KR20250047266A - 도전성 페이스트, 전극, 전자 부품 및 전자 기기 - Google Patents

도전성 페이스트, 전극, 전자 부품 및 전자 기기 Download PDF

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Publication number
KR20250047266A
KR20250047266A KR1020257002201A KR20257002201A KR20250047266A KR 20250047266 A KR20250047266 A KR 20250047266A KR 1020257002201 A KR1020257002201 A KR 1020257002201A KR 20257002201 A KR20257002201 A KR 20257002201A KR 20250047266 A KR20250047266 A KR 20250047266A
Authority
KR
South Korea
Prior art keywords
conductive paste
metal particles
electrode
palladium
particles
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020257002201A
Other languages
English (en)
Korean (ko)
Inventor
요시아키 요시이
코헤이 모리
Original Assignee
나믹스 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 나믹스 가부시끼가이샤 filed Critical 나믹스 가부시끼가이샤
Priority claimed from PCT/JP2023/013483 external-priority patent/WO2024042764A1/ja
Publication of KR20250047266A publication Critical patent/KR20250047266A/ko
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/14—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions
    • C03C8/18—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions containing free metals
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/14—Terminals or tapping points specially adapted for resistors; Arrangements of terminals or tapping points on resistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Electromagnetism (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Conductive Materials (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Thermistors And Varistors (AREA)
KR1020257002201A 2022-08-26 2023-03-31 도전성 페이스트, 전극, 전자 부품 및 전자 기기 Pending KR20250047266A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022134753 2022-08-26
JPJP-P-2022-134753 2022-08-26
PCT/JP2023/013483 WO2024042764A1 (ja) 2022-08-26 2023-03-31 導電性ペースト、電極、電子部品及び電子機器

Publications (1)

Publication Number Publication Date
KR20250047266A true KR20250047266A (ko) 2025-04-03

Family

ID=87763993

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020257002201A Pending KR20250047266A (ko) 2022-08-26 2023-03-31 도전성 페이스트, 전극, 전자 부품 및 전자 기기

Country Status (3)

Country Link
JP (2) JP7335671B1 (https=)
KR (1) KR20250047266A (https=)
CN (1) CN119563212A (https=)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07335402A (ja) 1994-06-06 1995-12-22 Sumitomo Metal Mining Co Ltd チップ抵抗器上面電極形成用ペースト
WO2021145269A1 (ja) 2020-01-16 2021-07-22 ナミックス株式会社 導電性ペースト、電極及びチップ抵抗器

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61203503A (ja) * 1985-03-06 1986-09-09 同和鉱業株式会社 Ａｇ−Ｐｄ系導電ペ−スト
JP6796448B2 (ja) * 2016-10-20 2020-12-09 Ｄｏｗａエレクトロニクス株式会社 導電性ペーストおよびその製造方法、ならびに太陽電池セル
JP7329941B2 (ja) * 2019-03-28 2023-08-21 株式会社ノリタケカンパニーリミテド コアシェル粒子およびその利用

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07335402A (ja) 1994-06-06 1995-12-22 Sumitomo Metal Mining Co Ltd チップ抵抗器上面電極形成用ペースト
WO2021145269A1 (ja) 2020-01-16 2021-07-22 ナミックス株式会社 導電性ペースト、電極及びチップ抵抗器

Also Published As

Publication number Publication date
JP7335671B1 (ja) 2023-08-30
JPWO2024042764A1 (https=) 2024-02-29
JP2024031862A (ja) 2024-03-07
CN119563212A (zh) 2025-03-04

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Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20250121

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application