KR20250132481A - 연마 방법, 연마 장치 및 컴퓨터 판독 가능한 기록 매체 - Google Patents

연마 방법, 연마 장치 및 컴퓨터 판독 가능한 기록 매체

Info

Publication number
KR20250132481A
KR20250132481A KR1020257022495A KR20257022495A KR20250132481A KR 20250132481 A KR20250132481 A KR 20250132481A KR 1020257022495 A KR1020257022495 A KR 1020257022495A KR 20257022495 A KR20257022495 A KR 20257022495A KR 20250132481 A KR20250132481 A KR 20250132481A
Authority
KR
South Korea
Prior art keywords
polishing
measurement
data points
substrate
measurement data
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020257022495A
Other languages
English (en)
Korean (ko)
Inventor
히로타카 사토리
Original Assignee
가부시키가이샤 에바라 세이사꾸쇼
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 에바라 세이사꾸쇼 filed Critical 가부시키가이샤 에바라 세이사꾸쇼
Publication of KR20250132481A publication Critical patent/KR20250132481A/ko
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/003Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving acoustic means
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/005Control means for lapping machines or devices
    • B24B37/013Devices or means for detecting lapping completion
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B24B49/04Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/10Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/10Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
    • B24B49/105Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means using eddy currents
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/14Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the temperature during grinding
    • H01L21/304
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00Grinding, lapping or polishing of wafers, substrates or parts of devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
KR1020257022495A 2022-12-26 2023-11-14 연마 방법, 연마 장치 및 컴퓨터 판독 가능한 기록 매체 Pending KR20250132481A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2022-208734 2022-12-26
JP2022208734A JP2024092647A (ja) 2022-12-26 2022-12-26 研磨方法、研磨装置、およびコンピュータ読み取り可能な記録媒体
PCT/JP2023/040890 WO2024142632A1 (ja) 2022-12-26 2023-11-14 研磨方法、研磨装置、およびコンピュータ読み取り可能な記録媒体

Publications (1)

Publication Number Publication Date
KR20250132481A true KR20250132481A (ko) 2025-09-04

Family

ID=91717295

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020257022495A Pending KR20250132481A (ko) 2022-12-26 2023-11-14 연마 방법, 연마 장치 및 컴퓨터 판독 가능한 기록 매체

Country Status (6)

Country Link
EP (1) EP4644043A1 (https=)
JP (1) JP2024092647A (https=)
KR (1) KR20250132481A (https=)
CN (1) CN120500399A (https=)
TW (1) TW202440270A (https=)
WO (1) WO2024142632A1 (https=)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010253627A (ja) 2009-04-27 2010-11-11 Ebara Corp 研磨方法及び研磨装置及び基板の監視方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021028099A (ja) * 2019-08-09 2021-02-25 株式会社荏原製作所 終点検知装置、終点検知方法
JP2021194748A (ja) * 2020-06-17 2021-12-27 株式会社荏原製作所 研磨装置及びプログラム
JP7783104B2 (ja) * 2021-04-28 2025-12-09 株式会社荏原製作所 研磨装置および研磨方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010253627A (ja) 2009-04-27 2010-11-11 Ebara Corp 研磨方法及び研磨装置及び基板の監視方法

Also Published As

Publication number Publication date
EP4644043A1 (en) 2025-11-05
TW202440270A (zh) 2024-10-16
WO2024142632A1 (ja) 2024-07-04
CN120500399A (zh) 2025-08-15
JP2024092647A (ja) 2024-07-08

Similar Documents

Publication Publication Date Title
US7070479B2 (en) Arrangement and method for conditioning a polishing pad
CN102956521B (zh) 用于在cmp加工中实时差错检测的装置和方法
JP2020013918A (ja) 基板の周縁部を研磨するための研磨装置および研磨方法
KR20230078720A (ko) 연마 장치, 및 연마 패드의 교환 시기를 결정하는 방법
CN110774076A (zh) 化学机械抛光设备和方法
JP6509766B2 (ja) 半導体製造装置および半導体装置の製造方法
JP2021091033A (ja) 研磨装置、研磨ヘッド、研磨方法、及び半導体装置の製造方法
KR102944366B1 (ko) 연마에서 진동을 검출하기 위한 와전류 모니터링
US20050142987A1 (en) Method and system for controlling the chemical mechanical polishing by using a seismic signal of a seismic sensor
JPH10202520A (ja) ウェーハの厚み加工量測定装置
KR20250132481A (ko) 연마 방법, 연마 장치 및 컴퓨터 판독 가능한 기록 매체
TW201916147A (zh) 用於晶圓上準確的感測器位置判定的振動校正
JP5126657B2 (ja) 研磨装置
JP2023159949A (ja) 研磨終点検出のためのパラメータ調整方法および研磨終点検出システム
CN221290866U (zh) 化学机械抛光装置
JP3324235B2 (ja) 加工物の研磨方法及びその研磨装置並びにそれを用いた半導体基板
JP7504713B2 (ja) 半導体製造装置及び半導体製造方法
US6254454B1 (en) Reference thickness endpoint techniques for polishing operations
TW202335788A (zh) 研磨終點檢測方法、研磨終點檢測系統、研磨裝置、及電腦可讀取之記錄媒體
JP2000340537A (ja) ポリッシング装置及び方法
TWI877799B (zh) 壓電墊監測裝置及半導體製程工具的操作方法
JPH11265860A (ja) 部分研磨装置及び方法
TW202436028A (zh) 研磨裝置、資訊處理裝置及程式
US20240424635A1 (en) Polishing method, polishing apparatus, and non-transitory computer-readable recording medium
JP2005305587A (ja) パッド表面形状測定装置及びこれを備えた研磨装置

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

P11 Amendment of application requested

Free format text: ST27 STATUS EVENT CODE: A-2-2-P10-P11-NAP-X000 (AS PROVIDED BY THE NATIONAL OFFICE)

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13 Application amended

Free format text: ST27 STATUS EVENT CODE: A-2-2-P10-P13-NAP-X000 (AS PROVIDED BY THE NATIONAL OFFICE)

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

R15 Change to inventor requested

Free format text: ST27 STATUS EVENT CODE: A-3-3-R10-R15-OTH-X000 (AS PROVIDED BY THE NATIONAL OFFICE)

R15-X000 Change to inventor requested

St.27 status event code: A-3-3-R10-R15-oth-X000

R16 Change to inventor recorded

Free format text: ST27 STATUS EVENT CODE: A-3-3-R10-R16-OTH-X000 (AS PROVIDED BY THE NATIONAL OFFICE)

R16-X000 Change to inventor recorded

St.27 status event code: A-3-3-R10-R16-oth-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

Q12 Application published

Free format text: ST27 STATUS EVENT CODE: A-1-1-Q10-Q12-NAP-PG1501 (AS PROVIDED BY THE NATIONAL OFFICE)

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000