KR20230133049A - Electrode connection structure, method of manufacturing the same and digitizer including the same - Google Patents

Abstract

Embodiments according to the present invention provide an electrode connection structure. The electrode connection structure includes a base layer, a lower conductive line disposed on the upper surface of the base layer, a first insulating layer formed on the upper surface of the base layer and adjacent to the lower conductive line, and a first insulating layer, It includes a second insulating layer including a via hole exposing a top surface of the lower conductive line, and an upper conductive line disposed on the second insulating layer and electrically connected to the lower conductive line through the via hole. The connection reliability between conductive lines can be improved through a double-layer insulation structure.

Description

Electrode connection structure, manufacturing method thereof, and digitizer including the same {ELECTRODE CONNECTION STRUCTURE, METHOD OF MANUFACTURING THE SAME AND DIGITIZER INCLUDING THE SAME}

The present invention relates to an electrode connection structure, a manufacturing method thereof, and a digitizer including the same. More specifically, it relates to an electrode connection structure including a multi-layer conductive structure, a manufacturing method thereof, and a digitizer including the same.

Recently, various sensing functions and communication functions have been combined with image display devices and are being implemented in the form of smartphones, for example. For example, electronic devices are being developed in which a touch panel or touch sensor is attached to the display panel of the image display device and an information input function is implemented by selecting a menu displayed on a window surface.

In addition, as disclosed in Korean Patent No. 10-1750564, a digitizer that converts analog coordinate information into a digital signal by electromagnetic method is disposed on the rear side of the image display device.

The digitizer may include conductive lines of a multi-layer structure connected to each other with an insulating layer interposed therebetween. In order to secure sufficient current intensity through low resistance, it may be desirable to increase the thickness of the conductive line. In this case, the thickness of the insulating layer may also increase.

When the thickness of the insulating layer increases, the formation of via holes or contact holes for interconnection of conductive lines may not be formed with desired shape and reliability. Additionally, as the thickness of the digitizer increases, folding characteristics or flexibility may deteriorate, and connection characteristics of conductive lines may also deteriorate.

Korean Patent Publication No. 10-1750564

One object of the present invention is to provide an electrode connection structure with improved mechanical and electrical reliability.

One object of the present invention is to provide a method for manufacturing an electrode connection structure with improved mechanical and electrical reliability.

One object of the present invention is to provide a digitizer including an electrode connection structure with improved mechanical and electrical reliability.

1. A base layer, a lower conductive line disposed on the upper surface of the base layer, a first insulating layer formed on the upper surface of the base layer and disposed adjacent to the lower conductive line, on the first insulating layer a second insulating layer formed and including a via hole exposing the upper surface of the lower conductive line, and an upper conductive line disposed on the second insulating layer and electrically connected to the lower conductive line through the via hole. Including, electrode connection structure.

2. The electrode connection structure according to 1 above, wherein the second insulating layer covers the first insulating layer and at least a portion of the upper surface of the lower conductive line.

3. The method of 1 above, wherein the second insulating layer is in contact with the first insulating layer and the lower conductive line and includes a first inclined portion including an inclined sidewall, contacting the upper surface of the lower conductive line and the via hole. An electrode connection structure comprising a second inclined portion forming a , and an extension portion extending from the first inclined portion.

4. The electrode connection structure of 1 above, wherein the thickness of the first insulating layer is 50 to 100% of the thickness of the lower conductive line.

5. The electrode connection structure according to 1 above, wherein the first insulating layer and the lower conductive line are formed on the same layer or at the same level.

6. The electrode connection structure of 1 above, wherein the first insulating layer and the lower conductive line are physically spaced apart from each other.

7. The electrode connection structure according to 6 above, wherein the separation distance between the first insulating layer and the lower conductive line is 20 ㎛ or less.

8. The electrode connection structure according to 1 above, wherein the thickness of the lower conductive line is greater than the thickness of the upper conductive line.

9. The electrode connection structure according to 1 above, wherein the thickness of the lower conductive line is 10㎛ or more.

