KR20230140588A - A system for handling substrates, a gripper for lifting a substrate from a surface, and a method for holding substrates using the gripper. - Google Patents

Abstract

A system 100 for handling substrates includes a first substrate support 112 including a first array of openings 722 defining a first substrate processing area and openings 824 defining a second substrate processing area. ) and at least one of the second substrate supports 114 including a second array. The system includes a gripper 200 for lifting substrates from the first and second substrate supports. The gripper includes a substrate receiving area 950. The gripper includes a first suction opening arrangement 1012 within the substrate receiving area. The first suction opening arrangement is disposed substantially external to the first array of sub-regions 1022 of the substrate receiving area, having a shape that matches the shape of the first array of openings of the first substrate support. The gripper includes a second suction opening arrangement 1114 within the substrate receiving area. The second suction aperture arrangement is disposed substantially external to the second array of sub-regions 1124 of the substrate receiving area, having a shape that matches the shape of the second array of openings of the second substrate support. The gripper is configured to selectively apply suction to the first suction aperture arrangement or the second suction aperture arrangement.

Description

A system for handling substrates, a gripper for lifting a substrate from a surface, and a method for holding substrates using the gripper.

[0001] Embodiments of the present disclosure relate to systems for handling substrates, such as semiconductor substrates. Systems of interest may include one or more substrate supports. The substrate supported by the substrate support may be processed, for example, by a laser configured to drill holes in the substrate. The disclosure also relates to grippers for gripping and moving substrates, for example after the substrates have been processed.

[0002] In many applications, a substrate is placed on a substrate support so that the substrate can be processed. For example, the substrate support can be a horizontal support that provides a horizontal surface on which a substrate is placed to allow the substrate to be processed. The substrate may be a thin piece of material, such as a semiconductor wafer. In some technologies, the thickness of the substrates continues to decrease. For example, in current applications, thin semiconductor substrates with thicknesses of 0.2 mm and even less are used and processed.

[0003] The substrate held by the substrate support can be processed, for example, by forming a pattern in the substrate using a laser. The laser directs the laser beam onto the substrate. By moving the laser beam over the substrate, a pattern can be formed in the substrate. The pattern may include a plurality of openings or holes drilled into or cut from the substrate by a laser. Depending on the application, different types of patterns are formed on the substrate.

[0004] After the substrate has been processed, for example after a pattern has been formed on the substrate, the transfer system may transfer the substrate from the substrate support to a different location. For thin substrates, such as semiconductor wafers, safely transporting the substrate without damaging or destroying the substrate can be a challenge. Furthermore, the substrate must be securely held by the transfer system, i.e. there should not be any unwanted movements of the substrate during transfer.

[0005] In view of the above, there is a need for improved systems and methods for handling substrates.

[0006] According to one embodiment, a system for handling substrates is provided. The system includes at least one of a first substrate support and a second substrate support. The first substrate support includes a first array of openings defining a first substrate processing area. The second substrate support includes a second array of openings defining a second substrate processing area. The system includes a gripper for lifting the substrates from the first substrate support and the second substrate support. The gripper includes a substrate receiving area. The gripper includes a first suction opening arrangement within the substrate receiving area. The first suction opening arrangement is disposed substantially external to the first array of subregions of the substrate receiving area, the first array of openings having a shape that matches the shape of the first array of openings of the first substrate support. The gripper includes a second suction aperture arrangement within the substrate receiving area. The second suction opening arrangement is disposed substantially external to the second array of sub-regions of the substrate receiving area, the second array having a shape that matches the shape of the second array of openings of the second substrate support. The gripper is configured to selectively apply suction to the first suction aperture arrangement or the second suction aperture arrangement.

[0007] According to a further embodiment, a gripper is provided for lifting a substrate from a surface. The gripper includes a substrate receiving area. The gripper includes a first suction opening arrangement including one or more first suction openings disposed in the substrate receiving area. The first array of sub-regions of the substrate receiving area is substantially free of suction openings of the first suction opening arrangement. The gripper includes a second suction opening arrangement including one or more second suction openings disposed in the substrate receiving area. The second array of sub-regions of the substrate receiving area is substantially free of suction openings of the second suction opening arrangement. The gripper is configured to selectively apply suction to the first suction aperture arrangement or the second suction aperture arrangement.

[0008] According to a further embodiment, a gripper is provided for lifting a substrate from a surface. The gripper includes a substrate receiving area. The gripper includes a first suction opening arrangement including one or more first suction openings disposed in the substrate receiving area. At least a portion of the first suction opening arrangement is arranged in a cross-shaped pattern. The gripper includes a second suction opening arrangement including one or more second suction openings disposed in the substrate receiving area. At least a portion of the second suction opening arrangement is arranged in a grid-shaped pattern. The gripper is configured to selectively apply suction to the first suction aperture arrangement or the second suction aperture arrangement.

[0009] According to a further embodiment, a method is provided for gripping substrates using a gripper. The gripper includes a first suction aperture arrangement and a second suction aperture arrangement disposed in a substrate receiving area of the gripper. The method includes supporting a first substrate by a first substrate support having a first array of openings. The first substrate has a first plurality of through holes, each through hole of the first plurality being disposed inside a perimeter of an opening of the first array of openings. The method includes lifting a first substrate from a first substrate support by applying suction to a first suction aperture arrangement, wherein the first suction aperture arrangement is configured such that no through holes of the first plurality of through holes are present. 1 Apply suction substantially exclusively to portions of the substrate. The method includes supporting a second substrate by a second substrate support having a second array of openings. The second substrate has a second plurality of through holes, each through hole of the second plurality being disposed inside a perimeter of an opening of the second array of openings. The method includes lifting a second substrate from a second substrate support by applying suction to a second suction aperture arrangement, wherein the second suction aperture arrangement is configured such that no through holes of the second plurality of through holes are present. 2 Apply suction substantially exclusively to portions of the substrate.

[0010] Embodiments also relate to apparatuses for performing the disclosed methods, including apparatus portions for performing each described method aspect. These method aspects may be performed by hardware components, by a computer programmed with suitable software, by any combination of the two, or in any other manner. Moreover, embodiments according to the present disclosure also relate to methods for operating the described device. Methods for operating the described device include method aspects for performing every respective function of the device.

[0011] A more detailed description of the disclosure briefly summarized above may be made with reference to the embodiments in such a way that the above-enumerated features of the disclosure may be understood in detail. The accompanying drawings relate to embodiments of the present disclosure and are described below:
1-6 illustrate a system for handling substrates as described herein;
7 shows examples of a first substrate support and a first substrate as described herein;
8 shows examples of a second substrate support and a second substrate as described herein;
Figure 9 shows a gripper as described herein;
10 shows a gripper, first substrate support, and first substrate as described herein;
11 shows a gripper, a second substrate support, and a second substrate as described herein;
12 and 13 show examples of grippers as described herein;
14 shows a gripper, first substrate support, and second substrate support as described herein;
Figure 15 shows a third substrate support and gripper as described herein; and
Figure 16 shows a system for handling substrates as described herein.

[0012] Reference will now be made in detail to various embodiments of the present disclosure, one or more examples of the various embodiments being illustrated in the drawings. Within the following description of the drawings, like reference numbers refer to like components. In general, only differences for individual embodiments are described. Each example is provided by way of explanation of the disclosure and is not intended as a limitation of the disclosure. Additionally, features illustrated or described as part of one embodiment may be used on or in conjunction with other embodiments to yield yet another additional embodiment. The description is intended to include such modifications and variations.

[0013] A substrate may be understood as a substantially flat piece of material, as described herein. The substrate may be a wafer. The substrate may be a semiconductor substrate or a semiconductor wafer, especially a silicon substrate or silicon wafer. For example, the substrate may be a c-Si wafer. The substrate may be a substantially rectangular substrate. The term “substantially rectangular” includes shapes having, for example, rounded or chamfered corners, but otherwise having a rectangular shape (“pseudo-square” substrates). The substrate may be a substrate for use in a printed circuit board (PCB) application. The substrate may have a length of less than or equal to 20 cm in a first direction and/or may have a length of less than or equal to 20 cm in a second direction. The substrate, such as a silicon substrate, may be a thin piece of material. The substrate may have a thickness of less than 150 μm, such as less than 120 μm or even less than 100 μm.

[0014] According to one embodiment, a system for handling substrates is provided. The system can include a first substrate support including a first array of openings defining a first substrate processing area. Additionally or alternatively, the system can include a second substrate support including a second array of openings defining a second substrate processing area. The system includes a gripper for lifting the substrates from the first substrate support and the second substrate support. The gripper includes a substrate receiving area. The gripper includes a first suction aperture arrangement within the substrate receiving area. The first suction aperture arrangement is disposed substantially external to the first array of sub-regions of the substrate receiving area having a shape that matches the shape of the first array of openings of the first substrate support. The gripper includes a second suction aperture arrangement within the substrate receiving area. The second suction opening arrangement is disposed substantially external to the second array of sub-regions of the substrate receiving area, the second array having a shape that matches the shape of the second array of openings of the second substrate support. The gripper is configured to selectively apply suction to the first suction aperture arrangement or the second suction aperture arrangement.

