KR20230113027A - 전기 전도성 접촉핀 - Google Patents
전기 전도성 접촉핀 Download PDFInfo
- Publication number
- KR20230113027A KR20230113027A KR1020220009420A KR20220009420A KR20230113027A KR 20230113027 A KR20230113027 A KR 20230113027A KR 1020220009420 A KR1020220009420 A KR 1020220009420A KR 20220009420 A KR20220009420 A KR 20220009420A KR 20230113027 A KR20230113027 A KR 20230113027A
- Authority
- KR
- South Korea
- Prior art keywords
- elastic
- electrically conductive
- conductive contact
- support
- contact pin
- Prior art date
Links
- 229910052751 metal Inorganic materials 0.000 claims description 53
- 239000002184 metal Substances 0.000 claims description 53
- 238000007689 inspection Methods 0.000 abstract description 28
- 238000000926 separation method Methods 0.000 abstract description 8
- 238000012360 testing method Methods 0.000 description 40
- 238000000034 method Methods 0.000 description 25
- 230000008569 process Effects 0.000 description 23
- 239000010407 anodic oxide Substances 0.000 description 22
- 238000003825 pressing Methods 0.000 description 19
- 229910045601 alloy Inorganic materials 0.000 description 13
- 239000000956 alloy Substances 0.000 description 13
- 230000006870 function Effects 0.000 description 13
- 239000004065 semiconductor Substances 0.000 description 12
- 238000004519 manufacturing process Methods 0.000 description 11
- 239000002245 particle Substances 0.000 description 11
- 239000011148 porous material Substances 0.000 description 11
- 239000010949 copper Substances 0.000 description 10
- 239000000463 material Substances 0.000 description 9
- 229920002120 photoresistant polymer Polymers 0.000 description 9
- 238000009434 installation Methods 0.000 description 8
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 7
- 238000010586 diagram Methods 0.000 description 7
- 238000007747 plating Methods 0.000 description 7
- 230000006835 compression Effects 0.000 description 6
- 238000007906 compression Methods 0.000 description 6
- 238000009713 electroplating Methods 0.000 description 6
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 6
- 239000000523 sample Substances 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 5
- 239000010953 base metal Substances 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010931 gold Substances 0.000 description 5
- 230000003647 oxidation Effects 0.000 description 5
- 238000007254 oxidation reaction Methods 0.000 description 5
- 230000002265 prevention Effects 0.000 description 5
- 230000004888 barrier function Effects 0.000 description 4
- 230000007423 decrease Effects 0.000 description 4
- 230000015654 memory Effects 0.000 description 4
- QXZUUHYBWMWJHK-UHFFFAOYSA-N [Co].[Ni] Chemical compound [Co].[Ni] QXZUUHYBWMWJHK-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000005611 electricity Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 229910052763 palladium Inorganic materials 0.000 description 3
- 238000004904 shortening Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 229910017052 cobalt Inorganic materials 0.000 description 2
- 239000010941 cobalt Substances 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 230000014509 gene expression Effects 0.000 description 2
- 230000002452 interceptive effect Effects 0.000 description 2
- 229910052741 iridium Inorganic materials 0.000 description 2
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 2
- 239000011572 manganese Substances 0.000 description 2
- ZAUUZASCMSWKGX-UHFFFAOYSA-N manganese nickel Chemical compound [Mn].[Ni] ZAUUZASCMSWKGX-UHFFFAOYSA-N 0.000 description 2
