KR20220163475A - Polymer film peeling method, electronic device manufacturing method, and peeling device - Google Patents

Abstract

Step A of preparing a laminate in which a polymer film having a circuit pattern and/or functional element in close contact with an inorganic substrate is prepared; Step B of forming a separation portion between the polymer film and the inorganic substrate at an end of the laminate; A polymer film peeling method comprising step C of separating the polymer film from the inorganic substrate while keeping the polymer film substantially flat by bending the substrate in a direction away from the polymer film.

Description

Polymer film peeling method, electronic device manufacturing method, and peeling device

The present invention relates to a method for peeling a polymer film, a method for manufacturing an electronic device, and a peeling device.

BACKGROUND ART In recent years, for the purpose of reducing the weight of functional elements such as semiconductor elements, MEMS elements, and display elements, reducing the size and thickness, and increasing flexibility, technology development of forming these elements on polymer films has been actively conducted. That is, as materials for base materials of electronic parts such as information communication devices (broadcasting devices, mobile radios, portable communication devices, etc.), radars, high-speed information processing devices, etc., conventionally, they have heat resistance and high frequency signal bands of information communication devices. Although ceramics capable of responding to (reaching the GHz band) have been used, ceramics are not flexible and have the disadvantage of being difficult to thin and limiting their applicable fields. Recently, polymer films have been used as substrates.

In forming functional elements such as semiconductor elements, MEMS elements, and display elements on the surface of a polymer film, it is ideal to process them in a so-called roll-to-roll process that takes advantage of the flexibility that is a characteristic of polymer films. However, in industries such as the semiconductor industry, the MEMS industry, and the display industry, process technologies targeting rigid flat substrates such as wafer bases or glass substrate bases have been built up to now. Therefore, in order to form a functional element on a polymer film using the existing infrastructure, the polymer film is bonded to a rigid support containing an inorganic material such as a glass plate, a ceramic plate, a silicon wafer, a metal plate, and the like, and a desired element is placed thereon. A process of peeling from the support after formation is used.

Conventionally, as a method of peeling a polymer film from a support, a method of exfoliating by weakening the adhesive force between the polymer film and the support by irradiating laser light is known (eg, see Patent Document 1).

Patent Document 1: Japanese Patent Laid-Open No. 10-125931

However, in the method of Patent Literature 1, since the entire surface of the support is irradiated with laser light, there is a problem that a large-scale irradiation device for irradiating the laser light is required. In addition, since the laser light is irradiated, there is a problem that seizure or the like occurs on the polymer film, which affects the quality of the polymer film. In addition, there is a concern that circuits and devices formed on the surface of the polymer film and elements mounted on the polymer film may be irradiated by leaking laser light or that the quality may be affected by the generation of shock waves in laser heating. Regarding mechanical peeling, there has been concern about damage caused by stress to the polymer film itself due to deformation of the polymer film, and affecting the quality of circuits and devices formed on the surface of the polymer film and elements mounted on the polymer film.

The present invention has been made in view of the above-mentioned problems, and its object is to easily form a polymer film inorganically without affecting the quality of a polymer film, a circuit or device formed on the surface of the polymer film, and an element mounted on the polymer film. It is to provide a peeling method for a polymer film capable of peeling from a substrate, a method for manufacturing an electronic device, and a peeling device.

The present inventors conducted intensive research on a method for peeling a polymer film, a method for manufacturing an electronic device, and a peeling device. As a result, by adopting the following configuration, it is possible to easily peel the polymer film from the inorganic substrate without affecting the quality of the polymer film, circuits or devices formed on the surface of the polymer film, and elements mounted on the polymer film. Having discovered what is possible, we have come to complete the present invention.

That is, the present invention provides the following.

(1) Step A of preparing a laminate in which a polymer film on which circuit patterns and/or functional elements are formed and an inorganic substrate are in close contact with each other;

Step B of forming a peeling portion between the polymer film and the inorganic substrate at the end of the laminate;

and step C of peeling the polymer film from the inorganic substrate while maintaining the polymer film substantially flat by bending the inorganic substrate in a direction away from the polymer film.

According to the above configuration, it is not mechanically peeled off, and since the inorganic substrate is bent in a direction away from the polymer film, the polymer film is peeled without bending (substantially flat), so that stress is not applied to the polymer film. , it is possible to easily peel the polymer film from the inorganic substrate without affecting the quality.

(2) In the configuration of (1) above,

The step C,

After the step B, a static pressure difference is provided between the non-adhesive surface of the inorganic substrate that is not in close contact with the polymer film and the peeling portion, and the inorganic substrate is bent in a direction away from the polymer film, thereby forming the polymer film It is preferable that it is a process of peeling from the said inorganic substrate, maintaining a substantially flat surface.

According to the configuration, the polymer film is not peeled off mechanically, and the polymer film is peeled off from the inorganic substrate by a static pressure difference between the non-stick surface and the peel portion, and the polymer film is peeled off without bending (substantially flat) the polymer film. Therefore, it is possible to easily peel the polymer film from the inorganic substrate without applying stress to the polymer film and without affecting its quality.

(3) In the configuration of (1) or (2) above,

The step C,

Step D-1 of arranging a roller or substrate contact on the non-adhesion surface side of the inorganic substrate and pressing the inorganic substrate in the direction of the peeling portion by the roller or substrate contact;

Step D-2 of providing the static pressure difference by setting the non-adhesive surface side to atmospheric pressure while setting the peeling portion to atmospheric pressure;

After Step D-1 and Step D-2, Step D of moving the roller or substrate contactor in parallel with the non-adhesion surface of the inorganic substrate, and proceeding with the separation in accordance with the movement of the roller or substrate contactor. It is preferable to include -3.

According to the above configuration, since a roller or substrate contactor is provided, its surface is moved parallel to the non-adhesion surface of the inorganic substrate, and the peeling is advanced according to the movement of the roller, the peeling speed can be controlled. . As a result, excessive load applied to the polymer film can be suppressed.

(4) In the configurations of (1) to (3) above,

The step C,

It is preferable to make the pressure difference between the non-adhesion surface side of the said inorganic substrate and the said peeling part a pressure higher than atmospheric pressure.

According to the above configuration, the static pressure difference is provided by setting the non-adhesive surface side to atmospheric pressure or lower and then setting the peeling portion to a pressure higher than atmospheric pressure (Case 1), or by setting the non-adhesive surface side to atmospheric pressure or higher After that, the polymer film is separated from the inorganic substrate by making the pressure difference higher than the atmospheric pressure by setting the peeling portion to a pressure higher than the pressure on the non-adhesive surface side (Case 2). Since the non-adhesive surface side is set to atmospheric pressure or higher, the required utility is only high-pressure gas or (in the case of Case 1) a combination of vacuum and high-pressure, and the high-pressure gas is also about 3 atm or less (pressure difference ( If it is 2.5 atm - 1 atm), peeling becomes possible by a simple configuration of up to 1.5 atm).

As an example of the above configuration, a mesh-like sheet may be disposed. When a mesh type sheet is disposed between the polymer film and the roller or substrate contactor, the polymer film after peeling can be maintained.

(5) In the configuration of (1) to (4) above,

The step C,

Step E of disposing an embedding member or spacer on the non-adhesive surface side of the polymer film and pressing the inorganic substrate in the direction of the peeling portion with a porous flexible body while embedding the functional element in the embedding member or spacer It is preferable to include -1 and step E-2 of providing the said static pressure difference by making the non-adhesion surface side of the said inorganic substrate below atmospheric pressure, and making the said peeling part atmospheric pressure.

According to the above configuration, the pressure difference is provided by setting the non-adhesive surface side to atmospheric pressure or higher, and then setting the peeling portion to a pressure higher than the pressure on the non-adhesive surface side, thereby removing the polymer film from the inorganic substrate. peel off Since the non-adhesive surface side is set to atmospheric pressure or higher, the polymer film after peeling can be maintained.

Further, according to the configuration of (2) above, in a state where the circuit pattern and/or the functional element are embedded in the embedding member or spacer, the static pressure difference is provided and the polymer film is peeled off from the inorganic substrate. , It is possible to suppress an excessive load applied to the polymer film at the location where the functional element is located.

(6) In the configuration of (1) above,

The step C,

After the step B, it is preferable to separate the polymer film from the inorganic substrate by applying a dynamic pressure to the peeling portion while keeping the polymer film substantially flat.

According to the configuration, the polymer film is not peeled off mechanically, and the polymer film is peeled from the inorganic substrate by applying a dynamic pressure to the peeling portion, and the polymer film is peeled off without bending (substantially flat). It is possible to easily peel the polymer film from the inorganic substrate without applying stress and without affecting the quality.

(7) In the configuration of (1) or (6) above,

The step C,

Step F-1 of displacing the inorganic substrate to the side of the non-adhesive surface that is not in close contact with the polymer film;

It is preferable to include step F-2 of applying the dynamic pressure by applying a flow of gas to the peeling portion while setting the non-adhesive surface side of the inorganic substrate to less than atmospheric pressure.

According to the above configuration, the inorganic substrate is displaced to the non-adhesive surface side, the non-adhesive surface side is set to less than atmospheric pressure, and a flow of gas is applied to the peeling portion, thereby easily peeling the polymer film without bending (substantially flat). can do.

(8) In the configuration of (1), (6) or (7) above,

The step C,

Step G-1 of arranging a roller or substrate contact on the non-adhesion surface side of the inorganic substrate and pressing the inorganic substrate in the direction of the peeling portion by the roller or substrate contact;

Step G-2 of applying the dynamic pressure by applying a flow of fluid to the peeling portion;

After Step G-1 and Step G-2, Step G of moving the roller or substrate contactor in parallel with the non-adhesion surface of the inorganic substrate, and advancing the peeling in accordance with the movement of the roller or substrate contactor. It is preferable to include -3.

