KR20220135158A - Digitizer, method of manufacturing the same and image display device including the same - Google Patents

Abstract

A digitizer includes: a substrate layer including a folding portion; a lower conductive layer arranged on the substrate layer; an interlayer insulation layer which is formed on the substrate layer to cover the lower conductive layer, and which has an open portion or a recess formed in the folding portion; and an upper conductive layer arranged on the interlayer insulation layer and the substrate layer and electrically connected to the lower conductive layer. The interlayer insulation layer is at least partially removed from the folding portion so that folding reliability can be improved.

Description

Digitizer, manufacturing method thereof, and image display device including the same

The present invention relates to a digitizer, a method for manufacturing the same, and an image display apparatus including the same. More particularly, it relates to a digitizer including a multilayer conductive structure, a method for manufacturing the same, and an image display device including the same.

Recently, various sensing functions and communication functions are combined in an image display device, and are implemented in the form of, for example, a smartphone. For example, electronic devices in which a touch panel or a touch sensor is attached to a display panel of the image display device to select a menu displayed on a window surface to implement an information input function are being developed.

In addition, as disclosed in Korean Patent No. 10-1750564, a digitizer that converts analog coordinate information into a digital signal by an electromagnetic method is disposed on the back side of the image display device.

Recently, a flexible display having flexibility that can be folded or bent is being developed, and accordingly, a sensor structure such as the digitizer needs to be developed to have appropriate physical properties, design, and structure so that it can also be applied to the flexible display.

For example, in the case of a digitizer applied to a thin display device, a wire crack or wire peeling may easily occur in a folding part. In this case, resistance may be increased by damaged wiring. Therefore, there is a need to develop a digitizer capable of maintaining reliability even after repeated folding.

Korean Patent Publication No. 10-1750564

One object of the present invention is to provide a digitizer having improved mechanical and electrical reliability.

One object of the present invention is to provide a method of manufacturing a digitizer having improved mechanical and electrical reliability.

An object of the present invention is to provide an image display device including a digitizer having improved mechanical and electrical reliability.

1. A base layer including a folding part; a lower conductive layer disposed on the upper surface of the base layer; an interlayer insulating layer formed on the upper surface of the base layer to cover the lower conductive layer and having an opening or a recess in the folding part; and an upper conductive layer disposed on the upper surface of the interlayer insulating layer and the base layer and electrically connected to the lower conductive layer.

2. The digitizer according to the above 1, wherein the opening passes through the interlayer insulating layer in the folding part, and the upper surface of the base layer is exposed through the opening.

3. The digitizer according to the above 2, wherein the upper conductive layer is in contact with the upper surface of the base layer in the folding part.

4. The digitizer according to 1 above, wherein the interlayer insulating layer has a single-layer structure and has a reduced thickness in the folding portion.

5. The digitizer according to 1 above, wherein the interlayer insulating layer has a multilayer structure including a first interlayer insulating layer and a second interlayer insulating layer sequentially stacked from the base layer.

6. The digitizer according to 5 above, wherein the interlayer insulating layer includes the recess in the folding portion, and the upper surface of the first interlayer insulating layer is exposed in the recess.

7. The digitizer according to 1 above, wherein the thickness of the lower conductive layer is greater than the thickness of the upper conductive layer.

8. The method of 1 above, wherein the lower conductive layer includes a plurality of first lower conductive lines and a plurality of second lower conductive lines extending in a second direction parallel to the upper surface of the base layer,

The upper conductive layer is parallel to the upper surface of the base layer and includes a plurality of first upper conductive lines and a plurality of second upper conductive lines extending in a first direction perpendicular to the second direction, the digitizer.

9. The method of 8 above, further comprising: first contacts electrically connecting the first upper conductive lines and the second lower conductive lines to form a first conductive coil; and

and second contacts electrically connecting the first lower conductive lines and the second upper conductive lines to form a second conductive coil.

10. The method of 9 above, wherein the first conductive coil extends in the first direction, and a plurality of the first conductive coils are arranged along the second direction,

The second conductive coil extends in the second direction, and a plurality of the second conductive coils are arranged along the first direction.

11. The digitizer according to 10 above, wherein the first upper conductive lines intersect a folding axis of the folding part, and the first lower conductive lines are parallel to the folding axis of the folding part.

12. The digitizer according to 11 above, wherein the first lower conductive lines are not arranged in the folding part.

13. The digitizer according to 11 above, wherein a first lower conductive line of at least one of the first lower conductive lines is arranged in the folding portion.

14. The digitizer according to the above 10, further comprising a passivation layer formed on the interlayer insulating layer and the base layer and covering the first upper conductive lines and the second upper conductive lines.

15. The digitizer according to 14 above, wherein the opening or the recess penetrates the passivation layer in the folding portion.

16. Display panel; and a digitizer according to the above-described embodiments disposed under the display panel.

17. The image display device according to 16 above, further comprising a touch sensor disposed on the display panel.

18. The method of 17 above, further comprising a rear cover and a window substrate,

The touch sensor is disposed between the window substrate and the display panel, and the digitizer is disposed between the display panel and the rear cover.

