KR20260039895A - 멀티 존 세라믹 히터 - Google Patents
멀티 존 세라믹 히터Info
- Publication number
- KR20260039895A KR20260039895A KR1020247020214A KR20247020214A KR20260039895A KR 20260039895 A KR20260039895 A KR 20260039895A KR 1020247020214 A KR1020247020214 A KR 1020247020214A KR 20247020214 A KR20247020214 A KR 20247020214A KR 20260039895 A KR20260039895 A KR 20260039895A
- Authority
- KR
- South Korea
- Prior art keywords
- zone
- heater circuit
- ceramic
- ceramic plate
- outer zone
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater
- H05B3/22—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible
- H05B3/28—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material
- H05B3/283—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material the insulating material being an inorganic material, e.g. ceramic
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/0033—Heating devices using lamps
- H05B3/0038—Heating devices using lamps for industrial applications
- H05B3/0047—Heating devices using lamps for industrial applications for semiconductor manufacture
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/02—Details
- H05B3/03—Electrodes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/002—Heaters using a particular layout for the resistive material or resistive elements
- H05B2203/005—Heaters using a particular layout for the resistive material or resistive elements using multiple resistive elements or resistive zones isolated from each other
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/016—Heaters using particular connecting means
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Resistance Heating (AREA)
- Surface Heating Bodies (AREA)
- Furnace Details (AREA)
- Manufacturing & Machinery (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2023/029889 WO2025041202A1 (ja) | 2023-08-18 | 2023-08-18 | マルチゾーンセラミックヒータ |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20260039895A true KR20260039895A (ko) | 2026-03-23 |
Family
ID=94609155
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020247020214A Pending KR20260039895A (ko) | 2023-08-18 | 2023-08-18 | 멀티 존 세라믹 히터 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20250063636A1 (cg-RX-API-DMAC7.html) |
| JP (1) | JP7642159B1 (cg-RX-API-DMAC7.html) |
| KR (1) | KR20260039895A (cg-RX-API-DMAC7.html) |
| CN (1) | CN121730018A (cg-RX-API-DMAC7.html) |
| TW (1) | TW202510629A (cg-RX-API-DMAC7.html) |
| WO (1) | WO2025041202A1 (cg-RX-API-DMAC7.html) |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6352663B2 (ja) * | 2014-03-28 | 2018-07-04 | 日本特殊陶業株式会社 | 積層発熱体 |
| JP6251461B1 (ja) * | 2016-03-29 | 2017-12-20 | 日本碍子株式会社 | 静電チャックヒータ |
| JP6758143B2 (ja) * | 2016-09-29 | 2020-09-23 | 日本特殊陶業株式会社 | 加熱装置 |
| WO2019008889A1 (ja) * | 2017-07-07 | 2019-01-10 | 住友電気工業株式会社 | 半導体基板加熱用の基板載置台 |
| JP6987995B2 (ja) * | 2018-07-31 | 2022-01-05 | 京セラ株式会社 | ヒータ |
| JP7252825B2 (ja) * | 2019-05-20 | 2023-04-05 | 日本特殊陶業株式会社 | 保持装置 |
-
2023
- 2023-08-18 WO PCT/JP2023/029889 patent/WO2025041202A1/ja active Pending
- 2023-08-18 CN CN202380014933.3A patent/CN121730018A/zh active Pending
- 2023-08-18 KR KR1020247020214A patent/KR20260039895A/ko active Pending
- 2023-08-18 JP JP2024531409A patent/JP7642159B1/ja active Active
-
2024
- 2024-04-26 TW TW113115607A patent/TW202510629A/zh unknown
- 2024-05-28 US US18/675,244 patent/US20250063636A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| JP7642159B1 (ja) | 2025-03-07 |
| JPWO2025041202A1 (cg-RX-API-DMAC7.html) | 2025-02-27 |
| US20250063636A1 (en) | 2025-02-20 |
| WO2025041202A1 (ja) | 2025-02-27 |
| TW202510629A (zh) | 2025-03-01 |
| CN121730018A (zh) | 2026-03-24 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0105 | International application |
St.27 status event code: A-0-1-A10-A15-nap-PA0105 |
|
| D11 | Substantive examination requested |
Free format text: ST27 STATUS EVENT CODE: A-1-2-D10-D11-EXM-PA0201 (AS PROVIDED BY THE NATIONAL OFFICE) |
|
| PA0201 | Request for examination |
St.27 status event code: A-1-2-D10-D11-exm-PA0201 |
|
| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| Q12 | Application published |
Free format text: ST27 STATUS EVENT CODE: A-1-1-Q10-Q12-NAP-PG1501 (AS PROVIDED BY THE NATIONAL OFFICE) |
|
| D13 | Search requested |
Free format text: ST27 STATUS EVENT CODE: A-1-2-D10-D13-SRH-X000 (AS PROVIDED BY THE NATIONAL OFFICE) |
|
| D13-X000 | Search requested |
St.27 status event code: A-1-2-D10-D13-srh-X000 |
|
| PN2301 | Change of applicant |
St.27 status event code: A-3-3-R10-R13-asn-PN2301 St.27 status event code: A-3-3-R10-R11-asn-PN2301 |