KR20250022887A - 기판 이송 장치 및 기판 이송 방법 - Google Patents

기판 이송 장치 및 기판 이송 방법 Download PDF

Info

Publication number
KR20250022887A
KR20250022887A KR1020257003162A KR20257003162A KR20250022887A KR 20250022887 A KR20250022887 A KR 20250022887A KR 1020257003162 A KR1020257003162 A KR 1020257003162A KR 20257003162 A KR20257003162 A KR 20257003162A KR 20250022887 A KR20250022887 A KR 20250022887A
Authority
KR
South Korea
Prior art keywords
pulley
band
end effector
substrate
chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020257003162A
Other languages
English (en)
Korean (ko)
Inventor
다니엘 밥스
빈센트 더블유. 창
로버트 씨. 메이
Original Assignee
브룩스 오토메이션 유에스, 엘엘씨
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 브룩스 오토메이션 유에스, 엘엘씨 filed Critical 브룩스 오토메이션 유에스, 엘엘씨
Publication of KR20250022887A publication Critical patent/KR20250022887A/ko
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J18/00—Arms
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
    • B65G47/90—Devices for picking-up and depositing articles or materials
    • H01L21/67742—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/0095—Manipulators transporting wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/0014—Gripping heads and other end effectors having fork, comb or plate shaped means for engaging the lower surface on a object to be transported
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/0052—Gripping heads and other end effectors multiple gripper units or multiple end effectors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Program-controlled manipulators
    • B25J9/02—Program-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
    • B25J9/04—Program-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
    • B25J9/041—Cylindrical coordinate type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Program-controlled manipulators
    • B25J9/02—Program-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
    • B25J9/04—Program-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
    • B25J9/041—Cylindrical coordinate type
    • B25J9/042—Cylindrical coordinate type comprising an articulated arm
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Program-controlled manipulators
    • B25J9/10—Program-controlled manipulators characterised by positioning means for manipulator elements
    • B25J9/104—Program-controlled manipulators characterised by positioning means for manipulator elements with cables, chains or ribbons
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16H—GEARING
    • F16H19/00—Gearings comprising essentially only toothed gears or friction members and not capable of conveying indefinitely-continuing rotary motion
    • F16H19/001—Gearings comprising essentially only toothed gears or friction members and not capable of conveying indefinitely-continuing rotary motion for conveying reciprocating or limited rotary motion
    • F16H19/003—Gearings comprising essentially only toothed gears or friction members and not capable of conveying indefinitely-continuing rotary motion for conveying reciprocating or limited rotary motion comprising a flexible member
    • F16H19/005—Gearings comprising essentially only toothed gears or friction members and not capable of conveying indefinitely-continuing rotary motion for conveying reciprocating or limited rotary motion comprising a flexible member for conveying oscillating or limited rotary motion
    • H01L21/67167—
    • H01L21/67196—
    • H01L21/68707—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0454—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers surrounding a central transfer chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0464—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the transfer chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3202—Mechanical details, e.g. rollers or belts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Robotics (AREA)
  • General Engineering & Computer Science (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
KR1020257003162A 2020-01-23 2021-01-25 기판 이송 장치 및 기판 이송 방법 Ceased KR20250022887A (ko)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US202062964817P 2020-01-23 2020-01-23
US62/964,817 2020-01-23
US17/156,007 2021-01-22
US17/156,007 US11235935B2 (en) 2020-01-23 2021-01-22 Substrate transport apparatus
PCT/US2021/014899 WO2021154640A1 (en) 2020-01-23 2021-01-25 Substrate transport apparatus
KR1020227029188A KR102763011B1 (ko) 2020-01-23 2021-01-25 기판 이송 장치

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020227029188A Division KR102763011B1 (ko) 2020-01-23 2021-01-25 기판 이송 장치

Publications (1)

Publication Number Publication Date
KR20250022887A true KR20250022887A (ko) 2025-02-17

Family

ID=76969728

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020257003162A Ceased KR20250022887A (ko) 2020-01-23 2021-01-25 기판 이송 장치 및 기판 이송 방법
KR1020227029188A Active KR102763011B1 (ko) 2020-01-23 2021-01-25 기판 이송 장치

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020227029188A Active KR102763011B1 (ko) 2020-01-23 2021-01-25 기판 이송 장치

Country Status (7)