According to the above configuration, since a roller or substrate contactor is provided, its surface is moved parallel to the non-adhesion surface of the inorganic substrate, and the peeling is advanced according to the movement of the roller, the peeling speed can be controlled. . As a result, excessive load applied to the polymer film can be suppressed.

(9) In the configuration of (7) or (8) above,

It is preferable that the said displacement is a curve, and the minimum radius of curvature of the said curve is 350 mm or more.

(10) In the configuration of (1) above,

The step C,

After step B, the laminate is installed and fixed so that the polymer film surface of the laminate is in contact with the vacuum adsorption plate, a partition wall is provided on the side surface of the laminate, and gas is then supplied to the peeling portion by a nozzle. It is preferable that it is a step of peeling the polymer film while maintaining it substantially flat by injecting and applying pressure.

According to the configuration, the polymer film is not peeled off mechanically, and the polymer film is peeled off from the inorganic substrate by applying pressure to the peeling portion, and the polymer film is peeled off without bending (approximately flat) the polymer film. It is possible to easily peel the polymer film from the inorganic substrate without applying stress and without affecting the quality. In addition, since the barrier rib is provided on the side surface of the laminate, when the inorganic substrate is separated, it can be limited only to the direction away from the polymer film.

(11) In the configuration of (1) or (10) above,

The step C,

Step H-1 of placing a rough flat plate parallel to the inorganic substrate and not in contact with the inorganic substrate;

It is preferable to include step H-2 of applying pressure to the peeling portion by injecting gas into the peeling portion while setting the side of the non-adhesive surface of the inorganic substrate to the polymer film at atmospheric pressure or low pressure.

According to the above configuration, when the inorganic substrate is peeled off, there is no general bending of the inorganic substrate. Therefore, it can peel efficiently.

(12) In the configuration of (1), (10) or (11) above,

The step C,

Step J-1 of vacuum adsorbing the polymer film;

Step J-2 of providing a wall so as to also surround the nozzle portion and placing the gas injected into the layered body in a shielded space that does not blow out from the peeling portion;

It is preferable to include a step J-3 of applying pressure from a nozzle and injecting gas after the step J-1 and the step J-2.

According to the above configuration, by providing the wall to surround the nozzle portion, the peeling portion can be sealed, and a pressure difference between the polymer film and the non-adhesive surface side of the inorganic substrate not in close contact can be efficiently provided.

(13) In the configurations of (1) to (12) above,

In the step B,

It is preferable to form a peeling region at the end portion of the laminate by spraying a gas onto a region including a boundary between the polymer film and the inorganic substrate.

According to the above configuration, the peeling region is not formed mechanically at the end of the laminate, but is formed by spraying gas (step B). After that, the polymer film is separated from the inorganic substrate using the separation region as a starting point (Step C). In Step C, since the separation region exists, the polymer film can be separated from the inorganic substrate without mechanically gripping the polymer film by further spraying gas to the separation region or by bending the inorganic substrate. can

In this way, according to the above configuration, the polymer film can be separated from the inorganic substrate without mechanical contact with the polymer film. As a result, it is possible to easily peel the polymer film from the inorganic substrate without damaging the quality of the polymer film, circuits or devices formed on the surface of the polymer film, and elements mounted on the polymer film.

(14) In the configurations of (1) to (13) above, it is preferable that the circuit pattern and/or the functional element are formed in such a way that they do not touch the outer periphery of the polymer film.

According to the above configuration, since the functional element is formed in such a way that it does not touch the outer periphery of the polymer film, it is possible to suppress an excessive load applied to the polymer film when forming the separation region.

(15) In the structure of (13) or (14) above, it is preferable that the peeling region formed in the step B is outside the circuit pattern and/or the functional element formation region.

According to the above configuration, since the separation region is outside the functional element formation region, excessive load applied to the polymer film can be suppressed when forming the separation region.

(16) In the configurations of (13) to (15) above,

The step C,

It is preferable to separate the circuit pattern and/or the functional element formation region of the polymer film from the inorganic substrate while maintaining a flat surface.

According to the configuration, since the polymer film is separated from the inorganic substrate while the functional element formation region of the polymer film is kept flat, excessive load is not applied to the polymer film at the location where the functional element is located. can be suppressed

(17) In the configurations of (13) to (16) above,

Before the step B, a step W of forming an extremely small peeled portion in a region including a boundary between the polymer film and the inorganic substrate at an end of the laminate,

It is preferable that the said process B is the process of spraying gas to the area|region containing the said micro peeling part after the said process W, and forming the said peeling area at the said edge part.

According to the above configuration, it becomes possible to easily form the peeling region in the case where there is no peeling region at the end portion of the laminate (when even a very small peeling portion does not exist).

(18) In the configurations of (1) to (17) above,

Prior to step C, a step of providing a spacer having a thickness equivalent to that of the circuit pattern and/or the functional element on the surface of the polymer film on which the circuit pattern and/or the functional element are not provided. It is preferable to include X.

According to the above configuration, irregularities on the polymer film can be reduced by the embedding member or the spacer. As a result, when peeling, it is possible to suppress excessive load on the polymer film at the location where the circuit pattern and/or the functional element are located.

(19) In the configurations of (1) to (18) above,

Prior to the step C, at least one selected from the group consisting of an embedding member, a spacer, and a vacuum chuck for embedding is disposed on the non-stick surface side of the polymer film, and the member, spacer, and vacuum chuck for embedding are disposed. It is preferable to perform the peeling step Y while embedding the circuit pattern and/or functional element in at least one selected from the group.

According to the configuration, in a state in which the circuit pattern and/or the functional element are embedded by an embedding member, a spacer, and/or a vacuum chuck for embedding, the static pressure difference is provided, and the polymer film is applied to the inorganic substrate. Since it is peeled off from the surface, it is possible to suppress excessive load on the polymer film at the location where the circuit pattern and/or the functional element are located.

(20) In the configurations of (1) to (19) above,

It is preferable to include a step Z of attaching an adhesive protective film to protect the circuit pattern and/or functional element of the polymer film of the laminate before the step C.

In addition, the present invention provides the following.

(21) Step A of preparing a laminate in which a polymer film having a circuit pattern and/or functional element formed thereon and an inorganic substrate are in close contact with each other;

Step B of forming a peeling portion between the polymer film and the inorganic substrate at the end of the laminate;

and step C of separating the inorganic substrate from the inorganic substrate while keeping the polymer film substantially flat by bending the inorganic substrate in a direction away from the polymer film.

According to the above configuration, it is not mechanically peeled off, and since the inorganic substrate is bent in a direction away from the polymer film, the polymer film is peeled without bending (substantially flat), so that stress is not applied to the polymer film. , it is possible to easily peel the polymer film from the inorganic substrate without affecting the quality. Therefore, a polymer film having peeled off functional elements can be suitably used for electronic devices.

(22) In the structure of (21) above, it is preferable that there is no adhesion of laser smear. When irradiated with laser light, there is a problem that, when the polymer film is burned and becomes a laser smear, the quality of the polymer film is affected or the device is contaminated by particle formation. Therefore, it is preferable that there is no adhesion of laser smear.

In addition, the present invention provides the following.

(23) A peeling device for peeling a polymer film from an inorganic substrate in a laminate in which a polymer film having a circuit pattern and/or functional element is formed in close contact with an inorganic substrate,

At an end of the laminate, means for forming a separation portion between the polymer film and the inorganic substrate;

A peeling device comprising: a peeling means for separating the inorganic substrate from the inorganic substrate while keeping the polymer film substantially flat by bending the inorganic substrate in a direction away from the polymer film.

According to the configuration, it is not mechanically peeled off, and since the inorganic substrate is bent in a direction away from the polymer film, the polymer film is peeled off without bending (approximately flat), which affects the quality of the polymer film It is possible to peel the polymer film from the inorganic substrate easily and without work.

According to the present invention, it becomes possible to easily peel the polymer film from the inorganic substrate without affecting the quality of the polymer film.

