KR20250012736A - Euv 리소그래피용 반사형 마스크 블랭크, euv 리소그래피용 반사형 마스크 및 그들의 제조 방법 - Google Patents
Euv 리소그래피용 반사형 마스크 블랭크, euv 리소그래피용 반사형 마스크 및 그들의 제조 방법 Download PDFInfo
- Publication number
- KR20250012736A KR20250012736A KR1020257001411A KR20257001411A KR20250012736A KR 20250012736 A KR20250012736 A KR 20250012736A KR 1020257001411 A KR1020257001411 A KR 1020257001411A KR 20257001411 A KR20257001411 A KR 20257001411A KR 20250012736 A KR20250012736 A KR 20250012736A
- Authority
- KR
- South Korea
- Prior art keywords
- film
- gas
- mask blank
- etching
- euv lithography
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/08—Mirrors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/22—Masks or mask blanks for imaging by radiation of 100nm or shorter wavelength, e.g. X-ray masks, extreme ultraviolet [EUV] masks; Preparation thereof
- G03F1/24—Reflection masks; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/38—Masks having auxiliary features, e.g. special coatings or marks for alignment or testing; Preparation thereof
- G03F1/48—Protective coatings
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/54—Absorbers, e.g. of opaque materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
- G03F1/80—Etching
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P50/00—Etching of wafers, substrates or parts of devices
- H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
- H10P50/24—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials
- H10P50/242—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials of Group IV materials
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Optics & Photonics (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Physical Vapour Deposition (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020201198 | 2020-12-03 | ||
| JPJP-P-2020-201198 | 2020-12-03 | ||
| JP2021174692 | 2021-10-26 | ||
| JPJP-P-2021-174692 | 2021-10-26 | ||
| KR1020237017782A KR102780958B1 (ko) | 2020-12-03 | 2021-11-26 | Euv 리소그래피용 반사형 마스크 블랭크, euv 리소그래피용 반사형 마스크 및 그들의 제조 방법 |
| PCT/JP2021/043502 WO2022118762A1 (ja) | 2020-12-03 | 2021-11-26 | Euvリソグラフィ用反射型マスクブランク、euvリソグラフィ用反射型マスク、およびそれらの製造方法 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020237017782A Division KR102780958B1 (ko) | 2020-12-03 | 2021-11-26 | Euv 리소그래피용 반사형 마스크 블랭크, euv 리소그래피용 반사형 마스크 및 그들의 제조 방법 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20250012736A true KR20250012736A (ko) | 2025-01-24 |
Family
ID=81853913
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020257001411A Pending KR20250012736A (ko) | 2020-12-03 | 2021-11-26 | Euv 리소그래피용 반사형 마스크 블랭크, euv 리소그래피용 반사형 마스크 및 그들의 제조 방법 |
| KR1020237017782A Active KR102780958B1 (ko) | 2020-12-03 | 2021-11-26 | Euv 리소그래피용 반사형 마스크 블랭크, euv 리소그래피용 반사형 마스크 및 그들의 제조 방법 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020237017782A Active KR102780958B1 (ko) | 2020-12-03 | 2021-11-26 | Euv 리소그래피용 반사형 마스크 블랭크, euv 리소그래피용 반사형 마스크 및 그들의 제조 방법 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20230288794A1 (https=) |
| JP (3) | JP7485084B2 (https=) |
| KR (2) | KR20250012736A (https=) |
| TW (1) | TWI912418B (https=) |
| WO (1) | WO2022118762A1 (https=) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7612408B2 (ja) * | 2020-12-22 | 2025-01-14 | Hoya株式会社 | 反射型マスクブランク、反射型マスク、反射型マスクの製造方法、及び半導体デバイスの製造方法 |
