KR20230121042A - 연마 패드, 그 제조 방법 및 연마 가공물의 제조 방법, 및 랩핑 패드, 그 제조 방법 및 랩 가공물의 제조 방법 - Google Patents
연마 패드, 그 제조 방법 및 연마 가공물의 제조 방법, 및 랩핑 패드, 그 제조 방법 및 랩 가공물의 제조 방법 Download PDFInfo
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- 238000005498 polishing Methods 0.000 title claims abstract description 298
- 238000004519 manufacturing process Methods 0.000 title claims description 118
- 239000011148 porous material Substances 0.000 claims abstract description 800
- 229920005989 resin Polymers 0.000 claims abstract description 699
- 239000011347 resin Substances 0.000 claims abstract description 699
- 238000009826 distribution Methods 0.000 claims abstract description 207
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 claims abstract description 134
- 229910052753 mercury Inorganic materials 0.000 claims abstract description 134
- 239000002002 slurry Substances 0.000 claims abstract description 100
- 238000002459 porosimetry Methods 0.000 claims abstract description 81
- 239000003795 chemical substances by application Substances 0.000 claims description 392
- 238000000926 separation method Methods 0.000 claims description 156
- 238000000034 method Methods 0.000 claims description 137
- 239000000203 mixture Substances 0.000 claims description 94
- 239000007788 liquid Substances 0.000 claims description 60
- 229920002635 polyurethane Polymers 0.000 claims description 9
- 239000004814 polyurethane Substances 0.000 claims description 9
- 150000001875 compounds Chemical class 0.000 description 190
- -1 polytetramethylene Polymers 0.000 description 82
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 80
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 74
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 72
- 239000001257 hydrogen Substances 0.000 description 72
- 229910052739 hydrogen Inorganic materials 0.000 description 72
- 125000003277 amino group Chemical group 0.000 description 68
- 239000000463 material Substances 0.000 description 54
- 238000005259 measurement Methods 0.000 description 54
- 230000008569 process Effects 0.000 description 49
- 239000000047 product Substances 0.000 description 49
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 48
- 238000002156 mixing Methods 0.000 description 48
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 48
- 238000012545 processing Methods 0.000 description 47
- 229920005862 polyol Polymers 0.000 description 40
- IBOFVQJTBBUKMU-UHFFFAOYSA-N 4,4'-methylene-bis-(2-chloroaniline) Chemical compound C1=C(Cl)C(N)=CC=C1CC1=CC=C(N)C(Cl)=C1 IBOFVQJTBBUKMU-UHFFFAOYSA-N 0.000 description 38
- 239000010410 layer Substances 0.000 description 37
- 239000004088 foaming agent Substances 0.000 description 36
- 230000000052 comparative effect Effects 0.000 description 35
- 229920005749 polyurethane resin Polymers 0.000 description 34
- 239000000654 additive Substances 0.000 description 32
- 239000005056 polyisocyanate Substances 0.000 description 32
- 229920001228 polyisocyanate Polymers 0.000 description 32
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 30
- 125000000524 functional group Chemical group 0.000 description 30
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 29
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 28
- 239000006260 foam Substances 0.000 description 28
- 238000000465 moulding Methods 0.000 description 28
- 239000006061 abrasive grain Substances 0.000 description 27
- 238000001878 scanning electron micrograph Methods 0.000 description 26
