KR102443239B1 - Device for removing fume - Google Patents

Abstract

The present invention provides a fume removal device for removing fumes by supplying a purge gas to a wafer,
wafer cassette; and a first mounting table for supporting the wafer, and a plurality of mounting units provided inside the wafer cassette, wherein the first mounting unit is one of the side surfaces of the first mounting unit to directly support the wafer. a pin provided on a curved surface; a plurality of purge gas outlets provided on the side surface of the first mounting table to supply a purge gas to the inside of the wafer cassette; and a purge gas flow path provided in the first mounting table to supply the purge gas to the inside of the wafer cassette through the plurality of purge gas outlets, wherein a portion of the plurality of purge gas outlets is the first loading It is formed on a flat surface of the side surfaces of the base, and the remainder of the plurality of purge gas outlets relates to a fume removal device formed on the curved surface of the side surfaces of the first loading table.

Description

Device for removing fume}

The present invention relates to a fume removal device.

In general, a semiconductor manufacturing process includes processes such as etching, deposition, and etching, and most of these processes are performed in a state filled with a process gas.

Most of the process gases are exhausted during the process, but some remain on the wafer surface to affect wafer damage or contaminate equipment used in the process, which is a problem.

In order to solve this problem, Patent Registration No. 10-1294143 of the present applicant discloses a wafer processing apparatus in which a fume removal function is provided in the cassette itself of the EFEM.

However, in the case of the wafer processing apparatus, there is a disadvantage in that fume cannot be evenly removed from the entire wafer surface.

US 10-1294143 B1

An object of the present invention is to provide a fume removal apparatus for removing a process gas remaining on a wafer.

An embodiment of the present invention provides a fume removal device for removing fumes by supplying a purge gas to a wafer, comprising: a wafer cassette; and a first mounting table for supporting the wafer, and a plurality of mounting units provided inside the wafer cassette, wherein the first mounting unit is one of the side surfaces of the first mounting unit to directly support the wafer. a pin provided on a curved surface; a plurality of purge gas outlets provided on the side surface of the first mounting table to supply a purge gas to the inside of the wafer cassette; and a purge gas flow path provided in the first mounting table to supply the purge gas to the inside of the wafer cassette through the plurality of purge gas outlets, wherein a portion of the plurality of purge gas outlets is the first loading It is possible to provide a fume removal device that is formed on a flat surface of the side surfaces of the base, and the rest of the plurality of purge gas outlets are formed on the curved surface of the side surfaces of the first mounting table.

In an embodiment of the present invention, the purge gas flow path may include a main flow path and a plurality of branch flow paths branched from the main flow path and respectively connected to the plurality of purge gas outlets.

One embodiment of the present invention may provide a fume removal device further comprising an exhaust unit provided in the wafer cassette to exhaust the fume of the wafer loaded in the wafer cassette.

In one embodiment of the present invention, in order to receive the wafer from an Equipment Front End Module (EFEM) provided on one side of the fume removal device, or to discharge the wafer loaded in the wafer cassette to the EFEM, the EFEM It is possible to provide a fume removal device further comprising a front opening formed in the wafer cassette to communicate with.

In one embodiment of the present invention, the exhaust unit, a lower hopper provided to guide the purge gas and fume exhausted from the wafer cassette; a first exhaust pipe connected to the lower hopper to exhaust the purge gas and fume; and a connection end formed on a side surface of the first exhaust pipe and communicating with the inside of the EFEM to remove the internal fluid of the EFEM.

Through the present invention, it is possible to efficiently remove the process gas remaining in the wafer.

1 is a perspective view showing a fume removal device according to an example of the present invention.
2 is a perspective view showing a fume removal device according to an example of the present invention.
3 is an exploded perspective view showing a fume removal device according to an example of the present invention.
Figure 4 (a) is a perspective view showing the configuration related to the upper body of the fume removal device according to an example of the present invention, (b) is a cross-sectional view taken from I-I' of (a).
5 is a plan view showing an upper body-related configuration of a fume removal device according to an example of the present invention.
6 is a bottom view showing a fume removal device according to an example of the present invention.
7 is a perspective view illustrating a wafer cassette of a fume removal apparatus according to an example of the present invention.
8 is a perspective view and a partially enlarged view illustrating a wafer cassette of a fume removal apparatus according to an example of the present invention.
9 is a plan view showing a mounting table of the first wafer accommodating unit of the fume removal apparatus according to an example of the present invention.
10 is a cross-sectional view showing the coupling structure of the wafer cassette, the base plate, and the upper body of the fume removal apparatus according to one embodiment of the present invention.
11 is a perspective view illustrating an exhaust portion of a fume removal device according to an example of the present invention.
12 is a perspective view illustrating an interface portion of a fume removal device according to an example of the present invention.
13 is a configuration diagram for explaining a flow path of a purge gas, compressed air, and fume in the fume removal device according to an example of the present invention.

Hereinafter, some embodiments of the present invention will be described in detail with reference to exemplary drawings. In adding reference numerals to the components of each drawing, it should be noted that the same components are given the same reference numerals as much as possible even though they are indicated on different drawings. In addition, in describing the embodiment of the present invention, if it is determined that a detailed description of a related known configuration or function interferes with the understanding of the embodiment of the present invention, the detailed description thereof will be omitted.

In addition, in describing the components of the embodiment of the present invention, terms such as first, second, A, B, (a), (b), etc. may be used. These terms are only for distinguishing the elements from other elements, and the essence, order, or order of the elements are not limited by the terms. When it is described that a component is “connected”, “coupled” or “connected” to another component, the component may be directly connected or connected to the other component, but between each component another component It will be understood that may also be "connected", "coupled" or "connected".

Hereinafter, a fume removal device according to an example of the present invention will be described in detail with reference to the drawings.

1 and 2 are perspective views illustrating a fume removal apparatus according to an example of the present invention, and FIG. 3 is an exploded perspective view illustrating a fume removal apparatus according to an example of the present invention.

1 to 3 , the fume removal apparatus according to an example of the present invention may include a body 100 and a wafer cassette 200 .

The main body 100 may form the exterior of the fume removal device according to an example of the present invention. The body 100 may include, for example, a partition wall 101 , a front plate 102 , and a first hook 103 .

The partition wall 101 may serve as a criterion for dividing the main body 100 into the upper body 110 and the lower body 120 . That is, an upper portion of the partition wall 101 may be referred to as an upper body 110 , and a lower portion of the partition wall 101 may be referred to as a lower body 120 . Also, the partition wall 101 may be referred to as a lower surface of the upper body 110 or an upper surface of the lower body 120 . The upper body 110 and the lower body 120 will be described later.

As shown in FIG. 4 , the height adjusting member 310 of the base plate 300 to be described later is supported on the partition wall 101 , and the height adjusting member 320 may be inserted and fixed. That is, the partition wall 101 may support the base plate 300 , which will be described later.

