KR20230131754A - 계량 디바이스 - Google Patents

계량 디바이스 Download PDF

Info

Publication number
KR20230131754A
KR20230131754A KR1020220088409A KR20220088409A KR20230131754A KR 20230131754 A KR20230131754 A KR 20230131754A KR 1020220088409 A KR1020220088409 A KR 1020220088409A KR 20220088409 A KR20220088409 A KR 20220088409A KR 20230131754 A KR20230131754 A KR 20230131754A
Authority
KR
South Korea
Prior art keywords
wafer
support
contact
elements
contact elements
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020220088409A
Other languages
English (en)
Korean (ko)
Inventor
로버트 엘리어트 그레고르
존 윌비 로버트
듀톤 휴
Original Assignee
메트릭스 리미티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 메트릭스 리미티드 filed Critical 메트릭스 리미티드
Publication of KR20230131754A publication Critical patent/KR20230131754A/ko
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01G—WEIGHING
    • G01G23/00—Auxiliary devices for weighing apparatus
    • G01G23/002—Means for correcting for obliquity of mounting
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01G—WEIGHING
    • G01G17/00—Apparatus for or methods of weighing material of special form or property
    • G01G17/02—Apparatus for or methods of weighing material of special form or property for weighing material of filamentary or sheet form
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01G—WEIGHING
    • G01G19/00—Weighing apparatus or methods adapted for special purposes not provided for in the preceding groups
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01G—WEIGHING
    • G01G21/00—Details of weighing apparatus
    • G01G21/22—Weigh pans or other weighing receptacles; Weighing platforms
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01G—WEIGHING
    • G01G21/00—Details of weighing apparatus
    • G01G21/23—Support or suspension of weighing platforms
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01G—WEIGHING
    • G01G21/00—Details of weighing apparatus
    • G01G21/28—Frames, Housings
    • H01L21/67253—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0462—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0604—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3308—Vertical transfer of a single workpiece
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7618—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating carrousel
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Sampling And Sample Adjustment (AREA)
KR1020220088409A 2022-03-07 2022-07-18 계량 디바이스 Pending KR20230131754A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB2203108.2 2022-03-07
GBGB2203108.2A GB202203108D0 (en) 2022-03-07 2022-03-07 Weighing device

Publications (1)

Publication Number Publication Date
KR20230131754A true KR20230131754A (ko) 2023-09-14

Family

ID=81175454

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020220088409A Pending KR20230131754A (ko) 2022-03-07 2022-07-18 계량 디바이스
KR1020247032393A Pending KR20240160138A (ko) 2022-03-07 2023-02-28 반도체 웨이퍼용 계량 디바이스 (weighing device)

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020247032393A Pending KR20240160138A (ko) 2022-03-07 2023-02-28 반도체 웨이퍼용 계량 디바이스 (weighing device)

Country Status (8)

Country Link
US (1) US20250155273A1 (cg-RX-API-DMAC7.html)
EP (1) EP4490474B1 (cg-RX-API-DMAC7.html)
JP (1) JP2025509159A (cg-RX-API-DMAC7.html)
KR (2) KR20230131754A (cg-RX-API-DMAC7.html)
CN (1) CN118891495A (cg-RX-API-DMAC7.html)
GB (1) GB202203108D0 (cg-RX-API-DMAC7.html)
TW (1) TW202401620A (cg-RX-API-DMAC7.html)
WO (1) WO2023169880A1 (cg-RX-API-DMAC7.html)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB0016562D0 (en) 2000-07-05 2000-08-23 Metryx Limited Apparatus and method for investigating semiconductor wafers
CN112410764A (zh) * 2019-08-23 2021-02-26 长鑫存储技术有限公司 气相沉积装置、调整方法、装置、系统、介质和电子设备
KR102508464B1 (ko) * 2021-04-01 2023-03-09 주식회사 코비스테크놀로지 질량 측정 장치

Also Published As

Publication number Publication date
US20250155273A1 (en) 2025-05-15
JP2025509159A (ja) 2025-04-11
GB202203108D0 (en) 2022-04-20
WO2023169880A1 (en) 2023-09-14
EP4490474B1 (en) 2025-12-10
EP4490474A1 (en) 2025-01-15
CN118891495A (zh) 2024-11-01
TW202401620A (zh) 2024-01-01
KR20240160138A (ko) 2024-11-08

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Date Code Title Description
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

A201 Request for examination
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

E14-X000 Pre-grant third party observation filed

St.27 status event code: A-2-3-E10-E14-opp-X000

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

PN2301 Change of applicant

St.27 status event code: A-3-3-R10-R11-asn-PN2301

R11 Change to the name of applicant or owner or transfer of ownership requested

Free format text: ST27 STATUS EVENT CODE: A-3-3-R10-R11-ASN-PN2301 (AS PROVIDED BY THE NATIONAL OFFICE)