KR20230152401A - Substrate processing apparatus - Google Patents

Abstract

A substrate processing apparatus according to an embodiment of the present invention includes a chamber provided with a processing space for processing a substrate; an insulating plate installed on the wall of at least one of the chambers to form a sealed insulating space between the wall and a surface installed on the wall; an exhaust unit that performs exhaust to create a vacuum in the insulated space; and a penetrating member that simultaneously penetrates the wall of the chamber and the insulating plate to seal the insulating space.

Description

Substrate processing apparatus {Substrate processing apparatus}

The present invention relates to a substrate processing apparatus, and more particularly, to a substrate processing apparatus having a chamber with improved thermal insulation performance.

Substrate processing equipment is used in the manufacture of flat panel displays, semiconductors, solar cells, etc., and is divided into a single substrate type that processes one substrate and a batch type that processes multiple substrates. The single wafer type substrate processing device has the advantage of simple configuration, but has the disadvantage of low productivity, so the batch type substrate processing device is often used for mass production.

In the batch type substrate processing apparatus, a chamber is formed to provide a substrate processing space, and a substrate holder, which is a support member that supports each of a plurality of substrates loaded into the chamber, may be installed in the chamber, and each substrate is used to process the plurality of substrates. A heater may be installed between each of the substrates.

Recently, as the size of glass substrates for displays and solar cells has become larger, the time and cost consumed in the substrate processing process are increasing. Therefore, shortening the processing time and increasing the process cycle is directly related to improving productivity.

The present invention seeks to provide a substrate processing device that can improve productivity by improving the insulation performance of the chamber. However, these tasks are illustrative and do not limit the scope of the present invention.

According to one embodiment of the present invention, a substrate processing apparatus is provided. A substrate processing apparatus includes a chamber provided with a processing space for processing a substrate; an insulating plate installed on the wall of at least one of the chambers to form a sealed insulating space between the wall and a surface installed on the wall; an exhaust unit that performs exhaust to create a vacuum in the insulated space; and a penetrating member that simultaneously penetrates the wall of the chamber and the insulating plate to seal the insulating space.

According to one embodiment of the present invention, a groove may be formed on the outer surface of the insulation plate, and the groove may be sealed with the wall to form the insulation space.

According to one embodiment of the present invention, a sealing member sealing the wall and the insulation plate along the periphery of the insulation space so that the insulation space can be sealed may be included.

According to one embodiment of the present invention, the penetrating member may include a heater portion formed of a plurality of heaters that penetrate the wall and the insulation plate and cross the processing space.

According to one embodiment of the present invention, the chamber includes: a first heater hole portion formed in the shape of a hole penetrating the wall so that the heater portion is coupled to the chamber; and a vacuum hole portion formed through the wall so that the insulating space is connected to the exhaust portion to form a vacuum state.

According to one embodiment of the present invention, the insulation plate includes a second heater hole portion penetrating from the outer surface to the inner surface of the insulation plate so that the heater portion is coupled to the insulation plate; and a heater sealing portion formed to surround the heater portion to seal the insulating space from the heater portion.

According to one embodiment of the present invention, the insulation plate is made of a metal material, and a reflective portion may be formed on the inner surface facing the processing space to preserve the internal heat of the processing space.

According to one embodiment of the present invention, the exhaust unit includes a vacuum pump that adjusts the pressure inside the insulated space to form the insulated space into a vacuum; and an exhaust line connecting the chamber and the vacuum pump.

According to one embodiment of the present invention, the wall and the insulating plate are formed in plural pieces, so that the plurality of insulating spaces are formed, and the plurality of insulating spaces can be respectively connected to the exhaust line.

According to one embodiment of the present invention, the exhaust unit may include a vacuum valve formed in each of the plurality of exhaust lines to differentially control the vacuum degree of each of the plurality of insulated spaces.

According to one embodiment of the present invention, the insulation plate may include a support portion supporting between the wall and the insulation plate so that the wall and the insulation plate are not deformed in the insulation space.

