KR20230089429A - Detection device with colimation unit - Google Patents

Abstract

The present invention is an inspection device for a substrate, and may include a probe unit for inspecting the energization state of the substrate and a collimation unit for inspecting a reference value for inspection, and the collimation unit is a virtual vertical line along with the probe unit. It penetrates and may be provided parallel to each other.

Description

Inspection device with collimation unit {Detection device with collimation unit}

The present invention relates to an inspection apparatus for inspecting the collimation of a substrate.

The board (Bare Board) before the circuit is printed must complete the energization test after completing the manufacturing process, and all electrical signals through this may be shipped without abnormalities. It may be important to determine whether a board has a specific resistance, whether it is normal, short, or open through a conduction test, and classify a normal board 200 and a faulty board through this.

In addition, in addition to correcting the error caused by the continuity test itself, the initial reference value (R) itself for the energization test may change depending on the facility environment, and the fine fluctuations in this reference value (R) itself can be adjusted through periodic collimation inspection. thing can be important.

The present invention is a device for inspecting the fluctuation of a reference value corresponding to the initial setting for various inspections such as alignment inspection, energization inspection, and puncture inspection of a board, by performing a collimation inspection for periodic reference value correction to obtain a high-quality board. It is to provide an inspection device for production.

The present invention is an inspection device for a substrate, and may include a probe unit for inspecting the energization state of the substrate and a collimation unit for inspecting a reference value for inspection, and the collimation unit is a virtual vertical line along with the probe unit. It penetrates and may be provided parallel to each other.

The probe unit may include an inspection unit in which a probe is provided and an inspection table on which a substrate is seated, and a collimation unit may be positioned between the inspection unit and the inspection table.

The collimation unit is located between the inspection unit and the inspection table, and may include a first camera at an upper part of the collimation unit and a second camera at a lower part of the collimation unit, the first camera photographs a probe of the probe unit, The second camera may photograph the circuit pattern of the substrate. The first camera of the collimation unit photographs the probe of the probe unit, the second camera photographs the circuit pattern of the substrate, and the controller captures the photographic image by the first camera based on the alignment mark of the substrate. An error may be corrected by comparing the first screen and the second screen photographed by the second camera with a target reference value.

When the collimation test is in progress, the collimation unit may enter a position between the inspection unit and the inspection table, and when the collimation inspection is completed, the collimation unit is positioned between the inspection unit and the inspection table. can retreat from

When an alignment unit inspecting the alignment state of the substrate is provided, the process position of the alignment unit is referred to as a first position, and the process positions of the collimation unit and the probe unit are referred to as a second position, the collimation inspection is performed as the first position. It may proceed while moving from the first position to the second position.

The control unit adjusts the x-direction, the y-direction, and the θ angle of the examination table, the x-direction and the y-direction are two axes forming a plane on which the substrate is placed, and the θ angle is perpendicular to the plane formed by the x-direction and the y-direction It can indicate the degree of rotation with respect to the direction.

A plurality of circuit patterns may be provided on the substrate, and the control unit compares the probe of the probe unit and the circuit pattern with a target reference value. You can select the regions to compare in the order of .

The inspection unit may include a first inspection unit located above the substrate and a second inspection unit located below the substrate, and a first collimation unit between the first inspection unit and the substrate, the second inspection unit and the substrate. A second collimation unit may be provided between them.

The collimation unit correcting the error of the initial setting reference value may be located at the process position of the probe unit in the inspection process, and structurally, the probe unit and the collimation unit may form a parallel plane spaced apart from each other on a virtual vertical line. That is, the probe unit may include a first inspection unit and a second inspection unit above and below the substrate, and an inspection table on which the substrate can be seated, and the collimation unit may be located between each inspection unit and the inspection table, so that the upper first camera may photograph the probe, and the lower second camera may photograph the substrate or circuit pattern.