10. The electrode connection structure according to 1 above, wherein the first insulating layer and the second insulating layer include different materials.

11. It includes the electrode connection structure described above, wherein the lower conductive line includes a plurality of lower conductive lines, the upper conductive line includes a plurality of upper conductive lines, and the lower conductive lines and the upper conductive lines A digitizer that is combined with each other through the via hole to form a plurality of conductive coils.

12. The method of 11 above, wherein the lower conductive lines include first lower conductive lines and second lower conductive lines extending in the column direction, and the upper conductive lines include first upper conductive lines extending in the row direction and A digitizer comprising second upper conductive lines.

13. The method of 12 above, wherein the conductive coils include a first conductive coil formed by connecting the first upper conductive lines and the second lower conductive lines to each other; and a second conductive coil formed by connecting the first lower conductive lines and the second upper conductive lines to each other.

14. The digitizer of 11 above, wherein the base layer includes a bending area, and the bending axis of the bending area intersects the upper conductive line and is parallel to the lower conductive line.

In the electrode connection structure according to embodiments of the present invention, an insulating structure that partially covers the lower conductive line may be formed in a multi-layer structure. Accordingly, even when the thickness of the lower conductive line increases, connection reliability of the lower conductive line and the upper conductive line through the insulating structure can be secured.

According to some embodiments, the first insulating layer serving as the lower insulating layer may be physically spaced from the lower conductive line. In this case, the inclination angle of the inclined portion may be further reduced when forming the second insulating layer that serves as the upper insulating layer. Accordingly, damage and/or disconnection of the upper conductive line can be prevented.

By utilizing the above insulating structure, the thickness of the lower conductive line can be sufficiently increased to increase the current path. Accordingly, by employing the electrode connection structure in the conductive coil of the digitizer, a digitizer with high resolution and improved flexible characteristics through amplification of electromagnetic induction phenomenon can be provided.

1 is a schematic cross-sectional view showing an electrode connection structure according to example embodiments.
Figure 2 is a schematic cross-sectional view showing an electrode connection structure according to example embodiments.
3 to 5 are schematic cross-sectional views for explaining a method of manufacturing an electrode connection structure according to example embodiments.
Figure 6 is a schematic cross-sectional view showing a digitizer according to example embodiments.
7 and 8 are schematic plan views showing conductive coils included in a digitizer according to example embodiments.
Figure 9 is a schematic plan view showing a digitizer according to example embodiments.

Embodiments of the present invention provide an electrode connection structure that includes multi-layered conductive lines and a plurality of insulating layers and has improved electrical connection reliability, and a method of manufacturing the same. Additionally, embodiments of the present invention provide a digitizer including the electrode connection structure.

With reference to the drawings below, embodiments of the present invention will be described in more detail. However, the following drawings attached to this specification illustrate preferred embodiments of the present invention, and serve to further understand the technical idea of the present invention along with the contents of the above-described invention, so the present invention is described in such drawings. It should not be interpreted as limited to the specifics.

1 is a schematic cross-sectional view showing an electrode connection structure according to example embodiments.

Referring to FIG. 1, the electrode connection structure may include a lower conductive line 110 and an upper conductive line 130 formed on the base layer 105. The lower conductive line 110 and the upper conductive line 130 may be separated into different layers with an insulating structure 120 therebetween.

For example, the insulating structure 120 may be provided as an interlayer insulating structure disposed between the lower conductive line 110 and the upper conductive line 130.

The base layer 105 is used to encompass a support layer or film-type base material for forming the conductive lines 110 and 130 and the insulating structure 120. For example, the base layer 105 may include a polymer applicable to flexible displays. Examples of the above polymers include cyclic olefin polymer (COP), polyethylene terephthalate (PET), polyacrylate (PAR), polyetherimide (PEI), polyethylene naphthalate (PEN), polyphenylene sulfide (PPS), poly Allylate, polyimide (PI), cellulose acetate propionate (CAP), polyethersulfone (PES), cellulose triacetate (TAC), polycarbonate (PC), cyclic olefin copolymer (COC), poly Methyl methacrylate (PMMA), etc. can be mentioned.