- 239000011806 microball Substances 0.000 description 2
- 239000012778 molding material Substances 0.000 description 2
- MOWMLACGTDMJRV-UHFFFAOYSA-N nickel tungsten Chemical compound [Ni].[W] MOWMLACGTDMJRV-UHFFFAOYSA-N 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- OFNHPGDEEMZPFG-UHFFFAOYSA-N phosphanylidynenickel Chemical compound [P].[Ni] OFNHPGDEEMZPFG-UHFFFAOYSA-N 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 229910052703 rhodium Inorganic materials 0.000 description 2
- 239000010948 rhodium Substances 0.000 description 2
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 101000822695 Clostridium perfringens (strain 13 / Type A) Small, acid-soluble spore protein C1 Proteins 0.000 description 1
- 101000655262 Clostridium perfringens (strain 13 / Type A) Small, acid-soluble spore protein C2 Proteins 0.000 description 1
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- 101000655256 Paraclostridium bifermentans Small, acid-soluble spore protein alpha Proteins 0.000 description 1
- 101000655264 Paraclostridium bifermentans Small, acid-soluble spore protein beta Proteins 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- SVMHVVMANJMZLD-UHFFFAOYSA-N [Co].[Ni].[Ni] Chemical compound [Co].[Ni].[Ni] SVMHVVMANJMZLD-UHFFFAOYSA-N 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 239000011805 ball Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 210000000988 bone and bone Anatomy 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 229910052735 hafnium Inorganic materials 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06705—Apparatus for holding or moving single probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06755—Material aspects
- G01R1/06761—Material aspects related to layers
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Geometry (AREA)
- Measuring Leads Or Probes (AREA)
- Push-Button Switches (AREA)
- Contacts (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020220009420A KR102708633B1 (ko) | 2022-01-21 | 2022-01-21 | 전기 전도성 접촉핀 |
PCT/KR2023/000965 WO2023140655A1 (fr) | 2022-01-21 | 2023-01-19 | Broche de contact électriquement conductrice |
TW112102531A TW202342992A (zh) | 2022-01-21 | 2023-01-19 | 導電接觸針 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020220009420A KR102708633B1 (ko) | 2022-01-21 | 2022-01-21 | 전기 전도성 접촉핀 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20230113027A true KR20230113027A (ko) | 2023-07-28 |
KR102708633B1 KR102708633B1 (ko) | 2024-09-24 |
Family
ID=87348492
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020220009420A KR102708633B1 (ko) | 2022-01-21 | 2022-01-21 | 전기 전도성 접촉핀 |
Country Status (3)
Country | Link |
---|---|
KR (1) | KR102708633B1 (fr) |
TW (1) | TW202342992A (fr) |
WO (1) | WO2023140655A1 (fr) |
Citations (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003185675A (ja) * | 2001-12-20 | 2003-07-03 | Mekano Electronic Kk | 電気信号抽出方法及び装置 |
JP2006084212A (ja) * | 2004-09-14 | 2006-03-30 | Unitechno Inc | 両端変位型コンタクトプローブ |
KR100659944B1 (ko) | 2005-12-23 | 2006-12-21 | 리노공업주식회사 | 플런저 및 이를 장착한 검사용 탐침장치 |
KR100952712B1 (ko) | 2007-12-27 | 2010-04-13 | 주식회사 아이에스시테크놀러지 | 판형 도전입자를 포함한 실리콘 콘택터 |
KR20100047995A (ko) * | 2008-10-30 | 2010-05-11 | 주식회사 휴먼라이트 | 프로브핀 |
US20110318959A1 (en) * | 2008-12-22 | 2011-12-29 | Molex Incorporated | Coaxial Connector |
US20120299612A1 (en) * | 2011-05-27 | 2012-11-29 | Yi-Lung Lee | Elastic micro high frequency probe |
JP2013134181A (ja) * | 2011-12-27 | 2013-07-08 | Enplas Corp | コンタクトプローブおよびその製造方法 |