According to one embodiment of the present invention, the support part may be formed by penetrating a hollow part, and a heater part crossing the processing space may be inserted into the hollow part.

According to one embodiment of the present invention, the support part may be formed by penetrating a hollow part, and a coupling member coupling the chamber and the insulating plate may be inserted into the hollow part.

According to one embodiment of the present invention, the insulating plate may have a trapezoidal cross-section.

As described above, in the substrate processing apparatus according to embodiments of the present invention, the chamber is provided with an insulation plate installed on at least one wall to form vacuum insulation with the wall, thereby improving the insulation performance of the chamber. It works.

Additionally, since the insulation plate functions as a reflector, it has the effect of further improving the insulation performance of the chamber.

In addition, the insulation plate is installed on the chamber wall so that some of the adjacent insulation plates are in contact with each other without a separation space between adjacent insulation plates, which has the effect of fundamentally preventing heat loss through the separation space between the insulation members.

In addition, the insulation plate is coupled to the inner wall of the chamber to form vacuum insulation, thereby improving the insulation performance of the chamber and simultaneously preventing an increase in the size of the chamber and deterioration of mechanical properties such as chamber rigidity. Of course, the scope of the present invention is not limited by this effect.

1 is a perspective view showing a substrate processing apparatus according to an embodiment of the present invention.
Figure 2 is a perspective view showing a chamber of a substrate processing apparatus according to an embodiment of the present invention.
Figure 3 is a perspective view showing an insulating plate of a substrate processing apparatus according to an embodiment of the present invention.
Figure 4 is a perspective view showing an insulating plate of a substrate processing apparatus according to another embodiment of the present invention.
Figure 5 is a cross-sectional view showing a support portion supporting a chamber and an insulation plate according to another embodiment of the present invention.
Figure 6 is a perspective view showing a substrate processing apparatus according to another embodiment of the present invention.
Figure 7 is an experimental example comparing heat preservation between a conventional insulation chamber and the insulation chamber of the present invention.
Figure 8 is a graph showing the thermal conductivity of the vacuum insulation material according to gas pressure.

Hereinafter, various preferred embodiments of the present invention will be described in detail with reference to the attached drawings.

The embodiments of the present invention are provided to more completely explain the present invention to those skilled in the art, and the following examples may be modified into various other forms, and the scope of the present invention is as follows. It is not limited to the examples. Rather, these embodiments are provided to make the present disclosure more faithful and complete and to fully convey the spirit of the present invention to those skilled in the art. Additionally, the thickness and size of each layer in the drawings are exaggerated for convenience and clarity of explanation.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will now be described with reference to drawings that schematically show ideal embodiments of the present invention. In the drawings, variations of the depicted shape may be expected, for example, depending on manufacturing technology and/or tolerances. Accordingly, embodiments of the present invention should not be construed as being limited to the specific shape of the area shown in this specification, but should include, for example, changes in shape resulting from manufacturing.

The present invention, which will be described later, is intended to provide a substrate processing device that can improve the productivity of the substrate processing process by improving the insulation performance of the chamber.

For reference, the existing substrate processing device installs a shaft on the inner wall of the chamber to insulate the chamber, and insulates the inside of the chamber by assembling an insulating material on the shaft. In this case, due to the characteristics of the insulation material, the insulation material cannot be attached to the chamber wall, so there is a problem that the size of the chamber is inevitably increased to secure processing space. In addition, there is a problem that a separation space is inevitably created between the insulation material formed inside the chamber and the chamber and between the insulation materials, and the insulation performance is deteriorated due to airflow formed through the separation space. In addition, commonly used insulating materials transmit long-wavelength regions, making it difficult to preserve heat inside the actual chamber, thereby deteriorating the insulating performance, and there is a problem that a separate reflective member must be installed to prevent this. In addition, there is a problem in that the quartz insulation material, which has excellent insulation performance, is highly brittle, making handling and maintenance difficult.

