Classifications

• • H01L21/67754—
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
  • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
  • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
  • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
  • H10P72/3311—Horizontal transfer of a batch of workpieces
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
  • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
  • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
  • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
  • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
  • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
  • B25J9/00—Program-controlled manipulators
  • B25J9/0084—Program-controlled manipulators comprising a plurality of manipulators
  • B25J9/0087—Dual arms
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
  • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
  • B25J9/00—Program-controlled manipulators
  • B25J9/02—Program-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
  • B25J9/04—Program-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
  • B25J9/041—Cylindrical coordinate type
  • B25J9/042—Cylindrical coordinate type comprising an articulated arm
  • B25J9/043—Cylindrical coordinate type comprising an articulated arm double selective compliance articulated robot arms [SCARA]
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
  • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
  • B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
  • B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
  • B65G47/90—Devices for picking-up and depositing articles or materials
• • H01L21/67196—
• • H01L21/67742—
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
  • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
  • H10P72/04—Apparatus for manufacture or treatment
  • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
  • H10P72/0464—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the transfer chamber
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
  • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
  • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
  • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
  • H10P72/3302—Mechanical parts of transfer devices

Landscapes

• Engineering & Computer Science (AREA)
• Mechanical Engineering (AREA)
• Robotics (AREA)
• Manipulator (AREA)
• Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
• Physical Vapour Deposition (AREA)
• Chemical Vapour Deposition (AREA)

Applications Claiming Priority (3)

Publications (1)

Family

ID=86613122

Family Applications (1)

Country Status (7)

Families Citing this family (1)

Family Cites Families (7)

• 2022
  • 2022-12-01 KR KR1020247022079A patent/KR20240112941A/ko active Pending
  • 2022-12-01 US US18/715,235 patent/US20250046643A1/en active Pending
  • 2022-12-01 JP JP2024532666A patent/JP2024544192A/ja active Pending
  • 2022-12-01 EP EP22902408.8A patent/EP4441779A4/en active Pending
  • 2022-12-01 WO PCT/US2022/080775 patent/WO2023102497A1/en not_active Ceased
  • 2022-12-01 CN CN202280090762.8A patent/CN118661249A/zh active Pending
  • 2022-12-02 TW TW111146286A patent/TW202342249A/zh unknown

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