In addition, a gas supply path 101a may be provided under the partition wall 101 as shown in FIG. 10 . In the gas supply path 101a, a gas (hereinafter referred to as a “purge gas”) supplied to the wafer in order to remove fume from the wafer supplied through a purge gas connection port 570, which will be described later, is a purge of the wafer cassette 200 . It should be supplied to a gas pipe (not shown). That is, the gas supply path 101a communicates the purge gas connection port 570 with the purge gas pipe of the wafer cassette 200 .

The front plate 102 forms the front surface of the main body 100 and may be in contact with the EFEM (not shown). In more detail, the fume removal device according to an example of the present invention may be a side storage provided on one side of the EFEM, where EFEM is an abbreviation for Equipment Front End Module, and a module that supplies a wafer to a process module in a semiconductor production line means

A bezel 117 may be provided on the front plate 102 to protrude toward the contacting EFEM. In addition, a first hook 103 may be provided on the rear side of the front plate 102 .

The first hook 103 may be hook-coupled with a second hook 111 of the upper body 110 to be described later, and the front plate 102 through the hook coupling of the first hook 103 and the second hook 111 . ) and the upper body 110 has the advantage of being easy to attach and detach.

In addition, the body 100 may include an upper body 110 and a lower body 120 as an example. The upper body 110 and the lower body 120 will be described later.

Figure 4 (a) is a perspective view showing the configuration related to the upper body of the fume removal device according to an example of the present invention, (b) is a sectional view taken from I-I 'of (a), Figure 5 is of the present invention It is a plan view showing an upper body related configuration of the fume removal device according to an example, and FIG. 6 is a bottom view showing the fume removal device according to an example of the present invention.

1 to 5 , the upper body 110 includes a second hook 111 , a fastening part (not shown), a front opening 113 , an upper surface 114 , a side surface 115 , and a bezel 117 . , a purge gas supply port 118 and a fume outlet 119 may be included.

As mentioned above, the second hook 111 may be provided in a shape corresponding to the first hook 111 of the front plate 102 to be hook-coupled with the first hook 111 . The second hook 111 may, for example, be formed such that the end of the hook faces downward, and in this case, the first hook 103 may be formed such that the end of the hook faces upward. In this case, it is convenient to remove the upper body 110 from the front plate 102 only by lifting the upper body 110 upward.

The fastening part serves to couple the upper body 110 to the lower body 120 . That is, the detachable upper body 110 may be firmly coupled to the lower body 120 through the fastening part. The fastening part may include a configuration for screw coupling as an example. That is, the upper body 110 and the lower body 120 may be firmly fixed through screw coupling.

The front opening 113 is formed in front of the upper body 110 and functions as a wafer transfer path. That is, the wafer is supplied to the upper body 110 through the front opening 113 or the wafer is discharged from the upper body 110 . In more detail, the front opening 113 may communicate with the EFEM, and the wafer transfer robot arm (not shown) of the EFEM transfers the wafer to the wafer cassette 200 inside the upper body 110 through the front opening 113 . can supply In addition, the wafer transfer robot arm of the EFEM may discharge the wafer loaded in the wafer cassette 200 inside the upper body 110 through the front opening 113 .

The upper surface 114 is a term referring to the upper surface of the upper body 110 , and in an example of the present invention, the upper surface 114 may include a transparent plate 114a. In this case, the user of the fume removal apparatus according to an example of the present invention has the advantage of being able to observe the situation inside the upper body 110 through the transparent plate 114a.

The side surface 115 is a term referring to a surface forming the side portion of the upper body 110 , and may include a transparent plate 115a like the upper surface. In this case, as described in the description of the upper surface 114, the user of the fume removal device according to an example of the present invention can observe the situation inside the upper body 110 through the transparent plate 115a. have.

The bezel 117 may protrude from the front plate 102 . The bezel 117 may be partially inserted into the EFEM when combined with the EFEM through such a structure. Accordingly, the bezel 117 may be manufactured in consideration of the rotation radius of the wafer transfer robot arm of the EFEM.

In addition, as shown in FIG. 1 , the bezel 117 couples the wafer cassette 200 and the upper body 110 from the front, and the purge gas purged from the wafer cassette 200 is the wafer cassette 200 and the upper body. It can serve to prevent leakage into the space between (110).

The purge gas supply port 118 includes the purge gas supply port coupling part 270 and the purge gas supply port coupling part 270 so that the purge gas supply port coupling part 270 of the wafer cassette 200 to be described later can be insertedly coupled thereto, as shown in FIG. 10 . It may be provided in a corresponding shape. The purge gas supply port 118 may include, for example, a protrusion 118a protruding inward. In this case, the purge gas supply port coupling part 270 is provided with a groove 271 having a shape corresponding to the protrusion 118a, so that the protrusion 118a is inserted into the groove 271 in the upper body ( 110) and the wafer cassette 200 may be coupled.

The fume outlet 119 serves to discharge fume (residual process gas) generated from the wafer loaded on the wafer cassette 200 . The wafer is processed in a process gas atmosphere (a state in which the process gas is provided inside the process chamber) in the process module, and the process gas remains on the wafer even after the process is completed. However, the process gas remaining on such a wafer affects wafer damage or contaminates devices used in the process, resulting in a problem. The fume outlet 119 communicates with an exhaust unit 400 to be described later and serves as a passage for discharging fume, which is a process gas remaining on the wafer. As an example, the fume remaining in the wafer accommodated in the wafer cassette 200 flows along the upper hopper 260 of the wafer cassette 2000 and flows into the lower hopper 410 through the fume outlet 119. It can be discharged. .

In addition, the fume outlet 119 may be formed by the fume outlet forming part 119a as shown in FIG. 4 . The fume outlet forming part 119a is provided to be movable so that the position of the fume outlet 119 can be changed. Through this, there is an advantage that can be used on both the left and right sides of the EFEM by adjusting the position of the outlet 119 when the fume removal device according to an example of the present invention is installed in the EFEM.

2 and 6 , the lower body 120 may include a side surface 121 , a lower surface 122 , a fume outlet 123 , a caster 124 , a leveler 125 and a door 126 . have.

An interface unit 500 may be provided on the side surface 121 as shown in FIG. 2 , which will be described later.

On the lower surface 122 , a fume outlet 123 , a caster 124 , and a leveler 125 to be described later forming a bottom surface of the lower body 120 may be formed.

The fume outlet 123 communicates with a connection port 450 of the exhaust unit 400 to be described later and may serve as a passage for discharging the fume exhausted through the exhaust unit 400 to the outside. The fume outlet 123 may be provided in a circular shape in the center of the lower surface 122 of the lower body 120 as an example, but is not limited thereto.

The caster 124 is provided on the lower surface 122 of the lower body 120 and serves to increase the convenience of movement of the fume removal device according to an example of the present invention. In more detail, the caster 124 is provided with wheels so that the fume removal device can be easily moved through the rotation of the caster 124 .