Preferably, the base layer 105 may include polyimide to ensure stable bending characteristics.

The lower conductive line 110 and the upper conductive line 130 may each include a low-resistance metal. For example, the lower conductive line 110 and the upper conductive line 130 are silver (Ag), gold (Au), copper (Cu), aluminum (Al), platinum (Pt), palladium (Pd), chromium ( Cr), titanium (Ti), tungsten (W), niobium (Nb), tantalum (Ta), vanadium (V), iron (Fe), manganese (Mn), cobalt (Co), nickel (Ni), zinc ( It may include Zn), tin (Sn), molybdenum (Mo), calcium (Ca), or an alloy containing at least two of these.

Preferably, the lower conductive line 110 and the upper conductive line 130 may include copper or a copper alloy to achieve low resistance.

The insulating structure 120 may be formed on the upper surface of the base layer 105 to partially cover the lower conductive line 110. The insulating structure 120 may include an organic insulating material such as epoxy resin, acrylic resin, siloxane resin, or polyimide resin, or an inorganic insulating material such as silicon oxide or silicon nitride. Preferably, the insulating structure 120 may be formed using an organic insulating material to improve flexible properties.

According to example embodiments, the insulating structure 120 may have a multi-layer structure including a first insulating layer 122 and a second insulating layer 124.

The first insulating layer 122 may serve as a lower insulating layer. The first insulating layer 122 may be disposed adjacent to the lower conductive line 110 on the base layer 105. For example, the sidewall of the first insulating layer 122 may be formed adjacent to the sidewall of the lower conductive line 110.

As used in this application, the terms “neighbor” and/or “adjacent” may refer to structures that are in direct contact or are physically spaced apart and arranged closely.

The first insulating layer 122 and the lower conductive line 110 may be formed on the same layer or at the same level. For example, the first insulating layer 122 and the lower conductive line 110 may be directly disposed on the upper surface of the base layer 105. Accordingly, the connection reliability of the upper conductive line 130 and the lower conductive line 110 can be secured by reducing the inclination angle of the second insulating layer 124, which will be described later.

The second insulating layer 124 may serve as an upper insulating layer. The second insulating layer 124 is formed on the first insulating layer 122 and may cover at least a portion of the upper surface of the lower conductive line 110. For example, the second insulating layer 124 may cover the peripheral portion of the upper surface of the lower conductive line 110. For example, the second insulating layer 124 may cover both the first insulating layer 122 and the lower conductive line 110.

In example embodiments, the second insulating layer 124 may include a via hole 125. The upper surface of the lower conductive line 110 may be at least partially exposed through the via hole 125. In one embodiment, the upper surface of the lower conductive line 110 may be partially exposed through the via hole 125.

According to some embodiments, the second insulating layer 124 may include an inclined portion. For example, the second insulating layer 124 has a first inclined portion 124a that contacts the first insulating layer 122 and the lower conductive line 110 and includes an inclined sidewall, and the lower conductive line 110. It may include a second inclined portion 124b that contacts the upper surface of and forms a via hole 125. The second insulating layer 124 may include an extension portion 124c extending from the first inclined portion.

For example, the second insulating layer 124 is formed on the first insulating layer 122, so that the inclination angles of the first inclined portion 124a and the second inclined portion 124b can be reduced compared to the single layer insulating structure. there is. Accordingly, damage to the upper conductive line 130 can be suppressed and the structural stability of the electrode connection structure can be improved.

In some embodiments, the thickness H1 of the first insulating layer 122 may be 50 to 100% of the thickness H2 of the lower conductive line. In the above thickness range, even if the thickness of the lower conductive line 110 increases, the inclination angle of the first inclined portion 124a and the second inclined portion 124b of the second insulating layer 124 may be formed gently. Accordingly, the connection reliability and structural stability of the upper conductive line 130 and the lower conductive line 110 can be improved.

According to some embodiments, the first insulating layer 122 and the second insulating layer 124 may have a thickness of 5 to 9 μm.