19. forming lower conductive lines on the base layer; forming a preliminary interlayer insulating layer covering the lower conductive lines on the base layer; exposing the preliminary interlayer insulating layer using an exposure mask including a first mask portion, a second mask portion provided as a halftone portion, and a third mask portion; forming an interlayer insulating layer by partially removing the exposed preliminary interlayer insulating layer through a developing process; and forming upper conductive lines electrically connected to the lower conductive lines on the interlayer insulating layer.

20. The method of 19 above, wherein in the forming of the interlayer insulating layer, a folding part is formed by partially removing the preliminary interlayer insulating layer region overlapping the second mask part through a single developing process, and the third mask part and forming contact holes exposing upper surfaces of the lower conductive lines by removing portions of the preliminary interlayer insulating layer overlapping the .

According to embodiments of the present invention, an interlayer insulating layer for insulating the lower conductive line and the upper conductive line may be at least partially removed from the folding part of the digitizer. Accordingly, it is possible to reduce or suppress the delamination and folding cracks of the upper conductive line by reducing the folding thickness of the folding part.

In some embodiments, the passivation layer covering the upper conductive line may also be at least partially removed from the folding part. Accordingly, the folding characteristic can be further improved.

In example embodiments, the upper conductive line may intersect a folding axis, and the lower conductive line may be parallel to the folding axis. By forming the thickness of the upper conductive line smaller than the thickness of the lower conductive line It is possible to suppress electrode cracks and improve folding characteristics.

The digitizer may include a plurality of first conductive coils and second conductive coils, and the first conductive coil and the second conductive coil may include a plurality of conductive loops. Accordingly, a digitizer that promotes the electromagnetic induction phenomenon and has high resolution and improved flexible characteristics can be provided.

1 and 2 are schematic cross-sectional views illustrating a digitizer according to exemplary embodiments.
3 and 4 are schematic plan views illustrating conductive coils included in a digitizer according to example embodiments.
5 is a schematic plan view illustrating a digitizer according to exemplary embodiments.
6 is a schematic cross-sectional view illustrating a digitizer according to some exemplary embodiments.
7 and 8 are schematic cross-sectional views illustrating a digitizer according to some exemplary embodiments.
9 and 10 are schematic partial enlarged plan views illustrating an active area of a digitizer according to some exemplary embodiments.
11 is a schematic cross-sectional view illustrating a digitizer according to exemplary embodiments.
12 and 13 are schematic cross-sectional views for explaining a method of manufacturing a digitizer according to example embodiments.
14 is a schematic cross-sectional view illustrating an image display apparatus according to example embodiments.

SUMMARY Embodiments of the present invention provide a digitizer including conductive patterns having a multilayer structure and having improved folding reliability. In addition, there is provided an image display device including the digitizer.

Hereinafter, with reference to the drawings, embodiments of the present invention will be described in more detail. However, the following drawings attached to the present specification illustrate preferred embodiments of the present invention, and serve to further understand the technical spirit of the present invention together with the above-described content of the present invention, so the present invention is described in such drawings It should not be construed as being limited only to the matters.

In the drawings below, two directions parallel to and intersecting with the upper surface of the digitizer 100 or the base layer 105 are defined as a first direction and a second direction. For example, the first direction and the second direction may cross each other perpendicularly.

The first direction may correspond to a width direction, a row direction, or an X-direction of the digitizer 100 . The second direction may correspond to a longitudinal direction, a column direction, or a Y-direction of the digitizer 100 .

The terms "row direction", "column direction", etc. used in the present application do not refer to absolute directions, and should be understood as relative meanings designating different directions.

1 and 2 are schematic cross-sectional views illustrating a digitizer according to exemplary embodiments. For example, FIG. 1 is a cross-sectional view taken along the line I-I' of FIG. 3 in the thickness direction. FIG. 2 is a cross-sectional view taken along line II-II' of FIG. 3 .

1 and 2 , a digitizer according to example embodiments may include a lower conductive layer 110 and an upper conductive layer 130 formed on a base layer 105 . The lower conductive layer 110 and the upper conductive layer 130 may be separated in different layers with the interlayer insulating layer 120 interposed therebetween.

The lower conductive layer 110 may include a first lower conductive line 112 (see FIG. 4 ) and a second lower conductive line 114 (see FIG. 3 ). The upper conductive layer 130 may include a first upper conductive line 132 (see FIG. 3 ) and a second upper conductive line 134 (see FIG. 4 ).

The substrate layer 105 is used to encompass a substrate or a film type substrate for forming the conductive layers 110 and 130 and the interlayer insulating layer 120 . For example, the base layer 105 may include a polymer applicable to a flexible display. Examples of the polymer include cyclic olefin polymer (COP), polyethylene terephthalate (PET), polyacrylate (PAR), polyetherimide (PEI), polyethylene naphthalate (PEN), polyphenylene sulfide (PPS), poly Allylate (polyallylate), polyimide (PI), cellulose acetate propionate (CAP), polyethersulfone (PES), cellulose triacetate (TAC), polycarbonate (PC), cyclic olefin copolymer (COC), poly Methyl methacrylate (PMMA), etc. are mentioned.

Preferably, the base layer 105 may include polyimide to secure stable folding characteristics.

