TW202401620A - 稱重裝置 - Google Patents

稱重裝置 Download PDF

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Publication number
TW202401620A
TW202401620A TW112107745A TW112107745A TW202401620A TW 202401620 A TW202401620 A TW 202401620A TW 112107745 A TW112107745 A TW 112107745A TW 112107745 A TW112107745 A TW 112107745A TW 202401620 A TW202401620 A TW 202401620A
Authority
TW
Taiwan
Prior art keywords
wafer
support
contact
elements
contact elements
Prior art date
Application number
TW112107745A
Other languages
English (en)
Chinese (zh)
Inventor
格雷戈爾 羅伯特 艾略特
羅伯特 約翰 威爾比
休 達頓
Original Assignee
英商美特拉斯有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 英商美特拉斯有限公司 filed Critical 英商美特拉斯有限公司
Publication of TW202401620A publication Critical patent/TW202401620A/zh

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01G—WEIGHING
    • G01G23/00—Auxiliary devices for weighing apparatus
    • G01G23/002—Means for correcting for obliquity of mounting
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01G—WEIGHING
    • G01G17/00—Apparatus for or methods of weighing material of special form or property
    • G01G17/02—Apparatus for or methods of weighing material of special form or property for weighing material of filamentary or sheet form
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01G—WEIGHING
    • G01G19/00—Weighing apparatus or methods adapted for special purposes not provided for in the preceding groups
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01G—WEIGHING
    • G01G21/00—Details of weighing apparatus
    • G01G21/22—Weigh pans or other weighing receptacles; Weighing platforms
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01G—WEIGHING
    • G01G21/00—Details of weighing apparatus
    • G01G21/23—Support or suspension of weighing platforms
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01G—WEIGHING
    • G01G21/00—Details of weighing apparatus
    • G01G21/28—Frames, Housings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0462—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0604—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3308—Vertical transfer of a single workpiece
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7618—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating carrousel
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Sampling And Sample Adjustment (AREA)
TW112107745A 2022-03-07 2023-03-03 稱重裝置 TW202401620A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB2203108.2 2022-03-07
GBGB2203108.2A GB202203108D0 (en) 2022-03-07 2022-03-07 Weighing device

Publications (1)

Publication Number Publication Date
TW202401620A true TW202401620A (zh) 2024-01-01

Family

ID=81175454

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112107745A TW202401620A (zh) 2022-03-07 2023-03-03 稱重裝置

Country Status (8)

Country Link
US (1) US20250155273A1 (cg-RX-API-DMAC7.html)
EP (1) EP4490474B1 (cg-RX-API-DMAC7.html)
JP (1) JP2025509159A (cg-RX-API-DMAC7.html)
KR (2) KR20230131754A (cg-RX-API-DMAC7.html)
CN (1) CN118891495A (cg-RX-API-DMAC7.html)
GB (1) GB202203108D0 (cg-RX-API-DMAC7.html)
TW (1) TW202401620A (cg-RX-API-DMAC7.html)
WO (1) WO2023169880A1 (cg-RX-API-DMAC7.html)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB0016562D0 (en) 2000-07-05 2000-08-23 Metryx Limited Apparatus and method for investigating semiconductor wafers
CN112410764A (zh) * 2019-08-23 2021-02-26 长鑫存储技术有限公司 气相沉积装置、调整方法、装置、系统、介质和电子设备
KR102508464B1 (ko) * 2021-04-01 2023-03-09 주식회사 코비스테크놀로지 질량 측정 장치

Also Published As

Publication number Publication date
US20250155273A1 (en) 2025-05-15
JP2025509159A (ja) 2025-04-11
GB202203108D0 (en) 2022-04-20
WO2023169880A1 (en) 2023-09-14
EP4490474B1 (en) 2025-12-10
EP4490474A1 (en) 2025-01-15
CN118891495A (zh) 2024-11-01
KR20230131754A (ko) 2023-09-14
KR20240160138A (ko) 2024-11-08

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