The controller may correct an error by comparing the first screen captured through the first camera and the second screen captured through the second camera with a target reference value. This is done by a person manually placing a pad on a substrate to perform an electrical power test, etc., and then visually identifying and collimating the dent in the pad and the target reference value using a microscope-level camera, or The process speed can be significantly increased compared to the manual collimation method in which the dents are inspected and collimated using a collimation camera along with the board. In addition, compared to manual collimation performed after temporarily stopping the main board inspection process such as alignment inspection and power inspection, the automatic collimation as described above does not stop the main inspection process, and the collimation unit periodically in the middle can be inserted into the probe unit and arranged vertically and parallel to each other. Therefore, according to the characteristics of the operator's working environment, the collimation inspection can be arranged between the main inspection process or as part of the main inspection process, and as a result, the entire process can be flexibly arranged.

1 is an explanatory diagram illustrating an alignment unit and a probe unit of an inspection device according to the present invention.
2 is an explanatory view explaining the position between the collimation unit and the probe unit of the inspection apparatus of the present invention.
3 is an explanatory diagram explaining the position of the probe and the position of the circuit pattern in the collimation unit of the present invention.
FIG. 4 is an explanatory diagram explaining that the probe position and the position of the circuit pattern are corrected with a target reference value by the collimation unit of the present invention.

The inspection apparatus of the present invention includes an alignment unit 170 for aligning the substrate 200, a probe unit 190 for inspecting the energized state of the substrate 200, and collimation of the substrate 200 and the probe 193. A collimation unit 400 for inspecting the state may be included.

The board 200 (Bare Board) before the circuit is printed can be subjected to a continuity test to check whether or not it has been normally manufactured after the manufacturing process is completed. can be inspected.

The probe unit 190 may include a first inspection unit 192 and a second inspection unit 194 above and below the substrate 200 and an inspection table 196 on which the substrate may be placed. The collimation unit 400 may be located between each of the inspection units 192 and 194 and the inspection table 196, the first upper camera may take a picture of the probe 193, and the second lower camera may capture the substrate 200 or circuit The pattern 210 may be photographed, and the probe 193 by the first camera may be shown as P in the drawing, and the substrate 200 or the circuit pattern 210 by the second camera may be shown as C. In addition, a reference value serving as a criterion by which a good quality normal substrate 200 can be produced may be referred to as a target reference value R. Therefore, in the case of the collimation test, the substrate 200 can be moved from the alignment unit 170 to the probe unit 190, and after the collimation test is completed, the collimation unit 400 can be retracted, and the probe unit 400 can be retracted. The unit 190 may perform an energization test.

Since the first inspection unit 192 and the second inspection unit 194 operate in the same way, the drawing may simply describe the collimation unit 400 provided in the first inspection unit 192 . The collimation inspection method of the first inspection unit 192 described below may be used for the collimation inspection of the second inspection unit as it is.

That is, the inspection unit may include a first inspection unit 192 located above the substrate 200 and a second inspection unit 194 located below the substrate, and between the first inspection unit 192 and the substrate A first collimation unit and a second collimation unit may be provided between the second inspection unit and the substrate. In this case, the screen of the first collimation unit photographing the probe of the first inspection unit is the first screen, and the screen of the first collimation unit photographing the circuit pattern of the board is the second screen, the second collimation. A screen in which the probe of the second inspection unit is photographed by the camera of the unit may be referred to as a third screen, and a screen in which the camera of the second collimation unit photographs the substrate may be referred to as a fourth screen.

The control unit may set a target reference value (R) for normal board production based on the alignment mark 230 of the board, and the probe position (P) of the first screen by the first camera and the second screen by the second camera By comparing the position (C) of the circuit pattern 210 on the screen with the target reference value (R), the controller can adjust the probe position (P) or the position (C) of the circuit pattern to the target reference value (R). In this case, the controller may move or rotate the inspection table 196 of the probe unit 190 to adjust the position of the substrate. That is, in the collimation unit 400, the first screen and the second screen can be compared with the screen on which the target reference value R is displayed, and the controller can correct the error between each screen and the target reference value R.

