JP2025509159A - 半導体ウエハの計量デバイス - Google Patents

半導体ウエハの計量デバイス Download PDF

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Publication number
JP2025509159A
JP2025509159A JP2024552119A JP2024552119A JP2025509159A JP 2025509159 A JP2025509159 A JP 2025509159A JP 2024552119 A JP2024552119 A JP 2024552119A JP 2024552119 A JP2024552119 A JP 2024552119A JP 2025509159 A JP2025509159 A JP 2025509159A
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JP
Japan
Prior art keywords
wafer
support
contact
underside
elements
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024552119A
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English (en)
Japanese (ja)
Other versions
JP2025509159A5 (cg-RX-API-DMAC7.html
Inventor
エリオット・グレガー・ロバート
ウィルビー，ロバート・ジョン
ダットン・ヒュー
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Metryx Ltd
Original Assignee
Metryx Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Metryx Ltd filed Critical Metryx Ltd
Publication of JP2025509159A publication Critical patent/JP2025509159A/ja
Publication of JP2025509159A5 publication Critical patent/JP2025509159A5/ja
Pending legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01G—WEIGHING
    • G01G23/00—Auxiliary devices for weighing apparatus
    • G01G23/002—Means for correcting for obliquity of mounting
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01G—WEIGHING
    • G01G17/00—Apparatus for or methods of weighing material of special form or property
    • G01G17/02—Apparatus for or methods of weighing material of special form or property for weighing material of filamentary or sheet form
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01G—WEIGHING
    • G01G19/00—Weighing apparatus or methods adapted for special purposes not provided for in the preceding groups
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01G—WEIGHING
    • G01G21/00—Details of weighing apparatus
    • G01G21/22—Weigh pans or other weighing receptacles; Weighing platforms
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01G—WEIGHING
    • G01G21/00—Details of weighing apparatus
    • G01G21/23—Support or suspension of weighing platforms
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01G—WEIGHING
    • G01G21/00—Details of weighing apparatus
    • G01G21/28—Frames, Housings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0462—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0604—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3308—Vertical transfer of a single workpiece
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7618—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating carrousel
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Sampling And Sample Adjustment (AREA)
JP2024552119A 2022-03-07 2023-02-28 半導体ウエハの計量デバイス Pending JP2025509159A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB2203108.2 2022-03-07
GBGB2203108.2A GB202203108D0 (en) 2022-03-07 2022-03-07 Weighing device
PCT/EP2023/055023 WO2023169880A1 (en) 2022-03-07 2023-02-28 Weighing device for a semiconductor wafer

Publications (2)

Publication Number Publication Date
JP2025509159A true JP2025509159A (ja) 2025-04-11
JP2025509159A5 JP2025509159A5 (cg-RX-API-DMAC7.html) 2026-02-18

Family

ID=81175454

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024552119A Pending JP2025509159A (ja) 2022-03-07 2023-02-28 半導体ウエハの計量デバイス

Country Status (8)

Country Link
US (1) US20250155273A1 (cg-RX-API-DMAC7.html)
EP (1) EP4490474B1 (cg-RX-API-DMAC7.html)
JP (1) JP2025509159A (cg-RX-API-DMAC7.html)
KR (2) KR20230131754A (cg-RX-API-DMAC7.html)
CN (1) CN118891495A (cg-RX-API-DMAC7.html)
GB (1) GB202203108D0 (cg-RX-API-DMAC7.html)
TW (1) TW202401620A (cg-RX-API-DMAC7.html)
WO (1) WO2023169880A1 (cg-RX-API-DMAC7.html)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB0016562D0 (en) 2000-07-05 2000-08-23 Metryx Limited Apparatus and method for investigating semiconductor wafers
CN112410764A (zh) * 2019-08-23 2021-02-26 长鑫存储技术有限公司 气相沉积装置、调整方法、装置、系统、介质和电子设备
KR102508464B1 (ko) * 2021-04-01 2023-03-09 주식회사 코비스테크놀로지 질량 측정 장치

Also Published As

Publication number Publication date
US20250155273A1 (en) 2025-05-15
GB202203108D0 (en) 2022-04-20
WO2023169880A1 (en) 2023-09-14
EP4490474B1 (en) 2025-12-10
EP4490474A1 (en) 2025-01-15
CN118891495A (zh) 2024-11-01
KR20230131754A (ko) 2023-09-14
TW202401620A (zh) 2024-01-01
KR20240160138A (ko) 2024-11-08

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