According to one embodiment, the thickness of the first insulating layer 122 may be greater than the thickness of the second insulating layer 124.

In exemplary embodiments, the interior of the via hole 125 may be filled with the above-described metal or alloy to form an upper conductive line 130 electrically connected to the lower conductive line 110 . The upper conductive line 130 sufficiently fills the via hole 125 and may at least partially cover the top surface of the second insulating layer 124 .

A contact 135 may be formed inside the via hole 125. The contact 135 may be a portion of the upper conductive line 130 formed inside the via hole 125, and may be formed as a member substantially integral with the upper conductive line 130.

In some embodiments, the thickness of the lower conductive line 110 may be 10 μm or more. For example, the thickness of the lower conductive line 110 may be 10 to 20 μm, or 10 to 15 μm.

As described above, the thickness of the insulating layer for electrical connection of the relatively thick lower conductive line 110 may also be increased. For example, when the insulating layer is formed through a single coating process, the sidewall of the lower conductive line 110 may be exposed or the insulating layer may become too thin, making it unsuitable to serve as an insulating layer between electrode layers.

However, according to the above-described exemplary embodiments, an insulating layer with a sufficient thickness for insulating the lower conductive line 110 can be formed by forming the multi-layer insulating structure 120. Additionally, a via hole 125 of sufficient height and width for connection to the upper conductive line 130 can be formed.

Additionally, the insulating structure 120 may form a second insulating layer 124 on the first insulating layer 122 to reduce the inclination angle of the inclined portions 124a and 124b of the second insulating layer 124. In this case, the upper conductive line 130 or contact 135 may extend at a gentle inclination angle and be electrically connected to the lower conductive line 110. Accordingly, disconnection of the upper conductive line 130 at the contact portion of the upper conductive line 130 and the lower conductive line 110 can be prevented and connection reliability can be improved.

In some embodiments, the thickness of the upper conductive line 130 may be smaller than the thickness of the lower conductive line 110. For example, the thickness of the upper conductive line 130 may be about 6 μm or less, and preferably about 1 to 6 μm.

By forming the width of the upper conductive line 130 to be relatively thin, folding or bending characteristics can be improved while securing sufficient channel current or conductive coil current from the lower conductive line 110. Additionally, the adhesion characteristics to the above-described via hole 125 can be further improved by utilizing the upper conductive line 130 in the form of a thin film.

A passivation layer 140 may be formed on the insulating structure 120 to cover the upper conductive line 130. For example, the passivation layer may include an organic or inorganic insulating material that is substantially the same as or similar to the insulating structure 120 .

According to one embodiment, the lower conductive line 110 and the upper conductive line 130 may extend in a direction that intersects each other.

In some embodiments, the first insulating layer 122 and the second insulating layer 124 may include different materials.

The first insulating layer 122 may include, for example, a polyolefin-based resin such as polyethylene, polypropylene, polyolefin having a cyclo-based or norbornene structure, or ethylene-propylene copolymer. According to one embodiment, the first insulating layer 122 may include cycloolefin polymer (COP). Precision patterning and process stability can be improved by using polyolefin-based resin with high viscosity characteristics as the first insulating layer 122.

The second insulating layer 124 may include, for example, an acrylic resin such as polymethyl (meth)acrylate or polyethyl (meth)acrylate. Uniform coating can be performed on the upper surface of the first insulating layer 122 and the upper surface of the lower conductive line 110 by using an acrylic resin with low viscosity characteristics and excellent coating properties as the second insulating layer 124.

Figure 2 is a schematic cross-sectional view showing an electrode connection structure according to example embodiments.

Referring to FIG. 2 , the first insulating layer 122 and the lower conductive line 110 may be physically spaced apart from each other. In this case, when forming the second insulating layer 124, the inclination angle of the first inclined portion 124a may be further reduced. Accordingly, damage and/or disconnection of the upper conductive line 130 can be prevented.