The present invention is intended to solve problems occurring in a substrate processing apparatus that secures insulation performance by installing an insulation material inside the chamber as described above. One object of the present invention is to reduce heat loss by forming an insulating vacuum on the chamber wall. The aim is to provide a substrate processing device that can minimize the heat treatment time, shorten the processing time for processing the substrate, and improve the productivity of the substrate processing process.

FIG. 1 is a perspective view showing a substrate processing apparatus according to an embodiment of the present invention, FIG. 2 is a perspective view showing the chamber 100 of the substrate processing apparatus, and FIGS. 3 and 4 are according to various embodiments of the present invention. These are perspective views showing the insulation plate 200 of the substrate processing apparatus.

First, as shown in FIG. 1, the substrate processing apparatus according to an embodiment of the present invention may largely include a chamber 100, an insulating plate 200, an exhaust unit 300, and a penetrating member.

The chamber 100 may be formed not only in the shape of a rectangular parallelepiped, but also in various shapes depending on the shape of the substrate, and may have an opening for loading and unloading the substrate on one side.

A door capable of opening and closing the opening may be installed in the opening, and the processing space A inside the chamber 100 may be formed as a sealed space according to the opening and closing of the door.

When the chamber 100 is opened by opening the door, the substrate can be supported by a substrate transfer robot (not shown) and loaded into the processing space A inside the chamber 100. Subsequently, the substrate can be processed in a state in which the chamber 100 is closed by closing the door.

In addition, on the other side of the chamber 100, a cover (not shown) for repair and replacement of the support unit, gas supply pipe, and gas discharge pipe installed inside the chamber 100 may be installed to be openable and closed.

As shown in FIG. 2, the chamber 100 has a processing space (A) for processing a substrate and may be formed of at least one wall 110, and the wall 110 includes a vacuum hole 120 and a second wall 110. 1 Heater hole portion 130 may be formed.

The vacuum hole portion 120 may be formed through the wall 110 so that the insulating space B is connected to the exhaust portion 300 and formed in a vacuum state. The chamber 100 is provided with an insulation plate 200 that is installed on at least one wall 110 and forms vacuum insulation together with the wall 110, thereby improving the insulation performance of the chamber 100.

Specifically, in order to form the insulation space B formed between the chamber 100 and the insulation plate 200 in a vacuum atmosphere, the surface where the insulation plate 200 of the chamber 100 is coupled may be connected to the outside of the chamber 100. A vacuum hole portion 120 formed by a hole may be formed.

For example, when the insulation plate 200 is formed on the walls 110 formed on the upper, lower, left, and right sides of the chamber 100, the walls including the upper wall, lower wall, left wall, and right wall ( Vacuum hole portions 120 may be formed in each 110).

The vacuum hole unit 120 may be connected to the exhaust unit 300.

The first heater hole portion 130 may be formed in the shape of a hole penetrating the wall 110 so that the heater portion 500 is coupled to the chamber 100.

Specifically, a heater may be installed inside the chamber 100 to heat the substrate being processed inside the chamber 100 or to increase the temperature of the processing space A. At this time, the heater can be inserted and supported from the wall on one side of the chamber 100 to the wall on the other side across the processing space (A), and a plurality of heaters can be inserted and installed in the wall 110. A first heater hole portion 130 including a plurality of first holes may be formed.

For example, the first heater hole portion 130 including the plurality of first holes may be formed at positions corresponding to the wall formed on the left side and the wall formed on the right side of the chamber 100. Thus, the plurality of heaters inserted into the plurality of first holes can be installed to be horizontal to each other.

Although not shown, a gas supply structure, a gas exhaust structure, etc. that can supply or exhaust gas to the processing space A may be formed in the shape of a hole penetrating the wall 110 to be coupled to the chamber 100.

As shown in FIG. 3, the insulation plate 200 is installed on the wall 110, so that a sealed insulation space B can be formed between the wall 110 and the surface installed on the wall 110.

The insulation plate 200 is a plate-shaped member installed inside the chamber 100. The inner surface 220 is installed in the direction of the processing space A, and the outer surface 210 is installed in the direction of the wall 110 of the chamber 100. , a groove in the insulation plate 200 may be formed so that the center of the outer surface 210 does not contact the wall 110 of the chamber 100.