[0015] 1-6 illustrate different states of operation of system 100 for handling substrates according to embodiments described herein. 1-6, system 100 is shown in side view.

[0016] System 100 includes a first substrate support 112 that can be mounted to support body 20 . The first substrate 12, for example a semiconductor substrate such as a thin silicon substrate, may be supported by the first substrate support 112, for example in a horizontal orientation. The first substrate 12 may be maintained in a fixed position on the first substrate support 112 . For example, the first substrate supporter 112 may apply a chucking force, for example, a suction force, to maintain the first substrate 12 .

[0017] As shown in FIG. 1 , system 100 may include a processing unit 150, for example a laser, for processing a first substrate 12 supported by a first substrate support 112. . The processing unit 150 can direct the laser beam 152 onto the first substrate 12 to form a pattern of openings in the first substrate 12 , in particular drilling or cutting.

[0018] System 100 includes gripper 200, as shown in FIG. 2. After the first substrate 12 has been processed by the processing unit 150, i.e., after the pattern of openings has been formed in the first substrate 12, the gripper 200 moves the gripper 200 as indicated by the downward arrow in FIG. 2 . Likewise, it can be moved downward toward the first substrate 12. The gripper 200 may grip or maintain the first substrate 12 by, for example, applying suction force to the first substrate 12 . The first substrate 12 may be gripped by applying suction to the first suction opening arrangement of the gripper 200, as described herein. The first substrate 12 may be lifted from the first substrate support 112 by the gripper 200, as indicated by the upward arrow in FIG. 3 . For ease of presentation, processing unit 150 is not shown in FIGS. 2 and 3 .

[0019] The gripper 200 according to embodiments described herein may be movable in the vertical direction. The gripper may comprise or be mounted on a mechanical arm for performing a movement in the vertical direction, for example a lifting movement or a lowering movement. The gripper may be configured to hold and transport the substrate.

[0020] System 100 includes a second substrate support 114 that can be mounted to support body 20, as shown in FIG. 4. For example, after the first substrate 12 is lifted from the first substrate support 112 by the gripper 200, the first substrate support 112 may be removed from the support body 20. The second substrate support 114 may be mounted on the support body 20 after the first substrate support 112 is removed from the support body 20 . In other words, the first substrate support 112 can be replaced by the second substrate support 114 so that both substrate supports can be arranged at the same location at different times. In other embodiments, first substrate support 112 and second substrate support 114 may be mounted in different locations. For example, the first substrate support 112 may be mounted on a first support body, and the second substrate support 114 may be mounted on a second support body spaced apart from the first support body.

[0021] As shown in FIG. 4 , a second substrate 14 , for example, a semiconductor substrate, may be supported by the second substrate support 114 . The processing unit 150 may direct the laser beam 154 onto the second substrate 14 to form a pattern of openings, particularly through holes, in the second substrate 14 . After the second substrate 14 has been processed by the processing unit 150, the gripper 200 may be moved downward toward the second substrate 14, as indicated by the downward arrow in Figure 5. . The second substrate 14 may be gripped by applying suction to the second suction opening arrangement of the gripper 200, as described herein. The second substrate 14 may be lifted from the second substrate support 114 by the gripper 200, as indicated by the upward arrow in FIG. 6 . For ease of presentation, processing unit 150 is not shown in FIGS. 5 and 6 .

[0022] According to embodiments described herein, system 100 includes a first substrate support and a second substrate support. Aspects where the system includes a first substrate support and a second substrate support may include configurations in which both the first substrate support and the second substrate support exist simultaneously as different parts of the processing tool or device. For example, the first substrate support and the second substrate support may be arranged in different positions of the tool or device, such that the gripper may be moved between the first and second substrate supports, for example. You can. A system including a first substrate support and a second substrate support may also include configurations in which only one of the first substrate support and the second substrate support is present in the tool or device at any time. The first substrate support and the second substrate support need not exist simultaneously. In a first phase of operation (eg, as shown in Figures 1-3), the first substrate support may be present as part of a tool or device. For example, the first substrate support unit may be mounted on the support body 20 . During the first phase, the second substrate support may be stored, for example in a storage area that may not be part of the tool or device. After the first phase of operation, the first substrate support can be removed from the mounting body 20 and placed aside. In a second phase of operation (e.g., as illustrated in FIGS. 4-6), which may occur after the first phase of operation, a second substrate support may be present in the tool or device. For example, instead of the first substrate support, the second substrate support can be pulled out of the storage area and mounted on the support body 20. In a second aspect, the first substrate support may not be present as part of the tool or device and may, for example, be stored in a storage area. In each aspect, only one of the first substrate support and the second substrate support may be present in the tool or device.

[0023] According to embodiments described herein, a substrate support (eg, first substrate support 112, second substrate support 114, or any other substrate support described herein) includes an array of openings. The opening of the substrate support may be understood as a through hole. An array of openings defines the processing area of the substrate support. The substrate supported by the substrate support can be processed, for example by a laser beam, at portions of the substrate lying inside the processing area. Openings in the substrate support are provided to allow the laser beam to pass therethrough and form openings in the substrate supported by the substrate support. The laser beam can be configured to move only within the perimeter of each opening of the substrate support, so that the laser beam does not impinge on the material of the substrate support (the latter would cause damage to the substrate support). Each opening in the array of openings in the substrate support can be a relatively large opening to allow the laser beam to cut a relatively large amount of material from the substrate.

[0024] Figure 7(a) shows a top view of the first substrate support 112 as described herein. First substrate support 112 may include a first array of openings 722 defining a first substrate processing area. Each opening may be a through hole formed in the first substrate support 112. The first substrate support 112 has a first substrate support area 732 . The first substrate support region 732 in (a) of FIG. 7 may be understood as a hatched region. Openings 722 do not belong to first substrate support area 732 .

[0025] The substrate support area, or substrate support surface, of a substrate support can be understood as a part of the material of the substrate support that is configured to support the substrate, in particular to be in contact with the substrate. Portions of the substrate supported by the substrate support surface may not be processed by processing unit 150. For example, the laser beam can be configured not to impinge on the substrate support area. The substrate support area may be separated from the substrate processing area defined by an array of openings in the substrate support.

[0026] The substrate support area (eg, first substrate support area 732, second substrate support area 834, or any other substrate support area described herein) may be a grid-shaped area. The grid may be a rectangular or square grid.

[0027] A grid as described herein includes a plurality of first lines extending in a first direction (e.g., 2, 3, 4, 5, 6, 7, 8, 9 or more first lines) and a first A structure having a plurality of second lines (e.g., 2, 3, 4, 5, 6, 7, 8, 9 or more second lines) extending in a second direction that may be substantially perpendicular to the direction. It can be understood as a shape that expresses. Substantially vertical directions may be understood as allowing for a deviation of up to 10 or even 15 degrees with respect to exactly vertical directions. Each first line may intersect a respective second line. In some grids, first lines may be spaced apart from each other with a constant first grid spacing between adjacent first lines. The second lines may be spaced apart from each other with a constant second grid spacing between adjacent second lines. In some grids, the first grid spacing may be equal to the second grid spacing.

[0028] As shown in (a) of FIG. 7, the first substrate support area 732 may have the shape of a first grid. The first substrate support area 732 shown in (a) of FIG. 7 is in a grid having three first lines extending in the left and right directions of the drawing plane and three second lines extending in the up and down directions of the drawing plane. It is molded accordingly. In other embodiments, the first substrate support region includes three, four, or five first lines extending in a first direction and three, four, or five first lines extending in a second direction. It can be molded according to a grid having the above second lines.

[0029] First substrate support 112 may include one or more suction openings 742 in first substrate support area 732 . A substrate support (e.g., first substrate support 112, second substrate support 114, or any other substrate support described herein) may include one or more substrate supports for applying a suction force to the substrate supported by the substrate support. It may include suction openings. One or more suction openings may be connectable to a vacuum source arrangement.

[0030] The array of openings in the substrate support (e.g., the first array of openings 722 in first substrate support 112 or the second array of openings 824 in second substrate support 114) is two-dimensional. It may be an array. The array of openings may be an N×K array containing N rows and K columns. Each of the N rows may include K openings arranged in a linear arrangement extending in the first direction. Each of the K columns may include N openings arranged in a linear arrangement extending in a second direction, which may be substantially perpendicular to the first direction. The number of rows (N) may be equal to the number of columns (K). For example, as shown in (a) of FIG. 7, the first array of openings 722 of the first substrate supporter 112 may be a 2×2 array.

