KR20230004562A - 배선 기판 및 배선 기판의 제조 방법 - Google Patents

배선 기판 및 배선 기판의 제조 방법 Download PDF

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Publication number
KR20230004562A
KR20230004562A KR1020227038545A KR20227038545A KR20230004562A KR 20230004562 A KR20230004562 A KR 20230004562A KR 1020227038545 A KR1020227038545 A KR 1020227038545A KR 20227038545 A KR20227038545 A KR 20227038545A KR 20230004562 A KR20230004562 A KR 20230004562A
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KR
South Korea
Prior art keywords
wiring
wiring board
substrate
less
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020227038545A
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English (en)
Korean (ko)
Inventor
세이지 다케
슈지 가와구치
지아키 하츠타
Original Assignee
다이니폰 인사츠 가부시키가이샤
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Application filed by 다이니폰 인사츠 가부시키가이샤 filed Critical 다이니폰 인사츠 가부시키가이샤
Publication of KR20230004562A publication Critical patent/KR20230004562A/ko
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/364—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith using a particular conducting material, e.g. superconductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q5/00—Arrangements for simultaneous operation of antennas on two or more different wavebands, e.g. dual-band or multi-band arrangements
    • H01Q5/20—Arrangements for simultaneous operation of antennas on two or more different wavebands, e.g. dual-band or multi-band arrangements characterised by the operating wavebands
    • H01Q5/22—RF wavebands combined with non-RF wavebands, e.g. infrared or optical
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/303—Assembling printed circuits with electric components, e.g. with resistors with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0108—Transparent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0158—Polyalkene or polyolefin, e.g. polyethylene [PE], polypropylene [PP]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09681—Mesh conductors, e.g. as a ground plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10098—Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Structure Of Printed Boards (AREA)
  • Details Of Aerials (AREA)
KR1020227038545A 2020-05-01 2021-04-28 배선 기판 및 배선 기판의 제조 방법 Ceased KR20230004562A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020081050 2020-05-01
JPJP-P-2020-081050 2020-05-01
PCT/JP2021/017032 WO2021221119A1 (ja) 2020-05-01 2021-04-28 配線基板及び配線基板の製造方法

Publications (1)

Publication Number Publication Date
KR20230004562A true KR20230004562A (ko) 2023-01-06

Family

ID=78374123

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020227038545A Ceased KR20230004562A (ko) 2020-05-01 2021-04-28 배선 기판 및 배선 기판의 제조 방법

Country Status (6)

Country Link
US (2) US12156337B2 (https=)
EP (1) EP4145621A4 (https=)
JP (2) JP7667960B2 (https=)
KR (1) KR20230004562A (https=)
CN (1) CN115428259A (https=)
WO (1) WO2021221119A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI818257B (zh) * 2021-05-07 2023-10-11 財團法人工業技術研究院 透明天線及其製作方法
JP2022178307A (ja) * 2021-05-20 2022-12-02 イビデン株式会社 プリント配線板
TWI814207B (zh) * 2022-01-12 2023-09-01 友達光電股份有限公司 天線模組及顯示裝置
CN114465008A (zh) * 2022-02-15 2022-05-10 武汉大学 天线的制造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5636735B2 (https=) 1977-01-26 1981-08-26
JP2011066610A (ja) 2009-09-16 2011-03-31 Dainippon Printing Co Ltd 透明アンテナ
JP5695947B2 (ja) 2010-03-25 2015-04-08 ソニーモバイルコミュニケーションズ株式会社 アンテナ装置および携帯機器

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050079903A1 (en) * 2002-04-18 2005-04-14 Hirokazu Taketomi Cell phone and built-in antenna thereof
WO2005069713A1 (ja) * 2004-01-13 2005-07-28 Dai Nippon Printing Co., Ltd. 電磁波シールドシート及びその製造方法
JP4151074B2 (ja) * 2004-03-30 2008-09-17 Ｔｏｔｏ株式会社 アンテナ装置およびアンテナ装置の製造方法
JP5252473B2 (ja) * 2006-10-19 2013-07-31 独立行政法人産業技術総合研究所 導電パターン形成フィルムと、そのための導電パターン形成方法及び導電パターン形成装置
JP2010239259A (ja) * 2009-03-30 2010-10-21 Sumitomo Osaka Cement Co Ltd 透明平面アンテナ及び粘着剤層付き透明平面アンテナ
JP5636735B2 (ja) 2009-09-24 2014-12-10 大日本印刷株式会社 透明アンテナ用エレメント及び透明アンテナ
US8237213B2 (en) * 2010-07-15 2012-08-07 Micron Technology, Inc. Memory arrays having substantially vertical, adjacent semiconductor structures and the formation thereof
JP5927927B2 (ja) * 2012-01-18 2016-06-01 新日鐵住金株式会社 現地溶接性に優れるラインパイプ用高強度熱延鋼板およびその製造方法
JP2014110514A (ja) * 2012-11-30 2014-06-12 Toppan Forms Co Ltd アンテナ構造体、通信機器及びアンテナ構造体の製造方法
WO2014156827A1 (ja) * 2013-03-27 2014-10-02 富士フイルム株式会社 導電シートおよびその製造方法、タッチパネル
JP6046867B2 (ja) 2014-12-26 2016-12-21 株式会社フジクラ 配線体、配線基板、タッチセンサ、及び配線体の製造方法
WO2016143201A1 (ja) * 2015-03-06 2016-09-15 コニカミノルタ株式会社 透明電極とその製造方法及び有機エレクトロルミネッセンス素子
TWI652698B (zh) * 2016-03-08 2019-03-01 日商藤倉股份有限公司 導線體、導線基板及觸控感測器
JP6597459B2 (ja) 2016-04-05 2019-10-30 住友金属鉱山株式会社 導電性基板、導電性基板の製造方法
TWI681872B (zh) * 2017-07-18 2020-01-11 日商旭化成股份有限公司 具有導電性圖案區域之構造體及其製造方法、積層體及其製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5636735B2 (https=) 1977-01-26 1981-08-26
JP2011066610A (ja) 2009-09-16 2011-03-31 Dainippon Printing Co Ltd 透明アンテナ
JP5695947B2 (ja) 2010-03-25 2015-04-08 ソニーモバイルコミュニケーションズ株式会社 アンテナ装置および携帯機器

Also Published As

Publication number Publication date
WO2021221119A1 (ja) 2021-11-04
US20250016928A1 (en) 2025-01-09
US20230062683A1 (en) 2023-03-02
JPWO2021221119A1 (https=) 2021-11-04
CN115428259A (zh) 2022-12-02
US12156337B2 (en) 2024-11-26
JP7667960B2 (ja) 2025-04-24
JP2025103028A (ja) 2025-07-08
EP4145621A1 (en) 2023-03-08
EP4145621A4 (en) 2024-04-03
TW202147687A (zh) 2021-12-16

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