The leveler 125 is provided on the lower surface 122 of the lower body 120 and serves to increase the fixing force of the fume removal device according to an example of the present invention. In more detail, the leveler 125 may move up and down by rotation and may protrude from the lower surface 122 of the lower body 120 than the caster 124 . When the leveler 125 protrudes from the lower surface 122 of the lower body 120 than the caster 124, the caster 124 is in a floating state, so the user cannot easily move the fume removal device. become a state Of course, even when both the caster 124 and the leveler 125 are in contact with the floor, the movement of the fume removal device may be limited. In addition, the leveler 125 may be used to adjust the height when the fume removal device is installed in the EFEM.

When the user wants to move the fume removal device, the user may rotate the leveler 125 to move it upward and allow the caster 124 to contact the floor where the fume removal device is installed. In this state, the user can move the fume removal device by simply pushing the fume removal device. And, if the fume removal device is installed in the EFEM, the leveler 125 may be moved downward by turning the leveler 125 so that the fume removal device can be installed firmly without moving so that the leveler 125 can touch the floor.

The door 126 may be provided on the side surface 121 of the lower body 120 to selectively open and close. That is, the user can easily access the interior of the lower body 120 by opening and closing the door 126 .

A wafer cassette 200 on which a wafer is loaded is accommodated in the upper body 110 . Also, the wafer cassette 200 may be described as being supported by the lower body 120 . The wafer cassette 200 will be described in detail below.

7 is a perspective view showing a wafer cassette of a fume removal apparatus according to an example of the present invention, FIG. 8 is a perspective view and a partially enlarged view showing a wafer cassette of a fume removal apparatus according to an example of the present invention, FIG. It is a top view which shows the mounting table of the 1st wafer accommodating part of the fume removal apparatus which concerns on an example of invention.

7 to 9 , the wafer cassette 200 of the fume removal device according to an example of the present invention includes a case 210 , a first wafer accommodating part 220 , a second wafer accommodating part 230 , and heating. Member 240, perforated plate 250, upper hopper 260, purge gas supply port coupling part 270, sebum gas pipe (not shown), leveler 291, first sensor 292, second sensor (not shown) city) and a lighting unit 294 .

The case 210 may form the exterior of the wafer cassette 200 . The case 210 may be provided to be larger than the wafer to accommodate the wafer therein. The case 210 may be formed to be sealed except for a portion corresponding to the front opening 113 of the upper body 110 as shown in FIGS. 7 and 8 . In this case, the purge gas injected from the purge gas outlet 226 of the first wafer accommodating part 220 to be described later may flow and be discharged only inside the case 210 . That is, when the case 210 is not provided, the purge gas discharged to the wafer flows through the entire interior of the upper body 110 , and is used to remove fume from the wafer compared to the case where the case 210 is provided. The amount of purge gas is increased. In other words, the sealed structure of the case 210 may serve to save the amount of purge gas used to remove fume from the wafer. This may be explained as the sealing structure of the case 210 improves the fume removal efficiency of the wafer.

The case 210 may include a front opening 211 having a size corresponding to a position corresponding to the front opening 113 of the upper body 110 . The front opening 211 of the case 210 may function as a wafer entry/exit passage. In addition, the case 210 may be formed in a closed structure except for the front opening 211 as described above.

The case 210 may include an upper heater 241 and a leveler 291 on the upper surface 212 . The upper heater 241 and the leveler 291 will be described later.

In addition, the case 210 may include a first wafer accommodating part 220 , a second wafer accommodating part 230 , a side gas pipe 282 , and a rod heater (not shown) on the side surface 213 . The first wafer accommodating part 220 , the second wafer accommodating part 230 , the side gas pipe 282 , and the rod heater will be described later.

In addition, the case 210 may include a perforated plate 250 and an upper hopper 260 on the rear surface 214 . The perforated plate 250 and the upper hopper 260 will be described later.

In addition, the case 210 includes a lower heater 242 , a purge gas supply port coupling part 270 , a lower gas pipe (not shown), a first sensor 292 , and a second sensor (not shown) on the lower surface 215 . and a lighting unit 294 and the like. The lower heater 242 , the purge gas supply port coupling unit 270 , the lower gas pipe, the first sensor 292 , the second sensor, and the lighting unit 294 will be described later.

The first wafer accommodating unit 220 serves to support a wafer and supply a purge gas to the wafer. As shown in FIG. 8 , the first wafer receiving unit 220 may be provided on both sides of the side surface 213 of the case 210 . In addition, the first wafer accommodating unit 220 may include a plurality of mounting tables 221 spaced up and down on which one wafer can be loaded. A wafer may be allowed to enter and exit the space between the plurality of mounting tables 221 . In other words, the wafer transfer robot arm of the EFEM can transfer the wafer through the space between the plurality of mounting tables 221 . Through such a structure, the first wafer accommodating unit 220 may support a plurality of wafers to be stacked in a spaced apart state from each other.

The mounting table 221 may include, for example, an inclined portion 222 . As shown in FIGS. 8 and 9 , the inclined part 222 is a part of the loading table 221 that is provided to protrude toward the circular wafer loaded on the loading table 221 and has an inclination. A second purge gas outlet 226c, which will be described later, may be provided at the inclined portion 222 . The second purge gas outlet 226c supplies a purge gas to the front (in the direction of the front opening 211 ) (refer to FIG. 8 ) of the circular wafer loaded on the mounting table 221 to supply the purge gas to the entire wafer. make it possible That is, the inclined portion 222 of the placing table 221 and the second purge gas outlet 226c provided in the inclined portion 222 are provided when the purge gas is not supplied to the wafer loaded on the placing table 221 . It serves to keep the area free.

In addition, the mounting table 221 may include pins 223 for supporting the wafer. The mounting table 221 is provided with a plurality of pins 223 as an example to support the wafer. As an example, the pin 223 may have a thin rod shape as shown in FIG. 8 . When the wafer is supported by the pins 223 , a portion in which the wafer and other members come into contact to support the wafer is minimized, so that damage to the wafer by contact is minimized.

In the case of the mounting table 221, it may have a predetermined width (refer to w of FIG. 9). In this case, the purge gas supplied to the wafer loaded on the pin 223 is blocked by the mounting table 221 and the wafer, so that the vertical flow is limited and only flows in the horizontal direction. That is, when the mounting table 221 has a width to fill the space between the wafer and the case 210 , the vertical movement of the purge gas is limited by the mounting table 221 and the wafer, so the purge gas used for purging the wafer It has the advantage of saving the amount of This may be explained as improving the fume removal efficiency of the wafer in addition to the sealing structure of the case 210 mentioned above.

The mounting table 221 may include a purge gas inlet 224 for accommodating the side gas pipe 282 that supplies the purge gas. That is, the purge gas may be introduced into the loading table 221 through the purge gas inlet 224 .