[0031] The substrate support (eg, first substrate support 112, second substrate support 114, or any other substrate support described herein) may be a sparse structure. That the substrate support is a sparse structure can be understood in the sense that the substrate support is formed as relatively thin pieces of material with relatively large openings therebetween, shaped for example in the form of windows. The joint area occupied by all the openings of the array of openings of the substrate support (e.g., the first array of openings 722 or the second array of openings 824) may be relatively large. there is. The common area of the array of openings may be at least 40%, at least 50%, at least 60%, at least 70%, or even at least 80% of the area defined by the circumference (or perimeter) of the substrate support. The common area, or total area, of the array of openings can be understood as the sum of the areas of the individual openings.

[0032] Figure 7(b) shows the first substrate 12 after a pattern of openings has been formed in the first substrate 12 by the laser beam 152. The first substrate 12 may include a plurality of openings 752, that is, through holes. Openings 722 may each be relatively large openings with a length and/or width that may be greater than 5% of the length and/or width of first substrate 12 . Squares shown as dashed lines in Figure 7(b) represent the perimeter of the openings of the first array of openings 722 when the first substrate 12 is supported by the first substrate support 112. As shown in (b) of FIG. 7, each opening 752 formed in the first substrate 12 is located inside the perimeter of the opening of the first array of openings 722, so that the laser beam ( This reflects that 152 is moved only within the perimeter to form openings 752 within the first substrate 12 . The first substrate may include a plurality of vias 762. Vias 762 may be small through holes, much smaller than openings 752. Each opening 752 may be surrounded by multiple vias 762. As shown in (b) of FIG. 7 , each via 762 is formed inside the perimeter of the opening of the first array of openings 722 .

[0033] Figure 8(a) shows a top view of the second substrate support 114 as described herein. Second substrate support 114 may include a second array of openings 824 . Each opening may be a through hole formed in the second substrate support 114. The second array of openings 824 of the second substrate support 114 may be a 3×3 array.

[0034] Second substrate support 114 may have a second substrate support area 834 or a second substrate support surface. The second substrate support area 834 in (a) of FIG. 8 may be understood as a hatched area in the drawing. Openings 824 do not belong to second substrate support area 834. The second substrate support area 834 may have the shape of a second grid. The second substrate support area 834 shown in (a) of FIG. 8 is formed on a grid having four first lines extending in the left and right directions of the drawing plane and four first lines extending in the up and down directions of the drawing plane. It is molded accordingly. In other embodiments, the second substrate support region includes three, four, or five first lines extending in a first direction and three, four, or five first lines extending in a second direction. It can be molded according to a grid having the above second lines.

[0035] The second substrate support 114 may include one or more suction openings 844 in the second substrate support area 834 for applying a suction force to the substrate supported by the second substrate support 114 .

[0036] Figure 8(b) shows the second substrate 14 after a pattern of openings has been formed in the second substrate 14 by, for example, a laser beam 154. The second substrate 14 may include a plurality of openings 854, that is, through holes. Openings 854 may each be relatively large openings with a length and/or width that may be greater than 5% of the length and/or width of the second substrate. The second substrate may include a plurality of vias 864. Each opening 854 may be surrounded by multiple vias 864. Squares shown as dashed lines in Figure 8(b) represent the perimeter of the openings of the second array of openings 824 when the second substrate 14 is supported by the second substrate support 114. As shown in (b) of FIG. 8, each opening 854 and each via 864 formed in the second substrate 14 are inside the perimeter of the opening 824 of the second substrate support 114. It is located to reflect that the laser beam 154 moves only within the perimeter for processing the second substrate 14.

[0037] The substrates shown in FIGS. 7 and 8 include large openings (openings 752 and 854) as well as vias (vias 762 and 864). In other examples, only vias may be formed in the substrate, ie, no large openings are formed. In still other implementations, only large openings may be formed in the substrate. The pattern in which the openings, i.e. vias and/or large openings, are formed in the substrate is a variety of possible patterns that may differ from those shown in FIGS. 7(b) and 8(b), depending on the application for which the substrate will be used. may be accompanied by

[0038] As illustrated in FIGS. 7 and 8 , the array of openings in the first substrate support 112 and the array of openings in the second substrate support 114 may be molded according to different patterns. For example, the number, size, and/or shape of the openings of the second substrate support 114 may be different from the number, size, and/or shape of the openings of the first substrate support 112, respectively. In light of this, the pattern of openings formed in the second substrate 14 supported by the second substrate support 114 is the pattern of openings formed in the first substrate 12 supported by the first substrate support 112. It may be different from . The gripper 200 according to embodiments described herein is configured to securely grip substrates having such differently shaped patterns. In particular, the gripper 200 has a first suction aperture arrangement designed to grip a first substrate 12 being processed on the first substrate support 112 and a second substrate 14 being processed on the second substrate support 114. and a second suction opening arrangement designed to grip. The gripper 200 is configured to selectively apply suction to a first arrangement of suction openings for gripping the first substrate 12 or a second arrangement of suction openings for gripping the second substrate 14 .

[0039] As illustrated in Figures 7 and 8, a relatively large portion of material can be removed from each substrate by laser processing. For example, with respect to the first substrate, the total area of material removed from the first substrate 12, i.e., the total area of the first substrate 12 while the first substrate 12 is supported by the first substrate support 112. ) The total area of the openings formed may be 40% or more, 50% or more, 60% or more, or 70% or more of the area of the first substrate. The amount of material of first substrate 12 remaining inside the perimeter of each opening 722 of first substrate support 112 after laser processing may be a small fraction of the material initially present within the perimeter. In other words, the amount of material of the first substrate 12 remaining inside each dashed line square shown in (b) of FIG. 7 may be a small fraction of the area of the dashed line square of interest. The resulting first substrate 12 may be a sparse structure that can be very fragile, ie a structure with a thin “skeleton” and many openings. Likewise, a relatively large portion of the material may be removed from the second substrate 14 by laser processing, resulting in the second substrate remaining inside each dashed square shown in Figure 8(b). The amount of material in 14) may be a small fraction of the area of the dashed square of interest. The total area of material removed from second substrate 14, i.e., the total area of openings formed in second substrate 14 while second substrate 14 is supported by second substrate support 114, is 2 It may be at least 40%, at least 50%, at least 60%, or at least 70% of the area of the substrate. The second substrate 14 may be a thin and fragile structure.

[0040] Processed substrates, i.e. substrates after a plurality of openings have been formed therein, may be sparse and fragile structures that must be handled carefully to prevent damage to the substrates. The gripper 200 according to embodiments described herein may have an arrangement of suction openings designed to securely grip such sparse and fragile substrates without damaging the substrates.

[0041] According to embodiments described herein, the gripper 200 is positioned at an area of the first substrate that lies substantially outside the perimeter of each opening 722 of the first substrate support 112, i.e., (see Figure 7). It is designed to grip the first substrate 12, i.e. the substrate being processed on the first substrate support 112, by applying a suction force only within the area of the substrate lying substantially outside of the dashed squares shown in b). In doing so, it can be ensured that the first substrate 12 is gripped only at unprocessed locations where there are no openings in the first substrate 12 . In other words, the first substrate 12 may be gripped (substantially) exclusively in those portions of the first substrate 12 where substrate material is present. In addition, the gripper 200 according to the embodiments described herein is provided in an area of the second substrate lying substantially outside the perimeter of each opening 824 of the second substrate support 114, that is, in FIG. 8 ( It is also designed to grip the second substrate 14 , ie the substrate being processed on the second substrate support 114 , by applying a suction force only to the areas lying substantially outside of the dashed squares shown in b). In doing so, it can also be ensured that the second substrate 14 is gripped only at unprocessed locations, ie, locations where there are no openings in the second substrate 14 . The second substrate 14 can be gripped (substantially) exclusively at the material portions of the second substrate 14 .

[0042] To achieve this, the gripper 200 according to embodiments described herein includes a first suction opening arrangement consisting of one or more first suction openings and a second suction opening arrangement comprising a second suction opening arrangement. do. The gripper 200 may selectively apply suction to the first suction opening arrangement or the second suction opening arrangement.

[0043] Figure 9 shows a bottom view of the gripper 200 according to embodiments described herein. The gripper 200 has a substrate receiving area 950, or substrate receiving surface, for receiving a substrate. Substrate receiving area 950 may be a substantially rectangular or square area. The area of the substrate receiving area 950 may be similar to the area of the substrate held by the gripper 200, for example, may be slightly larger. A plurality of suction openings 910 may be disposed in the substrate receiving area 950 to apply suction force to the substrate. The substrate receiving area may be a bottom area of the gripper that may be configured to be oriented in a substantially horizontal orientation. The substrate receiving area may be movable at least in a vertical direction. The substrate receiving area may be configured to face a substrate support that supports the substrate, such as the first substrate support or the second substrate support described herein.