1 is a schematic cross-sectional view showing an example of a laminate.
2 is a schematic cross-sectional view of the peeling device according to the first embodiment.
3 is a schematic cross-sectional view of the peeling device according to the first embodiment.
4 is a schematic cross-sectional view of Modification 1 of the peeling device according to the first embodiment.
5 is a schematic cross-sectional view of Modification 2 of the peeling device according to the first embodiment.
6 is a schematic cross-sectional view of a peeling device according to a second embodiment.
Fig. 7 is a schematic cross-sectional view showing an example of a laminate having functional elements.
Fig. 8 is a schematic cross-sectional view showing a spacer provided on a polymer film of a laminate having functional elements.
9 is a schematic cross-sectional view showing a state in which a member for embedding is disposed on a polymer film of a laminate having functional elements and the functional elements are embedded.
10 is a schematic sectional view of a peeling device according to a third embodiment.
11 is a schematic sectional view of a peeling device according to a fourth embodiment.
12 is a schematic cross-sectional view of the peeling device in the middle of operation according to the fourth embodiment.
13 is a schematic sectional view of a peeling device according to a fifth embodiment.
14 is a schematic sectional view of a peeling device according to a fifth embodiment.
15 is a schematic sectional view of a peeling device according to a fifth embodiment.
16 is a schematic sectional view of a peeling device according to a sixth embodiment.
17 is a schematic sectional view of a peeling device according to a seventh embodiment. Fig. 17 is during setting of the peeling device.
18 is a schematic sectional view of a peeling device according to a seventh embodiment. Fig. 18 is during setting of the peeling device.
Fig. 19 is a schematic cross-sectional view immediately before the operation of the peeling device according to the seventh embodiment.
20 is a schematic sectional view of a peeling device according to an eighth embodiment. Fig. 20 is during setting of the peeling device.
21 is a schematic cross-sectional view of a peeling device according to an eighth embodiment. Fig. 21 is during setting of the peeling device.
Fig. 22 is a schematic cross-sectional view immediately before the operation of the peeling device according to the eighth embodiment.
Fig. 23 is a schematic sectional view of a star of a peeling device according to an eighth embodiment. Fig. 23 is during setting of the peeling device.
Fig. 24 is a schematic sectional view of a star of a peeling device according to an eighth embodiment. Fig. 24 is during setting of the peeling device.
Fig. 25 is a schematic cross-sectional view of a peeling device according to an eighth embodiment in which a vacuum chuck for embedding is disposed on a polymer film of a laminate having functional elements and the functional elements are embedded.
Fig. 26 is another schematic cross-sectional view of a peeling device according to an eighth embodiment in which a vacuum chuck for embedding is disposed on a polymer film of a laminate having functional elements and the functional elements are embedded.
27 is a schematic cross-sectional view showing an example of a laminate.
Fig. 28 is a plan view of the laminate shown in Fig. 27;
Fig. 29 is a schematic cross-sectional view showing a laminate after forming a very small peeling portion.
Fig. 30 is a plan view of the laminate shown in Fig. 29;
31 is a schematic sectional view of a peeling device according to a tenth embodiment.
32 is a schematic cross-sectional view of a modified example of the peeling device according to the tenth embodiment.
33 is a schematic cross-sectional view of another modified example of the peeling device according to the tenth embodiment.
34 is a schematic cross-sectional view of another modified example of the peeling device according to the tenth embodiment.
35 is a schematic cross-sectional view of another modified example of the peeling device according to the tenth embodiment.
36 is a schematic sectional view of a peeling device according to an eleventh embodiment.
37 is a schematic cross-sectional view of a modified example of the peeling device according to the eleventh embodiment.
38 is a schematic cross-sectional view of another modified example of the peeling device according to the eleventh embodiment.
39 is a schematic cross-sectional view of another modified example of the peeling device according to the eleventh embodiment.
40 is a schematic cross-sectional view showing another example of a laminate.
Fig. 41 is a plan view of the laminate shown in Fig. 40;

EMBODIMENT OF THE INVENTION Hereinafter, embodiment of this invention is described. Hereinafter, a method for peeling a polymer film will be described, and, among them, a method for manufacturing an electronic device and a peeling device will also be described.

[Method of peeling polymer film]

The peeling method of the polymer film according to the present embodiment,

A step A of preparing a laminate in which a polymer film having a circuit pattern and/or functional element formed thereon and an inorganic substrate are in close contact with each other;

Step B of forming a peeling portion between the polymer film and the inorganic substrate at the end of the laminate;

and step C of separating the inorganic substrate from the inorganic substrate while maintaining the polymer film substantially flat by bending the inorganic substrate in a direction away from the polymer film.

<Process A>

In the polymer film peeling method according to the present embodiment, first, a laminate in which the polymer film and the inorganic substrate are in close contact with each other is prepared (step A). 1 is a schematic cross-sectional view showing an example of a laminate. As shown in FIG. 1 , the laminate 10 includes an inorganic substrate 12 and a polymer film 14 . The inorganic substrate 12 and the polymer film 14 are in close contact. The inorganic substrate 12 and the polymer film 14 may be in close contact with each other via a silane coupling agent layer (not shown).

On the polymer film 14, circuit patterns and/or functional elements are formed (not shown). Circuit patterns and/or functional elements are formed on the non-adhesive surface that is not in close contact with the inorganic substrate 12 . That is, in the present embodiment, both circuit patterns and functional elements may be formed on the polymer film 14, or circuit patterns may be formed and functional elements may not be formed, and functional elements may be formed and circuits may be formed. The pattern may not be formed.

The circuit pattern can be formed by a conventionally known method. The thickness of the circuit pattern is usually about 0.05 μm to 20 μm, preferably about 0.1 μm to 15 μm, and more preferably about 0.15 μm to 0.5 μm.

In FIG. 1, the inorganic substrate 12 and the polymer film 14 have different thicknesses, but are written in the same size. The sizes of the polymer film 14 and the inorganic substrate 12 are different, and the polymer film 14 may be larger or smaller than the inorganic substrate 12. Since it is easy to make the polymer film 14 smaller than the inorganic substrate 12 in terms of manufacturing, the size may be different in this way. Further, in order to facilitate peeling, after step A, the glass at the outer periphery is cut and removed from the laminate in which the polymer film 14 and the inorganic substrate 12 are in close contact, and the polymer film 14 is removed from the inorganic substrate 12. ) may be greater than

Further, in the present embodiment, a laminate can be obtained by adhering (laminating) a polymer film separately prepared in advance to an inorganic substrate. As a method of lamination, it is also possible to apply conventionally known adhesives, adhesive sheets, pressure-sensitive adhesives, pressure-sensitive adhesive sheets, etc., in addition to the lamination method using a silane coupling agent described later. In this case, the adhesive, the adhesive sheet, the pressure-sensitive adhesive, and the pressure-sensitive adhesive sheet may be applied first to the inorganic substrate side or to the polymer film side.

In addition, as another method of producing a laminate of a polymer film and an inorganic substrate, a polymer solution for forming a polymer film or a solution of a polymer precursor is coated on an inorganic substrate, dried, and, if necessary, chemically reacted to the inorganic substrate. A method of obtaining a laminate by forming a polymer into a film on the top is exemplified. A laminate of a polymer film and an inorganic substrate can be obtained by using a soluble polyimide solution as a polymer solution and a polyamic acid solution that becomes polyimide through a chemical reaction as a polymer precursor. At that time, it is also one of the preferable aspects to control the adhesion between the polymer film and the inorganic substrate by subjecting the inorganic substrate to surface treatment such as treatment with a silane coupling agent. At this time, in order to control the peel strength between the inorganic substrate and the polymer film, a two-layer configuration of a base easily peelable polymer layer (easily peelable layer) and a main polymer layer (polymer film), or a main layer (polymer film) and an inorganic thin film layer It is good also as a two-layer structure of. In addition, you may apply the existing structure for controlling peeling force.

In the case of a two-layer configuration of an easily-peelable polymer layer (easily peelable layer) and a main polymer layer (polymer film), the adhesive strength between the easily-peelable polymer layer (easily peelable layer) and the inorganic substrate is the polymer layer (easily peelable) In the case of a design in which the adhesion is stronger than the adhesive force between the easy layer) and the main polymer layer (polymer film), and the separation between the main polymer layer (polymer film) and the easily peelable polymer layer (easy peel layer), and the easy peel The adhesive force between the polymer layer (easily peelable layer) and the main polymer layer (polymer film) is stronger than the adhesive force between the easily peelable polymer layer (easily peeled layer) and the inorganic substrate, and the easily peelable polymer layer (easily peeled layer) and the inorganic substrate There is a case of a design that peels between substrates.

The adhesive force between the easily peelable polymer layer (easily peelable layer) and the inorganic substrate is stronger than the adhesive force between the easily peelable polymer layer (easily peeled layer) and the main polymer layer (polymer film), and the main polymer layer (polymer film) In the case of a design in which peeling is performed between the polymer layer (easily peelable layer) and the polymer layer (easily peelable layer) that is easily peeled, the inorganic substrate in the present invention corresponds to an easily peelable polymer layer (easily peelable layer) deposited on the inorganic substrate. .

In the case of a two-layer configuration with an inorganic thin film layer, the inorganic thin film layer is formed on an inorganic substrate, and then a solution or a solution of a polymer precursor is applied to the inorganic substrate on the inorganic thin film layer, followed by drying and, if necessary, chemical reaction. and a method of obtaining a laminate by forming a polymer film on an inorganic substrate. In this case, a separation occurs between the inorganic thin film and the polymer layer on the inorganic substrate. In this case, the inorganic thin film deposited on the inorganic substrate corresponds to the inorganic substrate in the present invention.

As a modification of the method using a polymer solution or a polymer precursor solution, a polymer film in a semi-solid state (high viscosity paste type) containing a solvent is pressed onto an inorganic substrate, followed by additional drying or, if necessary, a chemical reaction to form a mixture between the polymer film and the inorganic substrate. A laminated body can also be obtained. More specifically, the desired polymer solution or polymer precursor solution is applied onto a support film such as polyethylene terephthalate, and semi-drying is performed until the remaining solvent content is about 5 to 40% by mass in a wet base, thereby reducing plastic deformation. It can be set as a semi-solid film having (sometimes called a green film or a gel film). A laminate of the polymer film and the inorganic substrate can be obtained by pressing the obtained semi-solid film to an inorganic substrate and subjecting to drying and heat treatment.

In the present embodiment, when a thermoplastic polymer is used, a laminate can be obtained by directly melting and extruding the polymer onto an inorganic substrate. Further, in the case of a thermoplastic polymer film, an inorganic substrate and a polymer film may be overlapped and heated to the melting point or softening temperature of the polymer in a pressurized state, thereby compressing both to form a laminate.

The inorganic substrate 12 may be a plate-shaped substrate that can be used as a substrate containing an inorganic substance, for example, a glass plate, a ceramic plate, a semiconductor wafer, a metal, or the like, and those glass plates, ceramic plates, or semiconductor wafers. , as a composite of metals, those in which these are laminated, those in which they are dispersed, those in which these fibers are contained, and the like.

The thickness of the inorganic substrate 12 is not particularly limited, but is preferably 10 mm or less, more preferably 3 mm or less, and still more preferably 1.3 mm or less from the viewpoint of handleability. The lower limit of the thickness is not particularly limited, but is preferably 0.05 mm or more, more preferably 0.3 mm or more, still more preferably 0.5 mm or more.