In addition, the mounting table 221 may be provided with a purge gas flow path 225 and a purge gas outlet 226 . The purge gas flow path 225 is a flow path through which the purge gas introduced through the purge gas inlet 224 flows to be discharged through the purge gas outlet 226 . That is, the purge gas outlet 226 is a passage through which the purge gas introduced through the purge gas inlet 224 is discharged through the purge gas flow path 225 . The purge gas discharged through the purge gas outlet 226 is supplied to the wafer loaded on the mounting table 221 .

The purge gas flow path 225 may include a plurality of branch flow paths 225b, 225c, 225d, and 225e branching from the main flow path 225a. The purge gas flow path 225 includes, for example, a main flow path 225a, a first branch flow path 225b, a second branch flow path 225c, a third branch flow path 225d, and a fourth branch flow path 225e. can do. The first branch flow path 225b to the fourth branch flow path 225e may be sequentially referred to as going from the front (the direction in which the wafer is supplied) to the rear. The first branch flow path 225b to the fourth branch flow path 225e may be provided such that an angle formed with the main flow path 225a in a direction in which the purge gas is supplied becomes an obtuse angle. In addition, a flow path through which a relatively small amount of purge gas is to be injected among the first branch flow path 225b to the fourth branch flow path 225e forms a right angle or an acute angle with the main flow path 225a in the direction in which the purge gas is supplied. can be placed The diameters of the first branch flow path 225b, the second branch flow path 225c, the third branch flow path 225d, and the fourth branch flow path 225e may be different from each other. Here, the diameter may be understood as a concept including an index indicating the size of a polygon, such as width and width. As an example, the diameters of the first branch flow path 225b , the second branch flow path 225c , the third branch flow path 225d , and the fourth branch flow path 225e are from the first branch flow path 225b to the fourth branch flow path 225b . It may become smaller toward the flow path 225e. In addition, the diameters of the first branch flow path 225b, the second branch flow path 225c, the third branch flow path 225d, and the fourth branch flow path 225e are a first purge gas outlet 226b and a second branch flow path 225e, which will be described later. It may have a size corresponding to the purge gas outlet 226c, the third purge gas outlet 226d, and the fourth purge gas outlet 226e. Accordingly, the diameter may decrease from the first purge gas outlet 226b to the fourth purge gas outlet 226e. In this case, more purge gas is discharged from the purge gas outlet 226 for discharging the purge gas to the front of the wafer relatively. At this time, since the purge gas discharged to the wafer flows from the front side (the front opening 211 side) to the rear side (the perforated plate 250 side), a larger amount of the purge gas flows from the front side to the rear side of the wafer.

In addition, the mounting table 221 may be provided with a fixture (not shown). A rod-shaped support member (not shown) for fixing and supporting the plurality of loading tables 221 may be inserted into the fixture. That is, the plurality of loading tables 221 may be fixedly supported while being spaced apart from each other through the fixing member.

In addition, the mounting table 221 of the first wafer receiving unit 220 may be provided on both sides inside the case 210 of the wafer cassette 200, in this case, the width between the mounting tables 221 provided on both sides. (B, see FIG. 8) may be provided to be smaller than the diameter of the wafer. As mentioned above, this structure has an advantage in that the purge gas is supplied from the front of the wafer. However, loading the wafer on the mounting table 221 may be a problem, but in the present invention, a space is provided between the mounting tables 221 so that there is no problem in entering and exiting the wafer.

The second wafer accommodating part 230 serves to support the wafer. Also, the second wafer accommodating part 230 may be described as supporting the wafer by assisting the first wafer accommodating part 220 . As shown in FIG. 8 , the second wafer receiving part 230 may be provided on both sides of the side surface 213 of the case 210 , respectively. In addition, the second wafer accommodating part 230 may be provided at a relatively rear side compared to the first wafer accommodating part 220 . The second wafer receiving unit 230 may include a mounting table 231 and a pin 232 protruding from the mounting table 231 . The pins 232 serve to support the wafer from the bottom. The fins 232 of the second wafer accommodating part 230 may be provided in a thin rod shape having the same shape as the fins 223 of the first wafer accommodating part 220 , thereby minimizing the contact area with the wafer. can do.

The heating member 240 serves to heat the inside of the wafer cassette 200 . The heating member 240 may include, for example, an upper heater 241 , a lower heater 242 , and a rod heater (not shown). The upper heater 241 may be provided on the upper surface 212 of the case 210 . In addition, the lower heater 242 may be provided on the lower surface 215 of the case 210 . A plurality of the rod heaters may be provided on the side surface 213 of the case 210 . The heating member 240 may be evenly disposed on the upper surface 212 , the side surface 213 , and the lower surface 215 of the case 210 as shown in salpin to evenly heat the inside of the wafer cassette 200 .

The perforated plate 250 may be provided on the rear surface 214 of the case 210 as an example. In addition, the perforated plate 250 may include a plurality of intake holes 251 . The intake hole 251 is a passage through which fume and purge gas generated from the wafer accommodated in the wafer cassette 200 are discharged. The shape of the intake hole 251 may be provided in a straight line as shown in FIG. 8 as an example, but is not limited thereto. That is, the intake hole 251 may be formed in various ways, such as a circular shape, a polygonal shape, etc., if only the role of the exhaust passage for the fume and purge gas can be performed. However, preferably, the intake hole 251 may be provided such that the width increases toward the upper portion (refer to FIG. 8 ). In this case, there is an advantage that the fume and purge gas inside the wafer cassette 200 can be uniformly discharged from both upper and lower parts. This is, the fume and purge gas are discharged through the fume outlet 119 provided in the partition wall 101 corresponding to the lower surface of the upper body 110 through the upper hopper 260 provided on the rear surface of the perforated plate 250, This is because, due to the flow path of the fume and purge gas, a faster flow rate is formed in the lower portion of the wafer cassette 200 located relatively close to the fume outlet 119 than the upper portion.

The upper hopper 260 serves to guide the fume and purge gas discharged through the intake hole 251 of the perforated plate 250 to the fume outlet 119 of the upper body 110 . The upper hopper 260 may include, for example, an inclined portion 261 , a streamlined portion 262 , and a discharge passage 263 as shown in FIG. 7 . The inclined portion 261 is positioned at the upper portion of the upper hopper 260 and serves to guide the fume and purge gas discharged through the intake hole 251 toward the fume outlet 119 positioned at the lower portion. The streamlined portion 262 is located below the inclined portion 261 and serves to guide the fume and purge gas to the fume outlet 119 . The streamlined portion 262 may have a streamlined structure so that there is no dead area in which the fume and purge gas stagnate. The discharge passage 263 is provided under the streamlined portion 262 and may be inserted into the fume discharge port 119 . The fume and the purge gas discharged through the fume outlet 119 are introduced into the lower hopper 410 of the exhaust unit 400 to be described later, which will be described later.

