KR20230165333A - 처리액 유통 방법, 및, 처리액 공급 장치 - Google Patents

처리액 유통 방법, 및, 처리액 공급 장치 Download PDF

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Publication number
KR20230165333A
KR20230165333A KR1020237038191A KR20237038191A KR20230165333A KR 20230165333 A KR20230165333 A KR 20230165333A KR 1020237038191 A KR1020237038191 A KR 1020237038191A KR 20237038191 A KR20237038191 A KR 20237038191A KR 20230165333 A KR20230165333 A KR 20230165333A
Authority
KR
South Korea
Prior art keywords
pressure
pipe
processing liquid
filter
treatment liquid
Prior art date
Application number
KR1020237038191A
Other languages
English (en)
Korean (ko)
Inventor
도모미 히구치
Original Assignee
가부시키가이샤 스크린 홀딩스
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 스크린 홀딩스 filed Critical 가부시키가이샤 스크린 홀딩스
Publication of KR20230165333A publication Critical patent/KR20230165333A/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
    • F04B23/00—Pumping installations or systems
    • F04B23/02—Pumping installations or systems having reservoirs
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
    • F04B49/00—Control, e.g. of pump delivery, or pump pressure of, or safety measures for, machines, pumps, or pumping installations, not otherwise provided for, or of interest apart from, groups F04B1/00 - F04B47/00
    • F04B49/02—Stopping, starting, unloading or idling control
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
    • F04B49/00—Control, e.g. of pump delivery, or pump pressure of, or safety measures for, machines, pumps, or pumping installations, not otherwise provided for, or of interest apart from, groups F04B1/00 - F04B47/00
    • F04B49/06—Control using electricity
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
    • F04B53/00—Component parts, details or accessories not provided for in, or of interest apart from, groups F04B1/00 - F04B23/00 or F04B39/00 - F04B47/00
    • F04B53/20—Filtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Details Of Reciprocating Pumps (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
KR1020237038191A 2021-04-08 2022-03-18 처리액 유통 방법, 및, 처리액 공급 장치 KR20230165333A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021065941A JP2022161268A (ja) 2021-04-08 2021-04-08 処理液流通方法、及び、処理液供給装置
JPJP-P-2021-065941 2021-04-08
PCT/JP2022/012647 WO2022215497A1 (ja) 2021-04-08 2022-03-18 処理液流通方法、及び、処理液供給装置

Publications (1)

Publication Number Publication Date
KR20230165333A true KR20230165333A (ko) 2023-12-05

Family

ID=83545336

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020237038191A KR20230165333A (ko) 2021-04-08 2022-03-18 처리액 유통 방법, 및, 처리액 공급 장치

Country Status (5)

Country Link
JP (1) JP2022161268A (ja)
KR (1) KR20230165333A (ja)
CN (1) CN117121165A (ja)
TW (1) TWI818479B (ja)
WO (1) WO2022215497A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024209927A1 (ja) * 2023-04-04 2024-10-10 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置、および、基板処理方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019041039A (ja) 2017-08-28 2019-03-14 東京エレクトロン株式会社 液処理装置および液処理方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5741549B2 (ja) * 2012-10-09 2015-07-01 東京エレクトロン株式会社 処理液供給方法、処理液供給装置及び記憶媒体
KR102141271B1 (ko) * 2014-05-28 2020-08-04 엔테그리스, 아이엔씨. 정밀 시스템 및 용도에서 모터-구동식 부품을 위한 백래시 방지 메커니즘
JP7312656B2 (ja) * 2019-09-24 2023-07-21 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
CN115769346A (zh) * 2020-07-06 2023-03-07 东京毅力科创株式会社 液处理装置和液处理方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019041039A (ja) 2017-08-28 2019-03-14 東京エレクトロン株式会社 液処理装置および液処理方法

Also Published As

Publication number Publication date
TWI818479B (zh) 2023-10-11
TW202249101A (zh) 2022-12-16
WO2022215497A1 (ja) 2022-10-13
JP2022161268A (ja) 2022-10-21
CN117121165A (zh) 2023-11-24

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