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 24
- 239000003054 catalyst Substances 0.000 description 24
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 24
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 22
- 229920001296 polysiloxane Polymers 0.000 description 22
- 239000002518 antifoaming agent Substances 0.000 description 20
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 20
- 229920001451 polypropylene glycol Polymers 0.000 description 20
- 230000003287 optical effect Effects 0.000 description 19
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 18
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 18
- 239000011800 void material Substances 0.000 description 18
- 239000004065 semiconductor Substances 0.000 description 17
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 16
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 16
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 16
- 230000009257 reactivity Effects 0.000 description 16
- 238000012360 testing method Methods 0.000 description 16
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 16
- 238000004049 embossing Methods 0.000 description 13
- GTEXIOINCJRBIO-UHFFFAOYSA-N 2-[2-(dimethylamino)ethoxy]-n,n-dimethylethanamine Chemical compound CN(C)CCOCCN(C)C GTEXIOINCJRBIO-UHFFFAOYSA-N 0.000 description 12
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 12
- 230000000996 additive effect Effects 0.000 description 12
- 239000000853 adhesive Substances 0.000 description 12
- 230000001070 adhesive effect Effects 0.000 description 12
- 238000001816 cooling Methods 0.000 description 12
- 229910003460 diamond Inorganic materials 0.000 description 12
- 239000010432 diamond Substances 0.000 description 12
- 238000011156 evaluation Methods 0.000 description 12
- 239000000945 filler Substances 0.000 description 12
- 239000011259 mixed solution Substances 0.000 description 12
- 239000002243 precursor Substances 0.000 description 12
- RUELTTOHQODFPA-UHFFFAOYSA-N toluene 2,6-diisocyanate Chemical compound CC1=C(N=C=O)C=CC=C1N=C=O RUELTTOHQODFPA-UHFFFAOYSA-N 0.000 description 12
- 239000000919 ceramic Substances 0.000 description 11
- 229910052751 metal Inorganic materials 0.000 description 11
- 239000002184 metal Substances 0.000 description 11
- 150000002739 metals Chemical class 0.000 description 11
- 235000012431 wafers Nutrition 0.000 description 11
- VZSRBBMJRBPUNF-UHFFFAOYSA-N 2-(2,3-dihydro-1H-inden-2-ylamino)-N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]pyrimidine-5-carboxamide Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C(=O)NCCC(N1CC2=C(CC1)NN=N2)=O VZSRBBMJRBPUNF-UHFFFAOYSA-N 0.000 description 10
- 230000006835 compression Effects 0.000 description 10
- 238000007906 compression Methods 0.000 description 10
- 230000001788 irregular Effects 0.000 description 10
- 230000000704 physical effect Effects 0.000 description 10
- 238000003825 pressing Methods 0.000 description 10
- 239000003381 stabilizer Substances 0.000 description 10
- 239000000758 substrate Substances 0.000 description 10
- HMUNWXXNJPVALC-UHFFFAOYSA-N 1-[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]piperazin-1-yl]-2-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethanone Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)N1CCN(CC1)C(CN1CC2=C(CC1)NN=N2)=O HMUNWXXNJPVALC-UHFFFAOYSA-N 0.000 description 9
- 238000000227 grinding Methods 0.000 description 9
- UNVGBIALRHLALK-UHFFFAOYSA-N 1,5-Hexanediol Chemical compound CC(O)CCCCO UNVGBIALRHLALK-UHFFFAOYSA-N 0.000 description 8