| WO2022138434A1 (ja) * | 2020-12-25 | 2022-06-30 | Hoya株式会社 | 多層反射膜付き基板、反射型マスクブランク、反射型マスク、及び半導体装置の製造方法 |
| US12181790B2 (en) * | 2021-03-03 | 2024-12-31 | Shin-Etsu Chemical Co., Ltd. | Reflective mask blank and reflective mask |
| JP7392236B1 (ja) | 2022-07-05 | 2023-12-06 | Agc株式会社 | 反射型マスクブランク、反射型マスク、反射型マスクブランクの製造方法、および反射型マスクの製造方法 |
| WO2024009819A1 (ja) | 2022-07-05 | 2024-01-11 | Agc株式会社 | 反射型マスクブランク、反射型マスク、反射型マスクブランクの製造方法、および反射型マスクの製造方法 |
| WO2024024513A1 (ja) * | 2022-07-25 | 2024-02-01 | Agc株式会社 | 反射型マスクブランク、反射型マスク、反射型マスクブランクの製造方法、および反射型マスクの製造方法 |
| CN116165848B (zh) * | 2022-09-08 | 2026-04-21 | 苏州江泓电子科技有限公司 | 一种多层膜材料、极紫外光反射镜及其制备方法和应用 |
| WO2024162084A1 (ja) * | 2023-01-31 | 2024-08-08 | Agc株式会社 | 反射型マスクブランク、反射型マスク、反射型マスクブランクの製造方法、および反射型マスクの製造方法 |
| JP2025027983A (ja) * | 2023-08-16 | 2025-02-28 | 信越化学工業株式会社 | 反射型マスクブランク、及び反射型マスクの製造方法 |
| JP7681153B1 (ja) | 2024-04-11 | 2025-05-21 | テクセンドフォトマスク株式会社 | 反射型フォトマスクブランク、反射型フォトマスク及び反射型フォトマスクの製造方法 |
| WO2025239179A1 (ja) * | 2024-05-13 | 2025-11-20 | Agc株式会社 | 反射型マスクブランク、反射型マスク、反射型マスクの製造方法 |
| WO2025253899A1 (ja) * | 2024-06-03 | 2025-12-11 | Agc株式会社 | 反射型マスクブランク、反射型マスクおよび反射型マスクの製造方法 |
| WO2026042468A1 (ja) * | 2024-08-22 | 2026-02-26 | Agc株式会社 | 反射型マスクブランク、反射型マスクブランクの製造方法、反射型マスク、反射型マスクの製造方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6343690U (https=) | 1986-09-09 | 1988-03-23 | ||
| JP3366572B2 (ja) | 1998-06-08 | 2003-01-14 | 富士通株式会社 | X線露光用マスク及びその作成方法 |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI267704B (en) | 1999-07-02 | 2006-12-01 | Asml Netherlands Bv | Capping layer for EUV optical elements |
| US20030008148A1 (en) | 2001-07-03 | 2003-01-09 | Sasa Bajt | Optimized capping layers for EUV multilayers |
| DE10150874A1 (de) * | 2001-10-04 | 2003-04-30 | Zeiss Carl | Optisches Element und Verfahren zu dessen Herstellung sowie ein Lithographiegerät und ein Verfahren zur Herstellung eines Halbleiterbauelements |
| JP2006173446A (ja) * | 2004-12-17 | 2006-06-29 | Nikon Corp | 極端紫外線用の光学素子及びこれを用いた投影露光装置 |
| JP2006173502A (ja) * | 2004-12-17 | 2006-06-29 | Nikon Corp | 光学素子及びこれを用いた投影露光装置 |
| KR20110065439A (ko) * | 2008-09-05 | 2011-06-15 | 아사히 가라스 가부시키가이샤 | Euv 리소그래피용 반사형 마스크 블랭크 및 그 제조 방법 |
| DE102009054986B4 (de) | 2009-12-18 | 2015-11-12 | Carl Zeiss Smt Gmbh | Reflektive Maske für die EUV-Lithographie |
| JP6377361B2 (ja) * | 2013-02-11 | 2018-08-22 | Hoya株式会社 | 多層反射膜付き基板及びその製造方法、反射型マスクブランクの製造方法、反射型マスクの製造方法、並びに半導体装置の製造方法 |
| JP2014229825A (ja) * | 2013-05-24 | 2014-12-08 | 旭硝子株式会社 | Euvリソグラフィ用反射型マスクブランクの製造方法および、該マスクブランク用の反射層付基板の製造方法 |
| JP6408790B2 (ja) | 2013-05-31 | 2018-10-17 | Hoya株式会社 | 反射型マスクブランク、反射型マスク及びその製造方法、並びに半導体装置の製造方法 |
| JP6470176B2 (ja) * | 2013-07-22 | 2019-02-13 | Hoya株式会社 | 多層反射膜付き基板、euvリソグラフィー用反射型マスクブランク、euvリソグラフィー用反射型マスク及びその製造方法、並びに半導体装置の製造方法 |
| WO2015046303A1 (ja) * | 2013-09-27 | 2015-04-02 | Hoya株式会社 | 多層反射膜付き基板、マスクブランク、転写用マスク及び半導体装置の製造方法 |
| JP2015073013A (ja) * | 2013-10-03 | 2015-04-16 | 旭硝子株式会社 | Euvリソグラフィ用反射型マスクブランクの製造方法 |
| JP2015109366A (ja) * | 2013-12-05 | 2015-06-11 | 旭硝子株式会社 | Euvリソグラフィ用反射型マスクブランク若しくはeuvリソグラフィ用の反射層付基板、およびその製造方法 |
| US10061191B2 (en) * | 2016-06-01 | 2018-08-28 | Taiwan Semiconductor Manufacturing Co., Ltd. | High durability extreme ultraviolet photomask |
| JP6845122B2 (ja) * | 2017-11-27 | 2021-03-17 | Hoya株式会社 | 反射型マスクブランク、反射型マスク及びその製造方法、並びに半導体装置の製造方法 |