[0044] The plurality of suction openings 910 in substrate receiving area 950 comprises or consists of one or more first suction openings, e.g., 50 or more, 100 or even 200 or more first suction openings. It may include a first suction opening arrangement configured. The first suction opening arrangement may be connected to or connectable to a vacuum source system. For example, a suction force for holding or gripping the first substrate 12 supported by the first substrate support 112 may be applied to the first suction aperture arrangement, and in particular only to the first suction aperture arrangement.

[0045] 10(a) highlights a first suction opening arrangement 1012 that includes, or consists of, one or more first suction openings, as indicated by the dashed lines. Figure 10(b) shows the first array of sub-regions 1022 of the substrate receiving area 950, namely a 2x2 array of white squares. The first array of sub-regions 1022 of the substrate receiving region 950 may have a shape that matches the shape of the first array of openings 722 of the first substrate support 112, i.e., the first substrate processing region. You can. The first intake opening arrangement 1012 may be arranged outside, or at least substantially outside, the first array of sub-regions 1022 . As shown in Figure 10(b), the first suction openings are disposed within the hatched area complementary to the first array of sub-areas 1022. In light of this, a first suction aperture arrangement 1012 (in particular, a first suction aperture arrangement 1012) is provided for gripping the first substrate 12 after the first substrate 12 has been processed on the first substrate support 112. When used only, the first substrate 12 may be gripped only at locations where the first substrate 12 has not been processed by the laser beam 152, i.e. no openings have been formed and substrate material is present. will be.

[0046] 10(c) shows the first suction opening arrangement 1012 in relation to the first substrate support 112 when the gripper 200 is used to lift the first substrate 12 from the first substrate support 112. ) indicates where is placed. As shown in Figure 10(c), the first suction opening arrangement 1012 (again indicated by the dashed lines) is inside the first substrate support region 732 of the first substrate support 112, i.e., hatched. It can be placed inside the beaten area and outside the first array of openings 722, i.e. outside the white squares. The shape of the first array of openings 722 shown in (c) of FIG. 10 matches the shape of the first array of sub-regions shown in (b) of FIG. 10. The number, position, size and/or shape of the openings of the first array of openings 722 may be the same as the number, position, size and/or shape of the sub-regions of the first array of sub-regions 1022 .

[0047] Figure 10(d) shows that when a gripper is used to lift the first substrate 12 from the first substrate support 112 after the first substrate 12 is processed, the first suction opening arrangement 1012 is 1 Indicate where it is placed in relation to the substrate 12. For simplicity, the vias of the first substrate 12 are not shown in FIG. 10(d). As shown, the first suction aperture arrangement (again indicated by dashed lines) is formed outside the regions of the first substrate 12 processed by the laser beam, i.e. in the first substrate 12 by the laser beam. are placed outside the openings. The first suction openings are arranged in such a way that they allow the first suction openings to grip the first substrate 12 only in locations where the material of the first substrate is present, i.e. in locations where no openings are formed. .

[0048] The plurality of suction openings 910 in the substrate receiving area 950 of the gripper 200 may include one or more secondary suction openings, e.g., 50 or more, 100 or more, or even 200 or more secondary suction openings. and a second suction opening arrangement comprising or consisting of these. The second intake opening arrangement and the first intake opening arrangement may be separate intake opening arrangements, ie intake opening arrangements that do not have any intake openings in common. The second suction opening arrangement may be connected or connectable to the vacuum source system. A suction force may be applied to the second suction aperture arrangement, in particular only the second suction aperture arrangement, for holding or gripping the second substrate 14 supported by the first substrate support 112 .

[0049] The crisscross-shaped patterns of dashed lines shown in FIGS. 10(a)-(b) are visual aids added to the drawings to facilitate understanding of the spatial arrangement of the first suction opening arrangement within the substrate receiving area of the gripper. provided. Likewise, the crisscross-shaped broken lines shown in (c) - (d) of FIGS. 10 are in a configuration where the gripper is positioned adjacent to the first substrate support for gripping the first substrate supported by the first substrate support. These are visual aids to better understand the position of the first substrate support and the first suction aperture arrangement with respect to the first substrate. These visual aids are not part of the gripper, the first substrate support, or the actual physical structure of the first substrate. Likewise, the array of white squares shown in Figure 10(b) is a visual aid to facilitate understanding of the spatial arrangement of the first array of sub-regions and is not part of the physical structure of the gripper. Similar comments are made in relation to the grid-shaped pattern of dashed lines shown in Figures 11(a)-(d) and the second array of sub-regions of the gripper and the second suction aperture arrangement of the white color shown in Figure 11(b). This also applies to arrays of squares.

[0050] 11A highlights a second suction opening arrangement 1114 that includes, or consists of, one or more second suction openings, as indicated by the dashed lines. Figure 11(b) shows the second array of sub-regions 1124 of the substrate receiving area 950, namely a 3x3 array of white squares. The second array of sub-regions 1124 of the substrate receiving region 950 may have a shape that matches the shape of the second array of openings 824 of the second substrate support 114, i.e., the second substrate processing region. You can. The second intake opening arrangement 1114 may be arranged outside, or at least substantially outside, the second array of sub-regions 1124 . As shown in Figure 11(b), the second suction opening arrangement 1114 is disposed inside the hatched area, which is complementary to the second array of sub-areas 1124. In light of this, a second suction aperture arrangement 1114 (in particular, a second suction aperture arrangement 1114) is provided for gripping the second substrate 14 after the second substrate 14 has been processed on the second substrate support 114. If used only, the second substrate 14 is gripped only at locations where the second substrate 14 has not been processed by the laser beam 154, i.e. no openings have been formed and substrate material is present. It will be.

[0051] 11(c) shows the second suction opening arrangement 1114 in relation to the second substrate support 114 when the gripper 200 is used to lift the second substrate 14 from the second substrate support 114. ) indicates where is placed. As shown, the second suction openings (indicated by dashed lines) are inside the second substrate support area 834 of the second substrate support 114 (i.e., inside the hatched area), and the openings ( 824) (i.e., outside the white squares). The shape of the second array of openings 824 shown in (c) of FIG. 11 matches the shape of the second array of sub-regions shown in (b) of FIG. 11. The number, position, size and/or shape of the openings of the second array of openings 824 may be the same as the number, position, size and/or shape of the sub-regions of the second array of sub-regions 1124. .

[0052] Figure 11 (d) shows that when a gripper is used to lift the second substrate 14 from the second substrate support 114 after the second substrate 14 is processed, the second suction opening arrangement 1114 is 2 Indicate where it is placed in relation to the substrate 14. For simplicity, the vias of the second substrate 14 are not shown in FIG. 11(d). As shown, the second suction openings (again indicated by dashed lines) are outside the regions of the second substrate 14 processed by the laser beam 154, i.e. the second suction openings are processed by the laser beam 154. It is disposed outside the openings formed in the substrate 14. The second suction openings are arranged in such a way that they allow the second suction openings to grip the second substrate 14 only in locations where the material of the second substrate is present, i.e. in locations where no openings are formed. .

[0053] The gripper 200 may be configured to selectively apply suction to the first suction opening arrangement 1012 or the second suction opening arrangement 1114.

[0054] The gripper 200 operates on the first suction aperture arrangement 1012 while no suction is applied to the second suction aperture arrangement 1114 and, in particular, while no suction is applied to any other suction opening in the substrate receiving area 950. ) may be configured to apply suction. The grippers may be configured to individually apply suction to the first suction opening arrangement 1012. The gripper may include a first vacuum circuit for connecting the first suction aperture arrangement 1012 to the vacuum source system. The first vacuum circuit may include one or more channels. The first vacuum circuit may be a vacuum circuit configured to individually connect the first suction aperture arrangement 1012 to the vacuum source system.

[0055] The gripper 200 operates on the second suction aperture arrangement 1114 while no suction is applied to the first suction aperture arrangement 1012 and, in particular, while no suction is applied to any other suction opening in the substrate receiving area 950. ) may be configured to apply suction. The gripper may be configured to individually apply suction to the second suction opening arrangement 1114. The gripper may include a second vacuum circuit for connecting the second suction aperture arrangement 1114 to the vacuum source system. The second vacuum circuit may include one or more channels. The second vacuum circuit may be a vacuum circuit configured to individually connect the second suction aperture arrangement 1114 to the vacuum source system. The first vacuum circuit and the second vacuum circuit may be separate vacuum circuits. There may be no fluid connection or coupling between the first vacuum circuit and the second vacuum circuit.