At this time, the groove portion may be sealed with the wall 110 to form an insulating space B.

As shown in Figures 3 and 4, the cross-section of the insulation plate 200 is formed in a square or trapezoidal shape and can be respectively coupled to the wall 110 of the chamber 100. At this time, an insulating space B may be formed in one direction of a square shape or a long direction of a trapezoid shape.

The insulating plates 200 are formed in a square shape and are installed in an overlapping manner so that there is no space between each of the insulating plates 200, thereby fundamentally preventing heat loss through the space. In addition, the insulation plate 200 is formed in a trapezoidal shape, and the inclined sides of the trapezoid are installed against each other so that there is no space between each of the insulation plates 200, so that heat loss through the space is prevented. can be prevented at the source.

In addition, the insulation plate 200 is formed in a trapezoidal shape to facilitate pressure distribution at the corners and facilitate assembly with adjacent insulation plates.

The insulation plate 200 is made of a metal material, and a reflective portion may be formed on the inner surface 220 facing the processing space A to preserve the internal heat of the processing space A.

A second heater hole portion 230 including a plurality of second holes may be formed in the insulation plate 200 so that the plurality of heaters can be inserted and installed. Specifically, the second heater hole portion 230 may be formed by penetrating from the outer surface 210 to the inner surface 220 of the insulating plate 200 so that the heater portion 500 is coupled to the insulating plate 200.

For example, as shown in FIG. 3, the insulation plate 200 is coupled to the left and right walls of the chamber 100, and the plurality of second holes are formed in each of the insulation plates 200 at corresponding positions. A second heater hole portion 230 may be formed. Thus, the plurality of heaters inserted into the plurality of second holes can be installed to be horizontal to each other.

At this time, the second heater hole portion 230 and the first heater hole portion 130 may be formed in a straight line so that the heater can be inserted.

The heater sealing portion 240 may be formed to surround the heater portion 500 to seal the insulating space B from the heater portion 500 .

Specifically, the heater unit 500 may be installed to penetrate the insulation plate 200, pass through the insulation space B, and penetrate the wall 110 of the chamber 100. At this time, as the heater unit 500 passes through the insulating space B, a heater sealing unit 240 that seals the surroundings of the heater unit 500 is formed.

As shown in FIGS. 3 and 5, the heater sealing portion 240 may be formed in a cylindrical shape surrounding the heater portion 500 passing through the insulating space B on the outer surface 210 of the insulating plate 200. . At this time, an O-ring 241 may be formed in the heater sealing part 240 so that the heater sealing part 240 can be in close contact with the wall 110 of the chamber 100.

Therefore, the heater sealing unit 240 seals the area around the heater unit 500 to seal the insulating space (B) from communicating with the processing space (A) inside the chamber 100 and the space outside the chamber 100, The insulating space (B) can be formed and maintained in a vacuum state.

As shown in FIG. 3, the substrate processing apparatus according to the present invention may include a sealing member 400 formed between the chamber 100 and the insulation plate 200.

The sealing member 400 may seal the wall 110 and the insulation plate 200 along the perimeter of the insulation space (B) so that the insulation space (B) can be sealed.

The sealing member 400 may be coupled along the periphery of the insulation space (B), and may be coupled to a portion where the wall 110 of the chamber 100 and the insulation plate 200 contact, thereby protecting the insulation space (B) from the outside. and can be sealed. At this time, the sealing member 400 may include a sealing member such as an O-ring.

That is, on the outside of the insulation space (B), a sealing member 400 is coupled to the perimeter of the insulation space (B) where the wall 110 of the chamber 100 and the outer surface 210 of the insulation plate 200 are in contact. It is sealed, and the heater unit 500 may be coupled to the heater sealing unit 240 to be sealed inside the insulating space B.

Accordingly, the insulating space (B) can be sealed so as not to communicate with the processing space (A) inside the chamber 100 and the space outside the chamber 100, and the insulating space (B) can be formed and maintained in a vacuum state.

