KR20240015615A - 레이저 가공 장치 - Google Patents
레이저 가공 장치 Download PDFInfo
- Publication number
- KR20240015615A KR20240015615A KR1020237027903A KR20237027903A KR20240015615A KR 20240015615 A KR20240015615 A KR 20240015615A KR 1020237027903 A KR1020237027903 A KR 1020237027903A KR 20237027903 A KR20237027903 A KR 20237027903A KR 20240015615 A KR20240015615 A KR 20240015615A
- Authority
- KR
- South Korea
- Prior art keywords
- laser
- unit
- laser light
- incident surface
- displacement information
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/26—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes
- G01B11/27—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes for testing the alignment of axes
- G01B11/272—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes for testing the alignment of axes using photoelectric detection means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
- B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
- B23K26/046—Automatically focusing the laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
- B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Laser Beam Processing (AREA)
- Length Measuring Devices By Optical Means (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP-P-2021-092245 | 2021-06-01 | ||
| JP2021092245 | 2021-06-01 | ||
| PCT/JP2022/009218 WO2022254844A1 (ja) | 2021-06-01 | 2022-03-03 | レーザ加工装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20240015615A true KR20240015615A (ko) | 2024-02-05 |
Family
ID=84324187
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020237027903A Pending KR20240015615A (ko) | 2021-06-01 | 2022-03-03 | 레이저 가공 장치 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPWO2022254844A1 (https=) |
| KR (1) | KR20240015615A (https=) |
| CN (1) | CN117412830A (https=) |
| TW (1) | TWI912496B (https=) |
| WO (1) | WO2022254844A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118089565B (zh) * | 2024-04-23 | 2024-07-02 | 常州奥瑞克精密测量系统有限公司 | 一种具有多点式多姿态激光同轴度校验装置及方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008087053A (ja) | 2006-10-03 | 2008-04-17 | Hamamatsu Photonics Kk | レーザ加工方法 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11201719A (ja) * | 1998-01-09 | 1999-07-30 | Nikon Corp | 位置測定装置及びレーザ加工装置 |
| DE502004001360D1 (de) * | 2004-07-30 | 2006-10-12 | Innolas Gmbh | Waferbearbeitungsvorrichtung und zugehöriges Verfahren |
| JP4555092B2 (ja) * | 2005-01-05 | 2010-09-29 | 株式会社ディスコ | レーザー加工装置 |
| JP4402708B2 (ja) * | 2007-08-03 | 2010-01-20 | 浜松ホトニクス株式会社 | レーザ加工方法、レーザ加工装置及びその製造方法 |
| JP2011161492A (ja) * | 2010-02-12 | 2011-08-25 | Hitachi High-Technologies Corp | レーザ加工状態検査方法及び装置レーザ加工方法及び装置並びにソーラパネル製造方法 |
| JP2013096853A (ja) * | 2011-11-01 | 2013-05-20 | Omron Corp | 変位センサ |
| JP5775811B2 (ja) * | 2011-12-26 | 2015-09-09 | 浜松ホトニクス株式会社 | レーザ加工装置及びレーザ加工方法 |
| JP6786374B2 (ja) * | 2016-12-16 | 2020-11-18 | 株式会社スミテック | レーザ加工装置及びレーザ加工方法 |
| JP2018176212A (ja) * | 2017-04-11 | 2018-11-15 | 株式会社東京精密 | レーザー加工装置及びレーザー加工方法 |
| JP7257604B2 (ja) * | 2018-11-19 | 2023-04-14 | 株式会社東京精密 | レーザ加工装置及びその制御方法 |
| JP6911882B2 (ja) * | 2019-03-28 | 2021-07-28 | ブラザー工業株式会社 | レーザマーカ |
| JP7309277B2 (ja) * | 2019-09-12 | 2023-07-18 | 株式会社ディスコ | 位置調整方法及び位置調整装置 |
-
2022
- 2022-03-03 CN CN202280039414.8A patent/CN117412830A/zh active Pending
- 2022-03-03 JP JP2023525405A patent/JPWO2022254844A1/ja active Pending
- 2022-03-03 WO PCT/JP2022/009218 patent/WO2022254844A1/ja not_active Ceased
- 2022-03-03 KR KR1020237027903A patent/KR20240015615A/ko active Pending
- 2022-03-21 TW TW111110292A patent/TWI912496B/zh active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008087053A (ja) | 2006-10-03 | 2008-04-17 | Hamamatsu Photonics Kk | レーザ加工方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI912496B (zh) | 2026-01-21 |
| WO2022254844A1 (ja) | 2022-12-08 |
| CN117412830A (zh) | 2024-01-16 |
| JPWO2022254844A1 (https=) | 2022-12-08 |
| TW202247930A (zh) | 2022-12-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR102736968B1 (ko) | 레이저 가공 장치 | |
| TWI724125B (zh) | 雷射光照射裝置以及雷射光照射方法 | |
| TWI725133B (zh) | 雷射光照射裝置及雷射光照射方法 | |
| KR102685806B1 (ko) | 레이저광 조사 장치 | |
| JP7034621B2 (ja) | レーザ加工装置 | |
| TWI723127B (zh) | 雷射加工裝置及雷射輸出裝置 | |
| KR102343564B1 (ko) | 레이저 가공 장치 및 동작 확인 방법 | |
| KR102697771B1 (ko) | 레이저 가공 방법, 및 레이저 가공 장치 | |
| JP6695699B2 (ja) | レーザ加工装置 | |
| JP6661392B2 (ja) | レーザ加工装置 | |
| KR20240015615A (ko) | 레이저 가공 장치 | |
| JP6661394B2 (ja) | レーザ加工装置 | |
| JP6896913B2 (ja) | レーザ加工装置 | |
| JP7820206B2 (ja) | レーザ加工装置及びレーザ加工方法 | |
| JP6689612B2 (ja) | レーザ加工装置 | |
| JP2025142610A (ja) | レーザ加工装置、及び、レーザ加工方法 | |
| JP6661393B2 (ja) | レーザ加工装置 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0105 | International application |
St.27 status event code: A-0-1-A10-A15-nap-PA0105 |
|
| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-3-3-R10-R18-oth-X000 |
|
| A201 | Request for examination | ||
| PA0201 | Request for examination |
St.27 status event code: A-1-2-D10-D11-exm-PA0201 |
|
| D13 | Search requested |
Free format text: ST27 STATUS EVENT CODE: A-1-2-D10-D13-SRH-X000 (AS PROVIDED BY THE NATIONAL OFFICE) |
|
| D13-X000 | Search requested |
St.27 status event code: A-1-2-D10-D13-srh-X000 |