| KR102402767B1 (ko) * | 2017-12-21 | 2022-05-26 | 삼성전자주식회사 | 극자외선 마스크 블랭크, 극자외선 마스크 블랭크를 이용하여 제조된 포토마스크, 포토마스크를 이용한 리소그래피 장치 및 포토마스크를 이용한 반도체 장치 제조 방법 |
| TWI811369B (zh) * | 2018-05-25 | 2023-08-11 | 日商Hoya股份有限公司 | 反射型光罩基底、反射型光罩、以及反射型光罩及半導體裝置之製造方法 |
| SG11202109240PA (en) * | 2019-02-28 | 2021-09-29 | Hoya Corp | Reflective mask blank, reflective mask and method of manufacturing the same, and method of manufacturing semiconductor device |
-
2021
- 2021-11-26 KR KR1020257001411A patent/KR20250012736A/ko active Pending
- 2021-11-26 KR KR1020237017782A patent/KR102780958B1/ko active Active
- 2021-11-26 JP JP2022566893A patent/JP7485084B2/ja active Active
- 2021-11-26 WO PCT/JP2021/043502 patent/WO2022118762A1/ja not_active Ceased
- 2021-12-01 TW TW110144813A patent/TWI912418B/zh active
-
2023
- 2023-05-23 US US18/321,913 patent/US20230288794A1/en active Pending
-
2024
- 2024-04-19 JP JP2024068078A patent/JP7605362B2/ja active Active
- 2024-12-04 JP JP2024210865A patent/JP2025029113A/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6343690U (https=) | 1986-09-09 | 1988-03-23 | ||
| JP3366572B2 (ja) | 1998-06-08 | 2003-01-14 | 富士通株式会社 | X線露光用マスク及びその作成方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202230019A (zh) | 2022-08-01 |
| TWI912418B (zh) | 2026-01-21 |
| JP2024099662A (ja) | 2024-07-25 |
| JP7605362B2 (ja) | 2024-12-24 |
| KR20230109644A (ko) | 2023-07-20 |
| JPWO2022118762A1 (https=) | 2022-06-09 |
| JP7485084B2 (ja) | 2024-05-16 |
| JP2025029113A (ja) | 2025-03-05 |
| US20230288794A1 (en) | 2023-09-14 |
| KR102780958B1 (ko) | 2025-03-17 |
| WO2022118762A1 (ja) | 2022-06-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR102780958B1 (ko) | Euv 리소그래피용 반사형 마스크 블랭크, euv 리소그래피용 반사형 마스크 및 그들의 제조 방법 | |
| US12216397B2 (en) | Reflective mask blank for EUV lithography, mask blank for EUV lithography, and manufacturing methods thereof | |
| US9097976B2 (en) | Reflective mask blank for EUV lithography | |
| JP6287099B2 (ja) | Euvリソグラフィ用反射型マスクブランク | |
| JP5590113B2 (ja) | Euvリソグラフィ用反射型マスクブランクおよびその製造方法 | |
| US8288062B2 (en) | Reflective mask blank for EUV lithography | |
| US8137872B2 (en) | Reflective mask blank for EUV lithography | |
| JP5708651B2 (ja) | Euvリソグラフィ用反射型マスクブランク | |
| KR20130007533A (ko) | Euv 리소그래피용 광학 부재 | |
| SG11202112745RA (en) | Reflective mask blank for euv lithography | |
| JP7428287B2 (ja) | Euvリソグラフィ用反射型マスクブランク、euvリソグラフィ用反射型マスク、およびそれらの製造方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A107 | Divisional application of patent | ||
| PA0104 | Divisional application for international application |
St.27 status event code: A-0-1-A10-A18-div-PA0104 St.27 status event code: A-0-1-A10-A16-div-PA0104 |
|
| PA0201 | Request for examination |
St.27 status event code: A-1-2-D10-D11-exm-PA0201 |
|
| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| D21 | Rejection of application intended |
Free format text: ST27 STATUS EVENT CODE: A-1-2-D10-D21-EXM-PE0902 (AS PROVIDED BY THE NATIONAL OFFICE) |
|
| PE0902 | Notice of grounds for rejection |
St.27 status event code: A-1-2-D10-D21-exm-PE0902 |
|
| P11 | Amendment of application requested |
Free format text: ST27 STATUS EVENT CODE: A-2-2-P10-P11-NAP-X000 (AS PROVIDED BY THE NATIONAL OFFICE) |
|
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |