KR20230048491A - Camera module and optical instrument including the same - Google Patents

Abstract

An embodiment includes: a bracket including a first opening, a second opening, and a partition wall located between the first opening and the second opening; a first camera module including a first cover member and a first lens disposed within the first cover member and disposed within the first opening; a second camera module including a second cover member and a second lens disposed within the second cover member and disposed within the second opening; and a conductive member disposed on the partition wall of the bracket and connecting the first cover member and the second cover member. Therefore, it is possible to prevent the first and second camera modules from being separated from the bracket.

Description

Camera module and optical device including the same {CAMERA MODULE AND OPTICAL INSTRUMENT INCLUDING THE SAME}

Two or more camera modules may be mounted in a mobile communication terminal, computer, notebook computer, or vehicle. For example, a dual camera may include two camera modules, and each camera may photograph different parts and combine them into one image.

For example, in a dual camera module, one camera module may focus on a subject and the other camera module may capture a surrounding background, resulting in a wide-angle effect in which the camera's field of view is further widened.

In addition, by using the phase difference of images collected from different angles using these two or more camera modules, there is an advantage in that three-dimensional data can be collected, and augmented reality can be implemented.

The embodiment relates to a camera module and an optical device including the same.

The embodiment provides a camera module capable of preventing separation or separation of the first and second camera modules from the bracket due to external impact and improving reliability against impact, and an optical device including the same.

A camera module according to an embodiment includes a bracket including a first opening, a second opening, and a barrier rib positioned between the first opening and the second opening; a first camera module including a first cover member and a first lens disposed within the first cover member and disposed within a first opening; a second camera module including a second cover member and a second lens disposed within the second cover member and disposed within the second opening; and a conductive member disposed on the barrier rib of the bracket and connecting the first cover member and the second cover member.

The first cover member may include a first top plate and a first side plate, the second cover member may include a second top plate and a second side plate, and the conductive member may connect the first side plate and the second side plate. there is.

At least a portion of the conductive member may be coupled to an upper surface of the barrier rib.

At least another part of the conductive member may be coupled to a side surface of the barrier rib. The conductive member may be a conductive adhesive. The first cover member and the second cover member may be conductive members.

The first camera module includes a first holder disposed below the first lens and a first image sensor disposed below the first holder, and the second camera module includes a second holder disposed below the second lens. It may include a holder and a second image sensor disposed under the second holder.

A first adhesive coupling the bracket to at least one of the first holder and the second holder may be included.

The bracket may include side parts surrounding the first opening and the second opening; and at least one through hole formed in at least one of the side parts.

At least a portion of the first adhesive may be disposed within the at least one through hole of the bracket. The at least one through hole is located higher than a first position and lower than a second position, and the first position is any one of the at least one side of the bracket corresponding to the height of the upper surface of the first holder or the second holder. It is a position of one point, and the second position may be a position corresponding to a center between an upper end and a lower end of the at least one side part of the bracket.

The bracket may include at least one guide groove formed on an inner surface of the at least one side portion and connected to the at least one through hole. The at least one guide groove may be located below the at least one through hole.

The at least one guide groove may be recessed from the at least one inner surface and may extend to a lower end of the at least one side portion of the bracket.

A width of the at least one guide groove may increase from an upper end to a lower end of the at least one side portion of the bracket.

The first camera module includes a first substrate disposed below the first image sensor, the second camera module includes a second substrate disposed below the second image sensor, and the bracket comprises the first substrate. A substrate and the second substrate may be combined.

A camera module according to another embodiment includes a bracket; a first camera module and a second camera module spaced apart from each other within the bracket; and a conductive member connecting the first camera module and the second camera module, the bracket including a barrier rib disposed between the first camera module and the second camera module, and the first camera module comprising: It includes a first cover member, a first lens disposed within the first cover member, and a first image sensor facing the first lens, wherein the second camera module is disposed within a second cover member and the second cover member. and a second image sensor facing the second lens, wherein the conductive member connects the first cover member and the second cover member.

The conductive member may connect the side plate of the first cover member and the side plate of the second cover member. The conductive member may be disposed on top and side surfaces of the barrier rib.

According to the embodiment, separation or separation of the first and second camera modules from the bracket due to external impact may be prevented, and reliability against impact may be improved.

1 shows a perspective view of a camera module according to an embodiment.
FIG. 2 shows a cross-sectional view of the camera module of FIG. 1 in an AB direction.
Figure 3 is a first perspective view of the bracket shown in Figure 1;
Figure 4 is a second perspective view of the bracket shown in Figure 1;
5 is a third perspective view of the bracket shown in FIG. 1;
Figure 6 shows the inner surface of the first side of the bracket shown in Figure 5;
7 is an enlarged view of a portion of the camera module shown in FIG. 2 .
8 is a perspective view of a bracket according to another embodiment.
9 is a perspective view of a bracket according to another embodiment.
10A is a simplified cross-sectional view of a camera module without a through hole according to an embodiment.
10B shows a simplified cross-sectional view of a camera module according to an embodiment.
11 is a perspective view of a portable terminal according to an embodiment.
FIG. 12 shows a configuration diagram of the portable terminal shown in FIG. 11 .

Hereinafter, embodiments of the present invention that can specifically realize the above object will be described with reference to the accompanying drawings.

In the description of the embodiment, in the case where it is described as being formed on "on or under" of each element, the upper (upper) or lower (on or under) Both elements formed by directly contacting each other or by indirectly placing one or more other elements between the two elements are included. In addition, when expressed as "on or under", it may include the meaning of not only the upward direction but also the downward direction based on one element.

In addition, relational terms such as “first” and “second”, “upper/upper/upper” and “lower/lower/lower” used below refer to any physical or logical relationship or sequence between such entities or elements. may be used only to distinguish one entity or element from another entity or element, without necessarily requiring or implying that Also, like reference numbers indicate like elements throughout the description of the drawings.

In addition, terms such as "comprise", "comprise", or "have" described above mean that the corresponding component may be inherent unless otherwise stated, excluding other components. It should be construed as being able to further include other components. In addition, terms such as “corresponding” described above may include at least one of “opposite” or “overlapping” meanings.

Hereinafter, with reference to the accompanying drawings, a camera module according to an embodiment and an optical device including the same will be described as follows. For convenience of description, the camera module according to the embodiment is described using a Cartesian coordinate system (x, y, z), but it may be described using another coordinate system, and the embodiment is not limited thereto. In each figure, the x-axis and the y-axis mean directions perpendicular to the z-axis, which is the direction of the optical axes OA1 and OA2, and the z-axis direction, which is the direction of the optical axes OA1 and OA2, is referred to as a 'first direction', and the x-axis The direction may be referred to as a 'second direction', and the y-axis direction may be referred to as a 'third direction'.

1 shows a perspective view of a camera module 1000 according to an embodiment, and FIG. 2 shows a cross-sectional view of the camera module 1000 of FIG. 1 in an AB direction.

1 and 2, the camera module 1000 includes first and second camera modules 100-1 and 100-2, and the first camera module 100-1 and the second camera module 100. -2) may include a bracket (bracket, 200) for accommodating or fixing together.

Here, "camera module" may be expressed by replacing it with "photographer" or "camera", and the bracket may be expressed as a holder, mount, housing, or shield can. can

The following embodiment is described by exemplifying two imagers, but is not limited thereto, and other embodiments may include two or more imagers.

Each of the first camera module 100-1 and the second camera module 100-2 may be either an auto focus (AF) camera module or an optical image stabilizer (OIS) camera module. Alternatively, both the first camera module 100-1 and the second camera module 100-2 may be AF (Auto Focus) camera modules. Alternatively, both the first camera module 100-1 and the second camera module 100-2 may be optical image stabilizer (OIS) camera modules.

A camera module for AF refers to one capable of performing only an auto focus function, and a camera module for OIS refers to one capable of performing an auto focus function and an OIS (Optical Image Stabilizer) function.

For example, the first camera module 100-1 may be any one of an auto focus (AF) camera module and an optical image stabilizer (OIS) camera module, and the second camera module 100-2 may be an AF (auto focus) camera module. Focus) camera module and OIS (Optical Image Stabilizer) camera module.

For example, a first lens driving device included in a camera module for AF (Auto Focus) includes a bobbin for mounting a first lens, a housing for accommodating the bobbin inside, a coil disposed on the bobbin, and a magnet disposed on the housing. ), at least one elastic member coupled to the bobbin and the housing, and a base disposed under the bobbin, a driving signal (eg, driving current) may be provided to the coil, and a gap between the coil and the magnet may be provided. The bobbin may be moved in the optical axis direction by the electromagnetic force caused by the interaction. In another embodiment, the coil may be disposed in the housing and the magnet may be disposed in the bobbin.

In addition, for AF feedback driving, the first lens driving device included in the AF (Auto Focus) camera module includes a sensing magnet disposed on the bobbin, an AF position sensor (eg, a hall sensor) disposed on the housing ), and a circuit board disposed on the housing or/and the base and on which the position sensor is disposed or mounted In another embodiment, the position sensor may be disposed on the bobbin and the sensing magnet may be disposed on the housing.

At this time, the AF position sensor may output an output signal according to a result of sensing the strength of the magnetic field of the sensing magnet according to the movement of the bobbin. The circuit board may be electrically connected to the coil and the AF position sensor, a driving signal may be provided to each of the coil and the AF position sensor through the circuit board, and an output of the AF position sensor may be transmitted to the circuit board.

Also, the first lens driving device may further include a cover member for accommodating the above-described components together with the base.

In addition, for example, the second lens driving device included in the OIS (Optical Image Stabilizer) camera module includes a bobbin for mounting the second lens, a housing for accommodating the bobbin inside, a first coil disposed on the bobbin, and a housing disposed on the housing. a magnet, an upper elastic member coupled to the upper part of the bobbin and the upper part of the housing, a lower elastic member coupled to the lower part of the bobbin and the lower part of the housing, a second coil disposed under the bobbin, disposed under the second coil It may include a circuit board, a base disposed below the circuit board, and a support member electrically connecting the circuit board and the upper elastic member and supporting the housing with respect to the base. Each of the first coil and the second coil may be electrically connected to the circuit board.

For example, the upper elastic member may include a plurality of upper springs, and the first coil may be electrically connected to the circuit board through the upper springs and the support member. The circuit board may include a plurality of terminals, and some of the plurality of terminals may be electrically connected to each of the first coil and the second coil.

The bobbin may be moved in the optical axis direction by the electromagnetic force generated by the interaction between the first coil and the magnet, thereby controlling the bobbin's displacement in the optical axis direction, thereby realizing AF driving.

In addition, the housing may be moved in a direction perpendicular to the optical axis by the electromagnetic force due to the interaction between the second coil and the magnet, and thus, hand shake correction or OIS driving may be implemented.

As described in the first lens driving device, the second lens driving device may further include a sensing magnet and an AF position sensor for AF feedback driving.

Also, for OIS feedback driving, the second lens driving device may further include a first OIS position sensor and a second OIS position sensor electrically connected to the circuit board and disposed or seated on the base. In addition, the second lens driving device may further include a cover member for accommodating the above-described components together with the base.

The angle of view of the first camera module 100-1 and the angle of view of the second camera module 100-2 may be different from each other.

For example, one of the first camera module 100-1 and the second camera module 100-2 may be a wide-angle camera module, and the other may be a narrow-angle camera module, but is not limited thereto. In another embodiment, the angle of view of the first camera module 100-1 and the angle of view of the second camera module 100-2 may be the same.

Alternatively, for example, the angle of view of the first camera module 100-1 may be greater than that of the second camera module 100-2.

Also, either one of the first camera module 100-1 and the second camera module 100-2 may be used to capture a still image, and the other may be used to capture a video.

The first camera module 100-1 includes a first lens 101-1, a first lens driving device 100a-1 for moving the first lens 101-1, and a first image sensor 310a. , a first holder 320a, and a first filter 330a.

The first lens 101-1 may include at least one lens or a lens barrel in which at least one lens is mounted.

The first lens driving device 100a - 1 is any one of the first lens driving device included in the AF (Auto Focus) camera module and the second lens driving device included in the OIS (Optical Image Stabilizer) camera module. can be

The first holder 320a may be disposed below the first lens driving device 100a-1, and the first filter 330a may be seated or mounted on the first holder 320a.

The upper surface of the first holder 320a may be coupled or attached to the lower surface of the first lens driving device 100a-1 by the adhesive member 35a (see FIG. 10B). For example, an adhesive member or a shield member may be disposed between the upper surface of the first holder 320a and the lower surface of the base of the first lens driving device 100a-1.