As shown in FIG. 1, the insulation plate 200 may be coupled to the wall 110 of the chamber 100 with a coupling member 260. For example, the coupling member 260 formed of bolts and nuts at the corner of the insulation plate 200 is assembled to penetrate the insulation plate 200 and the wall 110, so that the insulation plate 200 and the wall 110 are can be combined

The coupling position of the coupling member 260 may be selectively coupled at various positions depending on the coupling of the insulating plate 200.

As shown in FIG. 1, the exhaust unit 300 may perform exhaust to create a vacuum in the insulating space B.

Specifically, the exhaust unit 300 may include a vacuum pump 310, an exhaust line 320, and a vacuum valve 330.

The vacuum pump 310 may include a pump that adjusts the pressure inside the insulating space (B) to form the insulating space (B) into a vacuum.

The exhaust line 320 may include a pipe connecting the chamber 100 and the vacuum pump 310.

The exhaust line 320 may be connected to the vacuum hole 120 formed in the wall 110 of the chamber 100 on the outer surface of the chamber 100. That is, the gas inside the insulation space B formed between the chamber 100 and the insulation plate 200 can be exhausted to the vacuum pump 310 along the exhaust line 320 connected to the vacuum hole part 120.

At this time, a control valve may be formed in the exhaust line 320.

As shown in FIG. 3, the substrate processing apparatus according to the present invention includes a chamber 100 with a penetrating member that simultaneously penetrates the wall 110 and the insulation plate 200 of the chamber 100 so that the insulation space B is sealed. may include.

The penetrating member may include a heater unit 500 that heats the substrate seated therein.

The heater unit 500 may be formed of a plurality of heaters that penetrate the wall 110 and the insulation plate 200 and cross the processing space A.

In order to directly heat the substrate, the plurality of heaters disposed at regular intervals along the stacking direction of the substrate may be installed inside the chamber 100. The substrate may be placed between one heater and another adjacent heater so that both sides of the substrate can be heated.

The heater unit 500 may include the plurality of heaters spaced at regular intervals parallel to the short side direction of the substrate. The heater is a typical long cylindrical heater with a heating element inserted inside the quartz tube, and can be said to be a unit constituting the heater unit 500 that generates heat by receiving external power through terminals installed at both ends. .

As described above, the heater unit 500 may be disposed to penetrate from the wall on one side of the chamber 100 to the wall on the other side. The number of heaters in the heater unit 500 may vary depending on the size of the chamber 100 and the size of the substrate.

Figure 5 is a cross-sectional view showing the support portion 250 supporting the chamber 100 and the insulation plate 200 according to another embodiment of the present invention.

The insulation plate 200 of the substrate processing apparatus according to another embodiment of the present invention may include a support portion 250.

The support portion 250 may include a structure that supports between the wall 110 and the insulation plate 200 to prevent the wall 110 and the insulation plate 200 from being compressed and deformed in the insulation space B. At this time, the support portion 500 may be formed in the chamber 100 to support between the wall 110 and the insulation plate 200.

For example, as the insulation space (B) becomes a vacuum, the internal pressure of the insulation space (B) becomes lower than the pressure of the processing space (A) or the external space of the chamber 100, so that the wall 110 of the chamber 100 or Deformation of the insulation plate 200 may occur.

The support portion 250 is a structure formed on the outer surface 210 of the insulation plate 200 and formed as a pillar to support the insulation plate 200 to maintain a certain distance from the wall 110 of the chamber 100.

As the support portion 250 is formed in the insulating space (B), deformation that may be problematic in maintaining the seal of the insulating space (B) can be prevented, and the wall 110 and the insulating plate ( It is possible to prevent deformation of the heater unit 500 that passes through and is coupled to 200.

At this time, the support part 250 may be formed as a heater sealing part 240.

