JP2024506289A - Ｔｃｐ窓用のハイブリッド液体／空気冷却システム - Google Patents

Ｔｃｐ窓用のハイブリッド液体／空気冷却システム Download PDF

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Publication number
JP2024506289A
JP2024506289A JP2023547182A JP2023547182A JP2024506289A JP 2024506289 A JP2024506289 A JP 2024506289A JP 2023547182 A JP2023547182 A JP 2023547182A JP 2023547182 A JP2023547182 A JP 2023547182A JP 2024506289 A JP2024506289 A JP 2024506289A
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JP
Japan
Prior art keywords
dielectric window
window assembly
faraday shield
cooling channel
assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023547182A
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English (en)
Japanese (ja)
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JP2024506289A5 (https=
Inventor
アルベルティ・アンドレア
スリラマン・サラヴァナプリヤン
ドルワリー・ジョン
パターソン・アレクサンダー・ミラー
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lam Research Corp
Original Assignee
Lam Research Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Research Corp filed Critical Lam Research Corp
Publication of JP2024506289A publication Critical patent/JP2024506289A/ja
Publication of JP2024506289A5 publication Critical patent/JP2024506289A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/321—Radio frequency generated discharge the radio frequency energy being inductively coupled to the plasma
    • H01J37/32119—Windows
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/3244—Gas supply means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32458—Vessel
    • H01J37/32522—Temperature

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Vapour Deposition (AREA)
  • Drying Of Semiconductors (AREA)
  • Plasma Technology (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2023547182A 2021-02-10 2022-02-07 Ｔｃｐ窓用のハイブリッド液体／空気冷却システム Pending JP2024506289A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US202163147802P 2021-02-10 2021-02-10
US63/147,802 2021-02-10
PCT/US2022/015479 WO2022173695A1 (en) 2021-02-10 2022-02-07 Hybrid liquid/air cooling system for tcp windows

Publications (2)

Publication Number Publication Date
JP2024506289A true JP2024506289A (ja) 2024-02-13
JP2024506289A5 JP2024506289A5 (https=) 2025-02-14

Family

ID=82838704

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023547182A Pending JP2024506289A (ja) 2021-02-10 2022-02-07 Ｔｃｐ窓用のハイブリッド液体／空気冷却システム

Country Status (4)

Country Link
US (1) US20230245854A1 (https=)
JP (1) JP2024506289A (https=)
KR (1) KR20230142334A (https=)
WO (1) WO2022173695A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20250095970A1 (en) * 2023-09-14 2025-03-20 Applied Materials, Inc. Plasma processing chamber lid cooling
WO2025101320A1 (en) * 2023-11-08 2025-05-15 Lam Research Corporation Composite window with liquid cooling for inductively coupled plasma processing system

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6036878A (en) * 1996-02-02 2000-03-14 Applied Materials, Inc. Low density high frequency process for a parallel-plate electrode plasma reactor having an inductive antenna
US6287435B1 (en) * 1998-05-06 2001-09-11 Tokyo Electron Limited Method and apparatus for ionized physical vapor deposition
US6652711B2 (en) * 2001-06-06 2003-11-25 Tokyo Electron Limited Inductively-coupled plasma processing system
WO2003029513A1 (en) * 2001-09-28 2003-04-10 Tokyo Electron Limited Hybrid plasma processing apparatus
US20050145341A1 (en) * 2003-11-19 2005-07-07 Masaki Suzuki Plasma processing apparatus
JP2007012734A (ja) * 2005-06-29 2007-01-18 Matsushita Electric Ind Co Ltd プラズマエッチング装置及びプラズマエッチング方法
US20110168673A1 (en) * 2008-07-04 2011-07-14 Tokyo Electron Limited Plasma processing apparatus, plasma processing method, and mechanism for regulating temperature of dielectric window
US9978565B2 (en) * 2011-10-07 2018-05-22 Lam Research Corporation Systems for cooling RF heated chamber components
US9437400B2 (en) * 2012-05-02 2016-09-06 Lam Research Corporation Insulated dielectric window assembly of an inductively coupled plasma processing apparatus
US9885493B2 (en) * 2013-07-17 2018-02-06 Lam Research Corporation Air cooled faraday shield and methods for using the same
US10510511B2 (en) * 2013-10-31 2019-12-17 Semes Co., Ltd. Apparatus for treating substrate
JP6262115B2 (ja) * 2014-02-10 2018-01-17 東京エレクトロン株式会社 基板処理方法及び基板処理装置
KR102262657B1 (ko) * 2014-10-13 2021-06-08 삼성전자주식회사 플라즈마 처리 장치
US20160118284A1 (en) * 2014-10-22 2016-04-28 Panasonic Intellectual Property Management Co., Ltd. Plasma processing apparatus
CN206432233U (zh) * 2017-01-19 2017-08-22 江苏鲁汶仪器有限公司 刻蚀机的下电极载片台
JP6918642B2 (ja) * 2017-08-25 2021-08-11 東京エレクトロン株式会社 冷媒用の流路を有する部材、冷媒用の流路を有する部材の制御方法及び基板処理装置

Also Published As

Publication number Publication date
KR20230142334A (ko) 2023-10-11
US20230245854A1 (en) 2023-08-03
WO2022173695A1 (en) 2022-08-18

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