Examples of the polymer film 14 include, but are not particularly limited to, polyimide-based resins such as polyimide, polyamideimide, polyetherimide, and fluorinated polyimide (eg, aromatic polyimide resin and alicyclic polyimide resin); co-polyesters such as polyethylene, polypropylene, polyethylene terephthalate, polybutylene terephthalate, and polyethylene-2,6-naphthalate (eg, fully aromatic polyesters and semi-aromatic polyesters); copolymerization (meth)acrylates typified by polymethyl methacrylate; polycarbonate; polyamide; polysulfone; polyethersulfone; polyether ketone; cellulose acetate; cellulose nitrate; aromatic polyamide; polyvinyl chloride; polyphenols; polyarylate; polyphenylene sulfide; polyphenylene oxide; Films, such as polystyrene, can be illustrated.

The thickness of the polymer film 14 is not particularly limited, but is preferably 250 μm or less, more preferably 100 μm or less, and still more preferably 50 μm or less, from the viewpoint of handleability. The lower limit of the thickness is not particularly limited, but is preferably 3 μm or more, more preferably 5 μm or more, still more preferably 10 μm or more.

The silane coupling agent layer is physically or chemically interposed between the inorganic substrate 12 and the polymer film 14, and has a function of adhering the inorganic substrate and the polymer film.

Although the silane coupling agent used in this embodiment is not specifically limited, It is preferable that the coupling agent which has an amino group is included.

Specific preferred examples of the silane coupling agent include N-2-(aminoethyl)-3-aminopropylmethyldimethoxysilane, N-2-(aminoethyl)-3-aminopropyltrimethoxysilane, and N-2-( Aminoethyl)-3-aminopropyltriethoxysilane, 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-triethoxysilyl-N-(1,3-dimethyl-butylidene )Propylamine, 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldiethoxysilane, 3-glycidoxypropyltri Ethoxysilane, vinyltrichlorosilane, vinyltrimethoxysilane, vinyltriethoxysilane, 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3 -Glycidoxypropylmethyldiethoxysilane, 3-glycidoxypropyltriethoxysilane, p-styryltrimethoxysilane, 3-methacryloxypropylmethyldimethoxysilane, 3-methacryloxypropyltrimethoxy Silane, 3-methacryloxypropylmethyldiethoxysilane, 3-methacryloxypropyltriethoxysilane, 3-acryloxypropyltrimethoxysilane, N-phenyl-3-aminopropyltrimethoxysilane, N-( Vinylbenzyl)-2-aminoethyl-3-aminopropyltrimethoxysilane hydrochloride, aminophenyltrimethoxysilane, aminophenethyltrimethoxysilane, 3-ureidpropyltriethoxysilane, 3-chloropropyltrimethoxy Silane, 3-mercaptopropylmethyldimethoxysilane, 3-mercaptopropyltrimethoxysilane, bis(triethoxysilylpropyl)tetrasulfide, 3-isocyanatepropyltriethoxysilane, tris-(3-trimethoxysilane) oxysilylpropyl) isocyanurate, chloromethylphenethyltrimethoxysilane, chloromethyltrimethoxysilane, aminophenyltrimethoxysilane, aminophenethyltrimethoxysilane, aminophenylaminomethylphenethyltrimethoxysilane, etc. can

Examples of the silane coupling agent include n-propyltrimethoxysilane, butyltrichlorosilane, 2-cyanoethyltriethoxysilane, cyclohexyltrichlorosilane, decyltrichlorosilane, and diacetoxydimethylsilane in addition to those described above. , diethoxydimethylsilane, dimethoxydimethylsilane, dimethoxydiphenylsilane, dimethoxymethylphenylsilane, dodecylchlorosilane, dodecyltrimethoxysilane, ethyltrichlorosilane, hexyltrimethoxysilane, octadecyltriethoxy Silane, octadecyltrimethoxysilane, n-octyltrichlorosilane, n-octyltriethoxysilane, n-octyltrimethoxysilane, triethoxyethylsilane, triethoxymethylsilane, trimethoxymethylsilane, Trimethoxyphenylsilane, pentyltriethoxysilane, pentyltrichlorosilane, triacetoxymethylsilane, trichlorohexylsilane, trichloromethylsilane, trichlorooctadecylsilane, trichloropropylsilane, trichlorotetradecylsilane, Trimethoxypropylsilane, allyltrichlorosilane, allyltriethoxysilane, allyltrimethoxysilane, diethoxymethylvinylsilane, dimethoxymethylvinylsilane, trichlorovinylsilane, triethoxyvinylsilane, vinyltris (2 -methoxyethoxy)silane, trichloro-2-cyanoethylsilane, diethoxy(3-glycidyloxypropyl)methylsilane, 3-glycidyloxypropyl(dimethoxy)methylsilane, 3-glycy Diloxypropyltrimethoxysilane etc. can also be used.

Among the above silane coupling agents, silane coupling agents having one silicon atom in one molecule are particularly preferred, such as N-2-(aminoethyl)-3-aminopropylmethyldimethoxysilane, N-2-(amino Ethyl)-3-aminopropyltrimethoxysilane, N-2-(aminoethyl)-3-aminopropyltriethoxysilane, 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3- Triethoxysilyl-N-(1,3-dimethyl-butylidene)propylamine, 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3 -Glycidoxypropylmethyldiethoxysilane, 3-glycidoxypropyltriethoxysilane, aminophenyltrimethoxysilane, aminophenethyltrimethoxysilane, aminophenylaminomethylphenethyltrimethoxysilane, etc. are mentioned. When particularly high heat resistance is required in a process, it is preferable to connect Si and an amino group with an aromatic group.

As said coupling agent, in addition to the above, 1-mercapto-2-propanol, 3-mercapto methyl propionate, 3-mercapto-2-butanol, 3-mercapto butyl propionate, 3-(dimethoxymethylsilyl) -1-propanethiol, 4-(6-mercaptohexanoyl)benzyl alcohol, 11-amino-1-undecenethiol, 11-mercaptoundecylphosphonic acid, 11-mercaptoundecyltrifluoroacetic acid, 2 ,2'-(ethylenedioxy)diethanethiol, 11-mercaptoundecyltri(ethylene glycol), (1-mercaptoundecyl-11-yl)tetra(ethyleneglycol), 1-(methylcarboxy)undec -11-yl) hexa(ethylene glycol), hydroxyundecyl disulfide, carboxyundecyl disulfide, hydroxyhexadodecyl disulfide, carboxyhexadecyl disulfide, tetrakis(2-ethylhexyloxy)titanium, Titaniumdioctyloxybis(octylene glycolate), zirconium tributoxymonoacetylacetonate, zirconium monobutoxyacetylacetonate bis(ethylacetoacetate), zirconium tributoxymonostearate, acetoalkoxyaluminum diisopropylate , 3-glycidyloxypropyltrimethoxysilane, 2,3-butanedithiol, 1-butanethiol, 2-butanethiol, cyclohexanethiol, cyclopentanethiol, 1-decanethiol, 1-dodecanethiol, 3-mercaptopropionate-2-ethylhexyl, 3-mercaptopropionate ethyl, 1-heptanethiol, 1-hexadecanethiol, hexylmercaptan, isoamylmercaptan, isobutylmercaptan, 3-mercaptopropionic acid, 3 -Mercaptopropionic acid-3-methoxybutyl, 2-methyl-1-butanethiol, 1-octadecanethiol, 1-octanethiol, 1-pentadecanethiol, 1-pentanethiol, 1-propanethiol, 1-tetra Decanethiol, 1-undecanethiol, 1-(12-mercaptododecyl)imidazole, 1-(11-mercaptodecyl)imidazole, 1-(10-mercaptodecyl)imidazole, 1-( 16-mercaptohexadecyl)imidazole, 1-(17-mercaptoheptadecyl)imidazole, 1-(15-mercapto)dodecanoic acid, 1-(11-mercapto)undecanoic acid, 1-(10- Mercapto) decanoic acid or the like can also be used.

As a method of applying the silane coupling agent (method of forming the silane coupling agent layer), a method of applying a silane coupling agent solution to the inorganic substrate 12, a vapor deposition method, or the like can be used. Also, the silane coupling agent layer may be formed on the surface of the polymer film 14 .

The film thickness of the silane coupling agent layer is very thin compared to the inorganic substrate 12, the polymer film 14, etc., and is negligible from the point of view of mechanical design. In principle, the minimum, monomolecular layer order thickness It is enough to have

After the application of the silane coupling agent, the adhesive force of the laminate can be developed by a step of bringing the inorganic substrate 12 and the polymer film 14 into close contact and a step of heating. The method for adhering is not particularly limited, but there are lamination, press, and the like. Adhesion and heating may be performed simultaneously or sequentially. The heating method is not particularly limited, but may include heating in an oven, heating lamination, heating press, and the like.

As a method for producing a laminate in which the polymer film and the inorganic substrate are in close contact, the inorganic substrate and the polymer film may be separately produced and then adhered. At this time, an easily peelable adhesive other than a known silane coupling agent, an adhesive sheet, You may adhere using an adhesive sheet. In this case, the adhesive, the adhesive sheet, the pressure-sensitive adhesive, and the pressure-sensitive adhesive sheet may be applied to the inorganic substrate first or to the polymer film. As another method for producing a laminate in which the polymer film and the inorganic substrate are in close contact, a varnish for forming the polymer film may be applied onto the inorganic substrate and then dried. At this time, in order to control the peel strength between the inorganic substrate and the polymer film, a two-layer configuration of a base varnish layer (easily peelable layer) and a main varnish layer (polymer film), or a main layer (polymer film) and inorganic It is good also as a two-layer structure of a thin film layer.

<Process B>

Next, at the end of the layered product 10, a peeling portion 18 is formed between the polymer film 14 and the inorganic substrate 12 (Step B).

