KR20250040966A - 레지스트 패턴의 검사 방법, 레지스트 패턴의 제조 방법, 기판 선별 방법, 및, 반도체 패키지 기판 또는 프린트 배선판의 제조 방법 - Google Patents

레지스트 패턴의 검사 방법, 레지스트 패턴의 제조 방법, 기판 선별 방법, 및, 반도체 패키지 기판 또는 프린트 배선판의 제조 방법 Download PDF

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Publication number
KR20250040966A
KR20250040966A KR1020257003900A KR20257003900A KR20250040966A KR 20250040966 A KR20250040966 A KR 20250040966A KR 1020257003900 A KR1020257003900 A KR 1020257003900A KR 20257003900 A KR20257003900 A KR 20257003900A KR 20250040966 A KR20250040966 A KR 20250040966A
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KR
South Korea
Prior art keywords
resist pattern
substrate
pattern
inspecting
manufacturing
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Pending
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KR1020257003900A
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English (en)
Korean (ko)
Inventor
데츠야 가토
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가부시끼가이샤 레조낙
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Publication date
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Publication of KR20250040966A publication Critical patent/KR20250040966A/ko
Pending legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/62—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light
    • G01N21/63—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light optically excited
    • G01N21/64—Fluorescence; Phosphorescence
    • G01N21/6402—Atomic fluorescence; Laser induced fluorescence
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/62—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light
    • G01N21/63—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light optically excited
    • G01N21/64—Fluorescence; Phosphorescence
    • G01N21/6428—Measuring fluorescence of fluorescent products of reactions or of fluorochrome labelled reactive substances, e.g. measuring quenching effects, using measuring "optrodes"
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Pathology (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • Optics & Photonics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
KR1020257003900A 2022-07-27 2023-07-10 레지스트 패턴의 검사 방법, 레지스트 패턴의 제조 방법, 기판 선별 방법, 및, 반도체 패키지 기판 또는 프린트 배선판의 제조 방법 Pending KR20250040966A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022119526 2022-07-27
JPJP-P-2022-119526 2022-07-27
PCT/JP2023/025480 WO2024024484A1 (ja) 2022-07-27 2023-07-10 レジストパターンの検査方法、レジストパターンの製造方法、基板選別方法、及び、半導体パッケージ基板又はプリント配線板の製造方法

Publications (1)

Publication Number Publication Date
KR20250040966A true KR20250040966A (ko) 2025-03-25

Family

ID=89706233

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020257003900A Pending KR20250040966A (ko) 2022-07-27 2023-07-10 레지스트 패턴의 검사 방법, 레지스트 패턴의 제조 방법, 기판 선별 방법, 및, 반도체 패키지 기판 또는 프린트 배선판의 제조 방법

Country Status (5)

Country Link
JP (1) JPWO2024024484A1 (https=)
KR (1) KR20250040966A (https=)
CN (1) CN119546950A (https=)
TW (1) TW202422045A (https=)
WO (1) WO2024024484A1 (https=)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005207802A (ja) 2004-01-21 2005-08-04 Toshiba Corp レジストパターン検査方法及びその検査装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0294491A (ja) * 1988-09-29 1990-04-05 Hitachi Chem Co Ltd 印刷配線板用銅張積層板
JP2947601B2 (ja) * 1990-08-17 1999-09-13 三菱レイヨン株式会社 画像形成用樹脂組成物および蛍光検出方式自動外観検査方法
JP2000193596A (ja) * 1998-12-24 2000-07-14 Toshiba Corp 検査方法
JP2003243290A (ja) * 2002-02-15 2003-08-29 Seiko Epson Corp レジストパターンの欠陥検査方法及びその欠陥検査装置
JP2004233054A (ja) * 2003-01-28 2004-08-19 Furoobell:Kk 基板検査装置および方法
JP2012233790A (ja) * 2011-05-02 2012-11-29 Mitsubishi Electric Corp 光硬化性樹脂の検査装置および検査方法
JP2014009969A (ja) * 2012-06-27 2014-01-20 Sumitomo Metal Mining Co Ltd 画像処理装置、画像処理方法、及び露光パターン検査装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005207802A (ja) 2004-01-21 2005-08-04 Toshiba Corp レジストパターン検査方法及びその検査装置

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WO2024024484A1 (ja) 2024-02-01
JPWO2024024484A1 (https=) 2024-02-01
TW202422045A (zh) 2024-06-01
CN119546950A (zh) 2025-02-28

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