The purge gas supply port coupling part 270 may be inserted into the hollow 301 of the base plate 300 and the purge gas supply port 118 of the upper body 110 as shown in FIG. 10 . The purge gas supply port coupling part 270 is coupled to the hollow 301 and the purge gas supply port 118 , and when coupled in this way, the purge gas supplied from the gas supply path (refer to 101a of FIG. 10 ) may be supplied. become possible. The purge gas supplied from the gas supply path 101a may be discharged to the wafer surface through a purge gas outlet 226 of the mounting table 221 through a purge gas pipe (not shown), which will be described later. The purge gas supply port coupling part 270 may include a groove 271 as an example. The groove 271 may be provided in a shape corresponding to the protrusion 118a of the upper body 110 . In this case, when the purge gas supply port coupling part 270 is inserted into the purge gas supply port 118 , the protrusion 118a is inserted into the groove 271 to form a strong coupling force. In addition, since the bonding force between the purge gas supply port 118 and the purge gas supply port coupling part 270 is improved through such a structure, leakage of the purge gas is prevented.

A purge gas pipe (not shown) serves to supply a purge gas connected to the purge gas supply port coupling part 270 to the purge gas inlet 224 of the first wafer receiving part 220 . The purge gas pipe may include, for example, a lower gas pipe (not shown) and a side gas pipe 282 . The lower gas pipe may be arranged along the lower surface 215 of the case 210 as an example. The lower gas pipe may connect the purge gas supply port coupling part 270 and the side gas pipe 282 . That is, the lower gas pipe may supply the purge gas supplied through the purge gas supply port coupling part 270 to the side gas pipe 282 . The side gas pipe 282 may be coupled to the purge gas inlet 224 to supply the purge gas to the purge gas flow path 225 as shown in FIG. 8 .

The leveler 291 serves to detect whether the wafer cassette 200 is installed horizontally. The leveler 291 may be, for example, a digital leveler. In this case, there is an advantage that the horizontal measurement value of the wafer cassette 200 sensed by the leveler 291 can be displayed through the display unit 520 of the interface unit 500 to be described later. In addition, a separate gauge (not shown) for displaying the measured value measured by the digital leveler may be provided on the interface unit 500 . In addition, when the measured value measured by the leveler 291 exceeds the reference value, that is, when the wafer cassette 200 is not installed horizontally (in the correct position), a warning message or a warning sound is output. A unit (not shown) may be provided. The warning output unit may be controlled by a controller (not shown) to be described later. Horizontal adjustment of the wafer cassette 200 is performed by the base plate 300 , which will be described later.

The first sensor 292 serves to detect the presence of a wafer in the wafer cassette 200 . As an example, the first sensor 292 may be provided on the lower surface 215 of the case 210 as shown in FIG. 8 , but is not limited thereto. The first sensor 292 may be connected to a control unit, and when it is determined by the first sensor 292 that there is no wafer inside the wafer cassette 200, the control unit may control the discharge of the purge gas to stop. have.

The second sensor (not shown) serves to detect whether the wafer loaded on the pins 223 and 232 of the mounting table 221,231 of the wafer cassette 200 protrudes forward, that is, whether the wafer is loaded in the correct position. do. The second sensor may be provided on the lower surface 215 of the case 210 , but is not limited thereto. The second sensor may be connected to the control unit, and the control unit may output a warning message or a warning sound through the warning output unit when it is determined that the wafer is not loaded in the correct position by the second sensor, and the EFEM wafer transfer robot arm Through this, it is possible to control the wafer to be loaded in place.

The lighting unit 294 serves to illuminate the inside of the wafer cassette 200 . As an example, the upper body 110 may include transparent plates 114a and 115a, and the wafer cassette 200 may also be made of a transparent material in which the case 200 is made of a transparent material. When light is illuminated inside the cassette 200 , the user can observe whether the operation inside the wafer cassette 200 is properly performed from the outside. The lighting unit 294 may be, as an example, an LED, but is not limited thereto.

10 is a cross-sectional view showing the coupling structure of the wafer cassette, the base plate, and the upper body of the fume removal apparatus according to one embodiment of the present invention.

4 and 10 , the fume removal apparatus according to an example of the present invention may further include a base plate 300 .

The base plate 300 is provided between the wafer cassette 200 and the partition wall 101 of the main body 100 to adjust the horizontal and height of the wafer cassette 200 . That is, the base plate 300 may include a horizontal adjustment structure. The base plate 300 may include, as an example, a hollow 301 , a height adjuster 310 , and a height fixture 320 . The purge gas supply port coupling part 270 of the wafer cassette 200 may be inserted into the hollow 301 of the base plate 300 . In addition, the height adjusting member 310 of the base plate 300 may move up and down by rotation as shown in FIG. 4 to adjust the distance between the base plate 300 and the partition wall 101 . The height fixture 320 of the base plate 300 passes through the base plate 300 and at least a portion is inserted into the partition wall 101 as shown in FIG. 4 to fix the base plate 300 to the main body 100 . can do. The height fixture 320 is provided with a screw as an example and may be screw-coupled to the body 100, but is not limited thereto.

Of course, a structure for adjusting the horizontality and height of the wafer cassette 200 itself may be provided directly. However, in an example of the present invention, even when a plurality of wafer cassettes 200 are mixed and used by applying the horizontal and height adjustment structure of the wafer cassette 200 to the base plate 300, each wafer cassette 200 is horizontally The advantage is that there is no need to adjust the

11 is a perspective view illustrating an exhaust portion of a fume removal device according to an example of the present invention.

Referring to FIG. 11 , the fume removal apparatus according to an example of the present invention may further include an exhaust unit 400 .

The exhaust unit 400 may suck in the fume generated from the wafer loaded in the wafer cassette 200 and the purge gas sprayed from the wafer cassette 200 and exhaust it to the outside. The exhaust unit 400 may include a lower hopper 410 , a first exhaust pipe 420 , a second exhaust pipe 430 , an exhaust pump 440 , and a connection port 450 .

The lower hopper 410 may be provided on the lower surface of the upper body 110 to the lower portion of the partition wall 101 . That is, the lower hopper 410 may be provided inside the lower body 120 . The lower hopper 410 communicates with the fume outlet 119 of the upper body 110 and serves to guide the flow of the fume and purge gas discharged through the fume outlet 119 . The lower hopper 410 may guide the fume and purge gas discharged through the fume outlet 119 to the first exhaust pipe 420 . The lower hopper 410 forms a double hopper structure together with the upper hopper 260 located in the upper body 110 . In one example of the present invention, it is possible to minimize the backflow of the fume and exhaust gas discharged through such a double hopper structure. In addition, the lower hopper 410 has a streamlined structure with an open top, so that a dead area in which fume and purge gas are stagnant can be minimized.

