KR20230030610A - Device for removing fume - Google Patents

Abstract

An embodiment of the present invention relates to a device for removing fume, wherein fume is removed by supplying purge gas to a wafer. Provided is a device for removing fume, comprising: a lower main body including a bulkhead for forming an upper surface, an exhaust part provided inside, and a fume discharge hole formed on the bulkhead to communicate with the exhaust part; an upper main body including a front opening part through which a wafer comes in and out, and provided above the lower main body; and a wafer cassette provided inside the upper main body. The wafer cassette includes: a plurality of loading shelves stacked to support the wafer; a case upper surface for supporting the upper side of the plurality of stacked loading shelves; a case lower surface for supporting the lower side of the plurality of stacked loading shelves; a perforated plate combined between the upper surface and the lower surface of the case and provided on a side surface to discharge, to the outside, fume and purge gas generated from the wafer; and an upper hopper combined with the perforated plate, guiding, to a lower side, the fume and the purge gas discharged from the perforated plate, and connected to the fume discharge hole, wherein the wafer cassette is provided in an inner space formed by the upper main body and the bulkhead to be able to be attached and detached. Therefore, provided is a device for removing fume, wherein process gas remaining in a wafer is removed.

Description

Fume removal device {Device for removing fume}

The present invention relates to a fume removal device.

In general, a semiconductor manufacturing process includes processes such as etching, deposition, and etching, and most of these processes are performed in a state in which a process gas is filled.

Most of the process gas is exhausted during the process, but some of it remains on the wafer surface and causes damage to the wafer or contaminates equipment used in the process.

In order to solve this problem, Patent Registration No. 10-1294143 of the present applicant discloses a wafer processing device in which a fume removal function is provided in the EFEM cassette itself.

However, in the case of the wafer processing device, there is a disadvantage in that it cannot evenly remove fume from the entire surface of the wafer.

KR 10-1294143 B1

An object of the present invention is to provide a fume removal device for removing process gas remaining on a wafer.

One embodiment of the present invention is a fume removal device for removing fume by supplying a purge gas to a wafer, comprising: a partition wall forming an upper surface, an exhaust unit provided inside, and a fume formed on the partition wall so as to communicate with the exhaust unit; A lower body including an outlet; an upper body including a front opening through which wafers enter and exit and provided above the lower body; and a wafer cassette provided inside the upper body, wherein the wafer cassette includes: a plurality of stacked platforms to support the wafer; an upper surface of the case supporting the upper side of the stacked plurality of stacking stands; a case lower surface supporting the lower side of the stacked plurality of stacking stands; a perforated plate coupled between an upper surface and a lower surface of the case and provided on a side surface to discharge fume and purge gas generated from the wafer to the outside; and the upper hopper coupled to the perforated plate, guiding the fume and purge gas discharged from the perforated plate downward and connected to the fume outlet, wherein the wafer cassette includes an inner space formed by the upper body and the partition wall It is possible to provide a fume removal device, characterized in that it is detachably provided on the.

An embodiment of the present invention may provide a fume removal device, wherein the fume outlet includes a fume outlet forming portion movably provided to change the location of the fume outlet.

In one embodiment of the present invention, the plurality of stacked loading stands are stacked to have spaced apart from each other in the vertical direction, the plurality of stacked loading stands are provided on the left and right sides of the wafer cassette, respectively, and the left loading stand It is possible to provide a fume removal device, characterized in that the gap between the right mounting table and the wafer is smaller than the diameter of the wafer, so that the wafer moves in and out of the wafer cassette through the separation space.

One embodiment of the present invention is provided inside the upper body, is mounted on the upper side of the partition wall, supports the lower side of the wafer cassette, and includes a base plate for adjusting the horizontal and vertical height of the wafer cassette, The base plate may include a height fixture having a portion inserted into the partition wall to fix the base plate; and a height adjuster supported on an upper surface of the barrier rib to adjust a distance between the base plate and the barrier rib.

One embodiment of the present invention is provided inside the upper body, is mounted on the upper side of the partition wall, supports the lower side of the wafer cassette, and includes a base plate for adjusting the horizontal and vertical height of the wafer cassette, The base plate may include a hollow formed on an upper surface of the base plate into which a purge gas supply port coupling part formed on a lower surface of the case of the wafer cassette may be inserted.

In one embodiment of the present invention, the purge gas supply port coupler passing through the hollow is connected to a gas supply passage provided in the partition wall, and receives the purge gas from the outside through the gas supply passage. It is possible to provide a fume removal device that does.

In one embodiment of the present invention, the front opening receives the wafer from an Equipment Front End Module (EFEM) provided on one side of the fume removal device, or discharges the wafer loaded inside the wafer cassette to the EFEM In order to do so, it is possible to provide a fume removal device characterized in that it communicates with the EFEM.

In one embodiment of the present invention, the exhaust unit may include a lower hopper communicating with the fume outlet to guide the fume and purge gas exhausted from the wafer cassette; and a first exhaust pipe connected to the lower hopper to exhaust the fume and the purge gas.

Through the present invention, it is possible to efficiently remove the process gas remaining in the wafer.

1 is a perspective view illustrating a fume removal device according to an example of the present invention.
2 is a perspective view illustrating a fume removal device according to an example of the present invention.
3 is an exploded perspective view illustrating a fume removal device according to an example of the present invention.
Figure 4 (a) is a perspective view showing the configuration of the upper body of the fume removal device according to an example of the present invention, (b) is a cross-sectional view seen from the line I-I 'of (a).
5 is a plan view showing a configuration related to an upper body of a fume removal device according to an example of the present invention.
6 is a bottom view showing a fume removal device according to an example of the present invention.
7 is a perspective view illustrating a wafer cassette of a fume removal device according to an example of the present invention.
8 is a perspective view and a partially enlarged view illustrating a wafer cassette of a fume removal device according to an example of the present invention.
9 is a plan view illustrating a loading table of a first wafer accommodating part of the fume removal device according to an example of the present invention.
10 is a cross-sectional view showing a coupling structure of a wafer cassette, a base plate, and an upper body of a fume removal device according to one embodiment of the present invention.
11 is a perspective view illustrating an exhaust unit of a fume removal device according to an example of the present invention.
12 is a perspective view illustrating an interface unit of a fume removal device according to an example of the present invention.
13 is a configuration diagram for explaining flow paths of purge gas, compressed air, and fume in a fume removal device according to an example of the present invention.

Hereinafter, some embodiments of the present invention will be described in detail through exemplary drawings. In adding reference numerals to components of each drawing, it should be noted that the same components have the same numerals as much as possible even if they are displayed on different drawings. In addition, in describing an embodiment of the present invention, if it is determined that a detailed description of a related known configuration or function hinders understanding of the embodiment of the present invention, the detailed description will be omitted.

Also, terms such as first, second, A, B, (a), and (b) may be used to describe components of an embodiment of the present invention. These terms are only used to distinguish the component from other components, and the nature, order, or order of the corresponding component is not limited by the term. When an element is described as being “connected,” “coupled to,” or “connected” to another element, that element may be directly connected or connected to the other element, but there may be another element between the elements. It should be understood that may be "connected", "coupled" or "connected".

Hereinafter, a fume removal device according to an example of the present invention will be described in detail with reference to the drawings.

1 and 2 are perspective views showing a fume removal device according to an example of the present invention, and FIG. 3 is an exploded perspective view showing a fume removal device according to an example of the present invention.

Referring to FIGS. 1 to 3 , the fume removal device according to an example of the present invention may include a main body 100 and a wafer cassette 200 .

The main body 100 may form the exterior of the fume removal device according to an example of the present invention. The main body 100 may include a partition wall 101, a front plate 102, and a first hook 103 as an example.

The barrier rib 101 may be a criterion for dividing the body 100 into an upper body 110 and a lower body 120 . That is, an upper portion of the barrier rib 101 may be referred to as an upper body 110 and a lower portion of the barrier rib 101 may be referred to as a lower body 120 . In addition, the barrier rib 101 may be referred to as a lower surface of the upper body 110 or an upper surface of the lower body 120 . The upper body 110 and the lower body 120 will be described later.

As shown in FIG. 4 , a height adjuster 310 of the base plate 300 may be supported on the partition wall 101 , and a height fixture 320 may be inserted and fixed to the partition wall 101 . That is, the barrier rib 101 may support the base plate 300, which will be described later.

In addition, a gas supply passage 101a may be provided below the partition wall 101 as shown in FIG. 10 . In the gas supply passage 101a, gas supplied to the wafer to remove fume from the wafer supplied through a purge gas connection port 570 (hereinafter referred to as “purge gas”) is used to purge the wafer cassette 200. It is supplied to a gas pipe (not shown). That is, the gas supply passage 101a communicates the purge gas connection port 570 with the purge gas pipe of the wafer cassette 200 .

The front plate 102 forms the front surface of the main body 100 and may contact the EFEM (not shown). In more detail, the fume removal device according to an example of the present invention may be a side storage provided on one side of the EFEM, where EFEM is an abbreviation of Equipment Front End Module, and is a module for supplying wafers to a process module in a semiconductor production line means

A bezel 117 may be provided on the front plate 102 to protrude toward the contacted EFEM side. In addition, a first hook 103 may be provided on the rear side of the front plate 102 .

The first hook 103 may be hook-coupled with the second hook 111 of the upper body 110, which will be described later, and the front plate 102 through the hook coupling of the first hook 103 and the second hook 111. ) and the upper body 110 has the advantage of being easy to attach and detach.

In addition, the body 100 may include an upper body 110 and a lower body 120 as an example. The upper body 110 and the lower body 120 will be described later.

Figure 4 (a) is a perspective view showing the configuration of the upper body of the fume removal device according to an example of the present invention, (b) is a cross-sectional view seen from the line Ⅰ-Ⅰ' of (a), Figure 5 is a view of the present invention It is a plan view showing a structure related to an upper body of a fume removal device according to an example, and FIG. 6 is a bottom view showing a fume removal device according to an example of the present invention.

1 to 5, the upper body 110 includes a second hook 111, a fastening part (not shown), a front opening 113, an upper surface 114, a side surface 115, and a bezel 117. , a purge gas supply port 118 and a fume discharge port 119.

As mentioned above, the second hook 111 is provided in a shape corresponding to the first hook 111 of the front plate 102 and can be hook-coupled with the first hook 111 . The second hook 111, for example, may be formed such that the end of the hook faces downward, and at this time, the first hook 103 may be formed such that the end of the hook faces upward. In this case, it is convenient to detach the upper body 110 from the front plate 102 only by lifting the upper body 110 upward.

The fastening part serves to couple the upper body 110 to the lower body 120 . That is, the detachable upper body 110 may be firmly coupled to the lower body 120 through the fastening portion. The fastening part may include a configuration for screw coupling as an example. That is, the upper body 110 and the lower body 120 may be firmly fixed through screw coupling.

The front opening 113 is formed in front of the upper body 110 and functions as a wafer transfer passage. That is, wafers are supplied to the upper body 110 through the front opening 113 or discharged from the upper body 110 . In more detail, the front opening 113 may communicate with the EFEM, and the wafer transfer robot arm (not shown) of the EFEM transfers the wafer to the wafer cassette 200 inside the upper body 110 through the front opening 113. can supply In addition, the wafer transfer robot arm of the EFEM may discharge wafers loaded in the wafer cassette 200 inside the upper body 110 through the front opening 113 .

The upper surface 114 is a term referring to the upper side of the upper body 110, and in one example of the present invention, the upper surface 114 may include a transparent plate 114a. In this case, the user of the fume removal device according to an example of the present invention has the advantage of being able to observe the inside of the upper body 110 through the transparent plate 114a.

The side surface 115 is a term referring to a surface forming a side portion of the upper body 110, and may include a transparent plate 115a like the upper surface. In this case, as described in the description of the upper surface 114, the user of the fume removal device according to an example of the present invention has the advantage of being able to observe the inside of the upper body 110 through the transparent plate 115a. there is.

The bezel 117 may protrude from the front plate 102 . A portion of the bezel 117 may be inserted into the EFEM when combined with the EFEM through such a structure. Therefore, the bezel 117 may be manufactured considering the rotation radius of the EFEM wafer transfer robot arm.

In addition, as shown in FIG. 1, the bezel 117 couples the wafer cassette 200 and the upper body 110 from the front, and the purge gas purged from the wafer cassette 200 passes through the wafer cassette 200 and the upper body. (110) can serve to prevent leakage into the space between.

As shown in FIG. 10 , the purge gas supply port 118 is connected to the purge gas supply port coupling portion 270 so that the purge gas supply port coupling portion 270 of the wafer cassette 200 can be inserted and coupled thereto. It may be provided in a corresponding shape. As an example, the purge gas supply port 118 may include a protrusion 118a protruding inward. In this case, the upper body ( 110) and the wafer cassette 200 may be coupled.

The fume outlet 119 serves to discharge fume (remaining process gas) generated from wafers loaded on the wafer cassette 200 . The wafer is processed in a process gas atmosphere (a process gas is provided inside the process chamber) in the process module, and the process gas remains on the wafer even after the process is completed. However, the process gas remaining on the wafer has a problem by affecting damage to the wafer or contaminating devices used in the process. The fume outlet 119 communicates with an exhaust unit 400 to be described later and serves as a passage through which fume, which is a process gas remaining on the wafer, is discharged. As an example, fume remaining in the wafers accommodated in the wafer cassette 200 may flow along the upper hopper 260 of the wafer cassette 2000, flow into the lower hopper 410 through the fume outlet 119, and then be discharged. .

Also, the fume outlet 119 may be formed by the fume outlet forming portion 119a as shown in FIG. 4 . The fume outlet formation part 119a is provided to be movable so that the position of the fume outlet 119 can be changed. Through this, when the fume removal device according to an example of the present invention is installed in the EFEM, the location of the outlet 119 is adjusted so that it can be used on both the left and right sides of the EFEM.

2 and 6 , the lower body 120 may include a side surface 121, a lower surface 122, a fume outlet 123, a caster 124, a leveler 125, and a door 126. there is.

On the side surface 121, as shown in FIG. 2, an interface unit 500 may be provided, which will be described later.

A fume outlet 123, a caster 124, and a leveler 125, which form the bottom surface of the lower body 120 and will be described later, may be formed on the lower surface 122.

The fume outlet 123 communicates with a connection port 450 of the exhaust unit 400 to be described later and may function as a passage through which fume exhausted through the exhaust unit 400 is discharged to the outside. As an example, the fume outlet 123 may be provided in a circular shape at the center of the lower surface 122 of the lower body 120, but is not limited thereto.

The caster 124 is provided on the lower surface 122 of the lower body 120 and serves to increase the convenience of movement of the fume removal device according to an example of the present invention. More specifically, the caster 124 is provided as a wheel so that the fume removal device can be easily moved through rotation of the caster 124 .

The leveler 125 is provided on the lower surface 122 of the lower body 120 and serves to increase the fixing force of the fume removal device according to an example of the present invention. More specifically, the leveler 125 may move up and down by rotation and may protrude from the lower surface 122 of the lower body 120 than the caster 124 . When the leveler 125 protrudes from the lower surface 122 of the lower body 120 more than the caster 124, the caster 124 is suspended in the air, so that the user cannot easily move the fume removal device. become a state Of course, even when both the caster 124 and the leveler 125 are in contact with the floor, the movement of the fume removal device may be limited. In addition, the leveler 125 may also be used to adjust the height when installing the fume removal device to the EFEM.

When the user wants to move the fume removal device, the leveler 125 can be turned and moved upward, and the caster 124 can touch the floor where the fume removal device is installed. In this state, the user can move the fume removal device simply by pushing the fume removal device. In addition, when the fume removal device is installed in the EFEM, the leveler 125 may be turned and moved downward so that the leveler 125 touches the floor so that the fume removal device can be firmly installed without moving.

The door 126 may be provided on the side surface 121 of the lower body 120 to be selectively opened and closed. That is, the user can easily access the inside of the lower body 120 by opening and closing the door 126 .

Inside the upper body 110, a wafer cassette 200 loaded with wafers is accommodated. In addition, the wafer cassette 200 may also be described as being supported by the lower body 120 . The wafer cassette 200 will be described in detail below.

7 is a perspective view showing a wafer cassette of a fume removal device according to an example of the present invention, FIG. 8 is a perspective view and a partially enlarged view of a wafer cassette of a fume removal device according to an example of the present invention, and FIG. It is a plan view showing the loading table of the first wafer accommodating part of the fume removal device according to an example of the present invention.

7 to 9, the wafer cassette 200 of the fume removal device according to an example of the present invention includes a case 210, a first wafer accommodating part 220, a second wafer accommodating part 230, a heating Member 240, perforated plate 250, upper hopper 260, purge gas supply port coupling part 270, sebum gas pipe (not shown), leveler 291, first sensor 292, second sensor (not shown) time) and a lighting unit 294.

The case 210 may form the outer appearance of the wafer cassette 200 . The case 210 may be larger than the wafer to accommodate the wafer therein. As shown in FIGS. 7 and 8 , the case 210 may be formed to be airtight except for a portion corresponding to the front opening 113 of the upper body 110 . In this case, the purge gas injected from the purge gas outlet 226 of the first wafer accommodating part 220 to be described later may flow and be discharged only inside the case 210 . That is, when the case 210 is not provided, the purge gas discharged to the wafer flows throughout the inside of the upper body 110, and is used to remove fume from the wafer compared to the case 210 is provided. The amount of purge gas is increased. In other words, the airtight structure of the case 210 may serve to save the amount of purge gas used to remove fume from the wafer. This may be explained as the sealing structure of the case 210 improves the fume removal efficiency of the wafer.

The case 210 may include a front opening 211 formed in a size corresponding to a position corresponding to the front opening 113 of the upper body 110 . The front opening 211 of the case 210 may function as a passage for entering and exiting wafers. In addition, the case 210 may have a closed structure except for the front opening 211 as described above.

The case 210 may include an upper heater 241 and a leveler 291 on the upper surface 212 . The upper heater 241 and the leveler 291 will be described later.

In addition, the case 210 may include a first wafer accommodating part 220, a second wafer accommodating part 230, a side gas pipe 282, and a rod heater (not shown) on the side surface 213. The first wafer accommodating part 220, the second wafer accommodating part 230, the side gas pipe 282, and the rod heater will be described later.

In addition, the case 210 may include a perforated plate 250 and an upper hopper 260 on the rear surface 214 . The perforated plate 250 and the upper hopper 260 will be described later.

In addition, the case 210 includes a lower heater 242, a purge gas supply port coupling part 270, a lower gas pipe (not shown), a first sensor 292, and a second sensor (not shown) on the lower surface 215. And a lighting unit 294 and the like may be provided. The lower heater 242, the purge gas supply port coupler 270, the lower gas pipe, the first sensor 292, the second sensor, and the lighting unit 294 will be described later.

The first wafer accommodating part 220 serves to support a wafer and supply a purge gas to the wafer. As shown in FIG. 8 , one first wafer accommodating part 220 may be provided on both sides of the side surface 213 of the case 210, respectively. In addition, the first wafer accommodating unit 220 may include a plurality of mounting tables 221 spaced apart from each other up and down, capable of loading one wafer. Wafers may be allowed in and out of the separation space between the plurality of loading tables 221 . In other words, the wafer transfer robot arm of EFEM can move wafers in and out through the separation space between the plurality of loading tables 221 . Through this structure, the first wafer accommodating part 220 can support a plurality of wafers stacked in a spaced apart state.

The loading platform 221 may include an inclined portion 222 as an example. As shown in FIGS. 8 and 9 , the inclined portion 222 is a portion of the loading table 221 that protrudes toward the circular wafer loaded on the loading table 221 and has an inclination. The inclined portion 222 may include a second purge gas discharge port 226c, which will be described later. The second purge gas outlet 226c supplies purge gas to the front of the circular wafer loaded on the loading table 221 (toward the front opening 211) (see FIG. 8 ) so that the purge gas is supplied to the entire wafer. make it possible That is, the inclined portion 222 of the loading table 221 and the second purge gas discharge port 226c provided on the inclined portion 222 are used when purge gas is not supplied to the wafers loaded on the loading table 221. It acts as a barrier to the area.

In addition, the mounting table 221 may include a pin 223 for supporting the wafer. As an example, a plurality of pins 223 may be provided on the mounting table 221 to support wafers. As an example, the pin 223 may have a thin bar shape as shown in FIG. 8 . When the wafer is supported by the pins 223, the contact portion between the wafer and other members to support the wafer is minimized, thereby minimizing damage to the wafer due to contact.