- BKOOMYPCSUNDGP-UHFFFAOYSA-N 2-methylbut-2-ene Chemical group CC=C(C)C BKOOMYPCSUNDGP-UHFFFAOYSA-N 0.000 description 8
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 8
- 239000004721 Polyphenylene oxide Substances 0.000 description 8
- 239000001361 adipic acid Substances 0.000 description 8
- 235000011037 adipic acid Nutrition 0.000 description 8
- 239000003963 antioxidant agent Substances 0.000 description 8
- 239000002216 antistatic agent Substances 0.000 description 8
- 239000007795 chemical reaction product Substances 0.000 description 8
- 238000013329 compounding Methods 0.000 description 8
- KORSJDCBLAPZEQ-UHFFFAOYSA-N dicyclohexylmethane-4,4'-diisocyanate Chemical compound C1CC(N=C=O)CCC1CC1CCC(N=C=O)CC1 KORSJDCBLAPZEQ-UHFFFAOYSA-N 0.000 description 8
- 239000003085 diluting agent Substances 0.000 description 8
- 239000000975 dye Substances 0.000 description 8
- 239000003063 flame retardant Substances 0.000 description 8
- 239000004872 foam stabilizing agent Substances 0.000 description 8
- TZMQHOJDDMFGQX-UHFFFAOYSA-N hexane-1,1,1-triol Chemical compound CCCCCC(O)(O)O TZMQHOJDDMFGQX-UHFFFAOYSA-N 0.000 description 8
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 8
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 8
- 230000014759 maintenance of location Effects 0.000 description 8
- 239000002245 particle Substances 0.000 description 8
- 238000005191 phase separation Methods 0.000 description 8
- 239000000049 pigment Substances 0.000 description 8
- 229920000570 polyether Polymers 0.000 description 8
- YPFDHNVEDLHUCE-UHFFFAOYSA-N propane-1,3-diol Chemical compound OCCCO YPFDHNVEDLHUCE-UHFFFAOYSA-N 0.000 description 8
- 238000004080 punching Methods 0.000 description 8
- 239000007787 solid Substances 0.000 description 8
- 238000010408 sweeping Methods 0.000 description 8
- WZFUQSJFWNHZHM-UHFFFAOYSA-N 2-[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]piperazin-1-yl]-1-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethanone Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)N1CCN(CC1)CC(=O)N1CC2=C(CC1)NN=N2 WZFUQSJFWNHZHM-UHFFFAOYSA-N 0.000 description 6
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 6
- 229910052799 carbon Inorganic materials 0.000 description 6
- 229910000420 cerium oxide Inorganic materials 0.000 description 6
- 230000002209 hydrophobic effect Effects 0.000 description 6
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- 239000004433 Thermoplastic polyurethane Substances 0.000 description 5
- 238000004891 communication Methods 0.000 description 5
- 239000013078 crystal Substances 0.000 description 5
- 230000007423 decrease Effects 0.000 description 5
- 239000004575 stone Substances 0.000 description 5
- 239000002023 wood Substances 0.000 description 5
- FKTHNVSLHLHISI-UHFFFAOYSA-N 1,2-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC=C1CN=C=O FKTHNVSLHLHISI-UHFFFAOYSA-N 0.000 description 4
- VGHSXKTVMPXHNG-UHFFFAOYSA-N 1,3-diisocyanatobenzene Chemical compound O=C=NC1=CC=CC(N=C=O)=C1 VGHSXKTVMPXHNG-UHFFFAOYSA-N 0.000 description 4
- IKYNWXNXXHWHLL-UHFFFAOYSA-N 1,3-diisocyanatopropane Chemical compound O=C=NCCCN=C=O IKYNWXNXXHWHLL-UHFFFAOYSA-N 0.000 description 4
- ALQLPWJFHRMHIU-UHFFFAOYSA-N 1,4-diisocyanatobenzene Chemical compound O=C=NC1=CC=C(N=C=O)C=C1 ALQLPWJFHRMHIU-UHFFFAOYSA-N 0.000 description 4
- SIZPGZFVROGOIR-UHFFFAOYSA-N 1,4-diisocyanatonaphthalene Chemical compound C1=CC=C2C(N=C=O)=CC=C(N=C=O)C2=C1 SIZPGZFVROGOIR-UHFFFAOYSA-N 0.000 description 4