Country Link
US (2) US11235935B2 (cg-RX-API-DMAC10.html)
EP (1) EP4094286A4 (cg-RX-API-DMAC10.html)
JP (1) JP7566916B2 (cg-RX-API-DMAC10.html)
KR (2) KR20250022887A (cg-RX-API-DMAC10.html)
CN (2) CN115280481A (cg-RX-API-DMAC10.html)
TW (2) TWI851868B (cg-RX-API-DMAC10.html)
WO (1) WO2021154640A1 (cg-RX-API-DMAC10.html)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI851868B (zh) * 2020-01-23 2024-08-11 美商布魯克斯自動機械美國公司 基板運送設備
US11413744B2 (en) * 2020-03-03 2022-08-16 Applied Materials, Inc. Multi-turn drive assembly and systems and methods of use thereof
US12163228B2 (en) * 2021-05-18 2024-12-10 Mellanox Technologies, Ltd. CVD system with substrate carrier and associated mechanisms for moving substrate therethrough
TWI881640B (zh) * 2022-12-28 2025-04-21 日商川崎重工業股份有限公司 基板搬送機器人
CN116750481A (zh) * 2023-06-09 2023-09-15 未来维度(深圳)科技有限公司 一种转运系统
US20250065509A1 (en) * 2023-08-21 2025-02-27 Applied Materials Israel Ltd. Robot blade and wafer breakage prevention system
CN116852339B (zh) * 2023-08-24 2024-10-29 上海广川科技有限公司 一种不等臂长的双臂机械手
JP2025099796A (ja) * 2023-12-22 2025-07-03 株式会社ダイヘン ベルト伝動機構およびこれを備えた搬送ロボット
CN120395789B (zh) * 2025-07-03 2025-09-02 中科芯微智能装备(沈阳)有限公司 一种真空机械手臂
CN121157004A (zh) * 2025-11-21 2025-12-19 沈阳新松半导体设备有限公司 一种基于从动端大角度旋转的传动机构

Family Cites Families (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6384887A (ja) * 1986-09-24 1988-04-15 三菱電機株式会社 ロボツトの駆動機構
JPS6384883A (ja) * 1986-09-24 1988-04-15 三菱電機株式会社 ロボツトの駆動機構
JPS6384883U (cg-RX-API-DMAC10.html) 1986-11-21 1988-06-03
JPH01240288A (ja) * 1988-03-18 1989-09-25 Mitsubishi Electric Corp 産業用ロボット
US4865577A (en) 1988-09-08 1989-09-12 Trustees Of Columbia University In The City Of New York Noncircular drive
JPH07122620A (ja) * 1993-10-25 1995-05-12 Tokyo Electron Ltd 動力伝達機構
US5682795A (en) * 1995-07-10 1997-11-04 Smart Machines Robotic joint using metal bands
US6428266B1 (en) * 1995-07-10 2002-08-06 Brooks Automation, Inc. Direct driven robot
US6547510B1 (en) 1998-05-04 2003-04-15 Brooks Automation Inc. Substrate transport apparatus with coaxial drive shafts and dual independent scara arms
JP3725355B2 (ja) * 1999-02-17 2005-12-07 三菱電機株式会社 ロボット装置のアーム駆動機構
JP3944108B2 (ja) 2003-03-31 2007-07-11 株式会社東芝 医療用マニピュレータの動力伝達機構およびマニピュレータ
US6794664B1 (en) 2003-12-04 2004-09-21 Axcelis Technologies, Inc. Umbilical cord facilities connection for an ion beam implanter
JP4473075B2 (ja) * 2004-08-27 2010-06-02 川崎重工業株式会社 搬送ロボットおよびそのアーム構造体
JP4816521B2 (ja) * 2007-03-15 2011-11-16 株式会社安川電機 ベルト伝動装置及びそれを備えたロボット
US8777547B2 (en) * 2009-01-11 2014-07-15 Applied Materials, Inc. Systems, apparatus and methods for transporting substrates
US8784033B2 (en) * 2009-01-11 2014-07-22 Applied Materials, Inc. Robot systems, apparatus and methods for transporting substrates
US8918203B2 (en) * 2011-03-11 2014-12-23 Brooks Automation, Inc. Substrate processing apparatus
US9076829B2 (en) 2011-08-08 2015-07-07 Applied Materials, Inc. Robot systems, apparatus, and methods adapted to transport substrates in electronic device manufacturing
KR102153608B1 (ko) * 2012-07-05 2020-09-08 어플라이드 머티어리얼스, 인코포레이티드 전자 디바이스 제조 시스템들에서 기판들을 운송하기 위한 붐 구동 장치, 멀티-아암 로봇 장치, 전자 디바이스 프로세싱 시스템들, 및 방법들
JP2014124741A (ja) * 2012-12-27 2014-07-07 Seiko Epson Corp エンドエフェクター
US9149936B2 (en) 2013-01-18 2015-10-06 Persimmon Technologies, Corp. Robot having arm with unequal link lengths
TWI803777B (zh) * 2013-08-26 2023-06-01 美商布魯克斯自動機械美國公司 基板搬運裝置
KR102285254B1 (ko) 2013-08-26 2021-08-03 브룩스 오토메이션 인코퍼레이티드 기판 이송 장치
JP6550391B2 (ja) * 2014-01-05 2019-07-24 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 電子デバイス製造において基板を搬送するためのロボット装置、駆動アセンブリ、及び方法
JP6431309B2 (ja) * 2014-07-30 2018-11-28 日本電産サンキョー株式会社 産業用ロボット
CN104948687B (zh) * 2015-05-07 2019-03-19 东方晶源微电子科技（北京）有限公司 一种适用于光机检测系统的带传动机构
US11270904B2 (en) * 2016-07-12 2022-03-08 Brooks Automation Us, Llc Substrate processing apparatus
JP6384883B1 (ja) 2017-03-27 2018-09-05 株式会社サンセイアールアンドディ 遊技機
US10155309B1 (en) * 2017-11-16 2018-12-18 Lam Research Corporation Wafer handling robots with rotational joint encoders
US11192239B2 (en) * 2018-10-05 2021-12-07 Brooks Automation, Inc. Substrate processing apparatus
TWI851868B (zh) * 2020-01-23 2024-08-11 美商布魯克斯自動機械美國公司 基板運送設備
US11413744B2 (en) * 2020-03-03 2022-08-16 Applied Materials, Inc. Multi-turn drive assembly and systems and methods of use thereof