For example, the adhesive member 35a may be a thermosetting adhesive, an ultraviolet curable adhesive, or a dual curable adhesive completely cured by ultraviolet light and heat. For example, the adhesive member may be an ultraviolet curable or/and heat curable epoxy.

The first image sensor 310a may receive an image included in light incident through the first lens driving device 100a-1 and convert the received image into an electrical signal.

The first image sensor 310a may be disposed below the first holder 320a or the first filter 330a, and the first lens 101-1 of the first lens driving device 100a-1 in the optical axis direction. may overlap with

The first holder 320a may have an opening corresponding to the first image sensor 310a so that light passing through the first filter 330a may be incident to the first image sensor 310a.

The first holder 320a may have a seating groove (or protrusion) for mounting or seating the first filter 330a. For example, the seating groove (or protrusion) may be disposed around the opening of the first holder 320a. The first filter 330a may be disposed in the seating groove of the first holder 320a to face the first image sensor 310a in the optical axis direction.

The first filter 330a may serve to block light of a specific frequency band from entering the first image sensor 310a from light passing through the first lens 101-1. For example, the first filter 330a may be an infrared cut filter, but is not limited thereto. In this case, the first filter 330a may be disposed parallel to a plane (eg, an x-y plane) perpendicular to the optical axis direction.

The second camera module 100-2 includes a second lens 101-2, a second lens driving device 100a-2 for moving the second lens 101-2, and a second image sensor 310b. , a second holder 320b, and a second filter 330b.

The second lens 101-2 may include at least one lens or a lens barrel in which at least one lens is mounted.

The second lens driving device 100a-2 is any one of the first lens driving device included in the AF (Auto Focus) camera module and the second lens driving device included in the OIS (Optical Image Stabilizer) camera module. can be

The second holder 320b may be disposed below the second lens driving device 100a-2, and the second filter 330b may be seated or mounted on the second holder 320b.

The upper surface of the second holder 320b may be coupled or attached to the lower surface of the second lens driving device 100a-2 by the adhesive member 35a (see FIG. 10A).

For example, an adhesive member or a shield member may be disposed between the upper surface of the second holder 320b and the lower surface of the base of the second lens driving device 100a-2. For example, the adhesive member 35a may be the same as the aforementioned adhesive member disposed between the first holder 320a and the first lens driving device 100a-1.

The second image sensor 310b may receive an image included in light incident through the second lens driving device 100a-2 and convert the received image into an electrical signal.

The second image sensor 310b may be disposed under the second holder 320b or the second filter 330b, and the second lens 101-2 of the second lens driving device 100a-2 in the optical axis direction. may overlap with

The second holder 320b may have an opening corresponding to the second image sensor 310b so that light passing through the second filter 330b may be incident to the second image sensor 310b.

The second holder 320b may have a seating groove (or protrusion) for mounting or seating the second filter 330b. For example, the seating groove (or protrusion) may be disposed around the opening of the second holder 320b.

The second filter 330b may be disposed in the seating groove of the second holder 320b to face the image sensor 310b in the optical axis direction.

The second filter 330b may serve to block light of a specific frequency band from entering the second image sensor 310b from light passing through the second lens. For example, the second filter 330b may be an infrared cut filter, but is not limited thereto. In this case, the second filter 330b may be disposed parallel to a plane perpendicular to the optical axis direction (eg, an x-y plane).

The first holder 320a and the second holder 320b may be spaced apart from each other, but are not limited thereto, and in another embodiment, the first holder 320a and the second holder 320b may be connected and integrally formed. It can also form one holder.

The camera module 1000 may further include a circuit board 340 disposed below the first camera module 100-1 and the second camera module 100-2. For example, the circuit board 340 may be disposed below the first holder 320a and the second holder 320b.

The first holder 320a and the second holder 320b and the circuit board 340 may be adhered and fixed to each other by the adhesive member 35b (see FIG. 10B ). The adhesive member 35b may be a heat-curable, or/and UV-curable adhesive.

For example, the circuit board 340 may be located under the first image sensor 310a and the second image sensor 310b and may include a connector 340a for electrical connection with the outside. The connector 340 may include a port electrically connected to the circuit board 340 and electrically connected to an external device.

Each of the first image sensor 310a and the second image sensor 310b may be disposed or mounted on the circuit board 340 . In order to convert images formed on the first image sensor 310a and the second image sensor 310b into electrical signals and transmit them to an external device, the circuit board 340 includes various circuits, elements, or/and controllers. may be provided.

For example, the circuit board 340 may be a PCB or a flexible circuit board, but is not limited thereto.

In FIGS. 1 and 2 , the first image sensor 310a and the second image sensor 320b are mounted on a circuit board integrally formed, but the embodiment is not limited thereto.

In another embodiment, the circuit board 340 may include a first board (or first circuit board) and a second board (or second circuit board) that are separated or separated from each other, and the first circuit board and the second circuit board Each board may include a connector.

In this case, the first image sensor may be mounted or disposed on the first circuit board, and the second image sensor may be mounted or disposed on the second circuit board. In this case, the first circuit board may be included in the first camera module 100-1, and the second circuit board may be included in the second camera module 100-2.

Hereinafter, the circuit board 340 will be described as an example in which the first board and the second board integrally form one circuit board, but the following description can be equally applied even when the first board and the second board are separate.

Also, for example, the camera module 1000 may further include a motion sensor and a controller disposed or mounted on the circuit board 340, and the motion sensor may be electrically connected to the controller and the controller.

For example, the motion sensor may output rotational angular velocity information due to movement of the camera module 10000 . For example, the motion sensor may be implemented as a 2-axis or 3-axis gyro sensor or an angular velocity sensor.

The controller may provide driving signals to the coil (or first coil) and the second coil of the first camera module 100-1 or/and the second camera module 100-2, respectively. In addition, the controller may provide a drive signal to each of the AF position sensor and the OIS position sensor, and may receive an output signal of each of the AF position sensor and the OIS position sensor.

FIG. 3 is a first perspective view of the bracket 200 shown in FIG. 1, FIG. 4 is a second perspective view of the bracket 200 shown in FIG. 1, and FIG. 5 is a first perspective view of the bracket 200 shown in FIG. 3 is a perspective view, and FIG. 6 shows the inner surface of the first side portion 212 of the bracket 200 shown in FIG.