Before at least one of the alignment test, the energization test, and the stamping test is performed, a collimation test corresponding to zero point control may be performed first to correct the reference value. Therefore, during alignment inspection, energization inspection, or puncture inspection, the collimation unit 400 may retreat and not be positioned between the inspection units 192 and 194 and the inspection table 196, and the error of the reference value before each inspection may be checked. During the collimation inspection to correct, the collimation unit 400 may enter and be positioned between the inspection units 192 and 194 and the inspection table 196 .

Alignment inspection, energization inspection, or puncture inspection can determine whether it is normal or defective through comparison with a reference value. That is, before the user puts the board 200 in the inspection device and operates it, a reference value initially set as a standard may be set, and the alignment unit 170 determines that the board 200 is distorted more than the reference value, and the probe The unit may perform a power-on test after correcting the distortion of the alignment unit 170 calculated by the control unit.

Therefore, since the determination of whether each inspection is normal or defective is made through comparison with the initially set standard value, if an error occurs in the standard value itself, it is a comparison judgment based on the wrong standard, and the entire product in the process must be discarded. can

Inspecting whether the initial reference value is properly set may be referred to as a collimation inspection. That is, the collimation test may be synonymous with nodal control or calibration. Theoretically, the reference value of this initial setting can be performed without any change in the process, but in practice, the reference value may eventually differ from the initial value due to repeated processes in which minute changes such as vibration of equipment are accumulated. Therefore, the substrate 200 with a lower defect rate can be produced by performing a collimation test, which is a correction of the reference value itself, in addition to comparing the test result with the reference value in the process.

The probe 193 of the first inspection unit 192 ascends and descends to contact the substrate 200, and for accurate energization inspection, the probe 193 must contact the exact measurement position of the substrate 200 to be measured. To do this, after the alignment unit 170 inspects the distortion of the substrate 200, the distortion is corrected, and then the first inspection unit 192 conducts a continuity test.

After the energization test, dents may occur due to the energization test itself. During the power test, the probe 193 of the first inspection unit 192 ascends and descends and may contact the target point. When the probe 193 and the substrate 200 come into contact, the impact of the substrate 200 may be alleviated by adjusting the elevation speed of the probe 193 slowly only in the vicinity.

The controller may calculate a positional error of the substrate 200 of the alignment unit 170 through a camera located in the alignment unit 170 . The positional error of the substrate 200 stored in the control unit can be corrected by moving or rotating the inspection table 196 on which the substrate 200 can be seated in the first inspection unit 192 in the opposite direction, and the control unit includes an alignment unit ( After moving the substrate 200 to a position and angle that corrects the positional error of the substrate 200 calculated in 170), the probe 193 of the first inspection unit 192 can contact the exact measurement point of the substrate 200. It is possible to control the inspection table 196, and when performing the stamping test using the control unit, the controller compares the stamping of the substrate 200 by the probe 193 with a reference value, and the stamping of the image taken by the camera is confirmed. If it is more than the standard value, it can be judged as a bad impression.

The jig provided with the substrate 200 and the plurality of probes 193 can be specified by adjusting three values of x, y, and θ. That is, the collimation state can be corrected by adjusting the three degrees of freedom. An object in space can have a total of six degrees of freedom, including three degrees of freedom along the x, y, and z axes and three rotational degrees of freedom along each axis. The first inspection unit 192 can contact the substrate 200 by lifting the probe 193 to conduct an electrical current test, and maintain the z-direction parallel to the jig provided with the plurality of probes 193 and the substrate 200. When the jig moves up and down while being moved, the reference value can be specified if only the degrees of freedom of the x and y axes and the degree of freedom of rotation about the z axis θ are specified. In addition, since the relative positions of the substrate 200 and the probe 193 can fix one and give all degrees of freedom to the other, collimation can be performed by correcting the degree of freedom of the substrate 200 having a relatively small weight. . Accordingly, the collimation problem of the inspection device may be a problem of correcting distortion of the substrate 200 in the x-direction, the y-direction, and the θ angle.

