KR20230050057A - 전기 전도성 접촉핀 및 이를 구비하는 검사장치 - Google Patents
전기 전도성 접촉핀 및 이를 구비하는 검사장치 Download PDFInfo
- Publication number
- KR20230050057A KR20230050057A KR1020210133306A KR20210133306A KR20230050057A KR 20230050057 A KR20230050057 A KR 20230050057A KR 1020210133306 A KR1020210133306 A KR 1020210133306A KR 20210133306 A KR20210133306 A KR 20210133306A KR 20230050057 A KR20230050057 A KR 20230050057A
- Authority
- KR
- South Korea
- Prior art keywords
- elastic
- electrically conductive
- conductive contact
- contact pin
- plunger
- Prior art date
Links
- 238000012360 testing method Methods 0.000 title description 19
- 238000003825 pressing Methods 0.000 claims abstract description 12
- 230000002238 attenuated effect Effects 0.000 claims abstract description 5
- 229910052751 metal Inorganic materials 0.000 claims description 49
- 239000002184 metal Substances 0.000 claims description 49
- 238000005452 bending Methods 0.000 claims description 8
- 230000006835 compression Effects 0.000 claims description 8
- 238000007906 compression Methods 0.000 claims description 8
- 238000007689 inspection Methods 0.000 abstract description 15
- 239000010410 layer Substances 0.000 description 54
- 239000000523 sample Substances 0.000 description 38
- 229910045601 alloy Inorganic materials 0.000 description 16
- 239000000956 alloy Substances 0.000 description 16
- 239000004065 semiconductor Substances 0.000 description 13
- 239000010949 copper Substances 0.000 description 12
- 238000000034 method Methods 0.000 description 9
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 8
- 230000008569 process Effects 0.000 description 8
- 229910017052 cobalt Inorganic materials 0.000 description 7
- 239000010941 cobalt Substances 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 6
- 230000033001 locomotion Effects 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000007747 plating Methods 0.000 description 5
- QXZUUHYBWMWJHK-UHFFFAOYSA-N [Co].[Ni] Chemical compound [Co].[Ni] QXZUUHYBWMWJHK-UHFFFAOYSA-N 0.000 description 4
- 239000011572 manganese Substances 0.000 description 4
- 230000015654 memory Effects 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- 229910052703 rhodium Inorganic materials 0.000 description 4
- 239000010948 rhodium Substances 0.000 description 4
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 4
- 230000007423 decrease Effects 0.000 description 3
- 230000002950 deficient Effects 0.000 description 3
- 230000006870 function Effects 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 2
- 230000014509 gene expression Effects 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052741 iridium Inorganic materials 0.000 description 2
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 2
- 229910052748 manganese Inorganic materials 0.000 description 2
- ZAUUZASCMSWKGX-UHFFFAOYSA-N manganese nickel Chemical compound [Mn].[Ni] ZAUUZASCMSWKGX-UHFFFAOYSA-N 0.000 description 2
- MOWMLACGTDMJRV-UHFFFAOYSA-N nickel tungsten Chemical compound [Ni].[W] MOWMLACGTDMJRV-UHFFFAOYSA-N 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- OFNHPGDEEMZPFG-UHFFFAOYSA-N phosphanylidynenickel Chemical compound [P].[Ni] OFNHPGDEEMZPFG-UHFFFAOYSA-N 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- 101000822695 Clostridium perfringens (strain 13 / Type A) Small, acid-soluble spore protein C1 Proteins 0.000 description 1
- 101000655262 Clostridium perfringens (strain 13 / Type A) Small, acid-soluble spore protein C2 Proteins 0.000 description 1
- 101000655256 Paraclostridium bifermentans Small, acid-soluble spore protein alpha Proteins 0.000 description 1
- 101000655264 Paraclostridium bifermentans Small, acid-soluble spore protein beta Proteins 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 230000001174 ascending effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06755—Material aspects
- G01R1/06761—Material aspects related to layers
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Geometry (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020210133306A KR20230050057A (ko) | 2021-10-07 | 2021-10-07 | 전기 전도성 접촉핀 및 이를 구비하는 검사장치 |
TW111137960A TW202332916A (zh) | 2021-10-07 | 2022-10-06 | 導電接觸針以及具有其之測試元件 |
PCT/KR2022/015028 WO2023059084A1 (ko) | 2021-10-07 | 2022-10-06 | 전기 전도성 접촉핀 및 이를 구비하는 검사장치 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020210133306A KR20230050057A (ko) | 2021-10-07 | 2021-10-07 | 전기 전도성 접촉핀 및 이를 구비하는 검사장치 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR20230050057A true KR20230050057A (ko) | 2023-04-14 |
Family
ID=85804532
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020210133306A KR20230050057A (ko) | 2021-10-07 | 2021-10-07 | 전기 전도성 접촉핀 및 이를 구비하는 검사장치 |
Country Status (3)
Country | Link |
---|---|
KR (1) | KR20230050057A (zh) |
TW (1) | TW202332916A (zh) |
WO (1) | WO2023059084A1 (zh) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101913355B1 (ko) | 2017-09-19 | 2018-12-28 | 윌테크놀러지(주) | 미세피치 대응이 가능한 수직형 프로브 카드용 니들유닛 및 이를 이용한 프로브 카드 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102018784B1 (ko) * | 2013-08-13 | 2019-09-05 | (주)위드멤스 | 미세 전극 회로 검사용 핀 제조 방법 및 이의 방법으로 제조된 미세 전극 회로 검사용 핀 |
JP2018009790A (ja) * | 2016-07-11 | 2018-01-18 | アルプス電気株式会社 | スプリングコンタクトおよびスプリングコンタクトを使用したソケット |
KR101901395B1 (ko) * | 2017-02-17 | 2018-09-28 | (주) 루켄테크놀러지스 | 프로브 핀 및 이의 제조 방법 |
KR20200104061A (ko) * | 2019-02-26 | 2020-09-03 | (주)포인트엔지니어링 | 프로브 카드용 가이드 플레이트 및 이를 구비한 프로브 카드 |
KR102145398B1 (ko) * | 2020-07-09 | 2020-08-19 | 피엠피(주) | 수직형 프로브 핀 및 이를 구비한 프로브 카드 |
-
2021
- 2021-10-07 KR KR1020210133306A patent/KR20230050057A/ko active IP Right Grant
-
2022
- 2022-10-06 WO PCT/KR2022/015028 patent/WO2023059084A1/ko unknown
- 2022-10-06 TW TW111137960A patent/TW202332916A/zh unknown
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101913355B1 (ko) | 2017-09-19 | 2018-12-28 | 윌테크놀러지(주) | 미세피치 대응이 가능한 수직형 프로브 카드용 니들유닛 및 이를 이용한 프로브 카드 |
Also Published As
Publication number | Publication date |
---|---|
WO2023059084A1 (ko) | 2023-04-13 |
TW202332916A (zh) | 2023-08-16 |
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