KR20250078974A - 기판 처리 방법 및 기판 처리 시스템 - Google Patents

기판 처리 방법 및 기판 처리 시스템 Download PDF

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Publication number
KR20250078974A
KR20250078974A KR1020257013709A KR20257013709A KR20250078974A KR 20250078974 A KR20250078974 A KR 20250078974A KR 1020257013709 A KR1020257013709 A KR 1020257013709A KR 20257013709 A KR20257013709 A KR 20257013709A KR 20250078974 A KR20250078974 A KR 20250078974A
Authority
KR
South Korea
Prior art keywords
substrate
wafer
notch
modified layer
formation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020257013709A
Other languages
English (en)
Korean (ko)
Inventor
요헤이 야마시타
히로토시 모리
요스케 나카무라
카즈히로 시바
카즈야 이와나가
카즈야 히사노
Original Assignee
도쿄엘렉트론가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 도쿄엘렉트론가부시키가이샤 filed Critical 도쿄엘렉트론가부시키가이샤
Publication of KR20250078974A publication Critical patent/KR20250078974A/ko
Pending legal-status Critical Current

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Classifications

    • H01L21/304—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • H01L21/185—
    • H01L21/67092—
    • H01L21/67253—
    • H01L21/67259—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P10/00—Bonding of wafers, substrates or parts of devices
    • H10P10/12—Bonding of semiconductor wafers or semiconductor substrates to semiconductor wafers or semiconductor substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0604—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
KR1020257013709A 2022-09-30 2023-08-17 기판 처리 방법 및 기판 처리 시스템 Pending KR20250078974A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022158103 2022-09-30
JPJP-P-2022-158103 2022-09-30
PCT/JP2023/029716 WO2024070309A1 (ja) 2022-09-30 2023-08-17 基板処理方法及び基板処理システム

Publications (1)

Publication Number Publication Date
KR20250078974A true KR20250078974A (ko) 2025-06-04

Family

ID=90477303

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020257013709A Pending KR20250078974A (ko) 2022-09-30 2023-08-17 기판 처리 방법 및 기판 처리 시스템

Country Status (5)

Country Link
JP (1) JPWO2024070309A1 (https=)
KR (1) KR20250078974A (https=)
CN (1) CN119948602A (https=)
TW (1) TW202430306A (https=)
WO (1) WO2024070309A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102903522B1 (ko) * 2020-04-02 2025-12-23 도쿄엘렉트론가부시키가이샤 기판 처리 방법 및 기판 처리 장치

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022097506A (ja) 2018-03-14 2022-06-30 東京エレクトロン株式会社 基板処理システム、基板処理方法及びコンピュータ記憶媒体

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4232148B2 (ja) * 2003-01-28 2009-03-04 株式会社Ｓｕｍｃｏ 貼り合わせ基板の製造方法
JP6286256B2 (ja) * 2014-03-31 2018-02-28 株式会社東京精密 ウエハマーキング・研削装置及びウエハマーキング・研削方法
KR102903523B1 (ko) * 2018-04-27 2025-12-23 도쿄엘렉트론가부시키가이샤 기판 처리 시스템 및 기판 처리 방법
TWI832975B (zh) * 2019-03-08 2024-02-21 日商東京威力科創股份有限公司 處理裝置及處理方法
KR102810856B1 (ko) * 2019-09-02 2025-05-20 삼성전자주식회사 반도체 소자 제조 장치, 반도체 소자 검사 장치 및 반도체 소자 제조 방법
JP7386075B2 (ja) * 2019-12-25 2023-11-24 東京エレクトロン株式会社 基板処理方法及び基板処理システム

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022097506A (ja) 2018-03-14 2022-06-30 東京エレクトロン株式会社 基板処理システム、基板処理方法及びコンピュータ記憶媒体

Also Published As

Publication number Publication date
JPWO2024070309A1 (https=) 2024-04-04
TW202430306A (zh) 2024-08-01
WO2024070309A1 (ja) 2024-04-04
CN119948602A (zh) 2025-05-06

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