The first inspection unit 192 where the continuity test is performed may include a probe 193 that probes the substrate 200 and a base plate 195 on which the probe 193 is supported. The probe 193 may come into contact with the substrate 200 while moving up and down, and the contact strength and the lifting speed of the probe 193 may be controlled by the control unit. The first inspection unit 192 and the second inspection unit 194 may be positioned above and below the inspection table 196 in a vertical direction, and may come into contact with the upper and lower sides of the substrate 200, respectively.

The alignment unit 170 may compare the alignment state of the substrate 200 with a reference value using a camera or the like, and the control unit adjusts the base plate 195 as much as the difference from the reference value measured by the alignment unit 170 to make a difference. can correct it. Such correction may be performed in the alignment unit 170 itself, depending on the equipment, or in a shuttle unit capable of moving the substrate 200 between units, and based on the information received from the alignment unit 170, correction may be performed. 1 After the base plate 195 of the inspection unit 192 is moved and corrected, the energization test can be performed. The base plate 195 can move in the x-direction and the y-direction, and can be rotated by θ, which is a rotation angle with respect to the z-direction.

The distance between elements in the circuit to be inspected and the thickness of the probe 193 may be on the order of several microns. Therefore, the camera of the collimation unit 400 should be able to discriminate between micron-level points.

The stamping unit may be provided at a position adjacent to the alignment unit 170 . During the essential energization test to determine the defective board 200, the test is performed with a probe 193 having a pointed end through the probe 193, etc., and as a result, the board 200 is punctured due to the energization test itself. this can happen If the circuit is mounted on the board 200 by neglecting these nicks and operating the facility for several hours or days, the problem of discarding the circuit itself, which is several times more expensive than the board 200, may occur, so the user must avoid the nicking. You may need to manage it periodically, such as on an hourly basis.

There is also an error due to the energization test itself in terms of structure, but defects may occur due to abrasion or bending in the probe 193 itself, and foreign substances may be caught in the probe 193 to cause defects. Therefore, defects due to puncture may include defects due to defects in the probe 193 itself or foreign substances in addition to peripheral factors that change a predetermined inspection distance between the probe 193 and the substrate 200 . That is, since the factors of dents are diverse, the exact form of dents is recognized using a camera capable of discriminating several microns at the level of a microscope, and the cause of dents identified by the dent unit is quickly found by classifying dents by cause. can cope The amount of stamping of the board 200 by the probe 193 provided in the first inspection unit 192 may be captured by the camera of the stamping unit.

Since a defective rate may occur in the substrate 200 due to the essential energization test itself for determining the defective rate of the substrate 200, this also needs to be regarded as one of the defective rates and classified through inspection. That is, during a series of processes in which the substrate 200 is loaded, inspected, and unloaded again, the first inspection unit 192 that inspects energization of the substrate 200 may be the previous step of the nick unit that inspects nicks caused by energization. there is.

The puncture test may be to check dents by an energization test. Since it takes too long to check all circuit connections during the power test, the user sets the position of the board 200, which is more dense and complicated according to the pattern of the specific board 200, where defects are likely to occur. , and selective testing can be performed. In this case, by dividing sections by time and setting different positions according to each section, data on which section has a high defect rate can be collected and used for analysis. Therefore, since the energization test can be performed only at the sampling position set by the user in each section, the puncture unit can quickly perform the puncture test by referring to the positional data of the energization test rather than inspecting the entire circuit.

When the stamping test is performed using the control unit, the control unit compares the stamping of the substrate 200 by the probe 193 with a reference value, and determines that the photographing is defective when the photographing of the image taken by the camera is equal to or greater than the reference value.

The thickness of the probe 193 and the distance of the elements in the circuit to be inspected by the stamping unit may be on the order of several microns.