[0056] The gripper 200 applies suction only to the first suction opening arrangement 1012, in particular the first suction opening arrangement 1012, in order to grip the first substrate 12 supported by the first substrate support 112. It can be configured to authorize. The gripper may be configured to apply suction to the second suction aperture arrangement 1114, in particular only the second suction aperture arrangement 1114, for gripping the second substrate 14 supported by the second substrate support 114. there is. The gripper may be configured to transition from a first state of operation to a second state of operation. In a first state of operation, the gripper may apply suction to the first suction aperture arrangement 1012 and/or may not apply suction to the second suction aperture arrangement 1114. In the second state of operation, the gripper may apply suction to the second suction aperture arrangement 1114 and/or may not apply suction to the first suction aperture arrangement 1012.

[0057] According to embodiments described herein, the first suction aperture arrangement 1012 may be disposed substantially external to the first array of sub-regions 1022 of the substrate receiving area 950 of the gripper 200. . The second suction opening arrangement 1114 may be disposed substantially external to the second array of sub-regions 1124 of the substrate receiving area 950. The term “substantially external” means that at most a small portion, for example up to 5%, 10% or 15%, of the first intake aperture arrangement may lie inside the first array of sub-regions 1022. It can be understood. Likewise, at most a small portion of the second intake opening arrangement, for example up to 5%, 10% or 15%, may lie within the second array of sub-regions 1124. The first array of sub-regions 1022 may be substantially free of suction openings of the first suction opening arrangement. The second array of sub-regions 1124 may be substantially free of the suction openings of the second suction opening arrangement 1114 .

[0058] An array of sub-regions as described herein of the substrate receiving region 950 of the gripper 200 (e.g., a first array of sub-regions 1022 or a second array of sub-regions 1124 ) may include 4 or more, 9 or more, 16 or more, or 25 or more sub-regions. The array of sub-regions may be a two-dimensional array, in particular an N×K array containing N rows and K columns. The numbers N and K may be 2, 3, 4, 5 or 6 or more. Each sub-area of the array of sub-areas may be a substantially rectangular sub-area.

[0059] The array of sub-regions of the gripper's substrate receiving region 950 (e.g., a first array of sub-regions 1022 or a second array of sub-regions 1124) may be dense in the substrate receiving region 950. You can. The common area of the sub-regions of the array of sub-regions (i.e., the total area of all sub-regions of the array of sub-regions combined) is surrounded by the area of the substrate receiving region 950 (i.e., the perimeter of the substrate receiving region 950). It may be at least 40%, at least 50%, at least 60%, at least 70% or at least 80% of the area. In other words, the array of sub-regions may make up a large portion of the substrate receiving area 950 of the gripper 200. Each sub-region of the array of sub-regions may be relatively large. Each sub-region may have a first width in a first direction. The first width may be 5% or more of the first width of the substrate receiving area 950 in the first direction. For example, the first direction may be the left and right direction in FIG. 10(b). Each sub-region may have a second width in a second direction. The second width may be 5% or more of the second width of the substrate receiving area 950 in the second direction. For example, the second direction may be the up and down direction in FIG. 10(b).

[0060] The first array of sub-regions 1022 of the substrate receiving area 950 may include a first sub-region, for example, the upper left sub-region 1022 shown in (b) of FIG. 10 . The first array of sub-areas 1022 may include a second sub-area, for example, the upper right sub-area 1022 shown in (b) of FIG. 10 . The second sub-area may be adjacent to the first sub-area. The first array of sub-areas 1022 may include a third sub-area, for example, the lower left sub-area 1022 shown in (b) of FIG. 10 . The third sub-area may be adjacent to the first sub-area. The first array of sub-areas 1022 may include a fourth sub-area, for example, the lower right sub-area 1022 shown in (b) of FIG. 10 . The fourth sub-area may be adjacent to the third sub-area and adjacent to the second sub-area. The first sub-area, the second sub-area, the third sub-area, and the fourth sub-area may form a 2×2 array, for example, as shown in (b) of FIG. 10 . The first portion of the first suction opening arrangement 1012 may be disposed between the first sub-area and the second sub-area. The first portion of the first intake opening arrangement may include a plurality of intake openings. The second portion of the first suction opening arrangement 1012 may be disposed between the first sub-region and the third sub-region. The second portion of the first intake opening arrangement 1012 may include a plurality of intake openings. The third portion of the first suction opening arrangement 1012 may be disposed between the second sub-region and the fourth sub-region. The third portion of the first intake opening arrangement may include a plurality of intake openings. The fourth portion of the first suction opening arrangement 1012 may be disposed between the third sub-region and the fourth sub-region. The fourth portion of the first intake opening arrangement 1012 may include a plurality of intake openings.

[0061] For example, as shown in Figure 10(b), an individual portion of the first suction opening arrangement 1012 is positioned between any two adjacent sub-regions of the first array of sub-regions 1022. can be placed. The first substrate 12, that is, a sparse substrate with a plurality of openings formed therein, can be reliably held in the suction openings of the first suction opening arrangement.

[0062] The second array of sub-regions 1124 of the substrate receiving area 950 may include the first sub-region. The second array of sub-regions 1124 may include a second sub-region. The second sub-area may be adjacent to the first sub-area. The second array of sub-regions 1124 may include a third sub-region. The third sub-area may be adjacent to the first sub-area. The second array of sub-regions 1124 may include a fourth sub-region. The fourth sub-area may be adjacent to the third sub-area and adjacent to the second sub-area. The first sub-region, second sub-region, third sub-region and fourth sub-region may form a 2×2 array, which may be a sub-array of the second array of sub-regions 1124. You can. The first portion of the second suction opening arrangement 1114 may be disposed between the first sub-region and the second sub-region. The first portion of the second intake opening arrangement 1114 may include a plurality of intake openings. The second portion of the second suction opening arrangement 1114 may be disposed between the first sub-region and the third sub-region. The second portion of the second intake opening arrangement may include a plurality of intake openings. The third portion of the second suction opening arrangement 1114 may be disposed between the second sub-region and the fourth sub-region. The third portion of the second intake opening arrangement may include a plurality of intake openings. The fourth portion of the second suction opening arrangement 1114 may be disposed between the third sub-region and the fourth sub-region. The fourth portion of the second intake opening arrangement 1114 may include a plurality of intake openings.

[0063] For example, as shown in Figure 11(b), individual portions of the second suction opening arrangement 1114 are positioned between any two adjacent sub-regions of the second array of sub-regions 1124. can be placed. The second substrate 14, that is, a sparse substrate with a plurality of openings formed therein, can be securely held in the suction openings of the second suction opening arrangement 1114.

[0064] Exemplary arrays of sub-regions of the substrate receiving area 950 shown schematically in the figures have a square design with N ² sub-regions arranged in an N×N matrix, with all sub-regions of the array having the same It has a shape and size. Embodiments described herein are not limited to such symmetrical designs. For example, different sub-regions of the array of sub-regions may have different sizes, the sub-regions may have different shapes than squares, the substrate receiving area 950 need not have a square shape, etc.

[0065] The first portion of the first suction opening arrangement 1012 may have a linear shape extending in a first direction. The first portion may include one or more suction openings of the first suction opening arrangement 1012. For example, in Figure 10(b), the first portion can be understood as a line of suction openings of the first suction opening arrangement 1012 extending in the left and right directions. At least two sub-regions of the first array of sub-regions 1022 may be disposed on a first side of the first portion. At least two sub-regions of the first array of sub-regions 1022 may be disposed on a second side of the first portion opposite the first side. The second portion of the first suction opening arrangement 1012 may have a linear shape extending in the second direction. The second direction may be substantially perpendicular to the first direction (eg, at an angle from 75 degrees to 105 degrees, especially from 80 degrees to 100 degrees). The second portion may include one or more suction openings of the first suction opening arrangement 1012. For example, in Figure 10(b), the second portion can be understood as a line of suction openings of the first suction opening arrangement 1012 extending in the vertical direction. At least two sub-regions of the first array of sub-regions 1022 may be disposed on the first side of the second portion. At least two sub-regions of the first array of sub-regions 1022 may be disposed on a second side of the second portion opposite the first side. The first portion and the second portion may form a crisscross shape.

[0066] A criss-cross can be understood as a shape that includes two lines that intersect each other, or represents a structure composed of the two lines. The two lines may be substantially perpendicular to each other. A grid as described herein can include a plurality of first lines in a first direction and a plurality of second lines in a second direction, each first line intersecting a respective second line. . In light of this, the grid may include a plurality of crisscross-shaped portions.

