by forming an N-type epitaxial layer, a P-type impurity layer and an N-type impurity layer on a high concentration N-type buried layer and a high concentration N-type buried layer on a P-type substrate, The high concentration N-type buried layer 11 is diffused on the type substrate 10, the P type etch injector rail 12 is diffused on the high concentration N-type buried layer 11, and the N type impurity layer 13 is formed. The N-type epitaxial layer 14 is grown on the P-type injector rail 12 and the N-type impurity layer 13, and the P-type impurity layer 16 is diffused on the epitaxial layer 14. The P-type injector rail 12, the N-type epitaxial layer 14, and the P-type embedded in the P-type impurity layer 16 are buried by diffusing a high concentration N-type impurity layer on the N-type impurity layer 13. Longitudinal current injection type coexist with linear element, characterized in that a longitudinal current injection type PNP transistor composed of impurity layer 16 is constructed Input logic element. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019830001145A 1983-03-22 1983-03-22 Length derection current integrated injection logic element and manufaturing method KR860000254B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019830001145A KR860000254B1 (en) 1983-03-22 1983-03-22 Length derection current integrated injection logic element and manufaturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019830001145A KR860000254B1 (en) 1983-03-22 1983-03-22 Length derection current integrated injection logic element and manufaturing method

Publications (2)

Publication Number Publication Date
KR840004307A true KR840004307A (en) 1984-10-10
KR860000254B1 KR860000254B1 (en) 1986-03-21

Family

ID=19228507

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019830001145A KR860000254B1 (en) 1983-03-22 1983-03-22 Length derection current integrated injection logic element and manufaturing method

Country Status (1)

Country Link
KR (1) KR860000254B1 (en)

Also Published As

Publication number Publication date
KR860000254B1 (en) 1986-03-21

Similar Documents

Publication Publication Date Title
KR840004830A (en) Complementary Integrated Circuit Fabrication Process
KR970024265A (en) Semiconductor devices
KR930001466A (en) Manufacturing method of P buried layer for PNP device
GB1326286A (en) Transistors
KR890013746A (en) Bipolar transistor and method of manufacturing the same
KR890016626A (en) Semiconductor device
KR850005169A (en) MIS type semiconductor device formed on semiconductor substrate having well region
KR840004307A (en) Longitudinal current chisel integrated master logic device coexisting with linear element and manufacturing method thereof
JPS6481351A (en) Manufacture of semiconductor device
GB1482298A (en) Monolithically integrated circuit
KR860001488A (en) Semiconductor Devices with Bipolar Transistors and IIL
KR910015063A (en) Complementary Bipolar Transistor
KR910003757A (en) Method of manufacturing transistor using double epitaxy
KR920003447A (en) Bipolar Device Manufacturing Method
JPS6481353A (en) Semiconductor device
GB1133422A (en) Improvements in or relating to methods of manufacturing planar transistors
KR910005422A (en) Method of manufacturing I²L gate of semiconductor integrated circuit
KR880008460A (en) Semiconductor device and manufacturing method thereof
KR870009485A (en) Integrated circuit manufacturing method
KR940018998A (en) Bi CMOS Memory Cell Manufacturing Method
KR840008532A (en) Method for manufacturing high frequency power device by selective silicon growth
JPS57143855A (en) Semiconductor integrated circuit device
KR890011087A (en) Semiconductor device manufacturing method
JPS5617058A (en) Semiconductor integrated circuit
GB1414066A (en) Junction transistors

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
G160 Decision to publish patent application
O035 Opposition [patent]: request for opposition
E701 Decision to grant or registration of patent right
O073 Decision to grant registration after opposition [patent]: decision to grant registration
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20030207

Year of fee payment: 18

EXPY Expiration of term