During the conduction inspection process, only one substrate 200 is inspected, and rather than sequentially, a plurality of substrates 200 may be arranged as one plate. A plate on which a plurality of substrates 200 are arranged may be referred to as a lot, and an individual substrate 200 or circuit may be referred to as a step. That is, the lot may be referred to as a substrate 200, and each step may be referred to as a circuit pattern. The substrate 200 may be provided with a plurality of circuit patterns and alignment marks 230 formed for each circuit pattern. Each circuit pattern may be a unit mounted on a product. For example, six circuit patterns are shown, and each circuit pattern may form a substrate 200 of a mobile communication terminal. That is, the board 200 may be separated into six circuit patterns and installed in each mobile communication terminal in a post-process performed downstream of the inspection device. In this way, when a plurality of circuit patterns are included in one substrate 200 , alignment marks 230 may be formed for each circuit pattern to promote convenience in subsequent processes.

The alignment unit 170 or the collimation unit 400 may check the alignment or collimation state of each circuit pattern using each alignment mark 230 provided for each circuit pattern. That is, the alignment unit 170 can check the alignment state of all alignment marks 230 regardless of the inspection unit of the probe unit 190 .

When the probe unit 190 uses one circuit pattern as an inspection unit, there may be an alignment error in each circuit pattern. At this time, when the probe unit 190 inspects one circuit pattern and moves away from the substrate 200 in the z-axis direction, the shuttle unit capable of moving the substrate 200 probes the next circuit pattern to be inspected. (190) can be matched or aligned. This appearance is similarly made even when the number of inspection units is smaller than the number of circuit patterns included in the board 200 . When the inspection unit is 6 circuit patterns with respect to the board 200, the shuttle unit may perform position correction on the alignment mark 230 representing the alignment state of the area including the 6 circuit patterns. For example, when the six circuit patterns below are inspection units, the shuttle unit uses the check result of the alignment unit 170 to use the second alignment mark 230 from the bottom to the top on the left and the first mark on the right to the substrate ( 200) can be sorted.

In summary, the alignment unit 170 can check the alignment of all circuit patterns regardless of the inspection unit of the probe unit 190 . Through this, the inspection unit of the probe unit 190 can be set in various ways. The inspection unit may be determined by the probe of the probe unit 190, and the probe is determined during initial setting. Accordingly, according to the present embodiment, inspection units may be changed upon initial setting, and the substrate 200 may be aligned with respect to various inspection units.

Therefore, an alignment test or a puncture test, which is one step of a series of typical energization tests, can be corrected through comparison with an initially set reference value, and a collimation test is a reference value that is a standard for the alignment test or dent test. may be corrected for Through the two-step correction of the correction of the reference value, which is the initial setting that becomes the standard, and the correction through comparison with this reference value during the energization inspection process, the error or error-producing substrate 200 is reduced, and as a result, the process yield can be greatly increased. there is.

Looking at the collimation process, coordinates may be assigned to the substrate 200 and each circuit pattern based on the alignment mark 230 . One point of a specific circuit pattern may be expressed as (x, y), which may indicate a position of each substrate 200 when the substrate 200 is viewed from the top like a plan view. The x-axis direction may be a direction of the inspection process, and the y-axis direction may be one direction of a plane perpendicular to and parallel to the x-axis direction. For example, one point of a specific circuit pattern may be set to (10, 20), and the results of the collimation check for this may be (7, 18) and (7, 16). That is, (10,20) may be the target reference value, (7,18) may be the first screen measured by the first camera of the first inspection unit 192, and (7,16) may be the second inspection unit. It may be the second screen measured by the second camera of (194).

In addition, the inspection unit can be performed for each stage, that is, for each circuit pattern, and errors may occur for each circuit pattern. The difference may be a case where there is no difference in θ and a difference occurs in the x-axis and the y-axis. In this case, the position (P) of the probe on the first screen may be a difference by -3 in the x-axis direction and -2 in the y-axis direction, and the circuit pattern (C) on the second screen is -3 in the x-axis direction. 3, a difference of -4 in the y-axis direction may have occurred.