In the case of the mounting table 221, it may have a predetermined width (see w in FIG. 9). In this case, the purge gas supplied to the wafer loaded on the pin 223 is blocked by the loading table 221 and the wafer, and flows only in the horizontal direction with limited up-and-down flow. That is, when the mounting table 221 has a width such that it fills the space between the wafer and the case 210, the vertical movement of the purge gas is restricted by the mounting table 221 and the wafer, so that the purge gas used for purging the wafers is limited. It has the advantage of saving the amount of This may be explained as improving the fume removal efficiency of the wafer together with the above-mentioned sealing structure of the case 210 .

The mounting table 221 may include a purge gas inlet 224 accommodating a side gas pipe 282 supplying purge gas. That is, purge gas may flow into the loading table 221 through the purge gas inlet 224 .

In addition, a purge gas passage 225 and a purge gas outlet 226 may be provided on the mounting table 221 . The purge gas passage 225 is a passage through which the purge gas introduced through the purge gas inlet 224 flows to be discharged through the purge gas outlet 226 . That is, the purge gas outlet 226 is a passage through which the purge gas introduced through the purge gas inlet 224 passes through the purge gas passage 225 and is discharged. The purge gas discharged through the purge gas outlet 226 is supplied to the wafers loaded on the loading platform 221 .

The purge gas passage 225 may include a plurality of branch passages 225b, 225c, 225d, and 225e branched from the main passage 225a. The purge gas passage 225 includes, for example, a main passage 225a, a first branch passage 225b, a second branch passage 225c, a third branch passage 225d, and a fourth branch passage 225e. can do. The first branch passage 225b to the fourth branch passage 225e may be sequentially called from the front (the direction in which wafers are supplied) to the rear. The first branch passage 225b to the fourth branch passage 225e may be provided such that an angle formed with the main passage 225a in the direction in which the purge gas is supplied is an obtuse angle. Further, among the first branch passages 225b to the fourth branch passages 225e, a passage to which a relatively small amount of purge gas is to be injected forms a right angle or an acute angle with the main passage 225a in the direction in which the purge gas is supplied. can be placed Each of the first branch passage 225b, the second branch passage 225c, the third branch passage 225d, and the fourth branch passage 225e may have different diameters. Here, the diameter may be understood as a concept including indicators representing the size of a polygon, such as a width and width. As an example, the diameters of the first branch passage 225b, the second branch passage 225c, the third branch passage 225d, and the fourth branch passage 225e may vary from the first branch passage 225b to the fourth branch passage 225b. It may become smaller toward the passage 225e. In addition, the diameters of the first branch passage 225b, the second branch passage 225c, the third branch passage 225d, and the fourth branch passage 225e will be described later. It may have a size corresponding to that of the purge gas outlet 226c, the third purge gas outlet 226d, and the fourth purge gas outlet 226e. Accordingly, the diameter may decrease from the first purge gas outlet 226b to the fourth purge gas outlet 226e. In this case, more purge gas is discharged from the purge gas outlet 226 that relatively discharges the purge gas toward the front of the wafer. At this time, since the purge gas discharged to the wafer flows from the front (front opening 211 side) to the rear (perforated plate 250 side), a larger amount of purge gas flows from the front to the rear of the wafer.

In addition, a fixture (not shown) may be provided on the loading table 221 . A support member (not shown) in the form of a rod for fixing and supporting the plurality of loading tables 221 may be inserted into the fixture. That is, the plurality of mounting tables 221 may be fixedly supported in a state of being spaced apart from each other through the fixture.

In addition, the loading tables 221 of the first wafer accommodating part 220 may be provided on both sides inside the case 210 of the wafer cassette 200, and at this time, the width between the loading tables 221 provided on both sides (B, see FIG. 8) may be provided to be smaller than the diameter of the wafer. As mentioned above, this structure has an advantage in supplying the purge gas from the front of the wafer. However, loading the wafers onto the loading table 221 may be a problem, but in the present invention, a separation space may be provided between the loading tables 221 so that there is no problem in wafer access.

The second wafer accommodating part 230 serves to support the wafer. Also, the second wafer accommodating unit 230 may be described as supporting a wafer by assisting the first wafer accommodating unit 220 . As shown in FIG. 8 , the second wafer accommodating part 230 may be provided on both sides of the side surface 213 of the case 210, respectively. In addition, the second wafer accommodating unit 230 may be relatively rearward compared to the first wafer accommodating unit 220 . The second wafer accommodating part 230 may include a loading table 231 and a pin 232 protruding from the loading table 231 . The pin 232 serves to support the wafer from below. The pin 232 of the second wafer accommodating part 230 may be provided in the form of a thin rod having the same shape as the pin 223 of the first wafer accommodating part 220, thereby minimizing the contact area with the wafer. can do.

The heating member 240 serves to heat the inside of the wafer cassette 200 . The heating member 240 may include, for example, an upper heater 241, a lower heater 242, and a rod heater (not shown). The upper heater 241 may be provided on the upper surface 212 of the case 210 . In addition, the lower heater 242 may be provided on the lower surface 215 of the case 210 . A plurality of rod heaters may be provided on the side surface 213 of the case 210 . The heating member 240 is evenly disposed on the upper surface 212, the side surface 213, and the lower surface 215 of the case 210, as salpin, to evenly heat the inside of the wafer cassette 200.

The perforated plate 250 may be provided on the rear surface 214 of the case 210 as an example. In addition, the perforated plate 250 may include a plurality of air intake holes 251 . The intake hole 251 is a passage through which fume and purge gas generated from wafers accommodated in the wafer cassette 200 are discharged. The shape of the intake hole 251 may be provided in a straight line as shown in FIG. 8 as an example, but is not limited thereto. That is, the intake hole 251 may be formed in various shapes, such as a circular shape and a polygonal shape, as long as it can serve only as a discharge passage for fume and purge gas. However, preferably, the intake hole 251 may be provided such that its width increases toward the top (see FIG. 8). In this case, there is an advantage in that fume and purge gas inside the wafer cassette 200 can be uniformly discharged from both upper and lower portions. This is where fume and purge gas are discharged through the upper hopper 260 provided on the rear surface of the perforated plate 250 and through the fume discharge port 119 provided on the partition wall 101 corresponding to the lower surface of the upper body 110, This is because a higher flow velocity is formed in the lower part of the wafer cassette 200 located relatively close to the fume outlet 119 than in the upper part due to the flow path of the fume and purge gas.

The upper hopper 260 serves to guide fume and purge gas discharged through the intake hole 251 of the perforated plate 250 to the fume outlet 119 of the upper body 110 . The upper hopper 260 may include an inclined portion 261, a streamlined portion 262, and a discharge passage 263 as shown in FIG. 7 as an example. The inclined portion 261 is located above the upper hopper 260 and serves to guide the fume and purge gas discharged through the intake hole 251 toward the fume discharge port 119 located at the bottom. The streamlined portion 262 is located below the inclined portion 261 and serves to guide fume and purge gas to the fume outlet 119 . The streamlined portion 262 may have a streamlined structure so that there is no dead area in which fume and purge gas stagnate. The discharge passage 263 is provided below the streamlined portion 262 and may be inserted into the fume outlet 119 . The fume and purge gas discharged through the fume outlet 119 flow into the lower hopper 410 of the exhaust unit 400 to be described later, which will be described later.

