KR20210130959A - Method of clamping a substrate and an apparatus for performing the same - Google Patents

Abstract

The present invention relates to a method of clamping a substrate. According to the method of clamping a substrate, a substrate can be placed on a stage. A first dummy region set from first and third opposing sides among the first to fourth side surfaces of the substrate may be primarily clamped. Secondary clamping may be performed on the second and fourth side surfaces of the substrate. Tertiary clamping may be performed on a second dummy region set from the first and third side surfaces of the substrate. Therefore, it becomes possible to clamp the substrate firmly, and the warpage of the substrate can be suppressed.

Description

Substrate clamping method and apparatus for performing the same

The present invention relates to a method for clamping a substrate and an apparatus for carrying out the same. More particularly, the present invention relates to a method for clamping a substrate in laser ablation equipment, and to an apparatus for performing such a method.

In general, a substrate used for a panel level package (PLP) may be transported in a state attached to it by a carrier. In order to perform a packaging process on the substrate, the carrier may be detached from the substrate.

Since the adhesive component remains on the board|substrate from which the carrier is removed, it is necessary to remove the adhesive component of the board|substrate using a laser ablation facility.

According to related technologies, a substrate can be placed on a stage of a laser ablation facility using a robotic hand. After the robot hand is returned to its original position, the substrate can be clamped only once using the clamp. In a state in which a vacuum is applied to the substrate through the stage, the adhesive component of the substrate can be removed using a laser.

As the size of the substrate increases, a warpage phenomenon of the substrate may be severe. By clamping such a large-area substrate only once, the curved substrate may not be able to adhere to the stage. For this reason, the vacuum provided from the stage may not be sufficiently provided to the curved substrate. As a result, a space may be formed between the stage and the curved substrate, and the efficiency of removing the adhesive component of the substrate using the laser may be reduced.

The present invention provides a substrate clamping method capable of suppressing the warpage of the substrate.

The invention also provides an apparatus for carrying out the method described above.

According to the substrate clamping method according to an aspect of the present invention, a substrate may be disposed on a stage. The first dummy region set from the first and third sides of the substrate that are opposite to each other among the first to fourth side surfaces of the substrate may be first clamped. Secondary clamping may be performed on the second and fourth sides of the substrate. The second dummy region set from the first and third side surfaces of the substrate may be clamped tertiarily.

A substrate clamping apparatus according to another aspect of the present invention may include a stage, a pair of first clamps and a pair of second clamps. The substrate may be placed on the stage. The first clamps may be disposed on opposite first and third sides of the first to fourth sides of the stage. The first clamps may include at least one clamping part for clamping the first and third sides of the substrate that are opposite to each other from among the first to fourth sides of the substrate at least twice. The second clamps may be disposed on second and fourth side surfaces of the stage to clamp the second and fourth side surfaces of the substrate.

According to the present invention described above, since the four sides of the substrate are clamped three times using the clamping portion and the second clamps of the first clamps, it is possible to firmly clamp the substrate. Accordingly, even when the substrate has a large area, warpage of the substrate can be suppressed. In particular, when the substrate is adsorbed with a vacuum, a sufficient vacuum is provided to the substrate to more firmly adsorb the substrate.

1 is a plan view showing a substrate clamping apparatus according to an embodiment of the present invention.
FIG. 2 is a cross-sectional view taken along line AA′ of FIG. 1 .
FIG. 3 is a cross-sectional view taken along line BB′ of FIG. 1 .
4 is a plan view showing a state before the clamping device shown in FIG. 1 clamps the substrate.
5 is a cross-sectional view showing a state in which the substrate is carried onto the stage by the robot hand.
FIG. 6 is a plan view showing that the clamping device shown in FIG. 1 primarily clamps the substrate.
FIG. 7 is a plan view showing that the clamping device shown in FIG. 1 has secondary clamped the substrate.
FIG. 8 is a plan view illustrating the third clamping of the substrate by the clamping device shown in FIG. 1 .