For example, as shown in FIG. 5, the heater sealing part 240 is formed in a cylindrical shape surrounding the heater part 500 in the insulating space B, and is in contact with the wall 110 of the chamber 100 to insulate it. The plate 200 can be supported to maintain a certain distance from the wall 110 of the chamber 100. That is, the heater sealing part 240 may be a support part 500 that supports the insulating space (B).

In another embodiment according to the present invention, a coupling member 260 may be inserted into the support portion 250.

For example, as shown in FIG. 5, the support portion 500 is formed in a cylindrical shape surrounding the bolt and nut in the insulation space B, and is in contact with the wall 110 of the chamber 100 so that the insulation plate 200 is in contact with the wall 110 of the chamber 100. It can be supported to maintain a certain distance from the wall 110 of the chamber 100. That is, the support part 500 can support the insulation space B, and a coupling member 260 can be formed to couple the chamber 100 and the insulation plate 200.

Figure 6 is a perspective view showing a substrate processing apparatus according to another embodiment of the present invention.

As shown in FIG. 6, the exhaust line 320 of the substrate processing apparatus of the present invention may include a plurality of exhaust lines 320 and a plurality of vacuum valves 330.

Specifically, a plurality of insulation plates 200 may be formed and coupled to each wall 110 forming the chamber 100. Accordingly, the insulation spaces B are formed in each of the plurality of insulation plates 200, and the plurality of insulation spaces B may be respectively connected to the exhaust line 320.

For example, as shown in FIG. 6, a plurality of insulating spaces ( B) may be formed, and an exhaust line 320 including an upper exhaust line, a lower exhaust line, a left exhaust line, and a right exhaust line may be formed in each insulated space B.

Each exhaust line 320 is connected to the vacuum pump 310 so that a plurality of insulating spaces B can be formed in a vacuum state. At this time, the vacuum pump 310 is formed as a single pump, and each exhaust line 320 is connected, so that a single pump can control a plurality of insulated spaces (B), and has high cost and spatial usability. You can have

In addition, although not shown, the vacuum pump 310 is formed in plural numbers and is individually connected to each insulating space (B), so that the plurality of insulating spaces (B) can be controlled independently.

The vacuum valve 330 may include a valve formed in each of the plurality of exhaust lines 320 to differentially control the vacuum degree of each of the plurality of insulated spaces B.

For example, as shown in FIG. 6, vacuum valves 330 are formed in a plurality of exhaust lines 320 connecting a plurality of insulation spaces B and a single pump, and each vacuum valve 330 Can individually control the vacuum degree of the plurality of insulated spaces (B) through the opening and closing time.

Figure 7 is an experimental example comparing heat preservation between a conventional insulation chamber and the insulation chamber of the present invention.

Figure 7(a) is a conventional insulation chamber, in which an insulation material (N-11) is attached and fixed to the front of the chamber wall (Al6061) using a shaft, and Figure 7(b) is an insulation chamber of the present invention, where the chamber wall is attached and fixed. An insulating vacuum space was formed by processing a SUS plate (SUS304) from (Al6061).

At this time, the experimental conditions were a heating temperature of 470 ℃ and an external temperature of 25 ℃. Changes in air flow inside the chamber were confirmed according to changes in the material and shape of the insulation material of the conventional chamber and the chamber of the present invention, and the corresponding change in temperature distribution was confirmed. Confirmed.

As shown in Figure 7, the temperature of the chamber wall of the conventional insulation chamber is 145.5°C and the internal temperature is 391.1°C, and the temperature of the chamber wall of the insulation chamber of the present invention is 96.2°C and the internal temperature is 426.5°C. It is displayed in ℃.

In this way, the shape of the insulating material of the present invention appears to exhibit excellent insulating performance compared to the conventional one, with a higher temperature in the processing space and a lower temperature in the chamber wall.

Figure 8 is a graph showing the thermal conductivity of the vacuum insulation material according to gas pressure.

As shown in Figure 8, the conventional insulating material (N-11) has a thermal conductivity of 1.6 W/m2K, but the vacuum insulating material of the present invention has an extremely low thermal conductivity of 0.0002 W/m2K to 0.0025 W/m2K. Have.