The lower conductive layer 110 and the upper conductive layer 130 may each include a low-resistance metal. For example, the lower conductive layer 110 and the upper conductive layer 130 are silver (Ag), gold (Au), copper (Cu), aluminum (Al), platinum (Pt), palladium (Pd), chromium ( Cr), titanium (Ti), tungsten (W), niobium (Nb), tantalum (Ta), vanadium (V), iron (Fe), manganese (Mn), cobalt (Co), nickel (Ni), zinc ( Zn), tin (Sn), molybdenum (Mo), calcium (Ca), or an alloy containing at least two of them.

Preferably, the lower conductive layer 110 and the upper conductive layer 130 may include copper or a copper alloy to realize low resistance.

The interlayer insulating layer 120 may be formed on the upper surface of the base layer 105 to cover the lower conductive layer 110 . The interlayer insulating layer 120 may include an organic insulating material such as an epoxy-based resin, an acrylic resin, a siloxane-based resin, or a polyimide-based resin, or an inorganic insulating material such as silicon oxide or silicon nitride. Preferably, the interlayer insulating layer 120 may be formed using an organic insulating material to improve flexible properties.

In some embodiments, the interlayer insulating layer 120 may have a multilayer structure. For example, the interlayer insulating layer 120 may include a first interlayer insulating layer 122 and a second interlayer insulating layer 124 sequentially stacked from the base layer 105 .

Accordingly, even when the thickness of the lower conductive layer 110 is increased, the interlayer insulating layer 120 having a sufficient thickness for forming the contacts 135 and 137 (refer to FIGS. 3 and 4 ) can be formed. Also, as will be described later, a neutral plane may be easily formed in the interlayer insulating layer 120 to be adjacent to the conductive layers 110 and 130 .

The upper conductive layer 130 may be formed on the interlayer insulating layer 120 . In some embodiments, the passivation layer 140 may be formed on the interlayer insulating layer 120 to cover the upper conductive layer 130 . The passivation layer 140 may include an organic insulating material such as an epoxy-based resin, an acrylic resin, a siloxane-based resin, or a polyimide-based resin, or an inorganic insulating material such as silicon oxide or silicon nitride. Preferably, the passivation layer 140 may be formed using an organic insulating material to improve flexible properties.

Each of the interlayer insulating layer 120 and the passivation layer 140 may have a thickness in the range of about 1.5 to 20 μm to improve folding characteristics.

As shown in FIG. 2 , the base layer 105 or the digitizer 100 may include a folding part FA, and the digitizer 100 may be bent or folded through the folding part FA.

In example embodiments, the interlayer insulating layer 120 may be at least partially removed from the folding part FA. In some embodiments, the folding part FA may be defined by a region from which the interlayer insulating layer 120 is removed.

For example, the opening 145 may be formed in the folding part FA by removing the insulating interlayer 120 . For example, the opening 145 may be defined by opposing sidewalls of the interlayer insulating layer 120 and a top surface of the base layer 105 .

The upper conductive layer 130 (eg, the first upper conductive line 132 ) may conformally extend along the upper surface of the interlayer insulating layer 120 and the opening 145 in the first direction.

In some embodiments, the first upper conductive line 132 may directly contact the upper surface of the base layer 105 in the folding part FA.

As described above, as the interlayer insulating layer 120 is removed from the folding part FA, the thickness of the digitizer 100 in the folding part FA may be reduced. Accordingly, the elongation in the folding part FA is increased to secure improved folding characteristics and flexibility.

Accordingly, it is possible to prevent cracks or breakage of the upper conductive layer 130 due to stress propagation occurring in the folding part FA.

In an area other than the folding part FA, the interlayer insulating layer 120 having a sufficient thickness may be formed. For example, the lower conductive layer 110 having a relatively large thickness and low resistance by utilizing the interlayer insulating layer 120 having a multilayer structure including the first interlayer insulating layer 122 and the second interlayer insulating layer 124 . ) can be sufficiently covered.

Also, in the folding part FA, the interlayer insulating layer 120 may be removed to prevent lifting and peeling of the upper conductive layer 130 that occurs during folding. Since the upper conductive layer 130 extends along the surface of the opening 145 , a contact area of the upper conductive layer 130 may be increased. Accordingly, the adhesion of the upper conductive layer 130 may be additionally increased.

The passivation layer 140 may also conformally extend on the folding part FA and cover the upper conductive layer 130 .

3 and 4 are schematic plan views illustrating conductive coils included in a digitizer according to example embodiments.

3 and 4 , the digitizer 100 according to example embodiments may include a first conductive coil 50 and a second conductive coil 70 .

The first conductive coil 50 and the second conductive coil 70 may be defined by combining the lower conductive layer 110 and the upper conductive layer 130 by the contacts 135 and 137 .

The lower conductive layer 110 may include a first lower conductive line 112 (see FIG. 4 ) and a second lower conductive line 114 (see FIG. 3 ). For example, the second lower conductive line 114 may be shorter than the first lower conductive line 112 .

The upper conductive layer 130 may include a first upper conductive line 132 (see FIG. 3 ) and a second upper conductive line 134 (see FIG. 4 ). For example, the second upper conductive line 134 may be shorter than the first upper conductive line 132 .

The first lower conductive line 112 and the second lower conductive line 114 may extend in the second direction. The first upper conductive line 132 and the second upper conductive line 134 may extend in a first direction.

As shown in FIG. 3 , the first upper conductive line 132 of the upper conductive layer 130 and the second lower conductive line 114 of the lower conductive layer 110 are coupled to each other to form a first conductive coil 50 . can form.