- DTZHXCBUWSTOPO-UHFFFAOYSA-N 1-isocyanato-4-[(4-isocyanato-3-methylphenyl)methyl]-2-methylbenzene Chemical compound C1=C(N=C=O)C(C)=CC(CC=2C=C(C)C(N=C=O)=CC=2)=C1 DTZHXCBUWSTOPO-UHFFFAOYSA-N 0.000 description 4
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 4
- JCTXKRPTIMZBJT-UHFFFAOYSA-N 2,2,4-trimethylpentane-1,3-diol Chemical compound CC(C)C(O)C(C)(C)CO JCTXKRPTIMZBJT-UHFFFAOYSA-N 0.000 description 4
- PIODVRGFECLUSY-UHFFFAOYSA-N 2,6-diamino-4-[2-(3,5-diamino-4-hydroxyphenyl)propan-2-yl]phenol Chemical compound C=1C(N)=C(O)C(N)=CC=1C(C)(C)C1=CC(N)=C(O)C(N)=C1 PIODVRGFECLUSY-UHFFFAOYSA-N 0.000 description 4
- KIAWNCIDEJNMPR-UHFFFAOYSA-N 2,6-diamino-4-methylphenol Chemical compound CC1=CC(N)=C(O)C(N)=C1 KIAWNCIDEJNMPR-UHFFFAOYSA-N 0.000 description 4
- WGFYAPLOOOHKPS-UHFFFAOYSA-N 2-(butan-2-ylamino)-4-[2-[3-(butan-2-ylamino)-4-hydroxyphenyl]propan-2-yl]phenol Chemical compound C1=C(O)C(NC(C)CC)=CC(C(C)(C)C=2C=C(NC(C)CC)C(O)=CC=2)=C1 WGFYAPLOOOHKPS-UHFFFAOYSA-N 0.000 description 4
- DPYAEAOFIKXXMM-UHFFFAOYSA-N 2-(hexan-2-ylamino)-4-[2-[3-(hexan-2-ylamino)-4-hydroxyphenyl]propan-2-yl]phenol Chemical compound CC(CCCC)NC=1C=C(C=CC=1O)C(C)(C)C1=CC(=C(C=C1)O)NC(CCCC)C DPYAEAOFIKXXMM-UHFFFAOYSA-N 0.000 description 4
- SFRDXVJWXWOTEW-UHFFFAOYSA-N 2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)CO SFRDXVJWXWOTEW-UHFFFAOYSA-N 0.000 description 4
- UHIDYCYNRPVZCK-UHFFFAOYSA-N 2-amino-4-[2-(3-amino-4-hydroxyphenyl)propan-2-yl]phenol Chemical compound C=1C=C(O)C(N)=CC=1C(C)(C)C1=CC=C(O)C(N)=C1 UHIDYCYNRPVZCK-UHFFFAOYSA-N 0.000 description 4
- TXDBDYPHJXUHEO-UHFFFAOYSA-N 2-methyl-4,6-bis(methylsulfanyl)benzene-1,3-diamine Chemical compound CSC1=CC(SC)=C(N)C(C)=C1N TXDBDYPHJXUHEO-UHFFFAOYSA-N 0.000 description 4
- GNBPEYCZELNJMS-UHFFFAOYSA-N 2-methylbutane-1,3-diol Chemical compound CC(O)C(C)CO GNBPEYCZELNJMS-UHFFFAOYSA-N 0.000 description 4
- RNLHGQLZWXBQNY-UHFFFAOYSA-N 3-(aminomethyl)-3,5,5-trimethylcyclohexan-1-amine Chemical compound CC1(C)CC(N)CC(C)(CN)C1 RNLHGQLZWXBQNY-UHFFFAOYSA-N 0.000 description 4
- HJJZIMFAIMUSBW-UHFFFAOYSA-N 3-methylbutane-1,2-diol Chemical compound CC(C)C(O)CO HJJZIMFAIMUSBW-UHFFFAOYSA-N 0.000 description 4
- OGLLAZUAZSIDFE-UHFFFAOYSA-N 3-methylpentane-1,2-diol Chemical compound CCC(C)C(O)CO OGLLAZUAZSIDFE-UHFFFAOYSA-N 0.000 description 4
- RLWWHEFTJSHFRN-UHFFFAOYSA-N 3-methylpentane-2,3-diol Chemical compound CCC(C)(O)C(C)O RLWWHEFTJSHFRN-UHFFFAOYSA-N 0.000 description 4
- RSXKLLMAPPDZJC-UHFFFAOYSA-N 4-[2-[4-hydroxy-3-(propan-2-ylamino)phenyl]propan-2-yl]-2-(propan-2-ylamino)phenol Chemical compound C1=C(O)C(NC(C)C)=CC(C(C)(C)C=2C=C(NC(C)C)C(O)=CC=2)=C1 RSXKLLMAPPDZJC-UHFFFAOYSA-N 0.000 description 4
- 229940086681 4-aminobenzoate Drugs 0.000 description 4
- AOFIWCXMXPVSAZ-UHFFFAOYSA-N 4-methyl-2,6-bis(methylsulfanyl)benzene-1,3-diamine Chemical compound CSC1=CC(C)=C(N)C(SC)=C1N AOFIWCXMXPVSAZ-UHFFFAOYSA-N 0.000 description 4
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 4
- 239000004604 Blowing Agent Substances 0.000 description 4
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 4
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 4
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 4
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 4
- AFCARXCZXQIEQB-UHFFFAOYSA-N N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CCNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 AFCARXCZXQIEQB-UHFFFAOYSA-N 0.000 description 4
