KR20250132481A - 연마 방법, 연마 장치 및 컴퓨터 판독 가능한 기록 매체 - Google Patents
연마 방법, 연마 장치 및 컴퓨터 판독 가능한 기록 매체Info
- Publication number
- KR20250132481A KR20250132481A KR1020257022495A KR20257022495A KR20250132481A KR 20250132481 A KR20250132481 A KR 20250132481A KR 1020257022495 A KR1020257022495 A KR 1020257022495A KR 20257022495 A KR20257022495 A KR 20257022495A KR 20250132481 A KR20250132481 A KR 20250132481A
- Authority
- KR
- South Korea
- Prior art keywords
- polishing
- measurement
- data points
- substrate
- measurement data
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/003—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving acoustic means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
- B24B37/013—Devices or means for detecting lapping completion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
- B24B49/04—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
- B24B49/105—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means using eddy currents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/14—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the temperature during grinding
-
- H01L21/304—
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP-P-2022-208734 | 2022-12-26 | ||
| JP2022208734A JP2024092647A (ja) | 2022-12-26 | 2022-12-26 | 研磨方法、研磨装置、およびコンピュータ読み取り可能な記録媒体 |
| PCT/JP2023/040890 WO2024142632A1 (ja) | 2022-12-26 | 2023-11-14 | 研磨方法、研磨装置、およびコンピュータ読み取り可能な記録媒体 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20250132481A true KR20250132481A (ko) | 2025-09-04 |
Family
ID=91717295
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020257022495A Pending KR20250132481A (ko) | 2022-12-26 | 2023-11-14 | 연마 방법, 연마 장치 및 컴퓨터 판독 가능한 기록 매체 |
Country Status (6)
| Country | Link |
|---|---|
| EP (1) | EP4644043A1 (https=) |
| JP (1) | JP2024092647A (https=) |
| KR (1) | KR20250132481A (https=) |
| CN (1) | CN120500399A (https=) |
| TW (1) | TW202440270A (https=) |
| WO (1) | WO2024142632A1 (https=) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010253627A (ja) | 2009-04-27 | 2010-11-11 | Ebara Corp | 研磨方法及び研磨装置及び基板の監視方法 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2021028099A (ja) * | 2019-08-09 | 2021-02-25 | 株式会社荏原製作所 | 終点検知装置、終点検知方法 |
| JP2021194748A (ja) * | 2020-06-17 | 2021-12-27 | 株式会社荏原製作所 | 研磨装置及びプログラム |
| JP7783104B2 (ja) * | 2021-04-28 | 2025-12-09 | 株式会社荏原製作所 | 研磨装置および研磨方法 |
-
2022
- 2022-12-26 JP JP2022208734A patent/JP2024092647A/ja active Pending
-
2023
- 2023-11-14 WO PCT/JP2023/040890 patent/WO2024142632A1/ja not_active Ceased
- 2023-11-14 EP EP23911415.0A patent/EP4644043A1/en active Pending
- 2023-11-14 KR KR1020257022495A patent/KR20250132481A/ko active Pending
- 2023-11-14 CN CN202380088869.3A patent/CN120500399A/zh active Pending
- 2023-12-21 TW TW112149903A patent/TW202440270A/zh unknown
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010253627A (ja) | 2009-04-27 | 2010-11-11 | Ebara Corp | 研磨方法及び研磨装置及び基板の監視方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| EP4644043A1 (en) | 2025-11-05 |
| TW202440270A (zh) | 2024-10-16 |
| WO2024142632A1 (ja) | 2024-07-04 |
| CN120500399A (zh) | 2025-08-15 |
| JP2024092647A (ja) | 2024-07-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7070479B2 (en) | Arrangement and method for conditioning a polishing pad | |
| CN102956521B (zh) | 用于在cmp加工中实时差错检测的装置和方法 | |
| JP2020013918A (ja) | 基板の周縁部を研磨するための研磨装置および研磨方法 | |
| KR20230078720A (ko) | 연마 장치, 및 연마 패드의 교환 시기를 결정하는 방법 | |
| CN110774076A (zh) | 化学机械抛光设备和方法 | |
| JP6509766B2 (ja) | 半導体製造装置および半導体装置の製造方法 | |
| JP2021091033A (ja) | 研磨装置、研磨ヘッド、研磨方法、及び半導体装置の製造方法 | |
| KR102944366B1 (ko) | 연마에서 진동을 검출하기 위한 와전류 모니터링 | |
| US20050142987A1 (en) | Method and system for controlling the chemical mechanical polishing by using a seismic signal of a seismic sensor | |
| JPH10202520A (ja) | ウェーハの厚み加工量測定装置 | |
| KR20250132481A (ko) | 연마 방법, 연마 장치 및 컴퓨터 판독 가능한 기록 매체 | |
| TW201916147A (zh) | 用於晶圓上準確的感測器位置判定的振動校正 | |
| JP5126657B2 (ja) | 研磨装置 | |
| JP2023159949A (ja) | 研磨終点検出のためのパラメータ調整方法および研磨終点検出システム | |
| CN221290866U (zh) | 化学机械抛光装置 | |
| JP3324235B2 (ja) | 加工物の研磨方法及びその研磨装置並びにそれを用いた半導体基板 | |
| JP7504713B2 (ja) | 半導体製造装置及び半導体製造方法 | |
| US6254454B1 (en) | Reference thickness endpoint techniques for polishing operations | |
| TW202335788A (zh) | 研磨終點檢測方法、研磨終點檢測系統、研磨裝置、及電腦可讀取之記錄媒體 | |
| JP2000340537A (ja) | ポリッシング装置及び方法 | |
| TWI877799B (zh) | 壓電墊監測裝置及半導體製程工具的操作方法 | |
| JPH11265860A (ja) | 部分研磨装置及び方法 | |
| TW202436028A (zh) | 研磨裝置、資訊處理裝置及程式 | |
| US20240424635A1 (en) | Polishing method, polishing apparatus, and non-transitory computer-readable recording medium | |
| JP2005305587A (ja) | パッド表面形状測定装置及びこれを備えた研磨装置 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0105 | International application |
St.27 status event code: A-0-1-A10-A15-nap-PA0105 |
|
| P11 | Amendment of application requested |
Free format text: ST27 STATUS EVENT CODE: A-2-2-P10-P11-NAP-X000 (AS PROVIDED BY THE NATIONAL OFFICE) |
|
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13 | Application amended |
Free format text: ST27 STATUS EVENT CODE: A-2-2-P10-P13-NAP-X000 (AS PROVIDED BY THE NATIONAL OFFICE) |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| R15 | Change to inventor requested |
Free format text: ST27 STATUS EVENT CODE: A-3-3-R10-R15-OTH-X000 (AS PROVIDED BY THE NATIONAL OFFICE) |
|
| R15-X000 | Change to inventor requested |
St.27 status event code: A-3-3-R10-R15-oth-X000 |
|
| R16 | Change to inventor recorded |
Free format text: ST27 STATUS EVENT CODE: A-3-3-R10-R16-OTH-X000 (AS PROVIDED BY THE NATIONAL OFFICE) |
|
| R16-X000 | Change to inventor recorded |
St.27 status event code: A-3-3-R10-R16-oth-X000 |
|
| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| Q12 | Application published |
Free format text: ST27 STATUS EVENT CODE: A-1-1-Q10-Q12-NAP-PG1501 (AS PROVIDED BY THE NATIONAL OFFICE) |
|
| P22-X000 | Classification modified |
St.27 status event code: A-2-2-P10-P22-nap-X000 |