CN117412830A - 激光加工装置 - Google Patents

激光加工装置 Download PDF

Info

Publication number
CN117412830A
CN117412830A CN202280039414.8A CN202280039414A CN117412830A CN 117412830 A CN117412830 A CN 117412830A CN 202280039414 A CN202280039414 A CN 202280039414A CN 117412830 A CN117412830 A CN 117412830A
Authority
CN
China
Prior art keywords
laser
unit
incident surface
displacement information
laser light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280039414.8A
Other languages
English (en)
Chinese (zh)
Inventor
是松克洋
饭田哲也
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hamamatsu Photonics KK
Original Assignee
Hamamatsu Photonics KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hamamatsu Photonics KK filed Critical Hamamatsu Photonics KK
Publication of CN117412830A publication Critical patent/CN117412830A/zh
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/26—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes
    • G01B11/27—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes for testing the alignment of axes
    • G01B11/272—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes for testing the alignment of axes using photoelectric detection means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/046—Automatically focusing the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Laser Beam Processing (AREA)
  • Length Measuring Devices By Optical Means (AREA)
CN202280039414.8A 2021-06-01 2022-03-03 激光加工装置 Pending CN117412830A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021-092245 2021-06-01
JP2021092245 2021-06-01
PCT/JP2022/009218 WO2022254844A1 (ja) 2021-06-01 2022-03-03 レーザ加工装置

Publications (1)

Publication Number Publication Date
CN117412830A true CN117412830A (zh) 2024-01-16

Family

ID=84324187

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280039414.8A Pending CN117412830A (zh) 2021-06-01 2022-03-03 激光加工装置

Country Status (5)

Country Link
JP (1) JPWO2022254844A1 (https=)
KR (1) KR20240015615A (https=)
CN (1) CN117412830A (https=)
TW (1) TWI912496B (https=)
WO (1) WO2022254844A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118089565B (zh) * 2024-04-23 2024-07-02 常州奥瑞克精密测量系统有限公司 一种具有多点式多姿态激光同轴度校验装置及方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1622196A1 (de) * 2004-07-30 2006-02-01 Innolas GmbH Waferbearbeitungsvorrichtung und zugehöriges Verfahren
CN1799752A (zh) * 2005-01-05 2006-07-12 株式会社迪斯科 激光加工装置
JP2011161492A (ja) * 2010-02-12 2011-08-25 Hitachi High-Technologies Corp レーザ加工状態検査方法及び装置レーザ加工方法及び装置並びにソーラパネル製造方法
JP2018098464A (ja) * 2016-12-16 2018-06-21 株式会社スミテック レーザ加工装置及びレーザ加工方法
JP2018176212A (ja) * 2017-04-11 2018-11-15 株式会社東京精密 レーザー加工装置及びレーザー加工方法
JP2020088040A (ja) * 2018-11-19 2020-06-04 株式会社東京精密 レーザ加工装置及びその制御方法
JP2021041437A (ja) * 2019-09-12 2021-03-18 株式会社ディスコ 位置調整方法及び位置調整装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11201719A (ja) * 1998-01-09 1999-07-30 Nikon Corp 位置測定装置及びレーザ加工装置
JP4964554B2 (ja) 2006-10-03 2012-07-04 浜松ホトニクス株式会社 レーザ加工方法
JP4402708B2 (ja) * 2007-08-03 2010-01-20 浜松ホトニクス株式会社 レーザ加工方法、レーザ加工装置及びその製造方法
JP2013096853A (ja) * 2011-11-01 2013-05-20 Omron Corp 変位センサ
JP5775811B2 (ja) * 2011-12-26 2015-09-09 浜松ホトニクス株式会社 レーザ加工装置及びレーザ加工方法
JP6911882B2 (ja) * 2019-03-28 2021-07-28 ブラザー工業株式会社 レーザマーカ

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1622196A1 (de) * 2004-07-30 2006-02-01 Innolas GmbH Waferbearbeitungsvorrichtung und zugehöriges Verfahren
CN1799752A (zh) * 2005-01-05 2006-07-12 株式会社迪斯科 激光加工装置
JP2011161492A (ja) * 2010-02-12 2011-08-25 Hitachi High-Technologies Corp レーザ加工状態検査方法及び装置レーザ加工方法及び装置並びにソーラパネル製造方法
JP2018098464A (ja) * 2016-12-16 2018-06-21 株式会社スミテック レーザ加工装置及びレーザ加工方法
JP2018176212A (ja) * 2017-04-11 2018-11-15 株式会社東京精密 レーザー加工装置及びレーザー加工方法
JP2020088040A (ja) * 2018-11-19 2020-06-04 株式会社東京精密 レーザ加工装置及びその制御方法
JP2021041437A (ja) * 2019-09-12 2021-03-18 株式会社ディスコ 位置調整方法及び位置調整装置

Also Published As

Publication number Publication date
TWI912496B (zh) 2026-01-21
WO2022254844A1 (ja) 2022-12-08
JPWO2022254844A1 (https=) 2022-12-08
KR20240015615A (ko) 2024-02-05
TW202247930A (zh) 2022-12-16

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