Therefore, for example, since the initially set reference value is moved by -3 in the x-axis and -2 in the y-axis direction, the position (P) of the probe is set by +3 in the x-axis direction and +3 in the y-axis direction. By moving it by +2, the reference value can be corrected. In addition, since the initially set reference value in the circuit pattern (C) is moved by -3 in the x-axis and -4 in the y-axis direction, the reference value is moved by +3 in the x-axis and +4 in the y-axis direction. It can be calibrated to the target reference value. In the same way, when the rotation for the value initially set by θ corresponding to the rotation in the z-axis direction occurs, the reference value can be corrected by rotating in the opposite direction similar to the movement in the x-axis and y-axis directions.

That is, the control unit can adjust the error of points P and C to be R by comparing the target reference value (R), the position (P) of the probe on the first screen, and the position of the circuit pattern (C) on the second screen. there is.

Summarizing the entire collimation test, the purpose of collimation is to correct the reference value of the test device, and for this purpose, accurate correction can be achieved by measuring and correcting three degrees of freedom of x, y, and θ.

Basically, the method of collimation can align the substrate 200 by identifying two points of the substrate 200, and since the contraction and expansion can be different locally, misalignment may occur only by aligning the entire substrate 200. can This distortion may be caused by an error of the entire substrate 200 or an error of the circuit pattern.

When a user installs a product for the first time in a factory, initial setting for a reference value may be required, and since this is a level of several microns, it can be precisely performed by recognizing coordinates using a microscope-level camera. This initial reference value setting can be called collimation, and in theory, one initial reference value setting should be sufficient. This may lead to defects of the substrate 200 to be shipped. Therefore, when the periodic collimation test is not performed, the entire amount of the substrate 200 may be discarded even though the reference value is continuously corrected during the test such as the energization test. Therefore, the user may need to perform a periodic collimation test.

The board 200 can inspect the distortion of the board 200 by holding the alignment mark 230 as a reference point, and can usually be checked by holding two diagonal points of the board 200 . For the accuracy of the inspection, three or more points can be captured and performed. However, in addition to the performance of the process, the process speed is also an important factor in production, so the user can determine the complexity and situation of the board 200 whether based on two points or more than three points. can be taken into consideration. Therefore, conversely, in a process requiring faster process speed than precision in a specific process, an inspection that compares only one point with the reference value may be performed.

The inspection by the inspection device of the present invention may include a collimation inspection and a process inspection, the collimation inspection may be for setting a reference value performed before the process inspection, and the process inspection may include an alignment inspection, a energization inspection, and a puncture inspection. can include The alignment unit 170 may perform an alignment test, the probe unit 190 may perform a energization test, and the stamping unit may perform a stamping test. The collimation unit 400 may be provided as a separate unit from the alignment unit 170 or the stamping unit, and may be particularly located between each inspection unit of the probe unit 190 and the inspection table 196 .

In other words, the controller may correct an error by comparing the first screen captured through the first camera and the second screen captured through the second camera with the target reference value R. This is done by a person manually placing a pad on a substrate to perform an electrical power test, etc., and then visually identifying and collimating the dent in the pad and the target reference value using a microscope-level camera, or The process speed can be significantly increased compared to the manual collimation method in which the dents are inspected and collimated using a collimation camera along with the board. In addition, compared to manual collimation performed after temporarily stopping the main board inspection process such as alignment inspection and power inspection, the automatic collimation as described above does not stop the main inspection process, and the collimation unit periodically in the middle can be arranged vertically and parallel to each other by inserting them into the probe unit. Therefore, according to the characteristics of the operator's working environment, the collimation inspection can be arranged between the main inspection process or as part of the main inspection process, and as a result, the entire process can be flexibly arranged.

During the collimation process, for example, a camera may be moved to confirm distortion of the substrate 200 or a circuit pattern through a field of view (FOV), and an error in the reference value may be corrected through a mouse click or numerical input.

The reference value may be changed by various factors such as human, material, and environmental factors, which may cause differences for each lot and each circuit pattern. In addition, since the daily production quantity may vary according to the user's purpose, the collimation inspection cycle can be adjusted according to the quantity.