The first upper conductive line 132 and the second lower conductive line 114 may together form a first conductive coil 50 to serve as a sensing line for an input pen through electromagnetic induction.

For example, the first upper conductive line 132 and the second lower conductive line 114 may be electrically connected to each other through the first contact 135 . A plurality of first upper conductive lines 132 and a plurality of second lower conductive lines 114 are electrically connected to each other through a plurality of first contacts 135 to form a single first conductive coil 50 . A plurality of conductive loops may be included. For example, four first conductive loops may be included in one first conductive coil 50 .

In some embodiments, the first conductive loops may have different sizes or areas in a planar direction. The first contact 135 may pass through the interlayer insulating layer 120 to be formed substantially integrally with the first upper conductive line 132 .

A first input line 113 and a first output line 115 may be connected to any one of the first conductive loops. For example, the first input line 113 may be connected to an innermost first conductive loop among the first conductive loops. The first output line 115 may be connected to an outermost first conductive loop among the first conductive loops.

The current input from the first input line 113 may alternately cycle through the lower conductive layer 110 and the upper conductive layer 130 through the first conductive loops, and may be discharged through the first output line 115 . have.

In some embodiments, the first input line 113 and the first output line 115 may be included in the lower conductive layer 110 .

In some embodiments, the lower conductive layer 110 may include a first internal connection line 114a. For example, adjacent first conductive loops may be connected by a first internal connection line 114a.

As shown in FIG. 4 , the first lower conductive line 112 of the lower conductive layer 110 and the second upper conductive line 134 of the upper conductive layer 130 are coupled to each other to form a second conductive coil 70 . can form.

The first lower conductive line 112 and the second upper conductive line 134 may be provided together as a sensing line for an input pen through electromagnetic induction by forming a second conductive coil 70 together.

For example, the first lower conductive line 112 and the second upper conductive line 134 may be electrically connected to each other through the second contact 137 . A plurality of first lower conductive lines 112 and a plurality of second upper conductive lines 134 are electrically connected to each other through a plurality of second contacts 137 to form a single second conductive coil 70 . A plurality of conductive loops may be included. For example, four second conductive loops may be included in one second conductive coil 70 .

In some embodiments, the second conductive loops may have different sizes or areas in a planar direction. The second contact 137 may be formed substantially integrally with the second upper conductive line 134 through the interlayer insulating layer 120 .

A second input line 117 and a second output line 119 may be connected to any one of the second conductive loops. For example, the second input line 117 may be connected to an innermost second conductive loop among the second conductive loops. The second output line 119 may be connected to an outermost second conductive loop among the second conductive loops.

The current input from the second input line 117 may alternately cycle through the lower conductive layer 110 and the upper conductive layer 130 through the second conductive loops, and may be discharged through the second output line 119 . have.

In some embodiments, the second input line 117 and the second output line 119 may be included in the lower conductive layer 110 .

In some embodiments, the upper conductive layer 130 may further include an external connection line 134a. For example, the second input line 117 and the second output line 119 may be connected through the second conductive loop and the second contact 137 by the external connection line 134a.

In an embodiment, the external connection line 134a may be connected to two different second conductive coils. For example, the output line 119 connected to one of the second conductive coils 70 may be connected to the input line 117 of the other second conductive coil 70 through an external connection line 134a.

In some embodiments, the upper conductive layer 130 may further include a second internal connection line 134b. For example, adjacent second conductive loops in the second conductive coil 70 may be connected to each other by the second internal connection line 134b.

3 and 4 show that four conductive loops are included in one conductive coil, but the number of conductive loops in the conductive coil may be adjusted in consideration of the size and resolution of the image display device.

As described with reference to FIGS. 3 and 4 , the first conductive coil 50 and the second conductive coil 70 may each include a plurality of conductive loops having different sizes.

Accordingly, it is possible to sufficiently increase the magnetic field strength generated by the digitizer 100 , so that, for example, energy transfer to the input pen in contact with the window surface of the image display apparatus can be efficiently enhanced.

In addition, since the conductive loop is formed by connecting the lower conductive layer 110 and the upper conductive layer 130 through the contacts 135 and 137 , the number of loops of the conductive coil in a limited space is efficiently increased and electromagnetic induction efficiency is achieved. can improve

In example embodiments, both the lower conductive layer 110 and the upper conductive layer 130 may be disposed on the upper surface of the base layer 105 . Accordingly, when folding or folding through the base layer 105 , the stress direction for the lower conductive layer 110 and the upper conductive layer 130 may be adjusted in the same manner.

For example, when tensile stress is applied to the bottom surface of the base layer 105 , compressive stress may be applied to the lower conductive layer 110 and the upper conductive layer 130 . Accordingly, a neutral plane in which stress is canceled may be easily generated to be adjacent to the conductive layers 110 and 130 . Accordingly, stress applied to the conductive layers 110 and 130 may be relieved, thereby reducing or preventing electrode cracking due to folding.

In example embodiments, the thickness of the lower conductive layer 110 may be greater than the thickness of the upper conductive layer 130 . For example, the thickness of the first lower conductive line 112 may be greater than the thickness of the first upper conductive line 132 .

