KR20230163306A - 분리층 형성용 조성물, 분리층 부착 지지 기체, 적층체 및 그의 제조 방법, 및 전자 부품의 제조 방법 - Google Patents

분리층 형성용 조성물, 분리층 부착 지지 기체, 적층체 및 그의 제조 방법, 및 전자 부품의 제조 방법 Download PDF

Info

Publication number
KR20230163306A
KR20230163306A KR1020230064766A KR20230064766A KR20230163306A KR 20230163306 A KR20230163306 A KR 20230163306A KR 1020230064766 A KR1020230064766 A KR 1020230064766A KR 20230064766 A KR20230064766 A KR 20230064766A KR 20230163306 A KR20230163306 A KR 20230163306A
Authority
KR
South Korea
Prior art keywords
separation layer
group
forming
substrate
support base
Prior art date
Application number
KR1020230064766A
Other languages
English (en)
Korean (ko)
Inventor
유키 도미오카
가즈히데 우노
다카시 마루야마
Original Assignee
도쿄 오카 고교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 도쿄 오카 고교 가부시키가이샤 filed Critical 도쿄 오카 고교 가부시키가이샤
Publication of KR20230163306A publication Critical patent/KR20230163306A/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
    • C08K5/41—Compounds containing sulfur bound to oxygen
    • C08K5/42—Sulfonic acids; Derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D161/00—Coating compositions based on condensation polymers of aldehydes or ketones; Coating compositions based on derivatives of such polymers
    • C09D161/34—Condensation polymers of aldehydes or ketones with monomers covered by at least two of the groups C09D161/04, C09D161/18 and C09D161/20
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/60—Additives non-macromolecular
    • C09D7/63—Additives non-macromolecular organic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/568—Temporary substrate used as encapsulation process aid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68318—Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Non-Insulated Conductors (AREA)
  • Materials For Photolithography (AREA)
KR1020230064766A 2022-05-23 2023-05-19 분리층 형성용 조성물, 분리층 부착 지지 기체, 적층체 및 그의 제조 방법, 및 전자 부품의 제조 방법 KR20230163306A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022083989A JP2023172292A (ja) 2022-05-23 2022-05-23 分離層形成用組成物、分離層付き支持基体、積層体及びその製造方法、並びに電子部品の製造方法
JPJP-P-2022-083989 2022-05-23

Publications (1)

Publication Number Publication Date
KR20230163306A true KR20230163306A (ko) 2023-11-30

Family

ID=88797232

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020230064766A KR20230163306A (ko) 2022-05-23 2023-05-19 분리층 형성용 조성물, 분리층 부착 지지 기체, 적층체 및 그의 제조 방법, 및 전자 부품의 제조 방법

Country Status (4)

Country Link
JP (1) JP2023172292A (zh)
KR (1) KR20230163306A (zh)
CN (1) CN117106358A (zh)
TW (1) TW202346483A (zh)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019034541A (ja) 2017-08-10 2019-03-07 東京応化工業株式会社 分離層形成用組成物、分離層付き支持基体、積層体及びその製造方法、並びに電子部品の製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019034541A (ja) 2017-08-10 2019-03-07 東京応化工業株式会社 分離層形成用組成物、分離層付き支持基体、積層体及びその製造方法、並びに電子部品の製造方法

Also Published As

Publication number Publication date
TW202346483A (zh) 2023-12-01
JP2023172292A (ja) 2023-12-06
CN117106358A (zh) 2023-11-24

Similar Documents

Publication Publication Date Title
KR102455663B1 (ko) 분리층 형성용 조성물, 분리층이 형성된 지지 기체, 적층체 및 그 제조 방법, 그리고 전자 부품의 제조 방법
JP5618093B2 (ja) 電子装置の製造方法、電子装置、電子装置パッケージの製造方法および電子装置パッケージ
TWI548445B (zh) 層合體、分離方法、及製造方法
TW201943851A (zh) 剝離用組成物、剝離接著劑之方法及電子零件之製造方法
JP7190826B2 (ja) 分離層形成用組成物、分離層付き支持基体、積層体及びその製造方法、並びに電子部品の製造方法
TWI713753B (zh) 層合體之製造方法、層合體，及接著劑組成物
TW201819202A (zh) 晶圓層合體及其之製造方法
TW201922995A (zh) 半導體裝置及其製造方法，以及層合體
KR20230163306A (ko) 분리층 형성용 조성물, 분리층 부착 지지 기체, 적층체 및 그의 제조 방법, 및 전자 부품의 제조 방법
JP7175186B2 (ja) 分離層形成用組成物、分離層付き支持基体、積層体及びその製造方法、並びに電子部品の製造方法
TWI611931B (zh) 層合體之製造方法、基板之處理方法及層合體
KR20230089551A (ko) 분리층 형성용 조성물, 분리층 부착 지지 기체, 적층체 및 그의 제조 방법, 및 전자 부품의 제조 방법
TW202044377A (zh) 電子零件之製造方法，及套組
JP5895789B2 (ja) 感放射線性樹脂組成物、ポリイミド膜、半導体素子および有機ｅｌ素子
TW201903095A (zh) 半導體裝置及其製造方法及層合體
JP2023172297A (ja) 分離層形成用組成物、分離層付き支持基体、積層体及びその製造方法、並びに電子部品の製造方法
JP7004566B2 (ja) 積層体及びその製造方法、並びに電子部品の製造方法
TW201804540A (zh) 密封體之製造方法及層合體
CN107230613A (zh) 分离层形成用组合物、层合体、及层合体的制造方法
JP2017073441A (ja) 感光性封止樹脂組成物、それを用いた半導体装置の製造方法及び半導体装置
WO2016052212A1 (ja) ナノインプリント用光硬化性組成物
JP2015219302A (ja) 感光性接着剤組成物、それを用いた半導体装置の製造方法、及び半導体装置