In some embodiments, the separation distance (W) between the first insulating layer 122 and the lower conductive line 110 may be 20 ㎛ or less. Within the above distance range, the second insulating layer 124 covers a portion of the upper surface of the lower conductive line 110 and the first inclined portion 124a may have a gentle inclined angle. Accordingly, the connection reliability and structural stability of the electrode connection structure can be improved.

3 to 5 are schematic cross-sectional views for explaining a method of manufacturing an electrode connection structure according to example embodiments. Detailed descriptions of the structure and materials described with reference to FIGS. 1 and 2 are omitted.

For example, a lower conductive film containing the above-described metal or alloy may be formed on the upper surface of the base layer 105. The lower conductive line 110 may be formed by patterning the lower conductive film to a predetermined width.

As described above, the lower conductive line 110 may be formed to have a thickness of about 10 μm or more.

Referring to FIG. 4, a first insulating layer 122 disposed adjacent to the lower conductive line 110 may be formed on the base layer 105.

For example, a first coating layer may be formed on the base layer 105 to entirely cover the lower conductive line 110. According to exemplary embodiments, the first coating layer is formed by performing a first spin coating process using a photosensitive composition containing a photosensitive resin such as epoxy resin, acrylic resin, siloxane resin, imide resin, novolac resin, etc. can be formed through

For example, a pre-baking (or soft baking) process may be performed on the first coating layer at a temperature of about 80 to 110 °C. Thereafter, an exposure process may be performed using a mask to expose a portion of the upper surface of the lower conductive line 110.

In some embodiments, after the exposure process, a post-baking process may be performed at a temperature of about 130 to 160° C., for example.

Thereafter, the first coating layer may be partially removed through a development process using, for example, an aqueous alkaline solution to form a first insulating layer 122 exposing the upper surface of the lower conductive line 110.

In one embodiment, the post-baking process may be performed for a longer time than the pre-baking process. For example, the pre-baking process may be performed for about 3 to 10 minutes, and the post-baking process may be performed for about 20 to 30 minutes.

By performing the post-baking process for sufficient time and temperature, damage to the first insulating layer 122 can be prevented when forming the second insulating layer 124 or via hole 125, which will be described later.

Referring to FIG. 5, the second insulating layer 124 may be formed on the first insulating layer 122.

For example, the photosensitive composition described above may be formed on the base layer 105 and the first insulating layer 122 through a second spin coating process to form a second coating layer. The second coating layer may be formed to fill the upper surface of the lower conductive line 110 exposed when forming the first insulating layer 122.

For example, a pre-baking process may be performed on the second coating layer at a temperature of about 80 to 110°C. Afterwards, an exposure process can be performed using a mask for forming the via hole 125.

In some embodiments, a post-baking process after the exposure process may be performed at a temperature of, for example, about 180 to 220°C.

Thereafter, the second coating layer may be partially removed through a development process using, for example, an aqueous alkaline solution to form the via hole 125. Accordingly, the second insulating layer 124 can be formed to cover a portion of the first insulating layer 122 and the lower conductive line 110 and partially expose the upper surface of the lower conductive line 110.

At least a portion of the second coating layer filling the upper surface of the lower conductive line 110 exposed in the development process may be removed to form the via hole 125. As described above, since the first insulating layer 122 is hardened through pre-baking and post-baking processes, the via hole 125 can be formed without damaging the first insulating layer 122.

Even when forming the second insulating layer 124, the post-baking process may be performed for a longer time than the pre-baking process. For example, the pre-baking process may be performed for about 3 to 10 minutes, and the post-baking process may be performed for about 20 to 30 minutes.

In some embodiments, the rotation speed of the first spin coating process for forming the first insulating layer 122 and the rotation speed of the second spin process for forming the second insulating layer 124 are each about 300 to 500 rpm. can be adjusted. Accordingly, the connection reliability between the conductive lines 110 and 130 can be improved by sufficiently increasing the height of the first insulating layer 122 and reducing the inclination angle of the inclined portions of the second insulating layer 124.

By forming the insulating structure 120 in two successive steps, the thickness and surface flatness of the insulating layers 122 and 124 can be uniformly adjusted.