As will be described later with reference to FIG. 5 , the first upper conductive line 132 may extend in a first direction (eg, a row direction or a width direction) and intersect the folding axis. For example, the first upper conductive line 132 may be perpendicular to the folding axis. The first lower conductive line 112 may extend in a second direction (a column direction or a length direction) and may be substantially parallel to the folding axis.

In some embodiments, by reducing the thickness of the first upper conductive line 132 through which the folding stress is easily transmitted as it intersects the folding axis, prevention of cracks in the conductive line may be reduced or suppressed. Also, as described with reference to FIG. 2 , the interlayer insulating layer 120 may be removed from the folding part FA. Accordingly, it is possible to further reduce folding stress and more effectively suppress peeling and cracking of the first upper conductive line 132 .

The first lower conductive line 112 that is parallel to the folding axis and is relatively free from folding stress is formed to have a large thickness, so that a sufficient electromagnetic induction effect can be realized by expanding a current path through the conductive coil.

In an embodiment, the second lower conductive line 114 may also have a greater thickness than the second upper conductive line 134 .

In some embodiments, the thickness of the lower conductive layer 110 (the first lower conductive line or the second lower conductive line) may be about 5 to 20 μm, preferably 10 to 20 μm. The thickness of the upper conductive layer 130 (the first upper conductive line or the second upper conductive line) may be 6 μm or less, preferably about 1 to 6 μm.

5 is a schematic plan view illustrating a digitizer according to exemplary embodiments.

Referring to FIG. 5 , a plurality of first conductive coils 50 and second conductive coils 70 may be arranged on the upper surface of the base layer 105 .

The first conductive coil 50 may extend in the first direction or the row direction. The plurality of first conductive coils 50 may be arranged along the second direction or the column direction.

For example, n first conductive coils 50 - 1 to 50 - n may be sequentially arranged along the second direction (n is a natural number).

The second conductive coil 70 may extend in the second direction or the column direction. The plurality of second conductive coils 70 may be arranged along the first direction or the row direction.

For example, m second conductive coils 70 - 1 to 70 - m may be sequentially arranged in the first direction.

An area in which the first and second conductive coils 50 and 70 overlap and are arranged may be provided as an active area AA in which sensing by electromagnetic induction is performed.

For example, the central portion of the base layer 105 may include a folding portion FA. A folding shaft 80 extending in the second direction may be positioned in the folding part FA. The digitizer 100 according to example embodiments may be bent or folded around the folding axis 80 .

In some embodiments, the thickness of the first upper conductive line 132 or the second upper conductive line 134 crossing the folding axis 80 may be relatively small. Accordingly, it is possible to prevent cracking of the upper conductive layer 130 to which the folding stress is directly applied and to increase flexibility. In addition, as described with reference to FIG. 2 , the interlayer insulating layer 120 is at least partially removed from the folding part FA, so that peeling of the upper conductive layer 130 can be suppressed even when abruptly folded or folded.

The thicknesses of the first lower conductive line 112 and the second lower conductive line 114 that are parallel to the folding axis 80 and have relatively small folding stress are increased to reduce resistance and improve the efficiency of generating a magnetic field through the conductive coil. can do it

6 is a schematic cross-sectional view illustrating a digitizer according to some exemplary embodiments. 6 is a cross-sectional view taken along line II-II' of FIG. 3 .

Referring to FIG. 6 , the interlayer insulating layer 120 may include a recess 146 in the folding part FA. For example, the interlayer insulating layer 120 may be partially etched or removed from the folding part FA. Accordingly, the thickness of the interlayer insulating layer 120 may be reduced in the folding portion FA to form the recess 146 .

In some embodiments, as shown in FIG. 6 , a portion of the second interlayer insulating layer 124 may be removed from the folding part FA. Accordingly, the upper surface of the first interlayer insulating layer 122 may be exposed through the recess 146 in the folding part FA.

7 and 8 are schematic cross-sectional views illustrating a digitizer according to some exemplary embodiments. For example, FIGS. 7 and 8 are cross-sectional views taken along line III-III′ of FIG. 3 .

Referring to FIG. 7 , the passivation layer 140 may also be at least partially removed from the folding part FA. Accordingly, folding characteristics and flexibility in the folding part FA may be further improved.

In some embodiments, the passivation layer 140 may be formed on the upper surface of the base layer 105 to cover the upper conductive layer 130 (eg, the first upper conductive line 132 ), respectively.

As described above, while the interlayer insulating layer 120 is removed from the folding part FA, the passivation layer 140 may also be partially removed to define the opening 145 . For example, the upper surface of the base layer 105 may be exposed through the opening 145 .

Referring to FIG. 8 , the passivation layer 140 may cover a pair of adjacent first upper conductive lines 132 together. In the folding part FA, an opening 145 through which the upper surface of the base layer 105 is exposed may be formed between the passivation layers 140 facing each other in the adjacent second direction.

In some embodiments, for example, as described later with reference to FIG. 12 , the thickness of the passivation layer 140 in the folding part FA may be selectively reduced by using an exposure mask including a halftone part. have. Accordingly, while the passivation layer 140 is formed as a whole in the digitizer, the thickness of the folding part FA is reduced, so that the folding characteristic of the digitizer may be improved. For example, in the opening 145 shown in FIG. 9 , the passivation layer 140 may be formed in the form of a thin film having a reduced thickness.