As shown in FIG. 10 , the purge gas supply port coupling part 270 may be inserted into the hollow 301 of the base plate 300 and the purge gas supply port 118 of the upper body 110 . The purge gas supply port coupling part 270 is coupled to the hollow 301 and the purge gas supply port 118, and when coupled in this way, receives the purge gas supplied from the gas supply passage (see 101a in FIG. 10). be in a state of being able to The purge gas supplied from the gas supply passage 101a may be discharged to the surface of the wafer through a purge gas outlet 226 of the loading table 221 through a purge gas pipe (not shown), which will be described later. The purge gas supply port coupler 270 may include a groove 271 as an example. The groove 271 may have a shape corresponding to the protrusion 118a of the upper body 110 . In this case, when the purge gas supply hole coupler 270 is inserted into the purge gas supply hole 118, the protrusion 118a is inserted into the groove 271, so that a strong coupling force may be formed. In addition, since the binding force between the purge gas supply port 118 and the purge gas supply port coupler 270 is improved through this structure, leakage of the purge gas is prevented.

The purge gas pipe (not shown) is connected to the purge gas supply port coupler 270 and serves to supply the supplied purge gas to the purge gas inlet 224 of the first wafer receiving part 220 . The purge gas pipe may include, for example, a lower gas pipe (not shown) and a side gas pipe 282 . The lower gas pipe may be arranged along the lower surface 215 of the case 210 as an example. The lower gas pipe may connect the purge gas supply port coupler 270 and the side gas pipe 282 . That is, the lower gas pipe may supply the purge gas supplied through the purge gas supply port coupler 270 to the side gas pipe 282 . As shown in FIG. 8 , the side gas pipe 282 may be coupled to the purge gas inlet 224 to supply purge gas to the purge gas passage 225 .

The leveler 291 serves to detect whether the wafer cassette 200 is installed to be level. The leveler 291 may be a digital leveler as an example. In this case, there is an advantage that the measured value for the horizontal of the wafer cassette 200 sensed by the leveler 291 can be displayed through the display unit 520 of the interface unit 500 to be described later. In addition, a separate gauge (not shown) may be provided on the interface unit 500 to display the measurement value measured by the digital leveler. In addition, when the measured value measured by the leveler 291 exceeds the reference value, that is, when the wafer cassette 200 is not installed horizontally (normally), a warning message or a warning sound is output. A unit (not shown) may be provided. The warning output unit may be controlled by a control unit (not shown) to be described later. Horizontal adjustment of the wafer cassette 200 is performed by the base plate 300, which will be described later.

The first sensor 292 serves to detect the presence or absence of a wafer inside the wafer cassette 200 . The first sensor 292 may be provided on the lower surface 215 of the case 210 as shown in FIG. 8 as an example, but is not limited thereto. The first sensor 292 may be connected to a controller, and the controller may control discharging of the purge gas to be stopped when it is determined by the first sensor 292 that no wafer exists inside the wafer cassette 200. there is.

The second sensor (not shown) serves to detect whether the wafers loaded on the pins 223 and 232 of the loading tables 221 and 231 of the wafer cassette 200 protrude forward, that is, whether the wafers are loaded in the correct position. do. The second sensor may be provided on the lower surface 215 of the case 210, but is not limited thereto. The second sensor may be connected to the control unit, and the control unit may output a warning message or a warning sound through the warning output unit when it is determined that the wafer is not loaded in the correct position by the second sensor, and the wafer transfer robot arm of the EFEM Through this, it is possible to control the wafer to be loaded in the right position.

The lighting unit 294 serves to illuminate the inside of the wafer cassette 200 . As an example, the upper body 110 may include transparent plates 114a and 115a, and the wafer cassette 200 may also have the case 200 made of a transparent material. In this case, the wafer by the lighting unit 294 When light shines on the inside of the cassette 200, the user has the advantage of being able to observe whether or not the work inside the wafer cassette 200 is properly progressing from the outside. The lighting unit 294 may be, for example, an LED, but is not limited thereto.

10 is a cross-sectional view showing a coupling structure of a wafer cassette, a base plate, and an upper body of a fume removal device according to one embodiment of the present invention.

Referring to FIGS. 4 and 10 , the fume removal device according to an example of the present invention may further include a base plate 300 .

The base plate 300 is provided between the wafer cassette 200 and the barrier rib 101 of the main body 100 to adjust the horizontality and height of the wafer cassette 200 . That is, the base plate 300 may include a horizontal adjustment structure. The base plate 300 may include, for example, a hollow 301 , a height adjustment member 310 and a height fixture 320 . The purge gas supply port coupling part 270 of the wafer cassette 200 may be inserted into the hollow 301 of the base plate 300 . In addition, the height adjuster 310 of the base plate 300 may adjust the distance between the base plate 300 and the partition wall 101 by moving up and down by rotation, as shown in FIG. 4 . As shown in FIG. 4 , the height fixture 320 of the base plate 300 penetrates the base plate 300 and at least partially is inserted into the partition wall 101 to fix the base plate 300 to the main body 100. can do. The height fixture 320, as an example, may be provided with screws and screwed to the main body 100, but is not limited thereto.

Of course, a structure for adjusting the level and height of the wafer cassette 200 itself may be provided directly. However, in one example of the present invention, even when a plurality of wafer cassettes 200 are used in combination by applying the horizontal and height adjustment structure of the wafer cassette 200 to the base plate 300, each wafer cassette 200 is horizontally It has the advantage of not having to adjust the

11 is a perspective view illustrating an exhaust unit of a fume removal device according to an example of the present invention.

Referring to FIG. 11 , the fume removal device according to an example of the present invention may further include an exhaust unit 400 .

The exhaust unit 400 may suck in fume generated from wafers loaded in the wafer cassette 200 and purge gas ejected from the wafer cassette 200 and exhaust the fumes to the outside. The exhaust unit 400 may include a lower hopper 410 , a first exhaust pipe 420 , a second exhaust pipe 430 , an exhaust pump 440 and a connection port 450 .

The lower hopper 410 may be provided on a lower surface of the upper body 110 or a lower portion of the partition wall 101 . That is, the lower hopper 410 may be provided inside the lower body 120 . The lower hopper 410 communicates with the fume outlet 119 of the upper body 110 and serves to guide the flow of fume and purge gas discharged through the fume outlet 119 . The lower hopper 410 may guide fume and purge gas discharged through the fume outlet 119 to the first exhaust pipe 420 . The lower hopper 410 forms a double hopper structure together with the upper hopper 260 located on the upper body 110 . In one example of the present invention, the reverse flow of fume and exhaust gas discharged through such a double hopper structure can be minimized. In addition, the lower hopper 410 has a streamlined structure with an open top, thereby minimizing a dead area where fume and purge gas are stagnant.