In the insulating structure 120 manufactured according to the above-described process, the thickness of the first insulating layer 122 may be 50 to 100% of the thickness of the lower conductive line 110.

Referring again to FIG. 1 , an upper conductive layer filling the via hole 125 may be formed on the second insulating layer 124 . Thereafter, the upper conductive layer may be patterned to a predetermined width to form an upper conductive line 130 including a contact 135 that contacts the lower conductive line 110 through the via hole 125.

Figure 6 is a schematic cross-sectional view showing a digitizer according to example embodiments. 7 and 8 are schematic plan views showing conductive coils included in a digitizer according to example embodiments. For example, Figure 6 is a cross-sectional view taken along the line II' shown in Figure 7 in the thickness direction.

6 to 8 , two directions that are parallel to the upper surface of the digitizer 100 or the base layer 105 and intersect each other are defined as the first direction and the second direction. For example, the first direction and the second direction may intersect each other perpendicularly.

The first direction may correspond to the width direction, row direction, or X-direction of the digitizer 100. The second direction may correspond to the longitudinal direction, column direction, or Y-direction of the digitizer 100.

Referring to FIGS. 6 to 8 , the digitizer 100 may include an electrode connection structure according to the exemplary embodiments described with reference to FIGS. 1 and 2 . According to example embodiments, the digitizer 100 may include a lower conductive line 110 and an upper conductive line 130 formed on the base layer 105. The lower conductive line 110 and the upper conductive line 130 may be separated into different layers with an insulating structure 120 therebetween.

The digitizer 100 according to example embodiments may include a first conductive coil 50 (see FIG. 7) and a second conductive coil 70 (see FIG. 8).

The first conductive coil 50 and the second conductive coil 70 may be defined by combining the lower conductive line 110 and the upper conductive line 130 by contacts 135 .

The lower conductive line 110 may include a first lower conductive line 112 (see FIG. 8) and a second lower conductive line 114 (see FIG. 7). The upper conductive line 130 may include a first upper conductive line 132 (see FIG. 7) and a second upper conductive line 134 (see FIG. 8).

The first lower conductive line 112 and the second lower conductive line 114 may extend in the second direction. The first upper conductive line 132 and the second upper conductive line 134 may extend in the first direction.

As shown in FIG. 7, the first upper conductive line 132 of the upper conductive line 130 and the second lower conductive line 114 of the lower conductive line 110 are coupled to each other to form the first conductive coil 50. can be formed.

The first upper conductive line 132 and the second lower conductive line 114 together form a first conductive coil 50 and can be provided together as a sensing line for an input pen through electromagnetic induction.

For example, the first upper conductive line 132 and the second lower conductive line 114 may be electrically connected to each other through the first contact 135a. A plurality of first upper conductive lines 132 and a plurality of second lower conductive lines 114 are electrically connected to each other through a plurality of first contacts 135a and are formed within one first conductive coil 50. Multiple conduction loops may be included. For example, four first conductive loops may be included in one first conductive coil 50.

In some embodiments, the first conductive loops may have different sizes or areas in the planar direction. The first contact 135a may penetrate the insulating structure 120 and be formed substantially integrally with the first upper conductive line 132 .

A first input line 113 and a first output line 115 may be connected to any one of the first conductive loops. For example, the first input line 113 may be connected to the innermost first conductive loop among the first conductive loops. The first output line 115 may be connected to the outermost first conductive loop among the first conductive loops.

The current input from the first input line 113 alternately circulates through the lower conductive line 110 and the upper conductive line 130 through the first conductive loops, and may be discharged through the first output line 115. there is.

In some embodiments, the first input line 113 and the first output line 115 may be included in the lower conductive line 110.

In some embodiments, the lower conductive line 110 may include a first internal connection line 114a. For example, neighboring first conductive loops may be connected by the first internal connection line 114a.

As shown in FIG. 8, the first lower conductive line 112 of the lower conductive line 110 and the second upper conductive line 134 of the upper conductive line 130 are coupled to each other to form a second conductive coil 70. can be formed.