Also Published As

Publication number Publication date
CN119650486A (zh) 2025-03-18
JP7566916B2 (ja) 2024-10-15
TWI851868B (zh) 2024-08-11
US20210229934A1 (en) 2021-07-29
EP4094286A4 (en) 2024-03-06
EP4094286A1 (en) 2022-11-30
US12162698B2 (en) 2024-12-10
US20220153535A1 (en) 2022-05-19
KR20220131978A (ko) 2022-09-29
TWI920643B (zh) 2026-04-01
KR102763011B1 (ko) 2025-02-05
TW202138143A (zh) 2021-10-16
CN115280481A (zh) 2022-11-01
US11235935B2 (en) 2022-02-01
WO2021154640A1 (en) 2021-08-05
JP2023522528A (ja) 2023-05-31
TW202508789A (zh) 2025-03-01

Similar Documents

Publication Publication Date Title
KR102763011B1 (ko) 기판 이송 장치
US11691267B2 (en) Substrate processing apparatus
US10134621B2 (en) Substrate transport apparatus
JP7263636B2 (ja) 基板処理装置の基板の搬送アームのための操作の方法および基板搬送装置
US12046499B2 (en) Substrate processing apparatus
KR102618895B1 (ko) 기판 처리 툴
US20230245910A1 (en) Substrate processing apparatus
US20230197493A1 (en) Substrate transport apparatus
TWI803777B (zh) 基板搬運裝置
TWI894199B (zh) 基材處理設備及其使用方法

Legal Events

Date Code Title Description
A107 Divisional application of patent
PA0104 Divisional application for international application

St.27 status event code: A-0-1-A10-A16-div-PA0104

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

A201 Request for examination
PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

D21 Rejection of application intended

Free format text: ST27 STATUS EVENT CODE: A-1-2-D10-D21-EXM-PE0902 (AS PROVIDED BY THE NATIONAL OFFICE)

PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

B15 Application refused following examination

Free format text: ST27 STATUS EVENT CODE: N-2-6-B10-B15-EXM-PE0601 (AS PROVIDED BY THE NATIONAL OFFICE)

PE0601 Decision on rejection of patent

St.27 status event code: N-2-6-B10-B15-exm-PE0601