- SPTUBPSDCZNVSI-UHFFFAOYSA-N N=C=O.N=C=O.COC1=CC=CC=C1C1=CC=CC=C1OC Chemical compound N=C=O.N=C=O.COC1=CC=CC=C1C1=CC=CC=C1OC SPTUBPSDCZNVSI-UHFFFAOYSA-N 0.000 description 4
- 238000005481 NMR spectroscopy Methods 0.000 description 4
- 239000002202 Polyethylene glycol Substances 0.000 description 4
- UWHCKJMYHZGTIT-UHFFFAOYSA-N Tetraethylene glycol, Natural products OCCOCCOCCOCCO UWHCKJMYHZGTIT-UHFFFAOYSA-N 0.000 description 4
- 238000002441 X-ray diffraction Methods 0.000 description 4
- YIMQCDZDWXUDCA-UHFFFAOYSA-N [4-(hydroxymethyl)cyclohexyl]methanol Chemical compound OCC1CCC(CO)CC1 YIMQCDZDWXUDCA-UHFFFAOYSA-N 0.000 description 4
- 239000012790 adhesive layer Substances 0.000 description 4
- 230000003078 antioxidant effect Effects 0.000 description 4
- 238000000149 argon plasma sintering Methods 0.000 description 4
- 230000001588 bifunctional effect Effects 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 4
- OMWQUXGVXQELIX-UHFFFAOYSA-N bitoscanate Chemical compound S=C=NC1=CC=C(N=C=S)C=C1 OMWQUXGVXQELIX-UHFFFAOYSA-N 0.000 description 4
- BMRWNKZVCUKKSR-UHFFFAOYSA-N butane-1,2-diol Chemical compound CCC(O)CO BMRWNKZVCUKKSR-UHFFFAOYSA-N 0.000 description 4
- OWBTYPJTUOEWEK-UHFFFAOYSA-N butane-2,3-diol Chemical compound CC(O)C(C)O OWBTYPJTUOEWEK-UHFFFAOYSA-N 0.000 description 4
- 229910052791 calcium Inorganic materials 0.000 description 4
- 239000011575 calcium Substances 0.000 description 4
- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical compound OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 description 4
- 238000007796 conventional method Methods 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 4
- 125000004956 cyclohexylene group Chemical group 0.000 description 4
- 150000002009 diols Chemical class 0.000 description 4
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000011049 filling Methods 0.000 description 4
- 239000010419 fine particle Substances 0.000 description 4
- 238000002795 fluorescence method Methods 0.000 description 4
- 239000006261 foam material Substances 0.000 description 4
- 235000011187 glycerol Nutrition 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- QVTWBMUAJHVAIJ-UHFFFAOYSA-N hexane-1,4-diol Chemical compound CCC(O)CCCO QVTWBMUAJHVAIJ-UHFFFAOYSA-N 0.000 description 4
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 4
- OHMBHFSEKCCCBW-UHFFFAOYSA-N hexane-2,5-diol Chemical compound CC(O)CCC(C)O OHMBHFSEKCCCBW-UHFFFAOYSA-N 0.000 description 4
- 239000011261 inert gas Substances 0.000 description 4
- 238000002347 injection Methods 0.000 description 4
- 239000007924 injection Substances 0.000 description 4
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 4
- 238000000399 optical microscopy Methods 0.000 description 4
- WCVRQHFDJLLWFE-UHFFFAOYSA-N pentane-1,2-diol Chemical compound CCCC(O)CO WCVRQHFDJLLWFE-UHFFFAOYSA-N 0.000 description 4
- GLOBUAZSRIOKLN-UHFFFAOYSA-N pentane-1,4-diol Chemical compound CC(O)CCCO GLOBUAZSRIOKLN-UHFFFAOYSA-N 0.000 description 4
- GTCCGKPBSJZVRZ-UHFFFAOYSA-N pentane-2,4-diol Chemical compound CC(O)CC(C)O GTCCGKPBSJZVRZ-UHFFFAOYSA-N 0.000 description 4
- 238000002135 phase contrast microscopy Methods 0.000 description 4
- 238000007517 polishing process Methods 0.000 description 4
- 229920001610 polycaprolactone Polymers 0.000 description 4
- 239000004632 polycaprolactone Substances 0.000 description 4
- 239000004417 polycarbonate Substances 0.000 description 4
- 229920000515 polycarbonate Polymers 0.000 description 4
- 229920005906 polyester polyol Polymers 0.000 description 4