The first lower conductive line 112 and the second upper conductive line 134 together form a second conductive coil 70 and can be provided together as a sensing line for an input pen through electromagnetic induction.

For example, the first lower conductive line 112 and the second upper conductive line 134 may be electrically connected to each other through the second contact 135b. A plurality of first lower conductive lines 112 and a plurality of second upper conductive lines 134 are electrically connected to each other through a plurality of second contacts 135b and are formed within one second conductive coil 70. Multiple conduction loops may be included. For example, four second conductive loops may be included in one second conductive coil 70.

In some embodiments, the second conductive loops may have different sizes or areas in the planar direction. The second contact 135b may penetrate the insulating structure 120 and be formed substantially integrally with the second upper conductive line 134 .

A second input line 117 and a second output line 119 may be connected to any one of the second conductive loops. For example, the second input line 117 may be connected to the innermost second conductive loop among the second conductive loops. The second output line 119 may be connected to the outermost second conductive loop among the second conductive loops.

The current input from the second input line 117 alternately circulates through the lower conductive line 110 and the upper conductive line 130 through the second conductive loops, and may be discharged through the second output line 119. there is.

In some embodiments, the second input line 117 and the second output line 119 may be included in the lower conductive line 110.

In some embodiments, the upper conductive line 130 may further include an external connection line 134a. For example, the second input line 117 and the second output line 119 may be connected by the external connection line 134a through the second conductive loop and the second contact 135b.

In one embodiment, the external connection line 134a may be connected to two different second conductive coils. For example, the output line 119 connected to one second conductive coil 70 may be connected to the input line 117 of the other second conductive coil 70 through the external connection line 134a.

In some embodiments, the upper conductive line 130 may further include a second internal connection line 134b. For example, neighboring second conductive loops within the second conductive coil 70 may be connected to each other by the second internal connection line 134b.

7 and 8 show that four conductive loops are included in one conductive coil, but the number of conductive loops in the conductive coil can be adjusted taking into account the size and resolution of the image display device.

As described with reference to FIGS. 7 and 8 , the first conductive coil 50 and the second conductive coil 70 may each include a plurality of conductive loops of different sizes.

Accordingly, the intensity of the magnetic field generated through the digitizer 100 can be sufficiently increased to efficiently enhance energy transfer to, for example, an input pen contacting the window surface of the image display device.

In addition, since the lower conductive line 110 and the upper conductive line 130 are connected through the contact 135 to form a conductive loop, the number of loops of the conductive coil within a limited space is efficiently increased and the electromagnetic induction efficiency is improved. You can do it.

As described above, the thickness of the lower conductive line 110 may be greater than the thickness of the upper conductive line 130. As will be described later with reference to FIG. 9 , the upper conductive line 130 may extend in a first direction (eg, row direction or width direction) and intersect the bending axis. For example, the upper conductive line 130 may be perpendicular to the bending axis. The lower conductive line 110 extends in a second direction (column direction or longitudinal direction) and may be substantially parallel to the bending axis.

According to exemplary embodiments, crack prevention within the conductive line can be reduced or suppressed by reducing the thickness of the upper conductive line 130, through which bending stress is easily transmitted as it intersects the bending axis. By forming the first lower conductive line 110, which is parallel to the bending axis and is relatively free from bending stress, to a large thickness, a sufficient electromagnetic induction effect can be realized by expanding the current path through the conductive coil.

Additionally, as described with reference to FIG. 1 , the contact 135 may be formed within the insulating structure 120 including the via hole 125 . Accordingly, even when the thickness of the lower conductive line 110 increases, a stable connection reliability with the upper conductive line 130 can be secured while maintaining a predetermined insulation property.

Figure 9 is a schematic plan view showing a digitizer according to example embodiments. For convenience of explanation, the detailed structure/configuration of the conductive coil is omitted in FIG. 9 .

Referring to FIG. 9 , a plurality of first conductive coils 50 and second conductive coils 70 may be arranged on the upper surface of the base layer 105.

The first conductive coil 50 may extend in the first direction or row direction. The plurality of first conductive coils 50 may be arranged along the second direction or the column direction.