Referring to FIGS. 3 to 6 , the bracket 200 may include openings for accommodating two or more imagers.

For example, the bracket 200 may include a first opening 201 for accommodating the first camera module 100-1 and a second opening 202 for accommodating the second camera module 100-2. can

The first opening 201 may provide a first accommodating space having a size or shape corresponding to the first camera module 100-1, and the second opening 202 may provide a second camera module 100-2. A second accommodating space having a size or shape corresponding to may be provided. For example, according to the size or shape of the first camera module 100-1 and the second camera module 100-2, the first accommodating space and the second accommodating space may have different sizes or/and shapes. It is not limited.

The bracket 200 may have at least one through hole 25a to 25d for injecting adhesive into at least one of the side parts 212 to 218 (or side walls). Here, the through holes 25a to 25d may be replaced with "adhesive injection through holes".

The shape of the through holes 25a to 25d may be a polygonal shape such as a circle, an ellipse, a triangle, or a quadrangle, but is not limited thereto.

In a state where the first camera module 100-1 and the second camera module 100-2 are mounted or inserted into the first opening 201 and the second opening 202, through the through holes 25a to 25d. Adhesive may be injected, and the injected adhesive is between the inner surface of the bracket 200 and the first holder 320a of the first camera module 100-1, and between the inner surface of the bracket 200 and the second camera module. It may be disposed between the second holders 320b of (100-2), and adhesion between the first and second holders 320a and 320b and the bracket 200 may be improved.

The circuit board 340, the bracket 200, and the first and second camera modules may be attached or fixed as follows.

First, after applying an adhesive (eg, epoxy) on the circuit board 340 , the lower surface of the bracket 200 is bonded to the upper surface of the circuit board 340 .

Next, the adhesive is injected or applied to the space between the upper surface of the bracket 200 and the upper surface of the first and second camera modules 100-1 and 100-2, and the through-holes 25a to 25d of the bracket 200 ), the bracket 200 and the first and second camera modules 100-1 and 100-2 may be attached or fixed to each other.

The bracket 200 may include a plurality of side parts 212 to 218 and a partition wall 219 disposed between the first opening 201 and the second opening 202 .

The “side parts 212 to 218 of the bracket 200 may be referred to as a “side wall” or an “outer wall”, and the partition wall 219 of the bracket 200 may be referred to as an “inner wall”.

The through holes 25a to 25d may be disposed or formed on at least one of the plurality of side parts 212 to 218 .

For example, the first and second through-holes 25a and 25b may be disposed on the first side 212 of the bracket 200, and the third and fourth through-holes 25c and 25d are of the bracket 200. It may be disposed on the second side part 212 , and the second side part 214 may be a side located opposite to the first side part 212 .

The bracket 200 may have grooves 22a, 22a1, and 22a2 provided at the bottom of at least one of the side parts 212 to 218.

5 and 6, at least one of the side parts 212 to 218 of the bracket 200 has a first area S1, a second area S2 spaced apart from the first area S1, and A third area S3 located between the first area S1 and the second area S2 and connecting the first area S1 and the second area S2 may be included.

A first groove 22a may be provided at a lower end of the second region S2. Here, the side portions provided with the first to third regions may be short side portions 212 and 214 among side portions of the bracket 200 . For example, the lengths of the short side portions 212 and 214 in the horizontal direction may be greater than the lengths of the long side portions 216 and 218 in the horizontal direction.

Also, for example, grooves 22a1 and 22a2 may be provided at the lower ends of the long side portions 216 and 218 of the bracket 200 . For example, the second groove 22a1 may be a groove corresponding to the first camera module 100-1 or the first opening 201, and the third groove 22a2 may be the second camera module 100-2 or the second groove 22a2. It may be a groove corresponding to the two openings 202 .

An adhesive (eg, epoxy) may be disposed between the first groove 22a of the bracket 200 and the circuit board 340 and between the second groove 22a1 of the bracket 200 and the circuit board 340. , Adhesion between the bracket 200 and the circuit board 340 can be improved. Also, for example, an adhesive (eg, epoxy) may be disposed between the third groove 22a2 of the bracket 200 and the circuit board 340 .

The second groove 22a1 of the bracket 200 may be provided for spatial avoidance of a soldered portion between the circuit board 340 and the first camera module 100-1. The third groove 22a2 of the bracket 200 may be provided for spatial avoidance of a soldered portion between the circuit board 340 and the second camera module 100-2.

For example, the side portion (eg, 212) of the bracket 200 may include a first area S1, a first area S1, and a third area S3.

The first height H1 from the bottom of the first area S1 to the top of the first area S1 of the side portion (eg, 212) of the bracket 200 and the second area from the bottom of the second area S2 The second height H2 to the upper end of (S2) may be greater than the third height H3 from the lower end of the third region S3 to the upper end of the third region S3. Also, for example, the first height H1 and the second height H2 may be the same.

The through holes (eg, 25a and 25b) may be disposed in the first area S1 and the second area S2 of the side portion (eg, 212) of the bracket 200. This is because when the through holes (eg, 25a and 25b) are formed in the third region S3 of the bracket 200, the durability of the bracket 200 is weakened and the bracket 200 may be deformed or damaged by impact. am. In another embodiment, a through hole for injecting an adhesive may be further formed in the third region S3. In another embodiment, through-holes may be formed in the first region S1 and the third region S3, or through-holes may be formed in the second region S2 and the third region S3.

Referring to FIGS. 3 and 6 , the bracket 200 has guide grooves 28a to 25d connected to through-holes 25a to 25d on the inner surface of side portions (eg, 212 and 214) provided with through-holes 25a to 25d. 28d) may be provided. Here, the guide grooves 28a to 29d may be replaced with "adhesive guide grooves".

The bracket 200 may include guide grooves 28a corresponding to the through holes 25a to 25d, and each of the guide grooves 28a to 28d is below a corresponding one of the through holes 25a to 25d. It may be positioned, and each of the guide grooves 28a to 28d may come into contact with a corresponding one of the through holes 25a to 25d.

Each of the guide grooves 28a to 28d may have a structure recessed from the inner side of the bracket 200 (eg, 212 and 214).

