TWI851868B - 基板運送設備 - Google Patents

基板運送設備 Download PDF

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Publication number
TWI851868B
TWI851868B TW110102494A TW110102494A TWI851868B TW I851868 B TWI851868 B TW I851868B TW 110102494 A TW110102494 A TW 110102494A TW 110102494 A TW110102494 A TW 110102494A TW I851868 B TWI851868 B TW I851868B
Authority
TW
Taiwan
Prior art keywords
pulley
belt
end effector
drive
substrate transport
Prior art date
Application number
TW110102494A
Other languages
English (en)
Chinese (zh)
Other versions
TW202138143A (zh
Inventor
丹尼爾 巴比斯
文森 曾
羅勃 美伊
Original Assignee
美商布魯克斯自動機械美國公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 美商布魯克斯自動機械美國公司 filed Critical 美商布魯克斯自動機械美國公司
Publication of TW202138143A publication Critical patent/TW202138143A/zh
Application granted granted Critical
Publication of TWI851868B publication Critical patent/TWI851868B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J18/00—Arms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
    • B65G47/90—Devices for picking-up and depositing articles or materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/0095—Manipulators transporting wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/0014—Gripping heads and other end effectors having fork, comb or plate shaped means for engaging the lower surface on a object to be transported
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/0052—Gripping heads and other end effectors multiple gripper units or multiple end effectors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Program-controlled manipulators
    • B25J9/02—Program-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
    • B25J9/04—Program-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
    • B25J9/041—Cylindrical coordinate type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Program-controlled manipulators
    • B25J9/02—Program-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
    • B25J9/04—Program-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
    • B25J9/041—Cylindrical coordinate type
    • B25J9/042—Cylindrical coordinate type comprising an articulated arm
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Program-controlled manipulators
    • B25J9/10—Program-controlled manipulators characterised by positioning means for manipulator elements
    • B25J9/104—Program-controlled manipulators characterised by positioning means for manipulator elements with cables, chains or ribbons
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16H—GEARING
    • F16H19/00—Gearings comprising essentially only toothed gears or friction members and not capable of conveying indefinitely-continuing rotary motion
    • F16H19/001—Gearings comprising essentially only toothed gears or friction members and not capable of conveying indefinitely-continuing rotary motion for conveying reciprocating or limited rotary motion
    • F16H19/003—Gearings comprising essentially only toothed gears or friction members and not capable of conveying indefinitely-continuing rotary motion for conveying reciprocating or limited rotary motion comprising a flexible member
    • F16H19/005—Gearings comprising essentially only toothed gears or friction members and not capable of conveying indefinitely-continuing rotary motion for conveying reciprocating or limited rotary motion comprising a flexible member for conveying oscillating or limited rotary motion
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0454—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers surrounding a central transfer chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0464—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the transfer chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3202—Mechanical details, e.g. rollers or belts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Robotics (AREA)
  • General Engineering & Computer Science (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
TW110102494A 2020-01-23 2021-01-22 基板運送設備 TWI851868B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US202062964817P 2020-01-23 2020-01-23
US62/964,817 2020-01-23

Publications (2)

Publication Number Publication Date
TW202138143A TW202138143A (zh) 2021-10-16
TWI851868B true TWI851868B (zh) 2024-08-11

Family

ID=76969728

Family Applications (2)

Application Number Title Priority Date Filing Date
TW110102494A TWI851868B (zh) 2020-01-23 2021-01-22 基板運送設備
TW113126367A TWI920643B (zh) 2020-01-23 2021-01-22 基板運送設備及運送基板的方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW113126367A TWI920643B (zh) 2020-01-23 2021-01-22 基板運送設備及運送基板的方法

Country Status (7)

Country Link
US (2) US11235935B2 (cg-RX-API-DMAC10.html)
EP (1) EP4094286A4 (cg-RX-API-DMAC10.html)
JP (1) JP7566916B2 (cg-RX-API-DMAC10.html)
KR (2) KR20250022887A (cg-RX-API-DMAC10.html)
CN (2) CN115280481A (cg-RX-API-DMAC10.html)
TW (2) TWI851868B (cg-RX-API-DMAC10.html)
WO (1) WO2021154640A1 (cg-RX-API-DMAC10.html)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI851868B (zh) * 2020-01-23 2024-08-11 美商布魯克斯自動機械美國公司 基板運送設備
US11413744B2 (en) * 2020-03-03 2022-08-16 Applied Materials, Inc. Multi-turn drive assembly and systems and methods of use thereof
US12163228B2 (en) * 2021-05-18 2024-12-10 Mellanox Technologies, Ltd. CVD system with substrate carrier and associated mechanisms for moving substrate therethrough
TWI881640B (zh) * 2022-12-28 2025-04-21 日商川崎重工業股份有限公司 基板搬送機器人
CN116750481A (zh) * 2023-06-09 2023-09-15 未来维度(深圳)科技有限公司 一种转运系统
US20250065509A1 (en) * 2023-08-21 2025-02-27 Applied Materials Israel Ltd. Robot blade and wafer breakage prevention system
CN116852339B (zh) * 2023-08-24 2024-10-29 上海广川科技有限公司 一种不等臂长的双臂机械手
JP2025099796A (ja) * 2023-12-22 2025-07-03 株式会社ダイヘン ベルト伝動機構およびこれを備えた搬送ロボット
CN120395789B (zh) * 2025-07-03 2025-09-02 中科芯微智能装备(沈阳)有限公司 一种真空机械手臂
CN121157004A (zh) * 2025-11-21 2025-12-19 沈阳新松半导体设备有限公司 一种基于从动端大角度旋转的传动机构

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US20100178146A1 (en) * 2009-01-11 2010-07-15 Applied Materials, Inc. Systems, apparatus and methods for transporting substrates
US20150190933A1 (en) * 2014-01-05 2015-07-09 Applied Materials, Inc. Robot apparatus, drive assemblies, and methods for transporting substrates in electronic device manufacturing
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US6794664B1 (en) * 2003-12-04 2004-09-21 Axcelis Technologies, Inc. Umbilical cord facilities connection for an ion beam implanter
US20100178146A1 (en) * 2009-01-11 2010-07-15 Applied Materials, Inc. Systems, apparatus and methods for transporting substrates
TWI577510B (zh) * 2012-07-05 2017-04-11 應用材料股份有限公司 吊桿驅動裝置、多重手臂機器人裝置、電子設備處理系統及在電子設備製造系統中用於運送基板的方法
US20150190933A1 (en) * 2014-01-05 2015-07-09 Applied Materials, Inc. Robot apparatus, drive assemblies, and methods for transporting substrates in electronic device manufacturing

Also Published As

Publication number Publication date
CN119650486A (zh) 2025-03-18
JP7566916B2 (ja) 2024-10-15
US20210229934A1 (en) 2021-07-29
EP4094286A4 (en) 2024-03-06
EP4094286A1 (en) 2022-11-30
US12162698B2 (en) 2024-12-10
US20220153535A1 (en) 2022-05-19
KR20220131978A (ko) 2022-09-29
TWI920643B (zh) 2026-04-01
KR102763011B1 (ko) 2025-02-05
TW202138143A (zh) 2021-10-16
CN115280481A (zh) 2022-11-01
US11235935B2 (en) 2022-02-01
WO2021154640A1 (en) 2021-08-05
JP2023522528A (ja) 2023-05-31
TW202508789A (zh) 2025-03-01
KR20250022887A (ko) 2025-02-17

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