The method of providing the peeling portion 18 is not particularly limited, but is a method of peeling off from the end with tweezers or the like, making a cut in the polymer film 14 and adhering an adhesive tape to one side of the cut portion, and then removing the tape portion. A peeling method, a method of vacuum adsorbing one side of a cutout portion of the polymer film 14 and then peeling it off from that portion can be employed.

As a method of making an incision in the polymer film 14, a method of cutting the polymer film 14 with a cutting tool such as a blade, or cutting the polymer film 14 by relatively scanning the laminate 10 with a laser method, a method of cutting the polymer film 14 by relatively scanning the laminate 10 with a water jet, a method of cutting the polymer film 14 while slightly incising the glass layer by a dicing device of a semiconductor chip, and the like. However, the method is not particularly limited. For example, in adopting the above-described method, a method such as superimposing ultrasonic waves on a cutting tool or adding a reciprocating motion or an up-and-down motion to improve cutting performance may be appropriately employed.

In addition, although not shown, in order to maintain a peeled state so that the peeling part 18 does not come into close contact again, a film or sheet having no adhesiveness or adhesiveness may be sandwiched between the peeling part 18. In addition, a film or sheet having adhesiveness and adhesiveness on one side may be sandwiched between the peeling portion 18. Also, a metal part (for example, a needle) may be inserted into the peeling portion 18 .

<Process C>

By bending the inorganic substrate 12 in a direction away from the polymer film 14, the polymer film 14 is peeled from the inorganic substrate 12 while maintaining a substantially flat surface (Step C).

Hereinafter, the specific example of process C is demonstrated.

In the following first to third embodiments, the step C is "after the step B, a static pressure difference is provided between the non-adhesive surface of the inorganic substrate that is not in close contact with the polymer film and the peeling portion, A case in which the inorganic substrate is detached from the inorganic substrate while maintaining the polymer film substantially flat by being bent in a direction away from the polymer film will be described.

That is, the process C in the first to third embodiments is as follows.

<Process C in the first to third embodiments>

After step B, a static pressure difference is provided between the surface of the inorganic substrate 12 that is not in close contact with the polymer film 14 (non-contact surface 14a) and the peeled portion 18, and the inorganic substrate 12 ) is bent in a direction away from the polymer film 14, and the polymer film 14 is separated from the inorganic substrate 12 while maintaining the polymer film 14 substantially flat (Step C).

[First Embodiment]

2 is a schematic cross-sectional view of the peeling device according to the first embodiment. As shown in FIG. 2 , the peeling device 20 according to the first embodiment includes a vacuum chamber 30 , a roller 32 , a vacuum chuck 34 , and a substrate contactor 35 .

The roller 32 is disposed so as to be movable within the vacuum chamber 30 .

The vacuum chuck 34 can adsorb and hold the laminate 10 , and can position the laminate 10 above the vacuum chamber 30 in an adsorbed state.

The substrate contact 35 is disposed on the upper surface of the vacuum chamber 30 so as to cover the opening on the upper surface of the vacuum chamber 30 . The smaller the gap between the vacuum chamber 30 and the substrate contact 35, the better. Although not shown, it is sufficient if there is a component that closes the gap. Further, the board contact 35 is preferably a suction plate with a porous body (an suction plate having a porous body).

Step C according to the first embodiment includes step D-1, step D-2 and step D-3. The peeling apparatus 20 performs process D-1, process D-2, and process D-3 by operating as follows.

First, the peeling device 20 adsorbs the polymer film 14 side of the laminate 10 with the vacuum chuck 34 and places it above the vacuum chamber 30 . At this time, the laminate 10 is positioned so as to be located in the opening of the peeling portion 18 . At this time, the inorganic substrate 12 of the laminate 10 is brought into contact with the substrate contactor 35.

Next, the peeling device 20 arranges the roller 32 on the non-adhesive surface 12a side of the inorganic substrate 12, and the inorganic substrate 12 is moved by the roller 32 and the substrate contactor 35. is pressed in the direction of the peeling portion 18 (upward in Fig. 2) (step D-1).

Next, the peeling device 20 makes the inside of the vacuum chamber 30 less than atmospheric pressure by the pump P. Here, the peeling portion 18 is at atmospheric pressure. This provides a static pressure difference between the non-adhesive surface 12a of the inorganic substrate 12 and the peeling portion 18 . That is, a static pressure difference is provided by making the non-adhesion surface 12a side less than atmospheric pressure, and making the peeling part 18 atmospheric pressure (process D-2).

Further, in this state, since the roller 32 is pressing the polymer film 14 over the board contact 35 in the direction of the peeling portion 18, peeling does not proceed.

Next, the peeling device 20 moves the surface of the roller 32 and the substrate contactor 35 (a contact surface with the inorganic substrate 12) in parallel with the non-adhesive surface 12a of the inorganic substrate 12. let it Fig. 3 is a schematic sectional view of the peeling device according to the first embodiment, showing a state in which the roller is being moved. As shown in FIG. 3 , when the roller 32 and the board contact 35 are moved from the lower part of the peeling portion 18 in the horizontal direction (leftward direction in FIG. 3 ), the roller 32 and the board contact 35 Peeling of the peeling portion 18 proceeds sequentially from the portion where the pressure is released. That is, the surfaces of the roller 32 and the substrate contactor 35 are moved in parallel to the non-adhesion surface 12a of the inorganic substrate 12, and peeling is performed according to the movement of the roller 32 and the substrate contactor 35. It advances (step D-3). After that, by moving the roller 32 and the substrate contactor 35 to directly below the opposite side of the side where the peeling portion 18 was formed, the inorganic substrate 12 warped in a direction away from the polymer film 14, The entire polymer film 14 is peeled from the inorganic substrate 12 while maintaining a substantially flat surface. At this time, since the polymer film 14 is always held in the vacuum chuck 34, bending and deformation did not occur. A substantially flat surface is not only a perfectly flat surface, but preferably has a flatness of 10 µm or less according to JISB0621 (1984), more preferably 5 µm or less.

In this way, in the peeling device 20, the surfaces of the roller 32 and the substrate contactor 35 are moved in parallel to the non-adhesive surface 12a of the inorganic substrate 12, and as the roller 32 moves, Since the peeling is advanced, the peeling speed can be controlled. As a result, excessive load applied to the inorganic substrate 12 or the polymer film 14 can be suppressed. To push up the laminated body 10, either the roller 32 or the substrate contactor 35 may be used, and preferably both the roller 32 and the substrate contactor 35 are used.

Moreover, by changing the radius of the roller 32, the separation angle of the inorganic substrate 12 can be controlled. For example, when the radius of the roller 32 is reduced, the inorganic substrate 12 is separated at the corresponding radius of curvature, and when the radius of the roller 32 is increased, the inorganic substrate 12 is separated at the corresponding radius of curvature. By making the radius of the roller 32 small, the peeling apparatus 20 can be miniaturized, and by making the radius of the roller 32 large, the bending load applied to the inorganic substrate 12 can be reduced.

In addition, the vacuum chamber 30 and the vacuum chuck 34 correspond to the static pressure difference forming means of the present invention.

The radius of the roller is 40 mm or more and 1000 mm or less, more preferably 60 mm or more and 100 mm or less.

As the material of the roller, a material having a certain degree of elasticity is preferable, and for example, silicone rubber, fluororubber, urethane rubber, ethylene propylene rubber and the like can be used.

The rebound elastic modulus (JIS K 6255: 2013) of the roller material is preferably 3 to 60%.

The rubber hardness of the roller material is preferably 50 to 90, and it is preferable that it is non-adhesive and antistatic or conductive.

Here, in this embodiment, although not shown, the mesh-like sheet 38 may be arrange|positioned between the inorganic substrate 12 and the roller 32. Since the mesh-like sheet 38 is arrange|positioned between the inorganic substrate 12 and the roller 32, the inorganic substrate 12 after peeling can be hold|maintained. As the mesh-type sheet 38, it is only necessary to have air permeability and a certain level of strength, and for example, a known screen mesh or the like can be used.

The material of the mesh-like sheet is preferably a material that is elastically deformed appropriately, specifically, a mesh-like sheet in the range of mesh count #80 or more and #600 or less using polyester filament, nylon filament, stainless wire, etc. it is desirable Moreover, antistatic or conductive ones are preferable.

In addition, in this embodiment, although the case where the mesh type sheet 38 was used was demonstrated, in the peeling apparatus 20, it is good also as a structure which does not arrange|position a mesh type sheet. In this case, it is sufficient if there is another mechanism for extracting the separated inorganic substrate 12 each time.

4 and 5 are schematic cross-sectional views of modified examples of the peeling device according to the first embodiment. As shown in FIG. 5, the peeling apparatus 23 is the apparatus which added the support part 33 with respect to the peeling apparatus 22 demonstrated above.

The support part 33 presses the inorganic substrate 12 to widen the separated portion 18 between the inorganic substrate 12 and the polymer film 14 .

The peeling device 23 performs the same operation as the peeling device 20 described above. However, since the support part 33 is provided in the peeling apparatus 23, the inorganic substrate 12 after peeling can be supported. Therefore, it is possible to prevent the peeled portion of the inorganic substrate 12 from being greatly treated.

It is preferable to control the separation angle between the polymer film (on which the functional element is formed) and the inorganic substrate to be 1 degree or more and 30 degrees or less. More preferably, it is 1 degree or more and 10 degrees or less. By setting it within the said range, it becomes possible to peel efficiently, without giving damage to a functional element.

In addition, the peeling angle in this specification depends on the mesh thickness, the film thickness, and the radius of the roller. By selecting an appropriate mesh thickness and roller radius according to the film thickness to be peeled off, the peeling angle can be made to fall within a predetermined range.