The first exhaust pipe 420 may connect the lower hopper 410 and the second exhaust pipe 430 . That is, the fume and exhaust gas introduced into the first exhaust pipe 420 through the lower hopper 410 may flow into the second exhaust pipe 430 . The first exhaust pipe 420 may include, for example, a connection pipe (not shown) and a connection end 422 . The connection pipe may couple the lower hopper 410 and the first exhaust pipe 420 . Accordingly, the connection pipe may include a sealing member so that the fume and exhaust gas do not leak from the connection end. In addition, the connection end 422 may be formed on the side of the first exhaust pipe 420 to be connected to a separate pipe (not shown). As an example, the connecting end 422 may communicate with a pipe (not shown) connecting the inside of the EFEM. In this case, there is an advantage that a fluid such as fume inside the EFEM can be removed by installing only a relatively simple piping structure. The connection end 422 is provided with an opening/closing member such as a damper, so that it can be controlled to open only when in use.

The second exhaust pipe 430 connects the first exhaust pipe 420 and the connection port 450 . An exhaust pump 440 may be provided inside the second exhaust pipe 430 , for example.

The exhaust pump 440 may control the flow direction and speed of a fluid on a flow path leading to the upper hopper 260 , the lower hopper 410 , the first exhaust pipe 430 , and the second exhaust pipe 430 . That is, the fume and purge gas inside the wafer cassette 200 may be discharged to the outside by the exhaust pump 440 , and the amount of exhaust per unit time of the fume and purge gas may be increased or decreased.

The exhaust pump 440 may be provided as a member for controlling the speed of the fluid by supplying compressed air through a compressor (not shown) without using a motor as an example, and this member will be referred to as a compressed air exhaust accelerator hereinafter. can However, it should be noted that the compressed air supplied to the compressed air discharge accelerator may be replaced with another fluid. In this case, there is an advantage in that the vibration transmitted to the fume removal device is minimized compared to the case of using a motor. In addition, in the case of a motor, continuous replacement is required, but in the case of the compressed air exhaust accelerator, this problem can be solved. 11 shows the structure of the compressed air exhaust accelerator in detail in cross section.

Referring to FIG. 11 , the compressed air discharge accelerator includes a first body 441 , a second body 442 , an expansion tube 443 , a compressed air moving unit 444 and a compressed air discharge unit 445 . can do.

As shown in FIG. 11 , the first body 441 and the second body 442 are hollow tubes, and at least some of them may be provided in a shape corresponding to each other to be coupled to each other. When the first body 441 and the second body 442 are coupled, a compressed air moving unit 444 and a compressed air discharging unit 445 may be provided between them. The compressed air moving unit 444 is a space in which compressed air introduced through an external compressor can flow, and the compressed air discharging unit 445 is the compressed air flowing through the compressed air moving unit 444 in the first body. It may be a passage introduced into the 441 and the second body 442 . In other words, the compressed air supplied to the compressed air discharge accelerator flows through the compressed air moving unit 444 that is the space between the first body 441 and the second body 442 and through the compressed air discharge unit 445 . It is introduced into the first body 441 and the second body 442 . At this time, since the compressed air is discharged along the compressed air discharge unit 445 after filling the compressed air moving unit 444 , there is an advantage that the discharged compressed air can be discharged evenly without being biased to one side. The compressed air discharge unit 445 may be manufactured in various sizes. In addition, the compressed air discharge unit 445 may be provided to be variable. Such a variable structure of the compressed air discharge unit 445 may be realized by providing, for example, the first body 441 and the second body 442 to be relatively movable. In this case, since the amount of compressed air discharged through the compressed air discharge unit 445 is variable, the exhaust speed of the exhaust gas discharged through the compressed air discharge accelerator may be changed.

The second body 442 may include an enlarged pipe portion 443 whose diameter increases toward the lower portion. In this case, the compressed air introduced into the first body 441 and the second body 442 flows toward the wide portion of the expansion tube 443 . This is because the pressure of the gas acting on the portion having a larger diameter is relatively smaller than that of the portion having the smaller diameter, so that the gas with the higher pressure tends to flow toward the lower portion. That is, the expansion tube 443 may serve to determine the direction of the flow of compressed air introduced into the first body 441 and the second body 442 . As such, when the flow of compressed air in the compressed air exhaust accelerator is generated, the fume and purge gas inside the wafer cassette 200 communicating through the upper hopper 260 , the lower hopper 410 and the first exhaust pipe 430 . It also affects the direction and speed of the discharge.

Referring to FIG. 13 , a valve 446 , a regulator 447 , and an operating air pressure sensor 448 may be additionally provided as components related to compressed air in the compressed air discharge accelerator. The valve 446 may be a member that opens and closes a flow path of compressed air. That is, whether compressed air is provided through the valve 446 may be determined. The valve 446 may be, for example, an on/off type valve, but is not limited thereto, and may be a valve that controls the passage amount of compressed air, such as a damper. The regulator 447 may maintain a constant speed or amount of compressed air passing through the regulator 477 . That is, in an example of the present invention, compressed air may be provided in a certain amount or at a constant speed to the compressed air exhaust accelerator through the regulator 447 . The working air pressure sensor 448 may sense the pressure of compressed air provided to the compressed air discharge accelerator. The working air pressure sensor 448 may be connected to a control unit, and the control unit may output the pressure value measured by the working air pressure sensor 448 to the display unit 520 to be described later, and the measured pressure value If it is different from the preset pressure value, a warning message may be output through the warning output unit.

In addition, the exhaust pump 440 may be provided with a tube 575a, at least a part of which is provided inside the exhaust pump 440 and communicates with the exhaust pump 440 . The tube 575a is connected to an exhaust gas pressure sensor 575 to be described later to measure the pressure of the exhaust gas passing through the exhaust pump 440 . The tube 575a may have an end 575b facing the exhaust gas exhaust direction. In this case, a negative pressure is formed in the exhaust gas pressure sensor 575 connected to the tube 575a, and it is confirmed through a number of experiments that a more accurate exhaust pressure is measured when the end 575b of the tube 575a takes a different direction. did.

The connection port 450 may connect the second exhaust pipe 430 and the fume outlet 123 of the lower body 120 . That is, the fume and purge gas flowing to the exhaust pump 440 inside the second exhaust pipe 430 through the connection port 450 may be discharged to the outside. The connection port 450 is coupled to one side of the fume outlet 123 of the lower body 120 , and a discharge pipe (not shown) is provided at the other side to discharge the fume and purge gas to the outside.

12 is a perspective view illustrating an interface portion of a fume removal device according to an example of the present invention.

* Referring to FIG. 12 , the fume removal apparatus according to an example of the present invention may further include an interface unit 500 .

The interface unit 500 may include a plurality of components for a user to operate the operation of the fume removal device according to an example of the present invention. The interface unit 500 may be provided on the side surface 121 of the lower body 120 as an example, but is not limited thereto.

The interface unit 500 is, as an example, the EMO switch 510 , the display unit 520 , the operation unit 530 , the compressed air gauge 540 , the purge gas gauge 541 , the communication port 550 , and the compressed air connection port. 560 and a purge gas connection port 570 .