The first exhaust pipe 420 may connect the lower hopper 410 and the second exhaust pipe 430 . That is, fume and exhaust gas flowing into the first exhaust pipe 420 through the lower hopper 410 may flow into the second exhaust pipe 430 . The first exhaust pipe 420 may include, for example, a connection pipe (not shown) and a connection end 422 . The connection pipe may couple the lower hopper 410 and the first exhaust pipe 420 . Accordingly, the connection pipe may include a sealing member to prevent fume and exhaust gas from leaking from the connection end. In addition, the connection end 422 may be formed on the side of the first exhaust pipe 420 and connected to a separate pipe (not shown). As an example, the connection end 422 may communicate with a pipe (not shown) connecting the inside of the EFEM. In this case, there is an advantage in that fluids such as fume inside the EFEM can be removed by installing only a relatively simple piping structure. An opening/closing member such as a damper may be provided at the connection end 422 so as to be opened only when in use.

The second exhaust pipe 430 connects the first exhaust pipe 420 and the connection port 450 . An exhaust pump 440 may be provided inside the second exhaust pipe 430 as an example.

The exhaust pump 440 may control the flow direction and speed of the fluid on the passage leading to the upper hopper 260 , the lower hopper 410 , the first exhaust pipe 430 and the second exhaust pipe 430 . That is, the fume and purge gas inside the wafer cassette 200 can be discharged to the outside by the exhaust pump 440, and the exhaust amount of the fume and purge gas per unit time can be increased or decreased.

The exhaust pump 440, for example, may be provided as a member that controls the velocity of the fluid by supplying compressed air through a compressor (not shown) without using a motor. Hereinafter, this member will be referred to as a compressed air discharge accelerator. can However, note that the compressed air supplied to the compressed air discharge accelerator may be replaced with other fluids. In this case, there is an advantage in that vibration transmitted to the fume removal device is minimized compared to a case in which a motor is used. In addition, in the case of a motor, continuous replacement is required, but in the case of the compressed air discharge accelerator, this problem can also be solved. 11 shows the structure of the compressed air discharge accelerator in detail in cross section.

Referring to FIG. 11 , the compressed air discharge accelerator includes a first body 441, a second body 442, a pipe expansion unit 443, a compressed air moving unit 444, and a compressed air discharge unit 445. can do.

The first body 441 and the second body 442 are hollow tubes, as shown in FIG. 11 , and at least some of them may be provided in a shape corresponding to each other so as to be coupled to each other. When the first body 441 and the second body 442 are coupled, a compressed air moving unit 444 and a compressed air discharge unit 445 may be provided between the two. The compressed air moving unit 444 is a space in which compressed air introduced through an external compressor can flow, and the compressed air discharge unit 445 allows the compressed air flowing through the compressed air moving unit 444 to flow into the first body. 441 and the passage leading to the inside of the second body 442. In other words, the compressed air supplied to the compressed air discharge accelerator flows through the compressed air moving part 444, which is the space between the first body 441 and the second body 442, and passes through the compressed air discharge part 445. It flows into the first body 441 and the second body 442 . At this time, since the compressed air is discharged along the compressed air discharge unit 445 after filling the compressed air moving unit 444, there is an advantage in that the discharged compressed air can be uniformly discharged without being biased to one side. The compressed air outlet 445 may be manufactured in various sizes. In addition, the compressed air outlet 445 may be provided to be variable. Such a variable structure of the compressed air discharge unit 445 may be realized by providing, for example, the first body 441 and the second body 442 to be relatively movable. In this case, since the amount of compressed air discharged through the compressed air discharge unit 445 is variable, the exhaust speed of the exhaust gas exhausted through the compressed air discharge accelerator may be changed.

The second body 442 may include an expansion tube 443 whose diameter goes downward. In this case, the compressed air introduced into the first body 441 and the second body 442 flows toward a portion of the expansion tube 443 having a wide diameter. This is because the pressure of the gas acting on the large diameter part is relatively smaller than that of the small diameter part, so that the gas on the high pressure side tends to flow to the low pressure side. That is, the pipe expansion unit 443 may play a role of determining a direction of a flow of compressed air introduced into the first body 441 and the second body 442 . As such, when a flow of compressed air is generated inside the compressed air discharge accelerator, fume and purge gas inside the wafer cassette 200 communicated through the upper hopper 260, the lower hopper 410, and the first exhaust pipe 430 It also affects the direction and speed of discharge.

Referring to FIG. 13 , a valve 446, a regulator 447, and an operating air pressure sensor 448 may be additionally provided as components related to compressed air in the compressed air discharge accelerator. The valve 446 may be a member that opens and closes a flow path of compressed air. That is, whether to provide compressed air may be determined through the valve 446 . The valve 446 may be, for example, an on/off type valve, but is not limited thereto, and may be a valve that controls the passage of compressed air, such as a damper. The regulator 447 may maintain a constant speed or amount of compressed air passing through the regulator 477 . That is, in an example of the present invention, compressed air may be supplied to the compressed air discharge accelerator in a constant amount or at a constant speed through the regulator 447 . The operating air pressure sensor 448 may sense the pressure of compressed air provided to the compressed air discharge accelerator. The operating air pressure sensor 448 may be connected to a controller, and the controller may output the pressure value measured by the operating air pressure sensor 448 to a display unit 520 to be described later, and the measured pressure value When the pressure value is different from the preset pressure value, a warning message may be output through the warning output unit.

In addition, the exhaust pump 440 may include a tube 575a, at least a part of which is provided inside the exhaust pump 440 and communicates therewith. The tube 575a is connected to an exhaust gas pressure sensor 575 to be described later so that the pressure of the exhaust gas passing through the exhaust pump 440 can be measured. The tube 575a may have an end 575b facing an exhaust direction of exhaust gas. In this case, a negative pressure is formed in the exhaust gas pressure sensor 575 connected to the tube 575a, and it has been confirmed through a number of experiments that more accurate exhaust pressure is measured when the end 575b of the tube 575a takes a different direction. did

The connection port 450 may connect the second exhaust pipe 430 and the fume outlet 123 of the lower body 120 . That is, fume and purge gas flowing through the connection port 450 to the exhaust pump 440 inside the second exhaust pipe 430 may be discharged to the outside. The connection port 450 is coupled to one side of the fume outlet 123 of the lower body 120 and a discharge pipe (not shown) is provided to the other side to discharge fume and purge gas to the outside.

12 is a perspective view illustrating an interface unit of a fume removal device according to an example of the present invention.

Referring to FIG. 12 , the fume removal device according to an example of the present invention may further include an interface unit 500 .

The interface unit 500 may include a plurality of components for a user to manipulate the operation of the fume removal device according to an example of the present invention. The interface unit 500 may be provided on the side surface 121 of the lower body 120 as an example, but is not limited thereto.

The interface unit 500 includes, for example, an EMO switch 510, a display unit 520, a control unit 530, a compressed air gauge 540, a purge gas gauge 541, a communication port 550, and a compressed air connection port. 560 and a purge gas connection port 570.