9 and 10 are schematic partial enlarged plan views illustrating an active area of a digitizer according to some exemplary embodiments. For convenience of description, the illustration of the interlayer insulating layer and the passivation layer is omitted in FIGS. 8 and 9 .

As described with reference to FIG. 5 , the conductive coils 50 and 70 may be arranged to cross each other in a planar direction. Accordingly, the first upper conductive lines 132 included in the first conductive coil 50 and the first lower conductive lines 112 included in the second conductive coil 70 overlap each other in the planar direction and extend. can do.

Referring to FIG. 9 , the first lower conductive line 112 included in the lower conductive layer 110 may be excluded from the folding part FA. For example, in the folding part FA, only the upper conductive lines 132 and 134 included in the relatively thin upper conductive layer 130 may be arranged.

As described with reference to FIGS. 7 and 8 , an opening 145 may be formed in the folding part FA as indicated by a dotted rectangle. The opening 145 may be formed by removing the interlayer insulating layer 120 and partially removing the passivation layer 140 . By substantially excluding the lower conductive lines 112 and 114 from the folding part FA, the area of the opening 145 may be sufficiently increased, and folding characteristics and folding reliability may be improved.

Referring to FIG. 10 , the first lower conductive line 112 included in the lower conductive layer 110 may be arranged on the folding part FA. In this case, in the folding part FA, the interlayer insulating layer 120 may be partially removed to form the opening 145 .

Since the lower conductive lines 112 and 114 are substantially parallel to the folding axis, sufficient conductive line density may be secured without causing defects due to folding.

11 is a schematic cross-sectional view illustrating a digitizer according to exemplary embodiments. For example, detailed descriptions of structures and configurations substantially the same as or similar to those described with reference to FIGS. 1 to 4 will be omitted.

Referring to FIG. 11 , the interlayer insulating layer 120 may have a relatively reduced thickness in the folding part FA. For example, the thickness of the interlayer insulating layer 120 in the folding part FA may be smaller than the thickness of the interlayer insulating layer 120 in the peripheral area of the folding part FA.

In one embodiment, the thickness of the interlayer insulating layer 120 in the folding part FA is the base layer 105 in which the lower conductive layer 110 (eg, the second lower conductive line 114) is not formed. It may be smaller than the minimum thickness Ha from the top surface of the interlayer insulating layer 120 to the top surface of the interlayer insulating layer 120 .

In an embodiment, the thickness of the interlayer insulating layer 120 in the folding part FA is determined from the upper surface of the lower conductive layer 110 (eg, the second lower conductive line 114) to the interlayer insulating layer 120 . It may be smaller than the maximum thickness (Hb) up to the upper surface of

According to example embodiments, the interlayer insulating layer 120 may have a single-layer structure. Accordingly, as shown in FIGS. 1 and 2 , when the interlayer insulating layer 120 has a multilayer structure, a step that may occur at the boundary between the first interlayer insulating layer 122 and the second interlayer insulating layer 124 is reduced. can be prevented

In addition, delamination that may occur in the multilayer insulating layer when the digitizer 100 is repeatedly bent/folded through the folding part FA is removed, and folding characteristics can be further improved.

As the thickness of the interlayer insulating layer 120 in the folding part FA is selectively reduced, the interlayer insulating layer 120 may include a recess formed in the folding part FA. For example, the interlayer insulating layer 120 may include a trench extending in the second direction from the folding part FA.

The upper conductive layer 130 (eg, the first upper conductive line 132 ) is conformally formed along the profile of the upper surface of the interlayer insulating layer 120 , and crosses the trench in the folding part FA. can be extended

12 and 13 are schematic cross-sectional views for explaining a method of manufacturing a digitizer according to example embodiments. For example, FIGS. 12 and 13 are cross-sectional views illustrating a method of manufacturing the digitizer described with reference to FIG. 11 .

Referring to FIG. 12 , lower conductive lines 112 and 114 may be formed on the base layer 105 . Thereafter, a preliminary interlayer insulating layer 120a covering the lower conductive lines 112 and 114 may be formed.

The preliminary interlayer insulating layer 120a may be formed using an alkali-soluble resin composition having photosensitivity. For example, the preliminary interlayer insulating layer 120a may be formed using a negative photosensitive resin composition or a positive photosensitive resin composition.

Thereafter, an exposure process may be performed after the exposure mask 90 is disposed on the preliminary interlayer insulating layer 120a. In example embodiments, the exposure mask 90 may include a half-tone exposure mask.

In some embodiments, the exposure mask 90 may include a first mask part 92 , a second mask part 94 , and a third mask part 96 . The transmittance of the first mask unit 92 , the second mask unit 94 , and the third mask unit 96 may sequentially decrease or increase sequentially.

In an embodiment, when the preliminary interlayer insulating layer 120a is formed of a negative photosensitive resin composition, the first mask part 92 may be provided as a substantially transmissive part. Accordingly, the region of the preliminary interlayer insulating layer 120a overlapping the first mask part 92 may be cured.

The second mask part 94 may substantially overlap the folding part FA. The second mask part 94 is provided as a halftone part, and a portion of the preliminary interlayer insulating layer 120a included in the folding part FA may be partially cured.