Guide grooves (28a to 28d) may extend to the lower end of the side (eg, 212, 214) of the bracket 200, one end of the guide grooves (28a to 28d) is the side (eg, 212, 214) of the bracket (200) 214), and may have an opening that opens to the lower surface of the side of the bracket 200 (eg, 212, 214).

For example, the guide grooves 28a to 28d may have a fan shape, but are not limited thereto, and may be implemented in various shapes capable of spreading the adhesive widely.

For example, in another embodiment, the guide groove may include a portion whose width becomes wider as it goes downward or a portion whose width becomes wider as it goes downward.

Or, for example, in another embodiment, the guide groove may include a portion with a lower portion wider than an upper portion.

The guide grooves 28a to 28d allow the adhesive injected through the through holes 25a to 25d to spread widely to the inner surface of the side portions (eg, 212 and 214) of the bracket 200, so that the first and second camera modules Adhesion between each of the s 100-1 and 100-2 and the side of the bracket may be improved.

In order to increase the spreading of the adhesive, the width W1 of the guide grooves 28a to 28d may increase from the upper end of the side of the bracket 200 to the lower end.

The diameter D1 of the through holes 25a to 25d may be 0.5 [mm] to 2 [mm]. For example, the diameter D1 of the through holes 25a to 25d may be 0.5 [mm] to 1 [mm].

When the diameter D1 of the through holes 25a to 25d is less than 0.5 [mm], it may be impossible to inject the adhesive because an injection hole or a needle for injecting the adhesive is not inserted into the through hole. In addition, when the diameter (D1) of the through holes (25a to 25d) exceeds 2 [mm], the size of the through hole is too large, and the durability of the side of the bracket 200 is weakened, so that the bracket 200 may be deformed or damaged by impact. can

For example, the width of the upper portion of the guide grooves 28a to 28d connected to the through holes 25a to 25d may be the same as the diameter D1 of the through holes 25a to 25d, and the guide grooves 28a to 28d The width W1 of the lower portion of may be larger than the diameter D1 of the through holes 25a to 25d (W1>D1).

Referring to FIG. 3 , the top or top of the side of the bracket 200 may include an inclined surface 41 or a tapered portion inclined toward the first opening 201 and the second opening 202 . This can increase the separation distance or space between the upper part of the bracket 200 and the first and second camera modules 100-1 and 100-2 by inclining the upper part of the bracket 200, thereby increasing the bracket ( 200) and the space between the first and second camera modules 100-1 and 100-2, the adhesive may be easily injected.

Referring to FIG. 2 , the camera module 1000 is disposed on the barrier rib 219 and connects the outer surface of the first lens driving device 100a - 1 and the outer surface of the second lens driving device 410 . ) may further include.

The conductive member 410 may be a conductive adhesive such as a conductive resin (eg, conductive epoxy), but is not limited thereto.

For example, the conductive member 410 may be formed between the first outer side surface of the first lens driving device 100a-1 and the first side surface of the barrier rib 219, the upper surface of the barrier rib 219, and the second lens driving device 100a-1. 2) may be disposed between the first outer side surface and the second side surface of the partition wall 219.

The first side of the barrier 219 may be a side facing the first outer side of the first lens driving device 100a-1, and the second side of the barrier 219 may be the second lens driving device 100a-2. ), and may be a side opposite to the first side of the partition wall 219.

For example, when the first and second camera modules 100-1 and 100-2 are mounted on the bracket 200, the height of the partition wall 219 is equal to the first and second camera modules 100-1 and 100-2. ) may be lower than that of the cover member.

Here, the first outer surface of the first lens driving device 100a-1 may be the outer surface of the first side plate of the cover member of the first lens driving device 100a-2, and the second lens driving device 100a-2 The first outer surface of 2) may be an outer surface of the first side plate of the cover member of the second lens driving device 100a - 2 .

Each cover member of the first and second lens driving devices 100a-1 and 100a-2 may be made of a conductive member, and the cover member of the first lens driving device 100a-1 and the The cover members of the second lens driving device may be electrically connected to each other, and at least one of the cover members of the first and second lens driving devices may be electrically connected to the ground terminal of the circuit board 340, whereby the camera The grounding resistance of the module 1000 can be increased.

FIG. 7 is a partially enlarged view of the camera module 1000 shown in FIG. 2 . The description of the through hole 25a of FIG. 7 may be equally applied to the through holes 25b to 25d.

Referring to FIG. 7 , the through hole 25a may be located between a first position 701 and a second position 702 of a side portion (eg, 212 ) of the bracket 200 .

The first position 701 is perpendicular to the optical axis on the top surfaces of the first and second holders 320a and 320b mounted on the bracket 200 (or the uppermost part of the side surfaces of the first and second holders 320a and 320b). It may be any one position of the side (eg, 212) of the bracket 200 corresponding to one direction.

For example, the first position 701 is the same as the uppermost part of the upper surfaces (or side surfaces of the first and second holders 320a and 320b) of the first and second holders 320a and 320b mounted on the bracket 200. can have height.

The second position 702 may be a position corresponding to the center of the side (eg, 212) of the bracket 200 in the optical axis direction. For example, the second position 702 may be a position corresponding to the center between the top and bottom of the side (eg, 212) of the bracket 200.

The reason for arranging through-holes 25a to 25d between the first position 701 and the second position 702 is that the bracket 200 located under the first position 701 and the first and second camera modules This is to inject and apply the adhesive to the first space between 100-1 and 100-2 and the second space between the bracket 200 and the circuit board 340 through the through holes 25a to 25d.

In addition, the adhesive injected and applied to the inclined surface 41 of the bracket 200 flows down, and the bracket 200 and the first and second camera modules located on the upper part of the second position 702 of the bracket 200 This is because the adhesive can be sufficiently applied to the third space between (100-1, 100-2).

In another embodiment, the through hole 25a may be formed to contact the first position 701 or the second position 702 .

In another embodiment, the center of the through hole 25a may be aligned or overlapped with the first position 701 or the second position 702 .

In another embodiment, the through hole may be located below the first position 701 . In another embodiment, the through hole may be located higher than the second position 702 .

Alternatively, in another embodiment, the through hole may be disposed below the center of the side of the bracket 200. In another embodiment, the through hole may be disposed higher than the center of the side of the bracket 200.