[0067] The second suction opening arrangement may include a first portion and a second portion each having a linear shape extending in a third direction. The third direction may be the same as the first direction described herein. Each of the first portion and the second portion may include one or more suction openings of the second suction opening arrangement 1114. For example, in Figure 11 (b), the first part and the second part can be understood as two lines of suction openings of the second suction opening arrangement 1114 extending in the left and right directions. At least three sub-regions of the second array of sub-regions 1124 may be disposed between the first portion and the second portion. The second suction opening arrangement 1114 may include a third portion and a fourth portion each having a linear shape extending in a fourth direction. The fourth direction may be the same as the second direction described herein. The fourth direction may be substantially perpendicular to the third direction. Each of the third portion and the fourth portion may include one or more suction openings of the second suction opening arrangement 1114. For example, in Figure 11 (b), the third part and the fourth part can be understood as two lines of suction openings of the second suction opening arrangement 1114 extending in the vertical direction. At least three sub-regions of the second array of sub-regions 1124 may be disposed between the third and fourth portions. The first part, the second part, the third part and the fourth part may form a grid.

[0068] 12 and 13 show two individual grippers according to additional embodiments described herein. Two grippers, such as the grippers shown in FIGS. 9 to 11, are used with the first substrate support 112 shown in (a) of FIG. 7 and the second substrate support 114 shown in (a) of FIG. 8. designed for In light of this, both of the two grippers shown in FIGS. 12 and 13 have a first array of identical sub-regions 1022 and a second array of identical sub-regions 1124 as the grippers shown in FIGS. 9-11. Contains an array.

[0069] Figure 12(a) shows a first suction opening arrangement 1012 indicated by dashed lines, according to one embodiment. The first suction opening arrangement 1012 is a grid, for example, three first lines extending in a first direction (left and right directions in FIG. 12 (a)) and a second direction (in FIG. 12 (a)) It may have the shape of a grid with three second lines extending in an upward and downward direction. The first suction opening arrangement 1012, when the first suction opening arrangement 1012 is used to hold the first substrate 12 shown in (b) of FIG. 7, is used to hold the first substrate 12 on which the substrate material is present ( The sub-regions ( 1022) is disposed substantially outside the first array. Figure 12(b) shows a second suction opening arrangement similar to the second suction opening arrangement shown in Figure 11.

[0070] Figure 13(a) shows a plurality of suction openings, indicated by dashed lines, of the substrate receiving area 950. The plurality of suction openings includes a first suction opening arrangement and a second suction opening arrangement.

[0071] Figure 13(b) highlights the first intake opening arrangement 1012, displayed as a 2x2 array comprised of four dashed rectangles. The first suction aperture arrangement 1012 is provided only at locations of the first substrate 12 where no openings exist when the first suction aperture arrangement 1012 is used to grip the first substrate 12. 1 Suction opening arrangement 1012 is disposed substantially outside the first array of sub-regions 1022 to exclusively apply suction. Each sub-region of the first array of sub-regions 1022 may be surrounded by a portion of the first intake opening arrangement 1012. For example, each white square in Figure 13(b) is surrounded by a plurality of suction openings of the first suction opening arrangement 1012 arranged in a rectangular shape. A portion of the first suction opening arrangement 1012 forms a crisscross-shaped pattern, that is, the portion indicated by solid lines in Figure 13(c).

[0072] Figure 13(d) highlights the second intake opening arrangement 1114, displayed as a 3x3 array comprised of 9 dashed rectangles. The second suction aperture arrangement 1114 is provided only at locations of the second substrate 14 where no openings are formed when the second suction aperture arrangement 1114 is used to grip the second substrate 14. A two suction aperture arrangement is disposed substantially outside the second array of sub-regions 1124 to exclusively apply suction. Each sub-region of the second array of sub-regions 1124 may be surrounded by a portion of the second intake opening arrangement 1114. For example, each white square in Figure 13(d) is surrounded by a plurality of suction openings of the second suction opening arrangement 1114 arranged in a rectangular shape. The second suction opening arrangement 1114 may form a grid-shaped pattern, as highlighted by solid lines in Figure 13(e).

[0073] Figure 14(a) shows a gripper 200 according to embodiments described herein. A plurality of suction openings, indicated by dashed lines, are provided in the substrate receiving area 950. The plurality of suction openings includes a first suction opening arrangement and a second suction opening arrangement.

[0074] Figure 14(b) highlights the first suction opening arrangement 1012 indicated by dashed lines. The first intake opening arrangement 1012 is disposed substantially external to the first array of sub-regions 1022. The first array of sub-regions 1022 has a shape that matches the first array of openings 722 of the first substrate support 112 shown in (c) of FIG. 14. When the first suction aperture arrangement 1012 is used to hold a first substrate processed on the first substrate support 112 shown in (c) of FIG. 14, the first suction aperture arrangement 1012 has a certain opening. Suction is applied exclusively to locations on the first substrate where no ridges have been formed. The first array of openings 722 of the first substrate support 112 shown in (c) of FIG. 14, and the first array of sub-regions 1022 also shown in (b) of FIG. 14, have openings It may be or contain a 3×3 array of fields/sub-regions. At least a portion of the first suction opening arrangement 1012 is shaped as a grid, e.g., representing a grid with two lines in a first direction (left and right directions) and two lines in a second direction (up and down directions). Patterns can be formed.

[0075] Figure 14(d) highlights the second suction opening arrangement 1114 indicated by dashed lines. The second intake opening arrangement 1114 is disposed substantially external to the second array of sub-regions 1124. The second array of sub-regions 1124 has a shape that matches the second array of openings 824 of the second substrate support 114 shown in (e) of FIG. 14 . When the second suction opening arrangement 1114 is used to hold the second substrate processed on the second substrate support 114 shown in (e) of FIG. 14, the second suction opening arrangement 1114 has a certain opening. Suction is applied exclusively to locations on the second substrate where no ridges have been formed. The second array of openings 824 of the second substrate support 114 shown in (e) of FIG. 14, and the second array of sub-regions 1124 also shown in (d) of FIG. 14, have openings. It may be or contain a 4×4 array of fields/sub-regions. At least a portion of the second suction opening arrangement 1114 is shaped as a grid, e.g., representing a grid with three lines in a first direction (left and right directions) and three lines in a second direction (up and down directions). Patterns can be formed.

[0076] Figure 15(a) shows a top view of the third substrate support 1506. The third substrate support 1506 may be a window-shaped or frame-shaped substrate support having a frame surrounding at least one opening 1526. At least one opening 1526 may define a third substrate processing area. A third substrate (not shown) supported by the third substrate support 1506 may be processed in the third substrate processing area, for example by a laser beam. The laser beam may be configured to travel within the perimeter of at least one opening 1526. While the third substrate is supported by the third substrate supporter 1506, a plurality of through holes may be formed in the third substrate. Each through hole may be located within the perimeter of at least one opening 1526. The third substrate support 1506 may include one or more suction openings 1546 for applying a suction force to the third substrate supported by the third substrate support 1506.

[0077] Figure 15(b) again shows a bottom view of the gripper of Figure 9. The substrate receiving area 950 may include a third suction opening arrangement 1516 that includes, or consists of, one or more third suction openings, as indicated by the dashed lines. The third suction opening arrangement 1516 is located in a third sub-region 1536 of the substrate receiving area 950 (FIG. 15) having a shape that matches the shape of the at least one opening 1526 of the third substrate support 1506. It may be disposed substantially outside (indicated by a white square in (b)). The third intake opening arrangement 1516, or a portion thereof, may be arranged in a rectangular pattern. The third suction opening arrangement 1516 may surround the first suction opening arrangement 1012 and/or the second suction opening arrangement 1114.

[0078] The gripper 200 may be configured to selectively apply suction to the first suction opening arrangement 1012, the second suction opening arrangement 1114, or the third suction opening arrangement 1516. The gripper 200 is configured to apply suction to the third suction aperture arrangement 1516, in particular only the third suction aperture arrangement 1516, to grip the third substrate supported by the third substrate support 1506. It can be. The third suction opening arrangement 1516 may apply suction only to portions of the third substrate that have not been processed, that is, portions in which through holes do not exist.

[0079] Figure 16 shows a system 100 for handling substrates according to embodiments described herein. System 100 may include a first substrate support 112 and a second substrate support (not shown) as described herein. The system includes a gripper 200 that includes a substrate receiving area 950 as described herein. Substrate receiving area 950 includes a first suction aperture arrangement and a second suction aperture arrangement (not shown in FIG. 16) as described herein.

[0080] First suction aperture arrangement 1012 may be connectable to a vacuum source system 1650 that includes one or more vacuum sources. A first vacuum circuit may connect the first suction aperture arrangement 1012 to the vacuum source system. The first vacuum circuit may include a first channel 1612 coupled to the vacuum source system, as shown in FIG. 16 . The first vacuum circuit may be individually coupleable and decoupable to the vacuum source system, for example by a first valve 1622 in the first channel 1612.