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a plan view showing a substrate clamping apparatus according to an embodiment of the present invention, FIG. 2 is a cross-sectional view taken along line A-A' of FIG. 1, and FIG. 3 is a cross-sectional view taken along line B-B' of FIG. 1 .

The substrate clamping apparatus according to the present embodiment may be included in laser ablation equipment. Laser ablation equipment can remove the adhesive component of a substrate used in a panel level package (PLP) using a laser. This laser process can be performed in a state where the substrate is placed on the stage using the robot hand of the Equipment Front End Module (EFEM) and the substrate is adsorbed onto the stage in a vacuum. The substrate clamping apparatus may clamp the substrate to the stage before adsorbing the substrate with vacuum.

As another embodiment, the substrate clamping apparatus of this embodiment may be applied to other semiconductor manufacturing facilities employing a method of clamping a substrate in addition to laser ablation equipment.

1 to 3 , the substrate clamping apparatus includes a stage 110 , a pair of first clamps 120 and 130 , a pair of second clamps 140 and 150 , and a first actuator 160 . , 162 ) and second actuators 164 and 166 .

The stage 110 may have a substantially rectangular shape. Accordingly, the stage 110 may have first to fourth side surfaces 112 , 114 , 116 , 118 . The first side 112 and the third side 116 may face each other, and the second side 114 and the fourth side 118 may face each other.

The stage 110 may accommodate the substrate S. Specifically, the substrate S may be placed on the upper surface of the stage 110 . The stage 110 may adsorb the substrate S by using a vacuum. Accordingly, the stage 110 may include a plurality of vacuum holes 119 for providing a vacuum to the substrate S. The vacuum holes 119 may be formed through the stage 110 in a vertical direction.

The first clamps 120 and 130 may be disposed on the first side surface 112 and the third side surface 116 of the stage 110 . Each of the first clamps 120 and 130 may have a rectangular shape elongated in a horizontal direction. A length of the first clamps 120 and 130 may correspond to a first width in a first horizontal direction of the substrate S mounted on the upper surface of the stage 110 . The first clamps 120 and 130 may clamp the first side and the third side of the substrate S mounted on the upper surface of the stage 110 .

In this embodiment, each of the first clamps 120 and 130 may include at least one clamping part 122 and 132, respectively. The clamping parts 122 and 132 may extend horizontally from the inner surfaces of the first clamps 120 and 130 , that is, the inner surfaces of the first clamps 120 and 130 facing the center of the stage 110 . In particular, each of the clamping parts 122 and 132 may be formed as a pair located on both sides of the inner surface of the first clamps 120 and 130 . However, the clamping parts 122 and 132 may be formed of one or three or more.

The clamping units 122 and 132 may primarily clamp the first and third side surfaces of the substrate S mounted on the upper surface of the stage 110 . In particular, the clamping units 122 and 132 may primary clamp the first dummy region R1 positioned within a first distance set from the first and third side surfaces of the substrate S. The first dummy region R1 may be an edge region of the upper surface of the substrate S located within a first distance from the first and third side surfaces of the substrate S. That is, the clamping units 122 and 132 may clamp the first dummy region R1 of the substrate S by pressing it from the top down. In this embodiment, the first distance may be approximately 2 mm, but may not be limited to a specific distance.

In this embodiment, the clamping parts 122 and 132 may have a size that can vertically pass through the grooves formed in the robot hand. Accordingly, the size of the clamping parts 122 and 132 may be determined according to the size of the groove of the robot hand. As a result, it may not be necessary to change the structure of the robot hand so that the functions of the clamping parts 122 and 132 for primary clamping the first and third sides of the substrate S can be exerted.

The first clamps 120 and 130 may tertiary clamp the first and third side surfaces of the substrate S mounted on the upper surface of the stage 110 . In particular, the first clamps 120 and 130 may primarily clamp the second dummy region R2 located within a second distance set from the first and third sides of the substrate S. The second dummy region R2 may be an edge region of the upper surface of the substrate S located within a second distance from the first and third side surfaces of the substrate S. That is, the first clamps 120 and 130 may clamp the second dummy region R2 of the substrate S by pressing from the top down. In this embodiment, the second distance may be longer than the first distance. For example, the second distance may be approximately 5 mm, but may not be limited to a specific distance.