The coupling between the bracket 200 and the cover members of the first and second camera modules 100-1 and 100-2 is coupled by the adhesive 350c applied on the top. Since the coupling between the bracket 200 and the holders 320a and 320b may not work well by the adhesive 350c, the adhesive 350a injected through the through hole for this purpose is applied to the bracket 200 and the holders 320a and 320b. bonding between them can be improved.

Alternatively, according to the recent trend of slim camera modules, in another embodiment, the through hole 25a is located at the first position 701 and the third position 703 of the side (eg, 212) of the bracket 200. may be located in between.

The third position 703 is located at 2/3 of the total height (or length L1) of the side part (eg, 212) of the bracket 200 in the optical axis direction based on the lower end (or lower surface) of the side part of the bracket. It may be a corresponding position.

Another reason for disposing the through hole 25a between the first position 701 and the third position 703 is that the adhesive flowing down from the inclined surface 41 to the third space may not reach the second position 702. This is to improve adhesion and fixation between the bracket 200 and the first and second camera modules by applying the adhesive more widely.

For example, the through holes 25a to 25d may overlap the first lens driving device 100a-1 and the second lens driving device 100a-2 in a direction perpendicular to the optical axis OA1 or OA2.

For example, the through holes 25a to 25d overlap the base of the first lens driving device 100a-1 and/or the base of the second lens driving device 100a-2 in a direction perpendicular to the optical axis OA1 or OA2. It can be.

Also, for example, the through holes 25a to 25d may not overlap the first holder 320a and the second holder 320b in a direction perpendicular to the optical axis OA1 or OA2.

The guide grooves 28a to 28d may overlap the first holder 320a and the second holder 320b in a direction perpendicular to the optical axis OA1 or OA2.

The height of the upper surface of the first holder 320a of the first camera module 100-1 may be different from the height of the upper surface of the second holder 320b of the second camera module 100-2. For example, the height of the upper surface of the first holder 320a may be higher than that of the upper surface of the second holder 320b.

Also, for example, the guide grooves 28a to 28d may overlap the circuit board 340 in a direction perpendicular to the optical axis OA1 or OA2.

The bracket 200 may be coupled to a circuit board (eg, a first board and a second board), and the bracket 200 may be coupled to at least one of the first holder 320a and the second holder 320b and an adhesive 350b. ), and a portion of the adhesive may be disposed in at least one hole (or through holes 25a to 25d) of the bracket 200.

The camera module 1000 is interposed between the inner surface of the side part (eg 212) of the bracket 200 and the side surface of the first holder 320a, or/and the inner surface of the side part (eg 214) of the bracket 200 and the first holder 320a. It may include a first adhesive 350a disposed between the sides of the two holders 320b.

For example, an adhesive disposed between the bracket 200 and the first holder 320a and an adhesive (eg, epoxy) disposed between the bracket 200 and the second holder 320b may be made of the same material.

For example, the first adhesive 350a is applied between the guide grooves (eg, 28a to 28b) of the side of the bracket 200 (eg, 212) and the side of the first holder 320a, or/and the side of the bracket 200. It may be disposed between the guide grooves (eg, 28c to 28d) of (eg, 214) and the side surface of the second holder 320b.

For example, the first adhesive 350a may be disposed in the guide grooves (eg, 28a to 28b). Also, the first adhesive 350a may be disposed on one region of the inner surface of the side portions 212 and 214 of the bracket 200 adjacent to the guide grooves (eg, 28a to 28b).

Also, for example, the first adhesive 350a may be disposed in the through holes 25a to 25d.

In addition, the camera module 1000 may further include a second adhesive 350b disposed between the circuit board 340 and the inner surface of the side portions (eg, 212 and 214) of the bracket 200 . For example, the second adhesive 350b may be disposed between the guide grooves (eg, 28a to 28d) of the side (eg, 212) of the bracket 200 and the side (or/and upper surface) of the circuit board 340. .

For example, the first adhesive 350a and the second adhesive 350b may be formed and disposed by an adhesive injected through the through holes 25a to 25d.

In addition, the camera module 1000 is located on the top of the first adhesive 350a, and between the inner surface of the bracket 200 (eg, 212 and 214) and the outer surface of the first lens driving device 100a-1, and a third adhesive 350c disposed between the inner surface of the side portions (eg, 212 and 214) of the bracket 200 and the outer surface of the second lens driving device 100a-2.

Here, the outer surface of the first lens driving device 100a-1 may be the outer surface of the side plate of the cover member of the first lens driving device 100a-2, and the outer surface of the second lens driving device 100a-2. The side surface may be an outer surface of the side plate of the cover member of the second lens driving device 100a - 2 .

For example, each of the first to third adhesives 350a to 350c may be a thermosetting adhesive, an ultraviolet curable adhesive, or a dual curable adhesive completely cured by ultraviolet rays and heat.

For example, the first and second adhesives 350a and 350b may be heat curable epoxy, and the third adhesive 350c may be UV curable epoxy.

Bonding between the bracket 200 and the first holder 320a, between the bracket 200 and the second holder 320b, and between the bracket 200 and the circuit board 340 can be achieved by the first adhesive 350a. As a result, the bonding area between the first and second camera modules 100-1 and 100-2 and the bracket 200 may be increased. As a result, the first and second lens driving devices 100a-1 and 100a-2, the first and second holders 320a and 320b, and the circuitry transmit external impact or force to the bracket 200. It can be evenly distributed on the substrate 340, whereby the embodiment can prevent the first and second camera modules 100-1 and 100-2 from being separated or separated from the bracket 200-2 by external impact. and can improve reliability against impact.

8 is a perspective view of a bracket 200-1 according to another embodiment.

Referring to FIG. 8 , the bracket 200-1 may be an embodiment in which a through hole 27 and a guide groove 27a are added to the bracket 200 of FIG. 3 .

The bracket 200-1 may be provided with through holes 27 and guide grooves 27a not only on the side parts 212 and 214 but also on the side parts 216 and 218, and the through holes and guide grooves are shown in FIGS. Descriptions of the through holes 25a to 25d and the guide grooves 28a to 28d and the first to third adhesives 350a and 350c described in FIG. 6 may be applied.

9 is a perspective view of a bracket 200-2 according to another embodiment.

Referring to FIG. 9, the bracket 200-2 is a modified example of the bracket 200 of FIG. 3, and the bracket 200-2 has two through-holes 25a, 25b, and 25c provided in the side parts 212 and 214. and 25d) may further include a hole 29 connecting each other.