The EMO switch 510 may quickly cut off the power in case of an emergency. That is, the ㄸMO switch 510 may be an operation stop or power cut-off button used in an emergency. That is, when the user presses the EMO switch 510 , the purge gas supplied to the wafer cassette 200 , the power transferred to the heating member 240 , the compressed air transferred to the exhaust pump 440 , etc. are blocked and the operation is stopped. can be stopped Of course, a power switch separate from the EMO switch 510 may be provided.

The display unit 520 may output the current operation status of the fume removal apparatus according to an example of the present invention. The display unit 520 may output, as an example, measured values measured by the digital leveler, the first sensor 292 , the second sensor, and the working air pressure sensor 448 . The display unit 520 may function as a warning output unit and may output a warning message if necessary. Also, the display unit 520 may be connected to the control unit and controlled by the control unit. The display unit 520 is provided as a touch screen as an example, and may serve as a manipulation unit 530 to be described later.

In addition, the interface unit 500 may further include a heater temperature control unit 521 for controlling the heating member 240 for controlling the internal temperature of the wafer cassette 200 and outputting the temperature of the heating member 240 . can The heater temperature control unit 521 may be provided separately from the display unit 520 and the operation unit 530 to be described later, but if omitted, the heater temperature control unit 521 is operated by the display unit 520 and the operation unit 530 . function can be performed.

The manipulation unit 530 may function as a means for the user to input a command to control the operation of the fume removal apparatus according to an example of the present invention. The user may press the purge gas through the operation unit 530 to determine whether the purge gas is supplied and the supply pressure (supply amount, supply time), the temperature inside the wafer cassette 200 (whether the heating member 240 operates), and the exhaust pump 440 . Air supply and supply pressure can be manipulated. In addition, items manipulated by the manipulation unit 530 may be output through the display unit 520 and configured so that the user can check them.

The compressed air gauge 540 may output the pressure of compressed air provided to the compressed air exhaust accelerator which is an example of the exhaust pump 440 of the exhaust unit 400 . The compressed air gauge 540 may be connected to the working air pressure sensor 448 to output a pressure value sensed through the working air pressure sensor 448 .

The purge gas gauge 541 may output the pressure of the purge gas purged into the wafer cassette 200 . The purge gas gauge 541 may be connected to the purge gas pressure sensor 573 to output a pressure value sensed through the purge gas pressure sensor 573 .

The communication port 550 may be provided to communicate with the EFEF and the semiconductor process main equipment. That is, a communication cable capable of communicating with other equipment may be connected to the communication port 550 .

The compressed air connection port 560 may be connected to an external compressor to supply compressed air to the compressed air discharge accelerator. That is, the compressed air discharged through the compressor may be supplied to the compressed air discharge accelerator through the compressed air connection port 560 .

The purge gas connection port 570 may be connected to an external purge gas supply source (not shown) to supply a purge gas to the wafer cassette 200 . That is, the purge gas discharged through the purge gas supply source may be supplied to the wafer cassette 200 through the purge gas connection port 570 .

Referring to FIG. 13 , the fume removal device according to an example of the present invention further includes a valve 571 , a regulator 572 , a purge gas pressure sensor 573 , and a filter 574 as a configuration for supplying a purge gas. can do.

The valve 571 may be a member that opens and closes the flow path of the purge gas. That is, whether the purge gas is provided through the valve 571 may be determined. The valve 571 may be, for example, an on/off type valve, but is not limited thereto, and may be a valve that controls even a passage amount of the purge gas, such as a damper. The regulator 572 may maintain a constant speed or amount of the purge gas passing through the regulator 572 . That is, in an example of the present invention, the purge gas may be provided to the wafer cassette 200 in a predetermined amount or at a constant rate through the regulator 572 . The purge gas pressure sensor 573 may sense the pressure of the purge gas provided to the wafer cassette 200 . The purge gas pressure sensor 573 may be connected to a control unit, and the control unit may output a pressure value measured by the purge gas pressure sensor 573 to the display unit 520, and the measured input value is If it is different from the set input value, a warning message may be output through the warning output unit. The filter 574 serves to filter the purge gas supplied through the flow path of the purge gas. As an example, the supplied purge gas may be nitrogen (N ₂ ) In this case, unnecessary fluids may be filtered through a filter.

The power connection port 580 may be coupled to a power cable for supplying power to the fume removal device according to an example of the present invention. That is, power may be supplied to the fume removal device through the power connection port 580 .

In addition, the fume removal apparatus according to an example of the present invention may further include an exhaust gas pressure sensor 575 . The exhaust gas pressure sensor 575 may sense the pressure of exhaust gas (fume and purge gas) that is at least partially connected to the tube 575a provided in the exhaust pump 440 and exhausted through the exhaust.

The fume removal apparatus according to an example of the present invention may further include a control unit. As mentioned above, the control unit includes a digital leveler, a first sensor 292 , a second sensor, a working air pressure sensor 448 , a purge gas pressure sensor 573 , a display unit 520 , an operation unit 530 , and a warning. It may be connected to a configuration such as an output unit. That is, the control unit may be connected to various sensors, a configuration for inputting an operation control command, a configuration for displaying the state of operation, etc. to control the operation of the fume removal device according to an example of the present invention, and read their values or can be controlled However, it goes without saying that even a configuration not mentioned may be controlled by the control unit.

Hereinafter, the operation of the fume removal device according to an example of the present invention will be described in detail with reference to the drawings.

13 is a configuration diagram for explaining a flow path of a purge gas, compressed air, and fume in the fume removal apparatus according to an example of the present invention.

First, the heating member 240 provided in the wafer cassette 200 operates to adjust the temperature inside the wafer cassette 200 to the temperature set by the user. In addition, wafers are stacked on the pins 223 of the first wafer receiving unit 220 of the wafer cassette 200 and the pins 232 of the second wafer receiving unit 230 of the wafer cassette 200 .

Thereafter, a purge gas (eg, nitrogen (N ₂ ) ) gas). Meanwhile, compressed air is supplied to the compressed air exhaust accelerator of the exhaust unit 400 . The supply of the purge gas and the supply of compressed air will be described in detail below with reference to FIG. 13 .

First, looking at the supply process of the purge gas, the purge gas is supplied from a purge gas supply source (not shown) through a flow path (a). The purge gas supplied to the flow path passes through a valve 571 that is opened and closed automatically or manually, and is changed to a pressure preset by the user in the regulator 572 and is supplied to a preset pressure by the purge gas pressure sensor 573 . Whether or not it is being sensed is filtered through a filter 574 and then supplied into the wafer cassette 200 . In more detail, the purge gas filtered by the filter 574 is transferred to the purge gas supply port coupling part 270 provided on the lower surface 215 of the wafer cassette 200 through the gas supply path 101a of the main body 100 . It flows and flows through the side gas pipe 282 through the lower gas pipe communicating with the purge gas supply port coupling part 270 through the purge gas flow path 225 of the mounting table 221 of the first wafer receiving part 220 . It is discharged to the purge gas outlet 226 . Looking at the flow of the purge gas in the mounting table 221 of the first wafer accommodating part 220 in more detail, as an example, the purge gas flow path 225 may be provided to have a larger diameter as it is positioned in the front (refer to FIG. 8 ). In this case, the largest amount of purge gas flows to the first purge gas flow path 225b positioned at the front, and is discharged through the first purge gas outlet 226b. Through this, since a large amount of purge gas flows from the front of the wafer, there is an advantage in that a dead area on the wafer that does not come into contact with the purge gas does not occur. In particular, the second purge gas outlet 226c is provided on the inclined portion 222 protruding toward the center of the loaded wafer so that the purge gas can flow even to the center of the wafer.