The first actuators 160 and 162 may individually operate each of the first clamps 120 and 130 . Specifically, the first actuators 160 and 162 may move the first clamps 120 and 130 in a second horizontal direction and a vertical direction orthogonal to the first horizontal direction at the top of the stage 110 . The first actuators 160 and 162 may include cylinders.

The second clamps 140 and 150 may be disposed on the second side surface 114 and the fourth side surface 118 of the stage 110 . The second clamps 140 and 150 may have substantially the same shape as the first clamps 120 and 130 . Accordingly, each of the second clamps 140 and 150 may have a rectangular shape elongated in the horizontal direction. A length of the second clamps 140 and 150 may correspond to a second width in the second horizontal direction of the substrate S mounted on the upper surface of the stage 110 . The second clamps 140 and 150 may clamp the second side and the fourth side of the substrate S mounted on the upper surface of the stage 110 .

In the present embodiment, the second clamps 140 and 150 may secondary clamp the second and fourth side surfaces of the substrate S placed on the upper surface of the stage 110 . That is, the second clamps 140 and 150 may clamp the second and fourth side surfaces of the substrate S by pressing from the top down.

The second actuators 164 and 166 may individually actuate each of the second clamps 140 and 150 . Specifically, the second actuators 164 and 166 may move the second clamps 140 and 150 along the second horizontal direction and the vertical direction at the top of the stage 110 . The second actuators 164 and 166 may include cylinders.

Hereinafter, an operation of clamping the substrate using the above-described substrate clamping device will be described with reference to FIGS. 4 to 8 .

4 is a plan view showing a state before the clamping device shown in FIG. 1 clamps the substrate.

Referring to FIG. 4 , the first clamps 120 and 130 by the first actuators 160 and 162 may be disposed outside the stage 110 . In addition, the second clamps 140 and 150 by the second actuators 164 and 166 may also be disposed at positions out of the stage 110 . Accordingly, the top surface of the stage 110 may be exposed without interference toward the top.

5 is a cross-sectional view showing a state in which the substrate is carried onto the stage by the robot hand.

Referring to FIG. 5 , the robot hand H may place the substrate S on the upper surface of the stage 110 . As described above, since the first clamps 120 and 130 and the second clamps 140 and 150 are disposed at positions deviated from the outside of the stage 110 , the robot hand H is the first clamp 120 . , 130 ) and the second clamps 140 and 150 , the substrate S may be placed on the upper surface of the stage 110 .

FIG. 6 is a plan view showing that the clamping device shown in FIG. 1 primarily clamps the substrate.

Referring to FIG. 6 , the first actuators 160 and 162 may move the first clamps 120 and 130 in a first horizontal direction toward the center of the stage 110 . Accordingly, the first clamps 120 and 130 may be positioned above the first and third side surfaces 112 and 116 of the stage 110 .

The first actuators 160 and 162 may move the first clamps 120 and 130 downward. The clamping units 122 and 132 of the first clamps 120 and 130 may clamp the first and third sides of the substrate S mounted on the upper surface of the stage 110 by pressing from above. As described above, the clamping units 122 and 132 may pass through the grooves of the robot hand H to clamp the first and third sides of the substrate S.

In this embodiment, the first actuators 160 and 162 move the first clamps 120 and 130 , specifically, the clamping parts 122 and 132 to the first dummy region R1 of the substrate S. can do it Accordingly, the clamping units 122 and 132 may clamp only the first dummy region R1 of the substrate S by pressing it from above.

After the first dummy region R1 of the substrate S is first clamped by the clamping units 122 and 132 , the robot hand H may rise upward and return to its original position.

FIG. 7 is a plan view showing that the clamping device shown in FIG. 1 has secondary clamped the substrate.

Referring to FIG. 7 , the second actuators 164 and 166 may move the second clamps 140 and 150 in the second horizontal direction toward the center of the stage 110 . Accordingly, the second clamps 140 and 150 may be positioned on the second and fourth side surfaces 114 and 118 of the stage 110 .