The hole 29 may pass through the side portions 212 and 214, and the adhesive may be injected into the bracket 200-2 through the connection hole 29.

In FIG. 9 , the hole 29 connects the through holes to each other, but is not limited thereto, and the hole according to another embodiment is located between the two through holes 25a and 25b, 25c and 25d, and the through holes 25a and 25d. 25b, 25c and 25d).

The camera module 1000 having the bracket 200-2 according to FIG. 9 is inserted through the connection hole 29 and is positioned between the two guide grooves 25a and 25b and 25c and 25d. 2) may further include a fourth adhesive disposed between a region of the inner surface of the side parts 212 and 214 and the side surfaces of the first and second holders.

In addition, the camera module 1000 having the bracket 200-2 according to FIG. 9 is injected through the connection hole 29, and the bracket 200 positioned between the two guide grooves 25a and 25b and 25c and 25d. A fourth adhesive may be further included between the other area of the inner surface of the side parts 212 and 214 of -2) and the side surface or/and the top surface of the circuit board 340 .

The bracket 200-2 further includes a hole 29 located between the two through-holes, so that between the bracket 200-2 and the first holder 320a and between the bracket 200-2 and the second holder (320b) and between the bracket 200-2 and the circuit board 340 can further widen the bonding area, thereby reducing the external impact or force transmitted to the bracket 200-2 in the first and second It can be evenly distributed to the lens driving devices 100a-1 and 100a-2, the first and second holders 320a and 320b, and the circuit board 340, so that the first and second holders 320a and 320b can be evenly distributed by external impact. It is possible to prevent the two camera modules 100-1 and 100-2 from being separated or separated from the bracket 200-2, and to improve reliability against impact.

10A is a simplified cross-sectional view of a camera module without a through-hole according to an embodiment, and FIG. 10B is a simplified cross-sectional view of a camera module 1000 according to an embodiment. For example, FIG. 10B may be a simplified cross-sectional view of the camera module having the embodiment of FIG. 8 in the CD direction.

Referring to FIG. 10A, the lens driving device 2 of the camera module 10, the holder 6, and the circuit board 4 are adhered to each other by adhesives 6 and 7, but by adhesive 8 Of the lens driving device 2 , holder 6 , and circuit board 4 , only the lens driving device 2 is bonded to an upper portion of the inner surface of the bracket 5 . This is because the adhesive injected from the top of the bracket 5 does not reach the holder 6 and the circuit board 4 .

Bonding may be performed between a portion of the upper surface of the edge of the circuit board 4 and the lower end of the bracket 5 by means of the adhesive 9, but sufficient bonding strength cannot be secured due to the narrow bonding area between the two. The reason why the bonding area between the two cannot be increased is that the outer size of the camera module is limited by the increase.

The impact transmitted through the bracket 5 is concentrated on the bonding area between the lens driving device 2 and the holder 6 and the bonding area between the holder 6 and the circuit board 4, and the transmitted impact affects these bonding areas. Separation between the lens driving device 2 and the holder 6 or separation or distortion between the holder 6 and the circuit board 4 may occur in the field.

In particular, in the case of a camera module (eg, a dual camera module) having two or more imagers, the amount of impact transmitted may increase due to an increase in the weight of the camera module, and such separation or distortion may occur more easily. .

In the structure of a general camera module, the bracket is bonded to the lens driving device and bonded to the circuit board, but it is difficult to increase the area of the circuit board due to the increase in the outer size of the camera module.

Referring to FIG. 10B , the brackets 200, 200-1, and 200-2 are formed by the first and second adhesives 350a and 350b formed by the adhesive material injected through the through holes 27 or 25a to 25d. ) The inner surface of the first holder 320a is bonded, and the inner surface of the brackets 200, 200-1, 200-2 and the side surface of the second holder 320b are bonded, and the bracket 200, Inner surfaces of 200-1 and 200-2 may be bonded to side surfaces or/and upper surfaces of the circuit board 340 .

Due to this, in the embodiment, an external shock or force transmitted to the brackets 200, 200-1, and 200-2 is transmitted to the first and second lens driving devices 100a-1 and 100a-2, and the first and second The holders 320a and 320b and the circuit board 340 can be evenly distributed, and the first and second camera modules 100-1 and 100-2 are separated from the bracket 200-2 by external impact or Separation can be prevented, and reliability against impact can be improved.

The camera module 10000 according to the embodiment forms an image of an object in space using reflection, refraction, absorption, interference, diffraction, etc., which are characteristics of light, and aims to increase the visual acuity of the eye, or by using a lens. It may be included in an optical instrument for the purpose of recording and reproducing images, optical measurement, propagation or transmission of images, and the like. For example, an optical device according to an embodiment may include a smart phone and a portable terminal equipped with a camera.

11 is a perspective view of a portable terminal 200A according to an embodiment, and FIG. 12 is a configuration diagram of the portable terminal 200A shown in FIG. 11 .

11 and 12, a portable terminal (200A, hereinafter referred to as a “terminal”) includes a body 850, a wireless communication unit 710, an A/V input unit 720, a sensing unit 740, an input/output unit, It may include an output unit 750, a memory unit 760, an interface unit 770, a control unit 780, and a power supply unit 790.

The body 850 shown in FIG. 11 is in the form of a bar, but is not limited thereto, and is a slide type, folder type, or swing type in which two or more sub-bodies are coupled to be relatively movable. , and may have various structures such as a swivel type.

The body 850 may include a case (casing, housing, cover, etc.) constituting an external appearance. For example, the body 850 may be divided into a front case 851 and a rear case 852 . Various electronic components of the terminal may be embedded in the space formed between the front case 851 and the rear case 852 .

The wireless communication unit 710 may include one or more modules enabling wireless communication between the terminal 200A and a wireless communication system or between the terminal 200A and a network in which the terminal 200A is located. For example, the wireless communication unit 710 may include a broadcast reception module 711, a mobile communication module 712, a wireless Internet module 713, a short-distance communication module 714, and a location information module 715. there is.

An audio/video (A/V) input unit 720 is for inputting an audio signal or a video signal, and may include a camera 721 and a microphone 722.

The camera 721 may include the camera module 1000 according to the embodiment shown in FIG. 1 .