- 229920001223 polyethylene glycol Polymers 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 4
- AOHJOMMDDJHIJH-UHFFFAOYSA-N propylenediamine Chemical compound CC(N)CN AOHJOMMDDJHIJH-UHFFFAOYSA-N 0.000 description 4
- 238000011160 research Methods 0.000 description 4
- 238000004626 scanning electron microscopy Methods 0.000 description 4
- 238000001350 scanning transmission electron microscopy Methods 0.000 description 4
- 239000002356 single layer Substances 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- 238000003756 stirring Methods 0.000 description 4
- 230000003746 surface roughness Effects 0.000 description 4
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 4
- QXJQHYBHAIHNGG-UHFFFAOYSA-N trimethylolethane Chemical compound OCC(C)(CO)CO QXJQHYBHAIHNGG-UHFFFAOYSA-N 0.000 description 4
- 150000004072 triols Chemical class 0.000 description 4
- 238000009827 uniform distribution Methods 0.000 description 4
- 150000003673 urethanes Chemical class 0.000 description 4
- LDXJRKWFNNFDSA-UHFFFAOYSA-N 2-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)-1-[4-[2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidin-5-yl]piperazin-1-yl]ethanone Chemical compound C1CN(CC2=NNN=C21)CC(=O)N3CCN(CC3)C4=CN=C(N=C4)NCC5=CC(=CC=C5)OC(F)(F)F LDXJRKWFNNFDSA-UHFFFAOYSA-N 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 239000003513 alkali Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000005187 foaming Methods 0.000 description 3
- 238000009499 grossing Methods 0.000 description 3
- 239000007800 oxidant agent Substances 0.000 description 3
- 239000002861 polymer material Substances 0.000 description 3
- 229910020203 CeO Inorganic materials 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- 239000003082 abrasive agent Substances 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 229910000019 calcium carbonate Inorganic materials 0.000 description 2
- 239000013530 defoamer Substances 0.000 description 2
- 239000004569 hydrophobicizing agent Substances 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 229910003465 moissanite Inorganic materials 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- OHVLMTFVQDZYHP-UHFFFAOYSA-N 1-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)-2-[4-[2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidin-5-yl]piperazin-1-yl]ethanone Chemical compound N1N=NC=2CN(CCC=21)C(CN1CCN(CC1)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)=O OHVLMTFVQDZYHP-UHFFFAOYSA-N 0.000 description 1
- YLZOPXRUQYQQID-UHFFFAOYSA-N 3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)-1-[4-[2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidin-5-yl]piperazin-1-yl]propan-1-one Chemical compound N1N=NC=2CN(CCC=21)CCC(=O)N1CCN(CC1)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F YLZOPXRUQYQQID-UHFFFAOYSA-N 0.000 description 1
- 239000000306 component Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 238000009304 pastoral farming Methods 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 239000002952 polymeric resin Substances 0.000 description 1
- 238000011069 regeneration method Methods 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 229920002725 thermoplastic elastomer Polymers 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
- B24D3/22—Rubbers synthetic or natural
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
- C08J9/02—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by the reacting monomers or modifying agents during the preparation or modification of macromolecules
