JPWO2024070309A1 - - Google Patents
Info
- Publication number
- JPWO2024070309A1 JPWO2024070309A1 JP2024549862A JP2024549862A JPWO2024070309A1 JP WO2024070309 A1 JPWO2024070309 A1 JP WO2024070309A1 JP 2024549862 A JP2024549862 A JP 2024549862A JP 2024549862 A JP2024549862 A JP 2024549862A JP WO2024070309 A1 JPWO2024070309 A1 JP WO2024070309A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
- B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
- B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P10/00—Bonding of wafers, substrates or parts of devices
- H10P10/12—Bonding of semiconductor wafers or semiconductor substrates to semiconductor wafers or semiconductor substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
- H10P72/0604—Process monitoring, e.g. flow or thickness monitoring
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
- H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022158103 | 2022-09-30 | ||
| PCT/JP2023/029716 WO2024070309A1 (ja) | 2022-09-30 | 2023-08-17 | 基板処理方法及び基板処理システム |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024070309A1 true JPWO2024070309A1 (https=) | 2024-04-04 |
| JPWO2024070309A5 JPWO2024070309A5 (https=) | 2025-06-05 |
Family
ID=90477303
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024549862A Pending JPWO2024070309A1 (https=) | 2022-09-30 | 2023-08-17 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPWO2024070309A1 (https=) |
| KR (1) | KR20250078974A (https=) |
| CN (1) | CN119948602A (https=) |
| TW (1) | TW202430306A (https=) |
| WO (1) | WO2024070309A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102903522B1 (ko) * | 2020-04-02 | 2025-12-23 | 도쿄엘렉트론가부시키가이샤 | 기판 처리 방법 및 기판 처리 장치 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4232148B2 (ja) * | 2003-01-28 | 2009-03-04 | 株式会社Ｓｕｍｃｏ | 貼り合わせ基板の製造方法 |
| JP6286256B2 (ja) * | 2014-03-31 | 2018-02-28 | 株式会社東京精密 | ウエハマーキング・研削装置及びウエハマーキング・研削方法 |
| CN118263105A (zh) | 2018-03-14 | 2024-06-28 | 东京毅力科创株式会社 | 基板处理系统、基板处理方法以及计算机存储介质 |
| KR102903523B1 (ko) * | 2018-04-27 | 2025-12-23 | 도쿄엘렉트론가부시키가이샤 | 기판 처리 시스템 및 기판 처리 방법 |
| TWI832975B (zh) * | 2019-03-08 | 2024-02-21 | 日商東京威力科創股份有限公司 | 處理裝置及處理方法 |
| KR102810856B1 (ko) * | 2019-09-02 | 2025-05-20 | 삼성전자주식회사 | 반도체 소자 제조 장치, 반도체 소자 검사 장치 및 반도체 소자 제조 방법 |
| JP7386075B2 (ja) * | 2019-12-25 | 2023-11-24 | 東京エレクトロン株式会社 | 基板処理方法及び基板処理システム |
-
2023
- 2023-08-17 KR KR1020257013709A patent/KR20250078974A/ko active Pending
- 2023-08-17 CN CN202380068148.6A patent/CN119948602A/zh active Pending
- 2023-08-17 WO PCT/JP2023/029716 patent/WO2024070309A1/ja not_active Ceased
- 2023-08-17 JP JP2024549862A patent/JPWO2024070309A1/ja active Pending
- 2023-09-14 TW TW112134990A patent/TW202430306A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| TW202430306A (zh) | 2024-08-01 |
| WO2024070309A1 (ja) | 2024-04-04 |
| CN119948602A (zh) | 2025-05-06 |
| KR20250078974A (ko) | 2025-06-04 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20250321 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20250321 |