The EMO switch 510 can quickly cut off power in an emergency situation. That is, the ㄸMO switch 510 may be an operation stop or power cut-off button used in an emergency situation. That is, when the user presses the EMO switch 510, the purge gas supplied to the wafer cassette 200, the power delivered to the heating member 240, the compressed air delivered to the exhaust pump 440, etc. are blocked and the operation is stopped. may be stopped Of course, a power switch separate from the EMO switch 510 may be provided.

The display unit 520 may output the current operation status of the fume removal device according to an example of the present invention. The display unit 520 may output, for example, measurement values measured by the digital leveler, the first sensor 292 , the second sensor, and the operating air pressure sensor 448 . The display unit 520 may function as a warning output unit and output a warning message if necessary. Also, the display unit 520 may be connected to and controlled by the controller. The display unit 520, as an example, is provided as a touch screen and may serve as a control unit 530 to be described later.

In addition, the interface unit 500 may further include a heater temperature controller 521 that controls the heating member 240 for controlling the internal temperature of the wafer cassette 200 and outputs the temperature of the heating member 240. can The heater temperature control unit 521 may be provided separately from the display unit 520 and the operation unit 530 to be described later, but if omitted, the heater temperature control unit 521 is controlled by the display unit 520 and the operation unit 530. function can be performed.

The control unit 530 may function as a means for inputting a command for a user to control the operation of the fume removal device according to an example of the present invention. The user determines whether or not the purge gas is supplied and the supply pressure (supply amount, supply time), the internal temperature of the wafer cassette 200 (whether the heating member 240 is operating or not), and compression by the exhaust pump 440 through the manipulation unit 530. Air supply and supply pressure can be manipulated. In addition, items manipulated by the manipulation unit 530 may be output through the display unit 520 so that the user can check them.

The compressed air gauge 540 may output the pressure of compressed air provided to a compressed air discharge accelerator, which is an example of the exhaust pump 440 of the exhaust unit 400 . The compressed air gauge 540 may be connected to the operating air pressure sensor 448 to output a pressure value sensed through the operating air pressure sensor 448 .

The purge gas gauge 541 may output the pressure of the purge gas purged into the wafer cassette 200 . The purge gas gauge 541 may be connected to the purge gas pressure sensor 573 to output a pressure value sensed through the purge gas pressure sensor 573 .

The communication port 550 may be provided to communicate with the EFEF and semiconductor process main equipment. That is, a communication cable capable of communicating with other equipment can be connected to the communication port 550 .

The compressed air connection port 560 may be connected to an external compressor to supply compressed air to the compressed air discharge accelerator. That is, the compressed air discharged through the compressor may be supplied to the compressed air discharge accelerator through the compressed air connection port 560 .

The purge gas connection port 570 may be connected to an external purge gas supply source (not shown) to supply purge gas to the wafer cassette 200 . That is, the purge gas discharged through the purge gas supply source may be supplied to the wafer cassette 200 through the purge gas connection port 570 .

Referring to FIG. 13 , the fume removal device according to an example of the present invention further includes a valve 571, a regulator 572, a purge gas pressure sensor 573, and a filter 574 as configurations for supplying purge gas. can do.

The valve 571 may be a member that opens and closes a purge gas flow path. That is, whether to provide purge gas may be determined through the valve 571 . The valve 571 may be, for example, an on/off valve, but is not limited thereto, and may be a valve that controls the passage of the purge gas, such as a damper. The regulator 572 may maintain a constant speed or amount of the purge gas passing through the regulator 572 . That is, in an example of the present invention, the purge gas may be supplied to the wafer cassette 200 in a constant amount or at a constant rate through the regulator 572 . The purge gas pressure sensor 573 may sense the pressure of the purge gas provided to the wafer cassette 200 . The purge gas pressure sensor 573 may be connected to a controller, and the controller may output the pressure value measured by the purge gas pressure sensor 573 to the display unit 520 and the measured input value may be If it is different from the set input value, a warning message may be output through the warning output unit. The filter 574 serves to filter the purge gas supplied through the purge gas passage. As an example, the supplied purge gas may be nitrogen (N ₂ ), and in this case, unnecessary fluids may be filtered through a filter.

A power cable supplying power to the fume removal device according to an example of the present invention may be coupled to the power connection port 580 . That is, power may be supplied to the fume removal device through the power connection port 580 .

In addition, the fume removal device according to an example of the present invention may further include an exhaust gas pressure sensor 575 . At least a portion of the exhaust gas pressure sensor 575 is connected to the tube 575a provided inside the exhaust pump 440 to sense the pressure of exhaust gas (fume and purge gas) exhausted through the exhaust unit.

The fume removal device according to an example of the present invention may further include a control unit. As mentioned above, the controller includes a digital leveler, a first sensor 292, a second sensor, an operating air pressure sensor 448, a purge gas pressure sensor 573, a display unit 520, an operation unit 530, and a warning. It may be connected to a configuration such as an output unit. That is, the control unit may be connected to various sensors, a component for inputting an operation control command, a component for displaying an operation state, etc. to control the operation of the fume removal device according to an example of the present invention, and reads or You can control it. However, it goes without saying that even components not mentioned can be controlled by the control unit.

Hereinafter, the operation of the fume removal device according to an example of the present invention will be described in detail with reference to the drawings.

13 is a configuration diagram for explaining flow paths of purge gas, compressed air, and fume in a fume removal device according to an example of the present invention.

First, the heating member 240 provided inside the wafer cassette 200 operates to match the temperature inside the wafer cassette 200 to the temperature set by the user. In addition, wafers are stacked on the pins 223 of the first wafer accommodating part 220 of the wafer cassette 200 and the pins 232 of the second wafer accommodating part 230 .

Thereafter, a purge gas (for example, nitrogen (N ₂ ) gas). Meanwhile, compressed air is supplied to the compressed air discharge accelerator of the exhaust unit 400 . The supply of the purge gas and the supply of compressed air will be described in detail with reference to FIG. 13 below.

First, looking at the process of supplying the purge gas, the purge gas is supplied from a purge gas supply source (not shown) through a flow path (a). The purge gas supplied to the flow passage passes through a valve 571 that is automatically or manually opened and closed, is changed to a pressure preset by the user in the regulator 572, and is supplied at a preset pressure by the purge gas pressure sensor 573. It is sensed whether or not it is being supplied to the inside of the wafer cassette 200 after being filtered through a filter 574. In more detail, the purge gas filtered by the filter 574 passes through the gas supply passage 101a of the main body 100 to the purge gas supply port coupler 270 provided on the lower surface 215 of the wafer cassette 200. It flows through the side gas pipe 282 passing through the lower gas pipe communicating with the purge gas supply port coupler 270 and passes through the purge gas passage 225 of the loading table 221 of the first wafer receiving part 220. It is discharged through the purge gas outlet 226 . Examining the flow of the purge gas inside the loading table 221 of the first wafer accommodating part 220 in more detail, as an example, the purge gas passage 225 will be provided with a larger diameter as it is located in the front (see FIG. 8). In this case, the most purge gas flows into the first purge gas passage 225b located at the frontmost position and is discharged through the first purge gas outlet 226b. Through this, since a large amount of purge gas flows from the front of the wafer, there is an advantage in that no dead area does not occur on the wafer where the purge gas does not reach. In particular, the second purge gas outlet 226c is provided on the inclined portion 222 protruding toward the center of the loaded wafer, so that the purge gas can flow even to the center of the wafer.