The sensing unit 740 detects the current state of the terminal 200A, such as the open/closed state of the terminal 200A, the location of the terminal 200A, whether or not there is a user contact, the direction of the terminal 200A, and the acceleration/deceleration of the terminal 200A. By sensing, a sensing signal for controlling the operation of the terminal 200A may be generated. For example, when the terminal 200A is in the form of a slide phone, the sensing unit 740 may sense whether the slide phone is opened or closed. In addition, the sensing unit 740 is responsible for sensing functions related to whether or not the power supply unit 790 supplies power and whether or not the interface unit 770 is connected to an external device.

The input/output unit 750 is for generating input or output related to sight, hearing, or touch. The input/output unit 750 may generate input data for controlling the operation of the terminal 200A, and may also display information processed by the terminal 200A.

The input/output unit 750 may include a keypad unit 730, a display module 751, a sound output module 752, and a touch screen panel 753. The keypad unit 730 may generate input data by keypad input.

The display module 751 may include a plurality of pixels whose colors change according to electrical signals. For example, the display module 751 may be a liquid crystal display, a thin film transistor-liquid crystal display, an organic light-emitting diode, a flexible display, a 3D At least one of 3D displays may be included.

The audio output module 752 outputs audio data received from the wireless communication unit 710 in a call signal reception mode, a call mode, a recording mode, a voice recognition mode, or a broadcast reception mode, or stored in the memory unit 760. Audio data can be output.

The touch screen panel 753 may convert a change in capacitance caused by a user's touch to a specific area of the touch screen into an electrical input signal.

The memory unit 760 may store programs for processing and control of the control unit 780, and may store input/output data (eg, phone book, messages, audio, still images, photos, videos, etc.) can be temporarily stored. For example, the memory unit 760 may store an image captured by the camera 721, for example, a photo or video.

The interface unit 770 serves as a passage through which an external device connected to the terminal 200A is connected. The interface unit 770 receives data from an external device or receives power and transmits it to each component inside the terminal 200A, or transmits data inside the terminal 200A to an external device. For example, the interface unit 770 may include a wired/wireless headset port, an external charger port, a wired/wireless data port, a memory card port, a port connecting a device having an identification module, an audio I/O (Input/ Output) port, video I/O (Input/Output) port, and earphone port.

The controller 780 may control overall operations of the terminal 200A. For example, the controller 780 may perform related control and processing for voice calls, data communications, video calls, and the like.

The controller 780 may include a multimedia module 781 for playing multimedia. The multimedia module 781 may be implemented within the control unit 180 or may be implemented separately from the control unit 780.

The controller 780 may perform a pattern recognition process capable of recognizing handwriting input or drawing input performed on the touch screen as characters and images, respectively.

The power supply unit 790 may receive external power or internal power under the control of the control unit 780 to supply power necessary for the operation of each component.

Features, structures, effects, etc. described in the embodiments above are included in at least one embodiment of the present invention, and are not necessarily limited to only one embodiment. Furthermore, the features, structures, effects, etc. illustrated in each embodiment can be combined or modified with respect to other embodiments by a person having ordinary knowledge in the field to which the embodiments belong. Therefore, contents related to these combinations and variations should be construed as being included in the scope of the present invention.

Claims (20)

a bracket including a first opening, a second opening, and a barrier rib disposed between the first opening and the second opening;
a first camera module including a first cover member and a first lens disposed within the first cover member and disposed within a first opening;
a second camera module including a second cover member and a second lens disposed within the second cover member and disposed within the second opening; and
and a conductive member disposed on the barrier rib of the bracket and connecting the first cover member and the second cover member. According to claim 1,
The first cover member includes a first top plate and a first side plate,
The second cover member includes a second top plate and a second side plate,
The conductive member connects the first side plate and the second side plate to the camera module. According to claim 1,
At least a portion of the conductive member is coupled to the upper surface of the partition wall camera module. According to claim 3,
At least another part of the conductive member is coupled to the side surface of the partition wall camera module. According to claim 1,
The conductive member is a conductive adhesive camera module. According to claim 1,
The first cover member and the second cover member are conductive members of the camera module. According to claim 1,
The first camera module includes a first holder disposed below the first lens and a first image sensor disposed below the first holder,
The second camera module includes a second holder disposed below the second lens and a second image sensor disposed below the second holder. According to claim 7,
A camera module including a first adhesive coupling at least one of the first holder and the second holder to the bracket. According to claim 8,
The bracket is
side parts surrounding the first opening and the second opening; and
A camera module comprising at least one through hole formed in at least one of the side parts. According to claim 9,
At least a portion of the first adhesive is disposed in the at least one through hole of the bracket. According to claim 9,
The at least one through hole is located higher than a first position and lower than a second position, and the first position is any one of the at least one side of the bracket corresponding to the height of the upper surface of the first holder or the second holder. A position of one point, and the second position is a position corresponding to a center between an upper end and a lower end of the at least one side of the bracket. According to claim 9,
The camera module of claim 1 , wherein the bracket includes at least one guide groove formed on an inner surface of the at least one side portion and connected to the at least one through hole. According to claim 12,
The at least one guide groove is located below the at least one through hole camera module. According to claim 12,
The at least one guide groove is recessed from the at least one inner surface and extends to the lower end of the at least one side of the bracket. According to claim 12,
A camera module in which the width of the at least one guide groove increases from the upper end to the lower end of the at least one side part of the bracket. According to claim 7,
The first camera module includes a first substrate disposed under the first image sensor,
The second camera module includes a second substrate disposed under the second image sensor,
The camera module is coupled to the first substrate and the second substrate. Brackets;
a first camera module and a second camera module spaced apart from each other within the bracket;
A conductive member connecting the first camera module and the second camera module,
The bracket includes a barrier rib disposed between the first camera module and the second camera module,
The first camera module includes a first cover member, a first lens disposed within the first cover member, and a first image sensor facing the first lens,
The second camera module includes a second cover member, a second lens disposed within the second cover member, and a second image sensor facing the second lens,
The conductive member connects the first cover member and the second cover member to the camera module. According to claim 17,
The conductive member connects the side plate of the first cover member and the side plate of the second cover member to the camera module. According to claim 17,
The camera module wherein the conductive member is disposed on an upper surface and a side surface of the barrier rib. Brackets; and
A camera module comprising a first camera module and a second second camera module disposed within the bracket.

Images