The third mask part 96 may be disposed to overlap the lower conductive lines 112 and 114 . The third mask part 96 may substantially serve as a light blocking part. Accordingly, transmittances of the first mask unit 92 , the second mask unit 94 , and the third mask unit 96 may sequentially decrease.

In an embodiment, when the preliminary interlayer insulating layer 120a is formed of a positive photosensitive resin composition, the first mask part 92 may substantially serve as a light blocking part. The second mask part 94 substantially overlaps the folding part FA and is provided as a halftone part, and the resin structure of the preliminary interlayer insulating layer 120a included in the folding part FA is partially modified to form a developer solution. Solubility may increase.

The third mask part 96 may be disposed to overlap the lower conductive lines 112 and 114 . The third mask part 96 may be provided as a substantially transmissive part. Accordingly, transmittances of the first mask unit 92 , the second mask unit 94 , and the third mask unit 96 may sequentially increase.

Referring to FIG. 13 , after the exposure process, the interlayer insulating layer 120 may be formed by partially removing the preliminary interlayer insulating layer 120a through a developing process using an alkali developer.

A portion of the preliminary interlayer insulating layer 120a overlapping the third mask portion 96 may be substantially completely removed. Accordingly, a contact hole 121 exposing upper surfaces of the lower conductive lines 112 and 114 may be formed.

In the folding part FA overlapping the second mask part 94 , the preliminary interlayer insulating layer 120a may be partially removed. Accordingly, the interlayer insulating layer 120 having a selectively reduced thickness in the folding part FA may be obtained.

After the developing process, a thermal curing process (eg, post-baking) may be further performed.

Referring back to FIG. 11 , the upper conductive layer 130 or the upper conductive lines 132 and 134 may be formed on the interlayer insulating layer 120 . The upper conductive lines 132 and 134 may fill the contact hole 121 . Accordingly, the upper conductive lines 132 and 134 and the lower conductive lines 112 and 114 are connected to each other through the contacts 135 and 137 to form the conductive coils as described with reference to FIGS. 3 and 4 . can be formed

A passivation layer 140 covering the upper conductive layer 130 may be formed on the interlayer insulating layer 120 .

As described above, the contact holes 121 and the folding part FA may be formed together through a single patterning process using a single exposure mask and a single development process. Accordingly, it is possible to secure sufficient folding reliability while reducing the overall thickness and the number of processes of the digitizer 100 .

14 is a schematic cross-sectional view illustrating an image display apparatus according to example embodiments.

Referring to FIG. 14 , the image display apparatus may include the display panel 360 , the touch sensor 200 , and the digitizer 100 according to the above-described exemplary embodiments.

The digitizer 100 may be disposed under the display panel 360 . For example, the digitizer 100 may be disposed between the display panel 360 and the rear cover 380 .

The digitizer 100 includes relatively thick conductive lines for efficiency in generating a magnetic field using electromagnetic induction, and may include a plurality of conductive coils. Accordingly, the digitizer 100 may be disposed under the display panel 360 so as not to be recognized by a user of the image display apparatus.

As described above, by using the structure of the digitizer 100 according to the exemplary embodiments to sufficiently increase the magnetic field strength, for example, energy transfer to the input pen in contact with the window substrate 230 of the image display device can be efficiently performed. can be promoted to

According to example embodiments, the digitizer 100 may be disposed on the rear surface of the image display apparatus or under the display panel 360 . Accordingly, the conductive lines included in the digitizer 100 may not be recognized by the user. Accordingly, each of the conductive lines included in the digitizer 100 may be formed as a solid line including the above-described metal without employing a mesh structure to improve transmittance.

Accordingly, a sufficient current path can be secured by the conductive line to enhance electromagnetic induction efficiency.

The display panel 360 may include a pixel electrode 310 , a pixel defining layer 320 , a display layer 330 , a counter electrode 340 , and an encapsulation layer 350 disposed on the panel substrate 300 . can

A pixel circuit including a thin film transistor (TFT) may be formed on the panel substrate 300 , and an insulating layer covering the pixel circuit may be formed. The pixel electrode 310 may be electrically connected to, for example, a drain electrode of a TFT on the insulating layer.

The pixel defining layer 320 may be formed on the insulating layer to expose the pixel electrode 310 to define a pixel area. A display layer 330 is formed on the pixel electrode 310 , and the display layer 330 may include, for example, a liquid crystal layer or an organic light emitting layer.

A counter electrode 340 may be disposed on the pixel defining layer 320 and the display layer 330 . The opposing electrode 340 may be provided as a common electrode or a cathode of the image display device, for example. An encapsulation layer 350 for protecting the display panel 360 may be stacked on the opposite electrode 340 .

The touch sensor 200 may be stacked on the display panel 360 and disposed toward the window substrate 230 . The touch sensor 200 may generate capacitance by a user's touch input through the surface of the window substrate 230 . Accordingly, the touch sensor 200 may include a sensing electrode or sensing channels having a thickness smaller than that of the conductive layer included in the digitizer 100 so as not to be recognized by the user. For example, the thickness of the sensing electrode or the sensing channel may be less than 1 μm or less than 0.5 μm.

Each of the sensing electrodes or the sensing channels may be independently disposed in one single layer to interact with an adjacent sensing electrode or sensing channel to generate capacitance.

The touch sensor 200 may be coupled to the display panel 360 through the adhesive layer 260 .