The second actuators 164 and 166 may move the second clamps 140 and 150 downward. The second clamps 140 and 150 may clamp the second and fourth side surfaces of the substrate S mounted on the upper surface of the stage 110 by pressing from above.

FIG. 8 is a plan view illustrating the third clamping of the substrate by the clamping device shown in FIG. 1 .

Referring to FIG. 8 , the first actuators 160 and 162 may further move the first clamps 120 and 130 in the first horizontal direction toward the center of the stage 110 . Accordingly, the first clamps 120 and 130 may be positioned on the second dummy region R2 of the substrate S.

The first actuators 160 and 162 may move the first clamps 120 and 130 downward. The first clamps 120 and 130 may perform tertiary clamping by pressing the second region R2 of the substrate S mounted on the upper surface of the stage 110 .

In the present embodiment, the first actuators 160 and 162 may move the first clamps 120 and 130 to the second dummy region R2 of the substrate S. Accordingly, the first clamping units 120 and 130 may clamp the second dummy region R2 of the substrate S by pressing the second dummy region R2 from above.

A vacuum is provided to the substrate S through the vacuum holes 119 of the stage 110 , so that the substrate S may be firmly fixed to the upper surface of the stage 110 . In this way, it is possible to remove the adhesive component remaining on the substrate S by using a laser with respect to the firmly clamped substrate S.

According to the present embodiment described above, since the four sides of the substrate are clamped three times using the clamping portion and the second clamps of the first clamps, the substrate can be firmly clamped. Accordingly, even when the substrate has a large area, warpage of the substrate can be suppressed. In particular, when the substrate is adsorbed with a vacuum, a sufficient vacuum is provided to the substrate to more firmly adsorb the substrate.

As described above, although described with reference to preferred embodiments of the present invention, those skilled in the art can variously modify the present invention without departing from the spirit and chamber of the present invention as set forth in the claims below. and may be changed.

110 ; stage 112 ; first aspect
114; second side 116 ; third aspect
118; fourth aspect 119 ; vacuum hole
120, 130; first clamps 122, 132; clamping part
140, 150 ; second clamp 160, 162; first actuator
164, 166; second actuator

Claims (10)

placing the substrate on the stage;
primary clamping a first dummy region established from opposite first and third sides of the first to fourth sides of the substrate;
secondary clamping the second and fourth sides of the substrate; and
and tertiary clamping a second dummy region established from the first and third sides of the substrate. The second dummy region of claim 1 , wherein the first dummy region is located within a first distance from the first and third sides, and wherein the second dummy region is longer than the first distance from the first and third sides. A method of clamping a substrate located within a distance. The method of claim 1 , wherein the substrate is placed on the stage by a robot hand, and further comprising returning the robot hand to an original position between the primary clamping and the secondary clamping. The method of claim 1 , further comprising applying a vacuum to the tertiary clamped substrate. a stage on which the substrate is placed;
disposed on opposing first and third sides of the first to fourth sides of the stage and clamping the opposing first and third sides of the first to fourth sides of the substrate at least twice a pair of first clamps having one clamping part; and
and a pair of second clamps disposed on second and fourth sides of the stage to clamp the second and fourth sides of the substrate. The substrate clamping apparatus of claim 5 , wherein the clamping part is provided on both sides of an inner side surface of the first clamp facing a central part of the stage. 6. The method of claim 5, wherein the first clamps primary clamp a first dummy region of the substrate set within a first distance from the first and third sides of the substrate, and the second clamps are configured to clamp a second dummy region of the substrate. and secondary clamping fourth sides, wherein the first clamps tertiarily clamp a second dummy region of the substrate set within a second distance greater than the first distance from the first and third sides of the substrate. clamping device. The substrate clamping device of claim 7 , wherein the clamping part protrudes from an inner surface of the first clamp by the first distance. 6. The method of claim 5,
first actuators each actuating the first clamps; and
and second actuators each actuating the second clamps. The substrate clamping apparatus of claim 5 , wherein the stage has a plurality of vacuum holes for applying a vacuum to the substrate.

Images