KR20230142334A - Tcp 윈도우들을 위한 하이브리드 액체/공기 냉각 시스템 - Google Patents
Tcp 윈도우들을 위한 하이브리드 액체/공기 냉각 시스템 Download PDFInfo
- Publication number
- KR20230142334A KR20230142334A KR1020227045239A KR20227045239A KR20230142334A KR 20230142334 A KR20230142334 A KR 20230142334A KR 1020227045239 A KR1020227045239 A KR 1020227045239A KR 20227045239 A KR20227045239 A KR 20227045239A KR 20230142334 A KR20230142334 A KR 20230142334A
- Authority
- KR
- South Korea
- Prior art keywords
- dielectric window
- faraday shield
- cooling
- cooling channels
- assembly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/321—Radio frequency generated discharge the radio frequency energy being inductively coupled to the plasma
- H01J37/32119—Windows
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/3244—Gas supply means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32458—Vessel
- H01J37/32522—Temperature
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Chemical Vapour Deposition (AREA)
- Drying Of Semiconductors (AREA)
- Plasma Technology (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US202163147802P | 2021-02-10 | 2021-02-10 | |
| US63/147,802 | 2021-02-10 | ||
| PCT/US2022/015479 WO2022173695A1 (en) | 2021-02-10 | 2022-02-07 | Hybrid liquid/air cooling system for tcp windows |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20230142334A true KR20230142334A (ko) | 2023-10-11 |
Family
ID=82838704
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020227045239A Pending KR20230142334A (ko) | 2021-02-10 | 2022-02-07 | Tcp 윈도우들을 위한 하이브리드 액체/공기 냉각 시스템 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20230245854A1 (https=) |
| JP (1) | JP2024506289A (https=) |
| KR (1) | KR20230142334A (https=) |
| WO (1) | WO2022173695A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20250095970A1 (en) * | 2023-09-14 | 2025-03-20 | Applied Materials, Inc. | Plasma processing chamber lid cooling |
| WO2025101320A1 (en) * | 2023-11-08 | 2025-05-15 | Lam Research Corporation | Composite window with liquid cooling for inductively coupled plasma processing system |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6036878A (en) * | 1996-02-02 | 2000-03-14 | Applied Materials, Inc. | Low density high frequency process for a parallel-plate electrode plasma reactor having an inductive antenna |
| US6287435B1 (en) * | 1998-05-06 | 2001-09-11 | Tokyo Electron Limited | Method and apparatus for ionized physical vapor deposition |
| US6652711B2 (en) * | 2001-06-06 | 2003-11-25 | Tokyo Electron Limited | Inductively-coupled plasma processing system |
| WO2003029513A1 (en) * | 2001-09-28 | 2003-04-10 | Tokyo Electron Limited | Hybrid plasma processing apparatus |
| US20050145341A1 (en) * | 2003-11-19 | 2005-07-07 | Masaki Suzuki | Plasma processing apparatus |
| JP2007012734A (ja) * | 2005-06-29 | 2007-01-18 | Matsushita Electric Ind Co Ltd | プラズマエッチング装置及びプラズマエッチング方法 |
| US20110168673A1 (en) * | 2008-07-04 | 2011-07-14 | Tokyo Electron Limited | Plasma processing apparatus, plasma processing method, and mechanism for regulating temperature of dielectric window |
| US9978565B2 (en) * | 2011-10-07 | 2018-05-22 | Lam Research Corporation | Systems for cooling RF heated chamber components |
| US9437400B2 (en) * | 2012-05-02 | 2016-09-06 | Lam Research Corporation | Insulated dielectric window assembly of an inductively coupled plasma processing apparatus |
| US9885493B2 (en) * | 2013-07-17 | 2018-02-06 | Lam Research Corporation | Air cooled faraday shield and methods for using the same |
| US10510511B2 (en) * | 2013-10-31 | 2019-12-17 | Semes Co., Ltd. | Apparatus for treating substrate |
| JP6262115B2 (ja) * | 2014-02-10 | 2018-01-17 | 東京エレクトロン株式会社 | 基板処理方法及び基板処理装置 |
| KR102262657B1 (ko) * | 2014-10-13 | 2021-06-08 | 삼성전자주식회사 | 플라즈마 처리 장치 |
| US20160118284A1 (en) * | 2014-10-22 | 2016-04-28 | Panasonic Intellectual Property Management Co., Ltd. | Plasma processing apparatus |
| CN206432233U (zh) * | 2017-01-19 | 2017-08-22 | 江苏鲁汶仪器有限公司 | 刻蚀机的下电极载片台 |
| JP6918642B2 (ja) * | 2017-08-25 | 2021-08-11 | 東京エレクトロン株式会社 | 冷媒用の流路を有する部材、冷媒用の流路を有する部材の制御方法及び基板処理装置 |
-
2022
- 2022-02-07 JP JP2023547182A patent/JP2024506289A/ja active Pending
- 2022-02-07 KR KR1020227045239A patent/KR20230142334A/ko active Pending
- 2022-02-07 US US18/013,736 patent/US20230245854A1/en active Pending
- 2022-02-07 WO PCT/US2022/015479 patent/WO2022173695A1/en not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| US20230245854A1 (en) | 2023-08-03 |
| JP2024506289A (ja) | 2024-02-13 |
| WO2022173695A1 (en) | 2022-08-18 |
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St.27 status event code: A-2-3-E10-E13-lim-X000 |
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