[0081] Second suction aperture arrangement 1114 may be connectable to vacuum source system 1650. A second vacuum circuit may connect the second suction aperture arrangement 1114 to the vacuum source system. The second vacuum circuit and the first vacuum circuit may be separate vacuum circuits that are not fluidly coupled to each other. The second vacuum circuit can include a second channel 1614 coupled to the vacuum source system, as shown in FIG. 16. The second vacuum circuit may be individually coupleable and decoupable to the vacuum source system, such as by a second valve 1624 in the second channel 1614.

[0082] Third suction aperture arrangement 1516 may be connectable to vacuum source system 1650. A third vacuum circuit may connect the third suction aperture arrangement 1516 to the vacuum source system. The first vacuum circuit, the second vacuum circuit, and the third vacuum circuit may be separate vacuum circuits that are not fluidly coupled to each other. The third vacuum circuit can include a third channel 1616 coupled to the vacuum source system, as shown in FIG. 16. The third vacuum circuit may be individually coupleable and decoupable to the vacuum source system, such as by a third valve 1626 in the third channel 1616. In embodiments, the third vacuum circuit may be omitted, especially if the gripper does not include a third suction opening arrangement.

[0083] By having multiple separate vacuum circuits, the gripper 200 can selectively apply suction to different suction aperture arrangements.

[0084] According to embodiments that may be combined with other embodiments described herein, a first array of openings 722 of the first substrate support 112 and/or a substrate receiving area 950 of the gripper 200 The first array of the sub-areas 1022 may be a two-dimensional N×N array. The number N can be 2 or more, 3 or more, or 4 or more. The second array of openings 824 of the second substrate support 114 and/or the second array of sub-regions 1124 of the substrate receiving area 950 of the gripper 200 may be a two-dimensional M×M array. may be, where M may be different from N. The number M can be 3 or more, 4 or more, or 5 or more.

[0085] According to embodiments that may be combined with other embodiments described herein, each opening in the first array of openings 722 of the first substrate support 112 may be a substantially rectangular opening. Each sub-region of the first array of sub-regions 1022 of the substrate receiving area 950 of the gripper 200 may be a substantially rectangular sub-region. Each opening in the second array of openings 824 of second substrate support 114 may be a substantially rectangular opening. Each sub-region of the second array of sub-regions 1124 of the substrate receiving area 950 of the gripper 200 may be a substantially rectangular sub-region.

[0086] According to embodiments that may be combined with other embodiments described herein, the first array of sub-areas 1022 may be dense in the substrate receiving area 950 of the gripper 200. The common area of the sub-regions of the first array of sub-regions 1022 may be at least 40%, at least 50%, at least 60%, or at least 70% of the area defined by the perimeter of the substrate receiving area. The second array of sub-regions 1124 may be dense in the substrate receiving area 950. The common area of the sub-regions of the second array of sub-regions may be at least 40%, at least 50%, at least 60%, or at least 70% of the area defined by the perimeter of the substrate receiving area.

[0087] According to embodiments that may be combined with other embodiments described herein, an individual portion of the first suction opening arrangement 1012 is adjacent to any two adjacent sub-regions of the first array of sub-regions 1022. can be placed between them. An individual portion of the second intake opening arrangement 1114 may be disposed between any two adjacent sub-regions of the second array of sub-regions 1124.

[0088] According to embodiments that may be combined with other embodiments described herein, at least a portion of the first suction opening arrangement 1012 may be arranged in a crisscross-shaped pattern. The crisscross-shaped pattern may include a first portion having a linear shape extending in a first direction and a second portion having a linear shape extending in a second direction different from the first direction. The first portion may intersect the second portion.

[0089] At least a portion of the first suction opening arrangement may be arranged in a grid-shaped pattern. The grid-shaped pattern includes: a first portion having a linear shape extending in a first direction; a second portion having a linear shape extending in a first direction, the second portion being spaced apart from the first portion; a third portion having a linear shape extending in a second direction different from the first direction; and a fourth portion having a linear shape extending in a second direction, the fourth portion being spaced apart from the third portion.

[0090] According to embodiments that may be combined with other embodiments described herein, at least a portion of the second suction opening arrangement may be arranged in a grid-shaped pattern. The grid-shaped pattern includes: a first portion having a linear shape extending in a third direction; a second portion having a linear shape extending in a third direction, the second portion being spaced apart from the first portion; a third portion having a linear shape extending in a fourth direction different from the third direction; and a fourth portion having a linear shape extending in a fourth direction, the fourth portion being spaced apart from the third portion. The third direction may be the same as the first direction. The fourth direction may be the same as the second direction. The grid-shaped pattern of the second suction opening arrangement may be different from the grid-shaped pattern of the first suction opening arrangement. The grid spacing (i.e., the distance between adjacent lines of the grid) of the grid-shaped pattern of the first suction aperture arrangement may be different from the grid spacing of the grid-shaped pattern of the first suction aperture arrangement. The number of lines of the grid-shaped pattern of the first suction aperture arrangement may be different from the number of lines of the grid-shaped pattern of the second suction aperture arrangement.

[0091] At least a portion of the second suction opening arrangement may be arranged in a criss-cross pattern. The crisscross-shaped pattern may include a first portion having a linear shape extending in a third direction and a second portion having a linear shape extending in a fourth direction that is different from the third direction. The first portion may intersect the second portion. At least a portion of the second suction opening arrangement may be arranged in a grid-shaped pattern. The crisscross-shaped pattern may be part of a grid-shaped pattern. The grid-shaped pattern may include a plurality of criss-cross-shaped parts, for example, 2 or more, 3 or more, 4 or more, or 10 or more criss-cross-shaped parts. Individual crisscross-shaped portions can be formed at locations where two lines of the grid intersect each other.

[0092] According to embodiments that may be combined with other embodiments described herein, the gripper may include a third suction aperture arrangement 1516 in the substrate receiving area 950. The third suction opening arrangement 1516 may surround the first suction opening arrangement 1012 and the second suction opening arrangement 1114. The gripper may be configured to selectively apply suction to the first suction aperture arrangement 1012, the second suction aperture arrangement 1114, or the third suction aperture arrangement 1516.

[0093] According to a further embodiment, a gripper 200 is provided for lifting a substrate from a surface. The gripper includes a substrate receiving area 950. The gripper 200 includes a first suction opening arrangement 1012 that includes one or more first suction openings disposed in the substrate receiving area 950. The first array of sub-regions 1022 of substrate receiving area 950 is substantially free of suction openings of the first suction opening arrangement. The gripper 200 includes a second suction opening arrangement 1114 that includes one or more second suction openings disposed in the substrate receiving area 950. The second array of sub-regions 1124 of the substrate receiving area is substantially free of the suction openings of the second suction opening arrangement 1114. The gripper 200 is configured to selectively apply suction to the first suction opening arrangement 1012 or the second suction opening arrangement 1114. The first/second array of sub-regions is substantially free of suction openings of the first/second suction opening arrangement, meaning that at most a small portion of the first/second suction opening arrangement, for example at most 5%, 10 % or 15% may lie inside the first/second array of sub-regions. The gripper may include any aspect or feature related to a gripper as described in this disclosure.

[0094] According to a further embodiment, a gripper 200 is provided for lifting a substrate from a surface. The gripper 200 includes a substrate receiving area 950. The gripper 200 includes a first suction opening arrangement 1012 that includes one or more first suction openings disposed in the substrate receiving area 950. At least a portion of the first suction opening arrangement 1012 is arranged in a criss-cross pattern. The gripper 200 includes a second suction opening arrangement 1114 that includes one or more second suction openings disposed in the substrate receiving area 950. At least a portion of the second suction opening arrangement 1114 is arranged in a grid-shaped pattern. The gripper is configured to selectively apply suction to the first suction aperture arrangement or the second suction aperture arrangement. The gripper may include any aspect or feature related to a gripper as described in this disclosure.

[0095] According to a further embodiment, a method for gripping substrates using a gripper (200) is provided. The gripper 200 includes a first suction opening arrangement 1012 and a second suction opening arrangement 1114 disposed in the substrate receiving area 950 of the gripper 200. The method includes supporting a first substrate 12 by a first substrate support 112 having a first array of openings 722. The first substrate 12 has a first plurality of through holes, each of which is disposed inside the perimeter of the opening of the first array of openings 722 . The method includes lifting a first substrate (12) from a first substrate support (112) by applying suction to a first suction aperture arrangement (1012), wherein the first suction aperture arrangement (1012) comprises a first plurality of The suction is applied substantially exclusively to those parts of the first substrate 12 where no through holes are present. The method includes supporting a second substrate (14) by a second substrate support (114) having a second array of openings (824). The second substrate 14 has a second plurality of through holes, each of which is disposed inside the perimeter of the opening of the second array of openings 824 . The method includes lifting a second substrate (14) from a second substrate support (114) by applying suction to a second suction aperture arrangement (1114), wherein the second suction aperture arrangement (1114) comprises a second plurality of It applies suction substantially exclusively to those parts of the second substrate 14 where no through holes are present. The method may include performing any of the functions of the system and/or gripper according to embodiments described herein.