In this embodiment, since the polymer film and the inorganic substrate after peeling are not pressed with a roller, they are substantially parallel and separated by several millimeters. Therefore, the once peeled polymer film does not come into contact with the inorganic substrate again while vacuum adsorbed.

As mentioned above, process C (process C including process D-1, process D-2, and process D-3) concerning 1st Embodiment was demonstrated.

[Second Embodiment]

6 is a schematic cross-sectional view of a peeling device according to a second embodiment. As shown in FIG. 6 , the peeling device 40 according to the second embodiment includes a vacuum chuck 34 and a diaphragm 42 .

The vacuum chuck 34 can adsorb and hold the laminate 10, and can position the laminate 10 above the diaphragm 42 in an adsorbed state.

The diaphragm 42 is an elastic thin film, and can press the laminate 10 with a surface. Specifically, a pressure device (not shown) is provided below the diaphragm 42, and the surface of the diaphragm 42 (elastic thin film) is pressed against the layered body 10 by the pressure by the pressure device. As will be described later, since the diaphragm 42 is an elastic thin film, even if the functional element 16 is provided on the polymer film 14, it is substantially uniform along the surface of the polymer film 14 and the functional element 16. The laminated body 10 can be pressed. In this embodiment, the case of using the diaphragm 42 will be described, but it is not limited to the diaphragm as long as the layered body 10 can be pressed by the surface. A functional element is an element formed on a polymer film, and refers to an element having a height difference of 10 µm or more between concavities and convexities on the surface of the polymer film.

Step C according to the second embodiment includes steps E2-1 and E2-2. The peeling apparatus 40 performs process E2-1 and process E2-2 by operating as follows.

First, the peeling device 40 adsorbs the polymer film 14 side of the laminate 10 with the vacuum chuck 34 and places it above the diaphragm 42 .

Next, the peeling device 40 operates the diaphragm 42 to press the layered product 10 to press the non-adhesive surface 12a side of the inorganic substrate 12 to atmospheric pressure or higher. And the peeling part of a laminated body is pressed by the roller 32 with the diaphragm 42 interposed. Moreover, the peeling part 18 is atmospheric pressure. That is, while the non-adhesive surface 12a side is set to atmospheric pressure or higher, the peeling portion 18 is set to atmospheric pressure (step E2-1).

Moreover, since the diaphragm 42 and the roller 32 are pressing the inorganic substrate 12 in the direction of the peeling part 18 in this state, peeling does not progress.

Next, the peeling device 40 presses the peeling portion 18 to a pressure higher than the pressure on the non-adhesive surface 12a side, so that the non-adhesive surface 12a of the inorganic substrate 12 and the peeling portion 18 A static pressure difference is provided between them (step E2-2). For example, the peeling part 18 is made into the pressure higher than the pressure of the non-adhesive surface 14a side by arrange|positioning the whole peeling apparatus 40 in a high-pressure chamber, and pressurizing the inside of a high-pressure chamber. At this time, a mechanical force may be used in combination. Then, by moving the roller in the non-peeling direction, the peeling gradually spreads from the peeling portion 18, and the polymer film 14 is peeled from the inorganic substrate 12.

In the peeling device 40, since the non-adhesive surface 12a side is set to atmospheric pressure or higher, the polymer film 14 after peeling can be maintained.

In addition, the vacuum chuck 34 and the diaphragm 42 correspond to the static pressure difference forming means of the present invention.

In the above, process C (process C including process E2-1 and process E2-2) concerning 2nd Embodiment was demonstrated.

In the first embodiment and the second embodiment described above, the polymer film 14 is separated from the inorganic substrate 12 using the laminate 10 in which the inorganic substrate 12 and the polymer film 14 are in close contact. case has been described.

However, in the present invention, the present invention is not limited to this example, and a polymer film having functional elements is formed on an inorganic substrate by using a laminate having functional elements in which functional elements 16 are provided on the polymer film 14 of the laminate. It may be peeled off from. In this case, instead of step A of preparing the laminate 10, step A-1 of preparing the laminate 11 having functional elements may be performed.

Fig. 7 is a schematic cross-sectional view showing an example of a laminate having functional elements. As shown in FIG. 7 , the laminate 11 having functional elements includes the laminate 10 (a laminate in which the inorganic substrate 12 and the polymer film 14 are in close contact), and the polymer of the laminate 10 It has a functional element 16 provided on the film 14.

When the polymer film 14 having the functional elements is separated from the inorganic substrate 12 using the multilayer body 11 having the functional elements, it is preferable to use a spacer described below. That is, step X of providing a spacer 62 having a thickness approximately equal to that of the functional element 16 on the surface of the polymer film 14 on which the functional element 16 is not provided before the step C described above. It is preferable to do

Fig. 8 is a schematic cross-sectional view showing how spacers 62 are provided on the polymer film 14 of the multilayer body 11 having functional elements. In FIG. 8 , a spacer 62 having a thickness approximately equal to that of the functional element 16 is provided on the surface of the polymer film 14 on which the functional element 16 is not provided.

In the first embodiment and the second embodiment, when the spacer 62 is used, that is, when the step X is performed before the step C, irregularities on the polymer film 14 can be reduced by the spacer 62 . As a result, at the time of peeling, excessive load applied to the polymer film 14 at the location where the functional element 16 is located can be suppressed.

In the case of peeling the polymer film 14 having the functional elements from the inorganic substrate 12 using the laminate 11 having the functional elements, it is also preferable to use a member for embedding described below. That is, it is preferable to arrange the embedding member 64 on the polymer film 14 before the step C, and perform the step Y of embedding the functional element 16 in the embedding member 64.

As the embedding member 64, a resin composition capable of plastic deformation may be applied to a hard sheet, or a resin composition capable of plastic deformation may be adhered to a hard sheet. Moreover, it may have adhesiveness, and the embedding member itself may have a role as a protective layer of a functional element.

Fig. 9 is a schematic cross-sectional view showing a state in which an embedding member 64 is disposed on the polymer film 14 of the multilayer body 11 having functional elements, and the functional elements are embedded. 9, the embedding member 64 is disposed on the polymer film 14, and the functional element 16 is embedded in the embedding member 64. As the embedding member 64, a porous material capable of vacuum adsorption is preferable. A polymer sintered body, a ceramic sintered body, a metal porous body, a porous film, and the like are preferable.

In the first and second embodiments, when the embedding member 64 is used, that is, when the step Y is performed before the step C, the functional element 16 is embedded by the embedding member 64. , since a static pressure difference is provided and the polymer film 14 is separated from the inorganic substrate 12, an excessive load is applied to the polymer film 14 and the inorganic substrate 12 at the location where the functional element 16 is located. You can curb getting caught.

[Third Embodiment]

In the third embodiment, a case where the polymer film 14 having the functional element 16 is separated from the layered body 11 having the functional element is described.

10 is a schematic sectional view of a peeling device according to a third embodiment. As shown in FIG. 10 , the peeling device 50 according to the third embodiment includes a vacuum chamber 30, a vacuum chuck 34, an embedding member 64, a flexible support material 66, and a porous material. A flexible body 52 and a pressure inlet 54 are provided.

Since the vacuum chamber 30 and the vacuum chuck 34 have already been described in the section of the first embodiment, a description thereof is omitted.

When the porous flexible body 52 is disposed in the vacuum chamber 30 and the inorganic substrate 12 is disposed thereon, the glass can be slightly bent. The porous flexible body 52 is not particularly limited as long as it is porous and has flexibility. As the material of the porous flexible body 52, any of a polymer porous body, a metal porous body, and a ceramic porous body can be used. As the polymeric porous material, low density polyethylene, high density polyethylene, ultra high density polyethylene, polypropylene, polymethacrylic, polyvinyl chloride, fluororesin, etc. are used. As a metal porous body, Cu, SUS, titanium, etc. are used. As the ceramic porous body, alumina, aluminum nitride, silicon nitride, zirconia and the like are used.

The flexible support member 66 is disposed in the vacuum chamber 30 and can hold the polymer film 14 or the inorganic substrate 12 when the laminate 11 having functional elements is disposed thereon. The flexible support material 66 is not particularly limited as long as it has flexibility, and examples thereof include a silicone rubber sheet.

The embedding member 64 is disposed in the vacuum chamber 30, and when the layered body 11 having functional elements is disposed on the surface opposite to the vacuum chuck 34, the polymer film 14 or the inorganic substrate It is possible to hold (12). Although it is in contact with the polymer film 14 in FIG. 10 , it may be positioned outside the polymer film 14 . The embedding member 64 is not particularly limited as long as it is porous and has flexibility. For example, a plastic sintered porous body, a metal porous sintered body, or a porous ceramic sintered body processed into a shape capable of embedding functional elements. can be heard

Step C according to the third embodiment includes step E-1 and step E-2. The peeling apparatus 50 performs process E-1 and process E-2 by operating as follows.

First, the peeling device 50 adsorbs the polymer film 14 side of the layered body 11 having functional elements with the vacuum chuck 34 and places it on the upper side of the vacuum chamber 30 . At this time, the functional element 16 of the stacked body 11 is positioned so as to be positioned in the opening of the burial member 64 .

Next, the peeling device 50 presses the inorganic substrate 12 in the direction of the peeling portion 18 by the porous flexible body 52 while press-fitting the porous flexible body 52 disposed in the vacuum chamber 30. (Step E-1).

Next, the peeling device 50 makes the inside of the vacuum chamber 30 less than atmospheric pressure by the pump P. Here, the peeling portion 18 is at atmospheric pressure. This provides a static pressure difference between the non-adhesive surface 14a of the polymer film 14 and the peeling portion 18 . That is, while making the non-adhesive surface 14a side less than atmospheric pressure, by introducing air from the pressure inlet 54, making it more than atmospheric pressure, a static pressure difference is provided (process E-2). As a result, peeling gradually spreads from the peeling portion 18, and the polymer film 14 having the functional element 16 is peeled off from the inorganic substrate 12. At that time, the inorganic substrate 12 is bent in a direction away from the polymer film 14, and the entire polymer film 14 is separated from the inorganic substrate 12 while maintaining a substantially flat surface.