In other words, the substrate processing device of the present invention has excellent thermal insulation performance by forming a vacuum insulation on the chamber wall, and the vacuum insulation acts as a reflector, which has an excellent heat preservation effect. There is no gap between the chamber wall and the insulation structure, thereby preventing airflow. Heat loss can be minimized.

In addition, the insulation plate 200 is coupled to the inner wall of the chamber 100 to form vacuum insulation, thereby improving the insulation performance of the chamber 100, preventing an increase in the size of the chamber 100, and increasing the rigidity of the chamber 100. It has the effect of preventing deterioration of mechanical properties such as.

The present invention has been described with reference to the embodiments shown in the drawings, but these are merely exemplary, and those skilled in the art will understand that various modifications and equivalent other embodiments are possible therefrom. Therefore, the true scope of technical protection of the present invention should be determined by the technical spirit of the attached patent claims.

A: Processing space
B: Insulated space
100: chamber
110: wall
120: Vacuum hole part
130: 1st heater hole part
200: insulation plate
210: turn away
220: Inside
230: Second heater hole part
240: Heater sealing part
250: support part
260: coupling member
300: exhaust part
310: vacuum pump
320: exhaust line
330: vacuum valve
400: No sealing member
500: Heater unit

Claims (14)

A chamber provided with a processing space for processing a substrate;
an insulating plate installed on the wall of at least one of the chambers to form a sealed insulating space between the wall and a surface installed on the wall;
an exhaust unit that performs exhaust to create a vacuum in the insulated space; and
a penetrating member simultaneously penetrating the wall of the chamber and the insulation plate to seal the insulation space;
Including, a substrate processing device. According to claim 1,
A substrate processing apparatus in which a groove is formed on an outer surface of the insulation plate, and the groove is sealed with the wall to form the insulation space. According to claim 1,
a sealing member sealing the wall and the insulation plate along the periphery of the insulation space so that the insulation space can be sealed;
Including, a substrate processing device. According to claim 1,
The penetrating member is
a heater unit formed of a plurality of heaters that penetrate the wall and the insulation plate and cross the processing space;
Including, a substrate processing device. According to claim 4,
The chamber is,
a first heater hole portion formed in the shape of a hole penetrating the wall so that the heater portion is coupled to the chamber; and
a vacuum hole formed through the wall so that the insulating space is connected to the exhaust part to form a vacuum state;
A substrate processing device comprising: According to claim 4,
The insulation plate is,
a second heater hole portion penetrating from the outer surface to the inner surface of the insulating plate so that the heater portion is coupled to the insulating plate; and
a heater sealing portion formed to surround the heater portion to seal the insulating space from the heater portion;
Including, substrate processing device According to claim 1,
The insulation plate is made of a metal material, and a reflection portion is formed on an inner surface facing the processing space to preserve internal heat of the processing space. According to claim 1,
The exhaust part,
a vacuum pump that adjusts the pressure inside the insulated space to form the insulated space into a vacuum; and
an exhaust line connecting the chamber and the vacuum pump;
A substrate processing device comprising: According to claim 8,
The wall and the insulating plate are formed in plural pieces, so that the plurality of insulating spaces are formed, and the plurality of insulating spaces are respectively connected to the exhaust line. According to clause 9,
The exhaust part,
Vacuum valves formed in each of the plurality of exhaust lines to differentially control the vacuum degree of each of the plurality of insulating spaces;
Including, a substrate processing device. According to claim 1,
The insulation plate is,
a support portion supporting between the wall and the insulation plate so that the wall and the insulation plate are not deformed in the insulation space;
Including, a substrate processing device. According to claim 11,
The support portion is formed by penetrating a hollow portion, and the heater portion crossing the processing space is formed into the hollow portion to be inserted into the hollow portion. According to claim 11,
The support portion is formed by penetrating a hollow portion, and is formed to insert a coupling member that couples the chamber and the insulating plate into the hollow portion. According to claim 1,
A substrate processing device, wherein the insulating plate has a trapezoidal cross-section.

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