KR20240063124A - 납프리 쾌삭 베릴륨 동합금 - Google Patents

납프리 쾌삭 베릴륨 동합금 Download PDF

Info

Publication number
KR20240063124A
KR20240063124A KR1020247009790A KR20247009790A KR20240063124A KR 20240063124 A KR20240063124 A KR 20240063124A KR 1020247009790 A KR1020247009790 A KR 1020247009790A KR 20247009790 A KR20247009790 A KR 20247009790A KR 20240063124 A KR20240063124 A KR 20240063124A
Authority
KR
South Korea
Prior art keywords
free
copper alloy
cutting
beryllium copper
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020247009790A
Other languages
English (en)
Korean (ko)
Inventor
히로미츠 우치야마
고키 치바
Original Assignee
엔지케이 인슐레이터 엘티디
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엔지케이 인슐레이터 엘티디 filed Critical 엔지케이 인슐레이터 엘티디
Publication of KR20240063124A publication Critical patent/KR20240063124A/ko
Pending legal-status Critical Current

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/10—Alloys based on copper with silicon as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Conductive Materials (AREA)
  • Lead Frames For Integrated Circuits (AREA)
KR1020247009790A 2022-10-28 2023-09-01 납프리 쾌삭 베릴륨 동합금 Pending KR20240063124A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022173377 2022-10-28
JPJP-P-2022-173377 2022-10-28
PCT/JP2023/032138 WO2024090037A1 (ja) 2022-10-28 2023-09-01 鉛フリー快削ベリリウム銅合金

Publications (1)

Publication Number Publication Date
KR20240063124A true KR20240063124A (ko) 2024-05-09

Family

ID=90830435

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020247009790A Pending KR20240063124A (ko) 2022-10-28 2023-09-01 납프리 쾌삭 베릴륨 동합금

Country Status (7)

Country Link
US (1) US20240263277A1 (https=)
EP (1) EP4394064A4 (https=)
JP (1) JP7742932B2 (https=)
KR (1) KR20240063124A (https=)
CN (1) CN118265806A (https=)
TW (1) TWI866458B (https=)
WO (1) WO2024090037A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118910463A (zh) * 2024-10-10 2024-11-08 国工恒昌新材料(义乌)有限公司 一种vcm弹片用高导电率铍铜箔材及其制备方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000119775A (ja) 1998-10-12 2000-04-25 Sanbo Copper Alloy Co Ltd 無鉛快削性銅合金
JP2021042459A (ja) 2019-06-25 2021-03-18 三菱マテリアル株式会社 快削性銅合金、及び、快削性銅合金の製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4425168A (en) * 1982-09-07 1984-01-10 Cabot Corporation Copper beryllium alloy and the manufacture thereof
JPS63125648A (ja) * 1986-11-13 1988-05-28 Ngk Insulators Ltd ベリリウム銅合金の製造法
JPS63143247A (ja) * 1986-12-06 1988-06-15 Ngk Insulators Ltd 鋳造方法
JP3378430B2 (ja) * 1996-03-28 2003-02-17 日本碍子株式会社 耐熱性および曲げ部の美観に優れる高強度ベリリウム銅合金
JP3316191B2 (ja) * 1998-12-24 2002-08-19 日本碍子株式会社 鏡面性に優れたベリリウム−銅−亜鉛合金
JP5135496B2 (ja) * 2007-06-01 2013-02-06 Ｄｏｗａメタルテック株式会社 Ｃｕ−Ｂｅ系銅合金板材およびその製造法
CN111057886B (zh) * 2019-10-29 2021-06-22 宁夏中色新材料有限公司 一种铍铜铸轧辊套的制备方法和铍铜铸轧辊套
JP2021155837A (ja) * 2020-03-30 2021-10-07 日本碍子株式会社 ベリリウム銅合金リング及びその製造方法
CN113174509B (zh) * 2021-03-15 2022-10-14 江阴金湾合金材料有限公司 一种高强度铍铜合金棒及其制备工艺

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000119775A (ja) 1998-10-12 2000-04-25 Sanbo Copper Alloy Co Ltd 無鉛快削性銅合金
JP2021042459A (ja) 2019-06-25 2021-03-18 三菱マテリアル株式会社 快削性銅合金、及び、快削性銅合金の製造方法

Also Published As

Publication number Publication date
WO2024090037A1 (ja) 2024-05-02
CN118265806A (zh) 2024-06-28
EP4394064A1 (en) 2024-07-03
JP7742932B2 (ja) 2025-09-22
US20240263277A1 (en) 2024-08-08
TWI866458B (zh) 2024-12-11
TW202428897A (zh) 2024-07-16
EP4394064A4 (en) 2026-03-18
JPWO2024090037A1 (https=) 2024-05-02

Similar Documents

Publication Publication Date Title
KR101615830B1 (ko) 전자 기기용 구리 합금, 전자 기기용 구리 합금의 제조 방법, 전자 기기용 구리 합금 소성 가공재 및 전자 기기용 부품
KR102437192B1 (ko) 고강도·고도전성 구리 합금 판재 및 그 제조 방법
CN113348262A (zh) 制造铝合金零件的方法
JP5520533B2 (ja) 銅合金材およびその製造方法
WO2020261666A1 (ja) 快削性銅合金、及び、快削性銅合金の製造方法
WO1993016206A1 (en) Alloys of molybdenum, rhenium and tungsten
WO2015029986A1 (ja) 銅合金板材およびその製造方法並びに通電部品
CN111032892B (zh) 铜合金线材和铜合金线材的制造方法
WO2019189558A1 (ja) 電子・電気機器用銅合金、電子・電気機器用銅合金板条材、電子・電気機器用部品、端子、及び、バスバー
WO2017047368A1 (ja) 銅合金板材およびその製造方法
JP2019178398A (ja) 電子・電気機器用銅合金、電子・電気機器用銅合金板条材、電子・電気機器用部品、端子、及び、バスバー
US9375811B2 (en) Active metal brazing material
EP3608430A1 (en) Cu-co-si system copper alloy sheet material and method for producing same, and part using the sheet material
WO2019189534A1 (ja) 電子・電気機器用銅合金、電子・電気機器用銅合金板条材、電子・電気機器用部品、端子、及び、バスバー
JP5954483B2 (ja) 鉛快削鋼
TWI502084B (zh) 電子．電氣機器用銅合金、電子．電氣機器用零件及端子
JP2006265731A (ja) 銅合金
KR20240063124A (ko) 납프리 쾌삭 베릴륨 동합금
CN110573635B (zh) 铜合金板材及其制造方法
JP4424503B2 (ja) 棒鋼・線材
JP6389414B2 (ja) 銅合金板材の製造方法
JP3552608B2 (ja) 耐部分腐食性に優れ疲労強度が高いアルミニウム合金押出加工品の製造方法
JP7845826B2 (ja) アルミニウム合金、積層造形物の製造方法および積層造形物
KR102915755B1 (ko) Cu-Ag계 합금선
JP4459067B2 (ja) 高強度高導電性銅合金

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

D21 Rejection of application intended

Free format text: ST27 STATUS EVENT CODE: A-1-2-D10-D21-EXM-PE0902 (AS PROVIDED BY THE NATIONAL OFFICE)

PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11 Amendment of application requested

Free format text: ST27 STATUS EVENT CODE: A-2-2-P10-P11-NAP-X000 (AS PROVIDED BY THE NATIONAL OFFICE)

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

PN2301 Change of applicant

St.27 status event code: A-3-3-R10-R13-asn-PN2301

St.27 status event code: A-3-3-R10-R11-asn-PN2301