In the peeling device 50, in a state where the functional element 16 is embedded in the embedding member 64, a static pressure difference is provided to separate the polymer film 14 from the inorganic substrate 12, so that the functional element ( 16), it is possible to suppress an excessive load applied to the polymer film 14 at the location. In addition, since the embedding member has some flexibility but maintains a flat surface, the polymer film 14 is also peeled off while maintaining the flat surface. This also suppresses an excessive load applied to the polymer film 14 .

In addition, the vacuum chamber 30 and the vacuum chuck 34 correspond to the static pressure difference forming means of the present invention.

The polymer film 14 having the functional element 16 peeled off in step C can be used as an electronic device, particularly a flexible electronic device. That is, the method including the step A-1, the step B and the step C is also a method of manufacturing an electronic device.

In the above, the first to third embodiments have been described.

In the following fourth to sixth embodiments, the step C is "a step of peeling from the inorganic substrate by applying a dynamic pressure to the peeling portion while maintaining the polymer film substantially flat after the step B" 」 Describe the case.

That is, the process C in the fourth to sixth embodiments is as follows.

<Process C in the fourth to sixth embodiments>

The polymer film 14 is separated from the inorganic substrate by applying a dynamic pressure to the peeling portion 18 while maintaining the substantially flat surface (Step C).

[Fourth Embodiment]

11 and 12 are schematic sectional views of a peeling device according to a fourth embodiment. As shown in FIGS. 11 and 12 , the peeling device 20 according to the fourth embodiment includes a support part 33 , an air blow nozzle 45 , and a vacuum chuck 34 .

Note that, in the description of the fourth to sixth embodiments, the same reference numerals may be attached to configurations common to those of the first to third embodiments.

The vacuum chuck 34 can adsorb and hold the laminate 10, and can peel the laminate 10 in the adsorbed state. Since the polymer film 14 side of the layered product 10 is adsorbed to the vacuum chuck 34, the polymer film 14 and the inorganic substrate 12 are separated from the air blow nozzle 45 at the separated portion 18. By applying a dynamic pressure, the polymer film 14 can be peeled from the inorganic substrate 12 while maintaining a substantially flat surface. In addition, the air blow nozzle 45 corresponds to the dynamic pressure forming means of the present invention.

Step C according to the fourth embodiment includes steps F-1 and F-2. The peeling apparatus 20 performs process F-1 and process F-2 by operating as follows.

First, the peeling device 20 adsorbs the polymer film 14 side of the laminate 10 with the vacuum chuck 34 . At this time, the inorganic substrate 12 of the laminate 10 is brought into contact with the support part 33 .

Next, the peeling device 20 displaces the inorganic substrate 12 by the support part 33 in the direction in which the peeling portion 18 spreads (downward in Fig. 11) (step F-1). Specifically, it is preferable to curve the inorganic substrate 12 . It is preferable that the minimum curvature radius of the said curve is 350 mm or more. Since the load of the inorganic substrate 12 can be made small, more preferably it is 400 mm or more, More preferably, it is 500 mm or more. Moreover, it is preferable that it is 1000 mm or less, and more preferably, it is 800 mm or less from the peeling rate rising.

Next, the peeling device 20 blows gas from the air blow nozzle 45 to advance the peeling while setting the non-adhesive surface side of the inorganic substrate 12 that is not in close contact with the polymer film 14 to less than atmospheric pressure. let it Here, the air nozzle may be moved appropriately when the sample size is large (step F-2). Although not shown in FIGS. 11 and 12, for example, a vacuum chamber 30 can be used to make the non-adhesive surface less than atmospheric pressure.

Subsequently, the entire polymer film 14 is peeled from the inorganic substrate 12 while maintaining a substantially flat surface. At this time, since the polymer film 14 is always held in the vacuum chuck 34, bending and deformation did not occur. A substantially flat surface is not only a perfectly flat surface, but preferably has a flatness of 500 µm or less according to JISB0621 (1984), more preferably 100 µm or less, and still more preferably 10 µm or less. Further, the deviation from the plane in the range of 1 mm 2 is preferably 10 μm or less, more preferably 3 μm or less, and still more preferably 0.5 μm or less.

Here, in the present embodiment, although not shown, a mesh-like sheet 38 may be arranged under the inorganic substrate 12 . Since the mesh-like sheet 38 is arranged under the inorganic substrate 12, the inorganic substrate 12 after peeling can be held. As the mesh-like sheet 38, it is only necessary to have air permeability and a certain level of strength, and for example, a known screen mesh or the like can be used.

In addition, in this embodiment, although the case where the mesh type sheet 38 was used was demonstrated, in the peeling apparatus 20, it is good also as a structure which does not arrange|position a mesh type sheet. In this case, it is sufficient if there is another mechanism for extracting the separated inorganic substrate 12 each time.

[Fifth Embodiment]

13 to 15 are schematic cross-sectional views of modified examples of the peeling device according to the fifth embodiment. 13 and 14, the peeling apparatuses 22 and 23 according to the fifth embodiment are a holding mechanism for the inorganic substrate 12 relative to the peeling apparatus 20 described above, and are for inorganic substrates. A vacuum chuck 37 is provided. The vacuum chuck 37 for inorganic substrates can perform up-and-down motions and tilting motions. The vacuum chuck 34 can adsorb and hold the stacked body 10, and can position the stacked body 10 upward in a state in which the stacked body 10 is adsorbed. As shown in FIG. 15 , the peeling device 24 replaces the vacuum chuck 34 with respect to the peeling device 20 described above, and uses a roller 32, a vacuum chamber 30, and a substrate contactor 35. This is an added device. When the inorganic substrate 12 follows the substrate contact 35, it is mechanically restricted so that it does not bend more than the minimum curvature radius of the inorganic substrate 12.

The peeling device 22 performs the same operation as the peeling device 20 described above. However, since the vacuum chuck 37 for inorganic substrates is provided in the peeling device 22, the inorganic substrate 12 can be deformed in a direction in which the peeling portion widens while limiting the inorganic substrate 12 so as not to bend more than the minimum radius of curvature.

Since the mesh-like sheet 38 is provided, the inorganic substrate 12 after peeling can be supported. Therefore, it is possible to prevent the exfoliated portion of the inorganic substrate 12 from sagging significantly.

Step C according to the fifth embodiment includes step G-1, step G-2 and step G-3. The peeling apparatuses 22, 23, and 24 perform step G-1, step G-2, and step G-3 by operating as follows.

First, the peeling device 22 adsorbs the polymer film 14 side of the laminate 10 with the vacuum chuck 34 and places it above the vacuum chamber 30 . At this time, the air blow nozzle 45 is positioned in the opening of the peeling portion 18 of the laminate 10 . It is brought into contact with the vacuum chuck 37 of the inorganic substrate. The inorganic substrate vacuum chuck 37 presses the inorganic substrate 12 in the direction of the peeling portion (step G-1). Here, the vacuum chuck 37 of the inorganic substrate corresponds to the substrate contactor.

Next, the separation device 22 displaces the inorganic substrate 12 in a direction in which the separation portion 18 is widened (downward in FIG. 11 ) by the inorganic substrate vacuum chuck 37 .

Next, the peeling device 22 ejects gas from the air blow nozzle 45 to advance the peeling. Here, the air nozzle may be moved appropriately when the sample size is large. Here, a dynamic pressure is applied to the peeling portion 18 (Step G-2).

Further, in this state, the vacuum chuck 37 of the inorganic substrate 12 presses the inorganic substrate 12 over the mesh sheet 38 in the direction of the peeling portion 18 at a position away from the peeling portion 18. Therefore, peeling (upward in Fig. 13) does not proceed.

Next, the peeling device 22 moves the vacuum chuck 37 (contact surface with the inorganic substrate 12) of the inorganic substrate to the non-adhesive surface 12a of the inorganic substrate 12 at a position away from the peeling portion 18. take away from At this time, since the inorganic substrate 12 takes a radius of curvature according to this movement, the height, inclination, and presence or absence of vacuum adsorption of the vacuum chuck 37 of the inorganic substrate are controlled. Separation of the peeling part 18 proceeds sequentially from the part where the pressure by the vacuum chuck 37 of the inorganic substrate was released (step G-3). The entire polymer film 14 is peeled from the inorganic substrate 12 while maintaining a substantially flat surface. At this time, since the polymer film 14 is always held in the vacuum chuck 34, no bending or deformation occurs.

In this way, in the separation device 22, the vacuum chuck 37 for the inorganic substrate is sequentially moved from the side of the separation portion 18 of the inorganic substrate 12, and separation is performed in accordance with the movement of the vacuum chuck 37 for the inorganic substrate. Since it advances, it is possible to control the peeling speed. As a result, excessive load applied to the inorganic substrate 12 or the polymer film 14 can be suppressed.

Here, in the present embodiment, the mesh-like sheet 38 may be disposed under the inorganic substrate 12 . Since the mesh-like sheet 38 is disposed under the inorganic substrate 12, the inorganic substrate 12 after peeling can be held. As the mesh-like sheet 38, it is only necessary to have air permeability and a certain level of strength, and for example, a known screen mesh or the like can be used.

In addition, in this embodiment, although the case where the mesh type sheet 38 was used was demonstrated, in the peeling apparatus 20, it is good also as a structure which does not arrange|position a mesh type sheet. In this case, it is sufficient if there is another mechanism for extracting the separated inorganic substrate 12 each time.