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
- C08J9/04—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (17)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020216946 | 2020-12-25 | ||
| JP2020216988 | 2020-12-25 | ||
| JPJP-P-2020-216952 | 2020-12-25 | ||
| JPJP-P-2020-217005 | 2020-12-25 | ||
| JP2020217005 | 2020-12-25 | ||
| JPJP-P-2020-216988 | 2020-12-25 | ||
| JPJP-P-2020-216946 | 2020-12-25 | ||
| JP2020216952 | 2020-12-25 | ||
| JP2021205047A JP2022103096A (ja) | 2020-12-25 | 2021-12-17 | 研磨パッド、その製造方法、及び研磨加工物の製造方法 |
| JPJP-P-2021-205117 | 2021-12-17 | ||
| JPJP-P-2021-205119 | 2021-12-17 | ||
| JPJP-P-2021-205051 | 2021-12-17 | ||
| JP2021205117A JP2022103099A (ja) | 2020-12-25 | 2021-12-17 | 研磨パッド、その製造方法、及び研磨加工物の製造方法 |
| JP2021205051A JP2022103097A (ja) | 2020-12-25 | 2021-12-17 | ラッピングパッド、その製造方法、及びラップ加工物の製造方法 |
| JPJP-P-2021-205047 | 2021-12-17 | ||
| JP2021205119A JP2022103100A (ja) | 2020-12-25 | 2021-12-17 | ラッピングパッド、その製造方法、及びラップ加工物の製造方法 |
| PCT/JP2021/048381 WO2022138958A1 (fr) | 2020-12-25 | 2021-12-24 | Tampon à polir, procédé de fabrication associé, procédé de fabrication d'un article poli, tampon à roder, procédé de fabrication associé et procédé de fabrication d'un article rodé |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20230121042A true KR20230121042A (ko) | 2023-08-17 |
Family
ID=82158278
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020237017705A KR20230121042A (ko) | 2020-12-25 | 2021-12-24 | 연마 패드, 그 제조 방법 및 연마 가공물의 제조 방법, 및 랩핑 패드, 그 제조 방법 및 랩 가공물의 제조 방법 |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR20230121042A (fr) |
| TW (1) | TW202239829A (fr) |
| WO (1) | WO2022138958A1 (fr) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5248861B1 (fr) | 1970-11-27 | 1977-12-13 | ||
| JPS649385B2 (fr) | 1980-08-12 | 1989-02-17 | Akebono Brake Ind | |
| JP4624781B2 (ja) | 2002-05-23 | 2011-02-02 | キャボット マイクロエレクトロニクス コーポレイション | 微小孔性研磨パッド |
| JP2014111296A (ja) | 2012-11-05 | 2014-06-19 | Toyo Tire & Rubber Co Ltd | 研磨パッド及びその製造方法 |
| JP6518680B2 (ja) | 2014-10-31 | 2019-05-22 | 株式会社クラレ | 研磨層用非多孔性成形体，研磨パッド及び研磨方法 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001348271A (ja) * | 2000-06-01 | 2001-12-18 | Tosoh Corp | 研磨用成形体及びこれを用いた研磨用定盤 |
| US7097549B2 (en) * | 2001-12-20 | 2006-08-29 | Ppg Industries Ohio, Inc. | Polishing pad |
| KR100697904B1 (ko) * | 2002-09-25 | 2007-03-20 | 피피지 인더스트리즈 오하이오 인코포레이티드 | 평탄화를 위한 연마 패드 |
| US7311862B2 (en) * | 2002-10-28 | 2007-12-25 | Cabot Microelectronics Corporation | Method for manufacturing microporous CMP materials having controlled pore size |
| JP3754436B2 (ja) * | 2004-02-23 | 2006-03-15 | 東洋ゴム工業株式会社 | 研磨パッドおよびそれを使用する半導体デバイスの製造方法 |
-
2021
- 2021-12-23 TW TW110148403A patent/TW202239829A/zh unknown
- 2021-12-24 KR KR1020237017705A patent/KR20230121042A/ko unknown
- 2021-12-24 WO PCT/JP2021/048381 patent/WO2022138958A1/fr active Application Filing
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5248861B1 (fr) | 1970-11-27 | 1977-12-13 | ||
| JPS649385B2 (fr) | 1980-08-12 | 1989-02-17 | Akebono Brake Ind | |
| JP4624781B2 (ja) | 2002-05-23 | 2011-02-02 | キャボット マイクロエレクトロニクス コーポレイション | 微小孔性研磨パッド |
| JP2014111296A (ja) | 2012-11-05 | 2014-06-19 | Toyo Tire & Rubber Co Ltd | 研磨パッド及びその製造方法 |
| JP6518680B2 (ja) | 2014-10-31 | 2019-05-22 | 株式会社クラレ | 研磨層用非多孔性成形体，研磨パッド及び研磨方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202239829A (zh) | 2022-10-16 |
| WO2022138958A1 (fr) | 2022-06-30 |
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