The purge gas discharged into the wafer cassette 200 in this way is together with the process gas (fume) remaining on the surface of the wafer and the intake hole 251 of the perforated plate 250 provided on the rear surface 214 of the wafer cassette 200 . ) is released through The fume and purge gas discharged through the intake hole 251 are the upper hopper 260, the lower hopper 410, the first exhaust pipe 420, the second exhaust pipe 430, the exhaust pump 440 and the connection port ( 450) may be sequentially flowed and discharged to the outside. This process will be described in detail below together with the process of supplying compressed air.

Compressed air is discharged from a compressor (not shown) and supplied to the flow path (b). The compressed air supplied to the flow path passes through a valve 446 that is opened and closed automatically or manually, and is changed to a pressure preset by the user in the regulator 447, and is supplied to a pressure preset by the operating air pressure sensor 448. It is sensed whether or not it is being supplied and then supplied to the compressed air exhaust accelerator. The compressed air supplied to the compressed air discharge accelerator flows into the first body 441 and the second body 442 through the compressed air discharge unit 445 after flowing through the compressed air moving unit 444 . The compressed air introduced into the first body 441 and the second body 442 has a flow direction determined by the expansion tube 443 to flow. That is, referring to FIG. 11 , the compressed air introduced into the first body 441 and the second body 442 flows toward the lower portion in which the diameter of the expansion tube 443 gradually increases. Such a flow of compressed air also affects the inside of the wafer cassette 200, which is a communicating space. Accordingly, when compressed air having a higher speed or compressed air having a higher pressure is supplied to the compressed air discharge accelerator, the speed of the fume and purge gas discharged through the perforated plate 250 is also increased.

That is, the exhaust speed of the fume and purge gas inside the wafer cassette 200 is controlled according to the compressed air supplied to the air amplifier, so that the upper hopper 260, the lower hopper 410, the first exhaust pipe 420, and the second The exhaust pipe 430, the exhaust pump 440, and the connection port 450 sequentially flow and are discharged to the outside (c). In addition, some of the fume and purge gas discharged to the outside may be introduced into the exhaust gas pressure sensor 575 and the pressure may be sensed (d).

The fume of the wafer loaded on the wafer cassette 200 can be efficiently removed through this series of processes. In addition, the series of processes may be performed when a command is input through the manipulation unit 530 by the user, and various numerical values such as the pressure of the purge gas and the pressure of the compressed air may be controlled. In addition, operation information may be output through the display unit 520 , and the user may check the operation state through the case 210 of the upper body 110 and the wafer cassette 200 , which are at least partially transparently provided. may be

In the above, even though it has been described that all components constituting the embodiment of the present invention operate by being combined or combined into one, the present invention is not necessarily limited to this embodiment. That is, within the scope of the object of the present invention, all the components may operate by selectively combining one or more. In addition, terms such as "include", "compose" or "have" described above mean that the corresponding component may be inherent unless otherwise stated, so excluding other components Rather, it should be construed as being able to include other components further. All terms, including technical and scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which the present invention belongs, unless otherwise defined. Terms commonly used, such as those defined in the dictionary, should be interpreted as being consistent with the contextual meaning of the related art, and are not interpreted in an ideal or excessively formal meaning unless explicitly defined in the present invention.

The above description is merely illustrative of the technical spirit of the present invention, and various modifications and variations will be possible without departing from the essential characteristics of the present invention by those skilled in the art to which the present invention pertains. Therefore, the embodiments disclosed in the present invention are not intended to limit the technical spirit of the present invention, but to explain, and the scope of the technical spirit of the present invention is not limited by these embodiments. The protection scope of the present invention should be construed by the following claims, and all technical ideas within the equivalent range should be construed as being included in the scope of the present invention.

100: body
200: wafer cassette
300: base plate
400: exhaust
500: interface unit

Claims (5)

A fume removal device for removing fumes by supplying a purge gas to a wafer, comprising:
wafer cassette; and
Including a first mounting table for supporting the wafer, and a plurality of mounting units provided in the inside of the wafer cassette,
The first loading stand,
a pin provided on a curved surface of the side surfaces of the first mounting table to directly support the wafer;
a plurality of purge gas outlets provided on the side surface of the first mounting table to supply a purge gas to the inside of the wafer cassette; and
and a purge gas flow path provided in the first loading table to supply the purge gas to the inside of the wafer cassette through the plurality of purge gas outlets,
A portion of the plurality of purge gas outlets is formed on a flat surface of the side surfaces of the first loading table, and the remainder of the plurality of purge gas outlets is formed on the curved surface of the side surfaces of the first loading table,
The purge gas flow path includes a main flow path and a plurality of branch flow paths branched from the main flow path and respectively connected to the plurality of purge gas outlets. A fume removal device for removing fumes by supplying a purge gas to a wafer, comprising:
wafer cassette; and
It is provided in the inside of the wafer cassette and includes a plurality of loading tables including a first loading table,
The first loading stand,
a pin protruding in a horizontal direction from a side surface of the first mounting table to directly support the wafer;
a plurality of purge gas outlets provided on the side surface of the first mounting table to supply a purge gas to the inside of the wafer cassette; and
and a purge gas flow path provided in the first loading table to supply the purge gas to the inside of the wafer cassette through the plurality of purge gas outlets,
The purge gas passage includes a main passage and a plurality of branch passages branched from the main passage and respectively connected to the plurality of purge gas outlets. According to claim 1,
The fume removal apparatus further comprising an exhaust unit provided inside the wafer cassette to exhaust the fume of the wafer loaded in the wafer cassette. According to claim 1,
Formed in the wafer cassette so as to communicate with the EFEM in order to receive the wafer from an Equipment Front End Module (EFEM) provided on one side of the fume removal device, or to discharge the wafer loaded inside the wafer cassette to the EFEM A fume removal device further comprising a front opening. According to claim 1,
Further comprising an exhaust unit provided in the inside of the wafer cassette to exhaust the fume of the wafer loaded in the wafer cassette,
The exhaust unit,
a lower hopper provided to guide the purge gas and fume exhausted from the wafer cassette;
a first exhaust pipe connected to the lower hopper to exhaust the purge gas and fume; and
A fume removal device formed on a side surface of the first exhaust pipe and including a connection end communicating with the inside of the EFEM to remove the internal fluid of the EFEM (equipment front end module) provided on one side of the fume removal device.

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