In this way, the purge gas discharged into the wafer cassette 200 together with the process gas (fume) remaining on the surface of the wafer is the intake hole 251 of the perforated plate 250 provided on the rear surface 214 of the wafer cassette 200. ) is released through The fume and purge gas discharged through the intake hole 251 pass through the upper hopper 260, the lower hopper 410, the first exhaust pipe 420, the second exhaust pipe 430, the exhaust pump 440, and the connection port ( 450) may be sequentially discharged to the outside. This process will be described in detail below together with the process of supplying compressed air.

Compressed air is discharged from a compressor (not shown) and supplied to the passage (b). The compressed air supplied to the passage passes through a valve 446 that is automatically or manually opened and closed, is changed to a pressure preset by the user in the regulator 447, and is supplied at a preset pressure by the operating air pressure sensor 448. After sensing whether or not it is running, the compressed air is supplied to the exhaust accelerator. The compressed air supplied to the compressed air discharge accelerator flows through the compressed air moving unit 444 and then flows into the first body 441 and the second body 442 through the compressed air discharge unit 445 . The flow direction of the compressed air introduced into the first body 441 and the second body 442 is determined by the expansion tube 443 and flows. That is, referring to FIG. 11 , the compressed air introduced into the first body 441 and the second body 442 flows toward the bottom where the diameter of the expander 443 gradually increases. Such a flow of compressed air also affects the inside of the wafer cassette 200, which is a communicating space. Accordingly, when compressed air having a higher speed or compressed air having a higher pressure is supplied to the compressed air discharge accelerator, the speed of fume and purge gas discharged through the perforated plate 250 also increases.

That is, the exhaust speed of the fume and purge gas inside the wafer cassette 200 is controlled according to the compressed air supplied to the air amplifier, so that the upper hopper 260, the lower hopper 410, the first exhaust pipe 420, the second The exhaust pipe 430, the exhaust pump 440, and the connection port 450 sequentially flow and are discharged to the outside (c). In addition, some of the fume and purge gas discharged to the outside may flow into the exhaust gas pressure sensor 575 and the pressure may be sensed (d).

Through such a series of processes, fume of wafers loaded in the wafer cassette 200 can be efficiently removed. In addition, the series of processes may be performed when a user inputs a command through the manipulation unit 530, and various numerical values such as pressure of purge gas and pressure of compressed air may be controlled. In addition, information on operation can be output through the display unit 520, and the user can check the operation state through the case 210 of the upper body 110 and the wafer cassette 200, which are at least partially transparent. can also

In the above, even though all the components constituting the embodiment of the present invention have been described as being combined or operated as one, the present invention is not necessarily limited to these embodiments. That is, within the scope of the object of the present invention, all of the components may be selectively combined with one or more to operate. In addition, terms such as "comprise", "comprise" or "having" described above mean that the corresponding component may be present unless otherwise stated, and thus exclude other components. It should be construed as being able to further include other components. All terms, including technical or scientific terms, have the same meaning as commonly understood by a person of ordinary skill in the art to which the present invention belongs, unless defined otherwise. Commonly used terms, such as terms defined in a dictionary, should be interpreted as being consistent with the contextual meaning of the related art, and unless explicitly defined in the present invention, they are not interpreted in an ideal or excessively formal meaning.

The above description is merely an example of the technical idea of the present invention, and various modifications and variations can be made to those skilled in the art without departing from the essential characteristics of the present invention. Therefore, the embodiments disclosed in the present invention are not intended to limit the technical idea of the present invention, but to explain, and the scope of the technical idea of the present invention is not limited by these embodiments. The protection scope of the present invention should be construed according to the claims below, and all technical ideas within the equivalent range should be construed as being included in the scope of the present invention.

100: body
200: wafer cassette
300: base plate
400: exhaust part
500: interface unit

Claims (8)

A fume removal device for removing fume by supplying a purge gas to a wafer, comprising:
a lower body including a partition wall forming an upper surface, an exhaust unit provided therein, and a fume outlet formed in the partition wall to communicate with the exhaust unit;
an upper body including a front opening through which wafers enter and exit and provided above the lower body; and
Including a wafer cassette provided inside the upper body,
The wafer cassette,
a plurality of stacked platforms to support the wafer;
an upper surface of the case supporting the upper side of the stacked plurality of stacking stands;
a case lower surface supporting the lower side of the stacked plurality of stacking stands;
a perforated plate coupled between the upper and lower surfaces of the case and provided on a side surface to discharge fume and purge gas generated from the wafer to the outside; and
an upper hopper coupled to the perforated plate, guiding the fume and purge gas discharged from the perforated plate downward, and connected to the fume discharge port;
The fume removal device, characterized in that the wafer cassette is detachably provided in the inner space formed by the upper body and the barrier rib. According to claim 1,
The fume removal device according to claim 1 , wherein the fume outlet includes a fume outlet forming portion movably provided to change the location of the fume outlet. According to claim 1,
The plurality of stacked stacking stands are stacked to have spaced apart from each other in the vertical direction,
The stacked plurality of loading tables are provided on the left and right sides of the wafer cassette, respectively, and the distance between the left loading table and the right loading table is smaller than the diameter of the wafer,
The fume removal device, characterized in that the wafer enters and exits the inside of the wafer cassette through the separation space. According to claim 1,
It is provided inside the upper body, is mounted on the upper side of the partition, supports the lower side of the wafer cassette, and includes a base plate for adjusting the horizontal and vertical height of the wafer cassette,
The base plate,
a height fixture having a portion inserted into the bulkhead to fix the base plate; and
and a height adjuster supported on an upper surface of the barrier rib to adjust a distance between the base plate and the barrier rib. According to claim 1,
It is provided inside the upper body, is mounted on the upper side of the partition, supports the lower side of the wafer cassette, and includes a base plate for adjusting the horizontal and vertical height of the wafer cassette,
The base plate includes a hollow formed on an upper surface of the base plate to insert a purge gas supply port coupling part formed on a lower surface of the case of the wafer cassette. According to claim 5,
The fume removal device of claim 1 , wherein the purge gas supply port connecting portion penetrating the hollow is connected to a gas supply passage provided in the partition wall and receives the purge gas from the outside through the gas supply passage. According to claim 1,
The front opening communicates with the EFEM to receive the wafer from an Equipment Front End Module (EFEM) provided on one side of the fume removal device or to discharge the wafer loaded in the wafer cassette to the EFEM. Characterized by a fume removal device. According to claim 1,
the exhaust,
a lower hopper communicating with the fume outlet to guide the fume and purge gas exhausted from the wafer cassette; and
and a first exhaust pipe connected to the lower hopper to exhaust the fume and purge gas.

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