For example, n first conductive coils 50-1 to 50-n may be sequentially arranged along the second direction (n is a natural number).

The second conductive coil 70 may extend in the second direction or the column direction. The plurality of second conductive coils 70 may be arranged along the first direction or row direction.

For example, m second conductive coils 70-1 to 70-m may be sequentially arranged along the first direction.

A bending area BA may be included in the central portion of the base layer 105. A bending axis 80 extending in the second direction may be located within the bending area BA. The digitizer 100 according to example embodiments may be bent or folded around the bending axis 80 .

As described above, in some embodiments, the thickness of the upper conductive line 130 that intersects the bending axis 80 may be relatively small. Accordingly, cracking of the upper conductive line 130 to which bending stress is directly applied can be prevented and flexibility can be increased.

By increasing the thickness of the lower conductive line 110, which is parallel to the bending axis 80 and has a relatively small bending stress, resistance can be reduced and magnetic field generation efficiency through the conductive coil can be improved.

In addition, by using the electrode connection structure described with reference to FIG. 1 and/or FIG. 2, a stable electrical connection of the conductive coils 50 and 70 can be achieved during repeated folding or bending even when the thickness of the upper conductive line 130 is reduced. It is maintained so that the desired electromagnetic generation can be realized.

50: first conductive coil 70: second conductive coil
100: Digitizer 105: Base layer
110: lower conductive line 120: insulation structure
122: first insulating layer 124: second insulating layer
125: via hole 130: upper conductive line
135: contact 140: passivation layer

Claims (14)

Base layer;
a lower conductive line disposed on the upper surface of the base layer;
a first insulating layer formed on the upper surface of the base layer and disposed adjacent to the lower conductive line;
a second insulating layer formed on the first insulating layer and including a via hole exposing a top surface of the lower conductive line; and
An electrode connection structure comprising an upper conductive line disposed on the second insulating layer and electrically connected to the lower conductive line through the via hole. The electrode connection structure according to claim 1, wherein the second insulating layer covers the first insulating layer and at least a portion of the upper surface of the lower conductive line. The method of claim 1, wherein the second insulating layer is
a first inclined portion that contacts the first insulating layer and the lower conductive line and includes an inclined sidewall;
a second inclined portion that contacts the upper surface of the lower conductive line and forms the via hole; and
An electrode connection structure comprising an extension part extending from the first inclined part. The electrode connection structure according to claim 1, wherein the thickness of the first insulating layer is 50 to 100% of the thickness of the lower conductive line. The electrode connection structure according to claim 1, wherein the first insulating layer and the lower conductive line are formed on the same layer or at the same level. The electrode connection structure according to claim 1, wherein the first insulating layer and the lower conductive line are physically spaced apart from each other. The electrode connection structure according to claim 6, wherein a separation distance between the first insulating layer and the lower conductive line is 20 μm or less. The electrode connection structure according to claim 1, wherein the thickness of the lower conductive line is greater than the thickness of the upper conductive line. The electrode connection structure according to claim 1, wherein the lower conductive line has a thickness of 10 μm or more. The electrode connection structure according to claim 1, wherein the first insulating layer and the second insulating layer include different materials. Comprising the electrode connection structure of claim 1,
The lower conductive line includes a plurality of lower conductive lines, and the upper conductive line includes a plurality of upper conductive lines,
A digitizer wherein the lower conductive lines and the upper conductive lines are combined with each other through the via hole to form a plurality of conductive coils. The method of claim 11, wherein the lower conductive lines include first lower conductive lines and second lower conductive lines extending in a column direction,
The digitizer wherein the upper conductive lines include first upper conductive lines and second upper conductive lines extending in a row direction. The method of claim 12, wherein the conductive coils include: a first conductive coil formed by connecting the first upper conductive lines and the second lower conductive lines to each other; and a second conductive coil formed by connecting the first lower conductive lines and the second upper conductive lines to each other. The method of claim 11, wherein the base layer includes a bending area,
A bending axis of the bending region intersects the upper conductive line and is parallel to the lower conductive line.