For collimation, inspection may be performed after aligning the substrate 200 collectively, and inspection after aligning circuit patterns individually may be repeatedly performed. This may vary depending on the precision requirements of the particular process. In cases where production speed is more important than precision, multiple lots can be aligned and inspected at once.

The substrate 200 on which a plurality of circuit patterns are arranged has a plurality of probe positions (P) and circuit pattern positions (C), so according to the target process speed or precision, the probe position (P) for collimation inspection ) and the circuit pattern position (C) can be selectively made. That is, a relatively dense area may exist depending on the type of circuit pattern, and when selecting the position (P) of the probe and the position (C) of the circuit pattern, the collimation test can be performed mainly on a relatively smaller or denser area. .

170 ... alignment unit 190 ... probe unit
192... first inspection unit 193... probe
194 ... second inspection unit 195 ... base plate
196... Examination table
200... substrate 210... circuit pattern
230... Align Mark 400... Collimation Unit
R... target reference value (R) P... probe shooting position
C... circuit pattern shooting position

Claims (9)

a probe unit for inspecting the energization state of the board;
a collimation unit inspecting a reference value for the inspection;
including,
The collimation unit penetrates a virtual vertical line together with the probe unit and is provided parallel to each other.
According to claim 1,
The probe unit includes an inspection unit on which a probe is provided and an inspection table on which a substrate is seated;
The collimation unit is positioned between the inspection unit and the inspection table.
According to claim 1,
The probe unit includes an inspection unit on which a probe is provided and an inspection table on which a substrate is seated;
The collimation unit is located between the inspection unit and the inspection table,
A first camera is provided on the upper part of the collimation unit and a second camera is provided on the lower part,
The first camera photographs the probe of the probe unit, and the second camera photographs the circuit pattern of the substrate.
According to claim 1,
A first camera of the collimation unit photographs a probe of the probe unit, and a second camera photographs a circuit pattern of the substrate;
The control unit corrects an error by comparing a first screen photographed by the first camera and a second screen photographed by the second camera with a target reference value based on the alignment mark of the substrate.
According to claim 1,
The probe unit includes an inspection unit on which a probe is provided and an inspection table on which a substrate is seated;
The collimation unit is located between the inspection unit and the inspection table,
When the collimation inspection is in progress, the collimation unit enters a position between the inspection unit and the inspection table,
When the collimation test is completed, the collimation unit retreats from a position between the test unit and the test table.
According to claim 1,
An alignment unit for inspecting the alignment of the substrate is provided,
When the process position of the alignment unit is the first position and the process position of the probe unit is the second position,
The collimation test by the collimation unit is performed at the first position or the second position.
According to claim 1,
The probe unit is provided with an inspection table on which the substrate is seated,
The control unit adjusts the x direction, y direction, and θ angle of the examination table,
The x-direction and the y-direction are two axes forming a plane on which the substrate is placed, and the θ angle indicates a degree of rotation with respect to a direction perpendicular to the plane formed by the x-direction and the y-direction.
According to claim 1,
A plurality of circuit patterns are provided on the substrate,
In order to compare the probe of the probe unit and the circuit pattern with a target reference value, the control unit selects regions to be compared in order from regions with a high density of circuit patterns to regions with a low density as a process accuracy requirement increases.
According to claim 1,
In the inspection unit,
A first inspection unit positioned above the substrate and a second inspection unit located below the substrate are provided;
A first collimation unit is provided between the first inspection unit and the substrate, and a second collimation unit is provided between the second inspection unit and the substrate,
The first screen captures the probe of the first inspection unit by the camera of the first collimation unit, and the second screen captures the circuit pattern of the circuit board by the camera of the first collimation unit. The third screen is a screen shot of the probe of the second inspection unit by the camera of the migration unit, and the fourth screen is a screen shot of the substrate by the camera of the second collimation unit.
The control unit compares at least one of the first to fourth screens with a target reference value to correct an error.

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