The window substrate 230 includes, for example, a hard coating film and thin glass, and in an embodiment, a light blocking pattern 235 may be formed on a peripheral portion of one surface of the window substrate 230 . The light blocking pattern 235 may include, for example, a color printing pattern. A bezel part or a non-display area of the image display device may be defined by the light blocking pattern 235 .

A polarization layer 210 may be disposed between the window substrate 230 and the touch sensor 200 . The polarizing layer 210 may include a coated polarizer or a polarizing plate.

The polarization layer 210 may be directly bonded to the one surface of the window substrate 230 or may be attached through the first adhesive layer 220 . The touch sensor 200 may be coupled to the polarization layer 210 through the second adhesive layer 225 .

As shown in FIG. 11 , the window substrate 230 , the polarization layer 210 , and the touch sensor 200 may be sequentially disposed from the user's viewing side. In this case, since the sensing electrodes of the touch sensor 200 are disposed under the polarization layer 210 , it is possible to more effectively prevent the sensing electrode from being viewed.

In an embodiment, the touch sensor 200 may be directly transferred onto the window substrate 230 or the polarization layer 210 . In an embodiment, the window substrate 230 , the touch sensor 200 , and the polarization layer 210 may be disposed in the order from the user's viewing side.

50: first conductive coil 70: second conductive coil
100: digitizer 105: base layer
110: lower conductive layer 112: first lower conductive line
114: second lower conductive line 120: interlayer insulating layer
130: second conductive layer 132: first upper conductive line
134: second upper conductive line 135: first contact
137: second contact 140: passivation layer
145: opening

Claims (20)

a base layer including a folding part;
a lower conductive layer disposed on the upper surface of the base layer;
an interlayer insulating layer formed on the upper surface of the base layer to cover the lower conductive layer and having an opening or a recess in the folding part; and
and an upper conductive layer disposed on the upper surface of the interlayer insulating layer and the base layer and electrically connected to the lower conductive layer. The digitizer of claim 1, wherein the opening passes through the interlayer insulating layer in the folding part, and the upper surface of the base layer is exposed through the opening. The digitizer of claim 2, wherein the upper conductive layer is in contact with the upper surface of the base layer in the folding part. The digitizer according to claim 1, wherein the interlayer insulating layer has a single-layer structure and has a reduced thickness in the folding part. The digitizer of claim 1, wherein the interlayer insulating layer has a multilayer structure including a first interlayer insulating layer and a second interlayer insulating layer sequentially stacked from the base layer. The method according to claim 5, wherein the interlayer insulating layer comprises the recess in the folding part,
and an upper surface of the first interlayer insulating layer is exposed in the recess. The digitizer of claim 1 , wherein a thickness of the lower conductive layer is greater than a thickness of the upper conductive layer. The method according to claim 1, wherein the lower conductive layer comprises a plurality of first lower conductive lines and a plurality of second lower conductive lines extending in a second direction parallel to the upper surface of the base layer,
The upper conductive layer is parallel to the upper surface of the base layer and includes a plurality of first upper conductive lines and a plurality of second upper conductive lines extending in a first direction perpendicular to the second direction, the digitizer. The apparatus of claim 8 , further comprising: first contacts electrically connecting the first upper conductive lines and the second lower conductive lines to form a first conductive coil; and
and second contacts electrically connecting the first lower conductive lines and the second upper conductive lines to form a second conductive coil. The method according to claim 9, wherein the first conductive coil extends in the first direction, a plurality of the first conductive coils are arranged along the second direction,
The second conductive coil extends in the second direction, and a plurality of the second conductive coils are arranged along the first direction. The digitizer of claim 10 , wherein the first upper conductive lines intersect a folding axis of the folding part, and the first lower conductive lines are parallel to the folding axis of the folding part. The digitizer according to claim 11, wherein the first lower conductive lines are not arranged in the folding part. The digitizer of claim 11 , wherein at least one of the first lower conductive lines is arranged in the folding portion. The digitizer of claim 10 , further comprising a passivation layer formed on the interlayer insulating layer and the base layer and covering the first upper conductive lines and the second upper conductive lines. 15. The digitizer of claim 14, wherein the opening or the recess penetrates the passivation layer in the folding portion. display panel; and
An image display device comprising the digitizer according to claim 1 disposed below the display panel. The image display device of claim 16 , further comprising a touch sensor disposed on the display panel. The method according to claim 17, further comprising a rear cover and a window substrate,
The touch sensor is disposed between the window substrate and the display panel, and the digitizer is disposed between the display panel and the rear cover. forming lower conductive lines on the base layer;
forming a preliminary interlayer insulating layer covering the lower conductive lines on the base layer;
exposing the preliminary interlayer insulating layer using an exposure mask including a first mask portion, a second mask portion provided as a halftone portion, and a third mask portion;
forming an interlayer insulating layer by partially removing the exposed preliminary interlayer insulating layer through a developing process; and
and forming upper conductive lines electrically connected to the lower conductive lines on the interlayer insulating layer. The method of claim 19 , wherein the forming of the interlayer insulating layer includes partially removing the preliminary interlayer insulating layer region overlapping the second mask part through a single developing process to form a folding part, and overlapping the third mask part and removing portions of the preliminary interlayer insulating layer to form contact holes exposing upper surfaces of the lower conductive lines.

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