KR20160045510A (ko) * | 2014-10-17 | 2016-04-27 | 주식회사 아이에스시 | 전기접속용 커넥터 |
US20160161528A1 (en) * | 2010-04-21 | 2016-06-09 | Johnstech International Corporation | Wafer Level Integrated Circuit Contactor and Method of Construction |
US20170346211A1 (en) * | 2012-12-04 | 2017-11-30 | Japan Electronic Materials Corporation | Contact Probe |
KR20190141116A (ko) * | 2018-01-11 | 2019-12-23 | 오므론 가부시키가이샤 | 프로브 핀, 검사 지그, 검사 유닛 및 검사 장치 |
KR102132232B1 (ko) * | 2019-05-10 | 2020-07-10 | (주)루켄테크놀러지스 | 프로브 핀, 이의 제조 방법 및 이를 포함하는 반도체 검사 장치 |
KR20200110681A (ko) * | 2018-01-17 | 2020-09-24 | 테크노프로브 에스.피.에이. | 캔틸레버 콘택 프로브 및 대응 프로브 헤드 |
KR102191759B1 (ko) * | 2019-12-17 | 2020-12-16 | 주식회사 세인블루텍 | 프로브 핀 및 이를 이용한 검사용 소켓 |
US20210140997A1 (en) * | 2017-05-30 | 2021-05-13 | Dong Weon Hwang | Contact and test socket device for testing semiconductor device |
KR20230067769A (ko) * | 2021-11-08 | 2023-05-17 | 주식회사 에이엠에스티 | 테스트 소켓 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009288156A (ja) * | 2008-05-30 | 2009-12-10 | Unitechno Inc | 検査用ソケット |
JP6740630B2 (ja) * | 2016-02-15 | 2020-08-19 | オムロン株式会社 | プローブピンおよびこれを用いた検査装置 |
KR102080832B1 (ko) * | 2019-10-02 | 2020-02-24 | 황동원 | 스프링 콘택트 및 스프링 콘택트 내장형 테스트 소켓 |
KR102228318B1 (ko) * | 2019-12-26 | 2021-03-16 | 주식회사 오킨스전자 | 아우터 스프링을 포함하는 프로브 핀 |
-
2022
- 2022-01-21 KR KR1020220009420A patent/KR102708633B1/ko active IP Right Grant
-
2023
- 2023-01-19 WO PCT/KR2023/000965 patent/WO2023140655A1/fr unknown
- 2023-01-19 TW TW112102531A patent/TW202342992A/zh unknown
Patent Citations (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003185675A (ja) * | 2001-12-20 | 2003-07-03 | Mekano Electronic Kk | 電気信号抽出方法及び装置 |
JP2006084212A (ja) * | 2004-09-14 | 2006-03-30 | Unitechno Inc | 両端変位型コンタクトプローブ |
KR100659944B1 (ko) | 2005-12-23 | 2006-12-21 | 리노공업주식회사 | 플런저 및 이를 장착한 검사용 탐침장치 |
KR100952712B1 (ko) | 2007-12-27 | 2010-04-13 | 주식회사 아이에스시테크놀러지 | 판형 도전입자를 포함한 실리콘 콘택터 |
KR20100047995A (ko) * | 2008-10-30 | 2010-05-11 | 주식회사 휴먼라이트 | 프로브핀 |
US20110318959A1 (en) * | 2008-12-22 | 2011-12-29 | Molex Incorporated | Coaxial Connector |
US20160161528A1 (en) * | 2010-04-21 | 2016-06-09 | Johnstech International Corporation | Wafer Level Integrated Circuit Contactor and Method of Construction |
US20120299612A1 (en) * | 2011-05-27 | 2012-11-29 | Yi-Lung Lee | Elastic micro high frequency probe |
JP2013134181A (ja) * | 2011-12-27 | 2013-07-08 | Enplas Corp | コンタクトプローブおよびその製造方法 |
US20170346211A1 (en) * | 2012-12-04 | 2017-11-30 | Japan Electronic Materials Corporation | Contact Probe |
KR20160045510A (ko) * | 2014-10-17 | 2016-04-27 | 주식회사 아이에스시 | 전기접속용 커넥터 |
US20210140997A1 (en) * | 2017-05-30 | 2021-05-13 | Dong Weon Hwang | Contact and test socket device for testing semiconductor device |
US20210148950A1 (en) * | 2017-05-30 | 2021-05-20 | Dong Weon Hwang | Contact and test socket device for testing semiconductor device |
KR20190141116A (ko) * | 2018-01-11 | 2019-12-23 | 오므론 가부시키가이샤 | 프로브 핀, 검사 지그, 검사 유닛 및 검사 장치 |
KR20200110681A (ko) * | 2018-01-17 | 2020-09-24 | 테크노프로브 에스.피.에이. | 캔틸레버 콘택 프로브 및 대응 프로브 헤드 |
KR102132232B1 (ko) * | 2019-05-10 | 2020-07-10 | (주)루켄테크놀러지스 | 프로브 핀, 이의 제조 방법 및 이를 포함하는 반도체 검사 장치 |
KR102191759B1 (ko) * | 2019-12-17 | 2020-12-16 | 주식회사 세인블루텍 | 프로브 핀 및 이를 이용한 검사용 소켓 |
KR20230067769A (ko) * | 2021-11-08 | 2023-05-17 | 주식회사 에이엠에스티 | 테스트 소켓 |
Also Published As
Publication number | Publication date |
---|---|
TW202342992A (zh) | 2023-11-01 |
WO2023140655A1 (fr) | 2023-07-27 |
KR102708633B1 (ko) | 2024-09-24 |
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