[0096] The suction openings of the gripper 200 shown in the figures are schematically depicted as schematically circular openings. The present disclosure is not limited thereto. The suction opening may have different shapes, for example a thin slit-like opening. In some implementations, several (eg, circular) intake openings may be placed next to each other in a linear sequence of a particular length. In other embodiments, an elongated, slit-like suction opening of a specific length may be provided. For example, instead of including a plurality of first suction openings as shown in Figure 10(a), the first suction opening arrangement is arranged in a first direction such that the two slits form a criss-cross shape (Figure It may include or be composed of a first elongated slit extending in a left-right direction in the drawings and a second elongated slit extending in a second direction (up-down direction in the drawings). Likewise, the second intake opening arrangement may include or consist of a plurality of elongated slits extending in a first direction and a plurality of elongated slits extending in a second direction, forming a grid structure. It can be.

[0097] Although the foregoing relates to embodiments of the disclosure, other and additional embodiments of the disclosure may be devised without departing from the basic scope of the disclosure, and the scope of the disclosure is defined in the following claims. is determined by

Claims (15)

A system for handling substrates, comprising:
a first substrate support 112 including a first array of openings 722 defining a first substrate processing area; and
A second substrate support 114 including a second array of openings 824 defining a second substrate processing area.
at least one of; and
Comprising a gripper (200) for lifting substrates from the first and second substrate supports,
The gripper is,
substrate receiving area 950;
A first suction opening arrangement 1012 in the substrate receiving area, the first suction opening arrangement having a shape that matches the shape of the first array of openings in the first substrate support. disposed substantially outside the first array of subregions 1022 of; and
Second suction aperture arrangement 1114 in the substrate receiving area - the second suction aperture arrangement comprising sub-regions of the substrate receiving area having a shape that matches the shape of the second array of openings of the second substrate support ( disposed substantially external to the second array of 1124), comprising:
The gripper is configured to selectively apply suction to the first suction aperture arrangement or the second suction aperture arrangement,
A system for handling substrates. According to claim 1,
The first array of openings of the first substrate support and the first array of sub-regions of the substrate receiving area of the gripper are two-dimensional N×N arrays, and/or
The second array of openings of the second substrate support and the second array of sub-regions of the substrate receiving area of the gripper are two-dimensional M×M arrays, where M is different from N.
A system for handling substrates. According to claim 1 or 2,
each opening of the first array of openings of the first substrate support is a substantially rectangular opening, each sub-region of the first array of sub-regions of the substrate receiving area of the gripper is a substantially rectangular sub-area, and/ or
each opening of the second array of openings of the second substrate support is a substantially rectangular opening, and each sub-region of the second array of sub-regions of the substrate receiving area of the gripper is a substantially rectangular sub-area.
A system for handling substrates. According to any one of claims 1 to 3,
The first array of sub-areas is compact in the substrate receiving area of the gripper, and the joint area of the sub-areas of the first array of sub-areas is 40% of the area defined by the perimeter of the substrate receiving area. or more, and/or
wherein the second array of sub-regions is dense in the substrate receiving region, wherein the common area of the sub-regions of the second array of sub-regions is at least 40% of the area defined by the perimeter of the substrate receiving region.
A system for handling substrates. According to any one of claims 1 to 4,
Each portion of the first intake opening arrangement is disposed between any two adjacent sub-regions of the first array of sub-regions, and/or
wherein an individual portion of the second intake opening arrangement is disposed between any two adjacent sub-regions of the second array of sub-regions.
A system for handling substrates. According to any one of claims 1 to 5,
At least a portion of the first suction opening arrangement,
a first portion having a linear shape extending in a first direction; and
Arranged in a cross-shaped pattern including a second portion having a linear shape extending in a second direction different from the first direction,
A system for handling substrates. The method according to any one of claims 1 to 6,
At least a portion of the second suction opening arrangement,
a first portion having a linear shape extending in a third direction;
a second portion having a linear shape extending in the third direction, the second portion being spaced apart from the first portion;
a third portion having a linear shape extending in a fourth direction different from the third direction; and
arranged in a grid-shaped pattern comprising a fourth portion having a linear shape extending in the fourth direction, the fourth portion being spaced apart from the third portion,
A system for handling substrates. The method according to any one of claims 1 to 7,
The gripper includes a third suction aperture arrangement 1516 within the substrate receiving area, the third suction aperture arrangement surrounding at least one of the first suction aperture arrangement and the second suction aperture arrangement, the gripper comprising: configured to selectively apply suction to the first suction opening arrangement, the second suction opening arrangement, or the third suction opening arrangement,
A system for handling substrates. As a gripper 200 for lifting a substrate from the surface,
substrate receiving area 950;
A first suction opening arrangement (1012) comprising one or more first suction openings disposed in the substrate receiving region, wherein a first array of sub-regions (1022) of the substrate receiving region include a suction opening of the first suction opening arrangement. There are practically none -; and
A second suction aperture arrangement 1114 comprising one or more second suction openings disposed in the substrate receiving area, wherein a second array of sub-regions 1124 of the substrate receiving area include a suction opening of the second suction opening arrangement. substantially absent - including,
The gripper is configured to selectively apply suction to the first suction aperture arrangement or the second suction aperture arrangement,
A gripper 200 for lifting the substrate from the surface. According to clause 9,
The first array of sub-regions is dense in the substrate receiving region, and the common area of the sub-regions of the first array of sub-regions is at least 40% of the area defined by the perimeter of the substrate receiving region, and/or
wherein the second array of sub-regions is dense in the substrate receiving region, wherein the common area of the sub-regions of the second array of sub-regions is at least 40% of the area defined by the perimeter of the substrate receiving region.
A gripper 200 for lifting the substrate from the surface. According to claim 9 or 10,
Each portion of the first intake opening arrangement is disposed between any two adjacent sub-regions of the first array of sub-regions, and/or
wherein an individual portion of the second intake opening arrangement is disposed between any two adjacent sub-regions of the second array of sub-regions.
A gripper 200 for lifting the substrate from the surface. The method according to any one of claims 9 to 11,
At least a portion of the first suction opening arrangement,
a first portion having a linear shape extending in a first direction; and
Arranged in a crisscross-shaped pattern including a second portion having a linear shape extending in a second direction different from the first direction,
A gripper 200 for lifting the substrate from the surface. According to any one of claims 9 to 12,
At least a portion of the second suction opening arrangement,
a first portion having a linear shape extending in a third direction;
a second portion having a linear shape extending in the third direction, the second portion being spaced apart from the first portion;
a third portion having a linear shape extending in a fourth direction different from the third direction; and
arranged in a grid-shaped pattern comprising a fourth portion having a linear shape extending in the fourth direction, the fourth portion being spaced apart from the third portion,
A gripper 200 for lifting the substrate from the surface. As a gripper 200 for lifting a substrate from the surface,
substrate receiving area 950;
a first suction opening arrangement (1012) comprising one or more first suction openings disposed in the substrate receiving area, at least a portion of the first suction opening arrangement being arranged in a crisscross-shaped pattern; and
a second suction opening arrangement (1114) comprising one or more second suction openings disposed in the substrate receiving area, at least a portion of the second suction opening arrangement being arranged in a grid-shaped pattern,
The gripper is configured to selectively apply suction to the first suction aperture arrangement or the second suction aperture arrangement,
A gripper 200 for lifting the substrate from the surface. As a method for gripping substrates using a gripper 200,
The gripper includes a first suction opening arrangement (1012) and a second suction opening arrangement (1114) disposed in a substrate receiving area (950) of the gripper,
The above method is,
supporting a first substrate (12) by a first substrate support (112) having a first array of openings (722), the first substrate having a first plurality of through holes (752, 762); , each through hole of the first plurality of through holes is disposed inside the perimeter of an opening of the first array of openings;
Lifting the first substrate from the first substrate support by applying suction to the first suction aperture arrangement, the first suction aperture arrangement having no through holes present in the first plurality of through holes. applying suction substantially exclusively to portions of the first substrate;
supporting a second substrate (14) by a second substrate support having a second array of openings, the second substrate having a second plurality of through holes (854, 864), the second plurality of through holes (854, 864) each through-hole of holes disposed within the perimeter of an opening of the second array of openings; and
Lifting the second substrate from the second substrate support by applying suction to the second suction aperture arrangement, wherein the second suction aperture arrangement is configured such that no through holes of the second plurality of through holes are present. applying suction substantially exclusively to portions of the second substrate,
Method for gripping substrates using a gripper (200).