Next, the peeling apparatus 23 is demonstrated (FIG. 14). First, the peeling device 23 adsorbs the polymer film 14 side of the laminate 10 with the vacuum chuck 34 and places it above the vacuum chamber 30 . At this time, the air blow nozzle 45 is positioned in the opening of the peeling portion 18 of the laminate 10 . At this time, the inorganic substrate 12 of the laminate 10 is brought into contact with the support part 33 . The non-adhesive surface of the inorganic substrate 12 is brought into contact with the vacuum chuck 37 . Here, the vacuum chuck 37 of the inorganic substrate corresponds to the substrate contactor.

Next, the peeling device 23 displaces the inorganic substrate 12 in the direction in which the peeling portion 18 spreads (downward direction in FIG. 14) by the inorganic substrate vacuum chuck 37, and the inorganic substrate ( 12) is pressed in the direction of the peeling portion 18 (upward in Fig. 14) (step G-1).

Next, the peeling device 23 ejects gas from the air blow nozzle 45 to advance the peeling. Here, the air blow nozzle 45 may be moved appropriately when the sample size is large. Here, dynamic pressure is applied to the peeling portion 18 (step G-2).

Further, in this state, the vacuum chuck 37 of the inorganic substrate 12 presses the inorganic substrate 12 over the mesh sheet 38 in the direction of the peeling portion 18 at a position away from the peeling portion 18. Therefore, peeling (upward in Fig. 14) does not proceed.

Next, the peeling device 23 moves the vacuum chuck 37 (contact surface with the inorganic substrate 12) of the inorganic substrate in the direction away from the peeling portion 18 to the non-adhesive surface 12a of the inorganic substrate 12. move parallel to At this time, since the inorganic substrate 12 takes a radius of curvature according to the curvature of the contact surface of the vacuum chuck 37 of the inorganic substrate with the inorganic substrate, the radius of curvature of the inorganic substrate can be controlled. Separation of the peeling part 18 proceeds sequentially from the part where the pressure by the vacuum chuck 37 of the inorganic substrate was released (step G-3). The entire polymer film 14 is peeled from the inorganic substrate 12 while maintaining a substantially flat surface. At this time, since the polymer film 14 is always held in the vacuum chuck 34, bending and deformation do not occur. A substantially flat surface is not only a perfectly flat surface, but preferably has a flatness of 500 µm or less according to JISB0621 (1984), more preferably 100 µm or less, still more preferably 10 µm or less. Further, the deviation from the plane in the range of 1 mm 2 is preferably 10 μm or less, more preferably 3 μm or less, still more preferably 0.5 μm or less.

In this way, in the separation device 23, the vacuum chuck 37 for the inorganic substrate is sequentially moved from the side of the separation portion 18 of the inorganic substrate 12, and separation is performed in accordance with the movement of the vacuum chuck 37 for the inorganic substrate. Since it advances, it is possible to control the peeling speed. As a result, excessive load applied to the inorganic substrate 12 or the polymer film 14 can be suppressed.

Here, in the present embodiment, the mesh-like sheet 38 may be disposed under the inorganic substrate 12 . Since the mesh-like sheet 38 is disposed under the inorganic substrate 12, the inorganic substrate 12 after peeling can be held. As the mesh-like sheet 38, it is only necessary to have air permeability and a certain level of strength, and for example, a known screen mesh or the like can be used.

In addition, in this embodiment, although the case where the mesh type sheet 38 was used was demonstrated, in the peeling device 23, it is good also as a structure which does not arrange|position a mesh type sheet. In this case, it is sufficient if there is another mechanism for extracting the separated inorganic substrate 12 each time.

Next, the peeling apparatus 24 is demonstrated (FIG. 15). First, the peeling device 24 adsorbs the polymer film 14 side of the laminate 10 with the vacuum chuck 34 and places it above the vacuum chamber 30 . At this time, the air blow nozzle 45 is positioned in the opening of the peeling portion 18 of the layered product 10 (the air blow nozzle 45 is omitted). At this time, the inorganic substrate 12 of the laminate 10 is brought into contact with the support part 33 (the illustration of the support part 33 is omitted). It is also brought into contact with the board contactor 35.

Next, the peeling device 24 displaces the inorganic substrate 12 in the direction in which the peeling portion 18 spreads (downward in Fig. 15) by means of the substrate contactor 35 and the support part 33, The inorganic substrate 12 is pressed in the direction of the peeling portion 18 (upward in Fig. 15) (Step G-1).

Next, the peeling device 24 ejects gas from the air blow nozzle 45 to advance the peeling. Here, the air blow nozzle 45 may be moved appropriately when the sample size is large. Here, a dynamic pressure is applied to the peeling portion (step G-2). Further, in this state, since the roller 32 is pressing the inorganic substrate 12 over the substrate contactor 35 in the direction of the peeling portion 18 at a position away from the peeling portion 18 (upward in Fig. 15), Separation does not proceed.

Next, the peeling device 24 moves the substrate contact 35 (contact surface with the inorganic substrate 12) of the inorganic substrate in the direction away from the peeling portion 18 together with the roller 32 and the vacuum chamber 30. It is moved parallel to the non-adhesion surface 12a of the inorganic substrate 12. At this time, since the inorganic substrate 12 takes a radius of curvature according to the curvature of the contact surface of the substrate contactor 35 with the inorganic substrate, the radius of curvature of the inorganic substrate can be controlled. Separation of the peeling portion 18 proceeds sequentially from the portion where the pressing by the substrate contactor 35 is released (Step G-3). The entire polymer film 14 is peeled from the inorganic substrate 12 while maintaining a substantially flat surface. At this time, since the polymer film 14 is always held in the vacuum chuck 34, bending and deformation do not occur.

In this way, in the peeling device 24, the roller 32 and the substrate contact 35 are sequentially moved from the peeling portion 18 side of the inorganic substrate 12, and the roller 32 and the substrate contact 35 are moved. Since peeling proceeds according to this, it is possible to control the peeling speed. As a result, excessive load applied to the inorganic substrate 12 or the polymer film 14 can be suppressed.

Here, in the present embodiment, the mesh-like sheet 38 may be disposed under the inorganic substrate 12 . Since the mesh-like sheet 38 is disposed under the inorganic substrate 12, the inorganic substrate 12 after peeling can be held.

As the mesh-like sheet 38, it is only necessary to have air permeability and a certain level of strength, and for example, a known screen mesh or the like can be used.

In addition, in this embodiment, although the case where the mesh type sheet 38 was used was demonstrated, in the peeling apparatus 24, it is good also as a structure which does not arrange|position a mesh type sheet. In this case, it is sufficient if there is another mechanism for extracting the separated inorganic substrate 12 each time.

As mentioned above, process C (process C including process G-1, process G-2, and process G-3) concerning 5th Embodiment was demonstrated.

[Sixth Embodiment]

In the sixth embodiment, a case where the polymer film 14 having the functional element 16 is separated from the layered body 11 having the functional element is described.

16 is a schematic sectional view of a peeling device according to a sixth embodiment. As shown in FIG. 16 , the peeling device 50 according to the sixth embodiment includes a support part 33, an air blow nozzle 45, a vacuum chuck 34, a member for embedding 64, and a flexible body. (66) is provided. In addition, since the support part 33 is the same as FIG. 14, it is not shown.

Since the support part 33, the air blow nozzle 45, and the vacuum chuck 34 have already been described in the section of the fourth embodiment, the description here is omitted.

The flexible support member 66 is placed on the vacuum chuck 34 and can hold the polymer film 14 when the laminate 11 having functional elements is placed thereon. The flexible support material 66 is not particularly limited as long as it has flexibility, and examples thereof include a silicone rubber sheet.

The embedding member 64 is disposed on the vacuum chuck 34, and holds the polymer film 14 when the laminate 11 having functional elements is disposed on the surface opposite to the vacuum chuck 34. It is possible. 16, it is in contact with the polymer film 14, but may be positioned outside the polymer film 14. The embedding member 64 is not particularly limited as long as it is porous and has flexibility. For example, a plastic sintered porous body, a metal porous sintered body, or a porous ceramic sintered body processed into a shape capable of embedding functional elements. can be heard

Step C according to the sixth embodiment includes step F2-1 and step F2-2. The peeling apparatus 50 performs process F2-1 and process F2-2 by operating as follows.

First, the peeling device 50 adsorbs the polymer film 14 side of the layered body 11 having functional elements with the vacuum chuck 34 and places it above the vacuum chamber 30 . At this time, the functional element 16 of the stacked body 11 is positioned so as to be positioned in the opening of the burial member 64 .

Next, the peeling device 50 displaces the inorganic substrate 12 in the direction in which the peeling portion 18 spreads (downward in Fig. 16) by the support part 33 (not shown) (Step F2- One).

Next, the peeling device 50 ejects gas from the air blow nozzle 45 to advance the peeling. Here, the air nozzle may be moved appropriately when the sample size is large (Step F2-2).

As a result, the entire polymer film 14 is peeled from the inorganic substrate 12 while maintaining a substantially flat surface. At this time, since the polymer film 14 is always held in the vacuum chuck 34, bending and deformation do not occur.

In the peeling device 50, in a state where the functional element 16 is embedded in the embedding member 64, dynamic pressure is applied to separate the polymer film 14 from the inorganic substrate 12, so that the functional element 16 It is possible to suppress an excessive load applied to the polymer film 14 at the location where is located. In addition, since the embedding member has some flexibility but maintains a flat surface, the polymer film 14 is also peeled while maintaining a substantially flat surface. This also suppresses an excessive load applied to the polymer film 14 .

In addition, the air blow nozzle 45 corresponds to the dynamic pressure forming means of the present invention.

The polymer film 14 having the functional element 16 peeled off in step C can be used as an electronic device, particularly a flexible electronic device. That is, the method including the step A-1, the step B and the step C is also a method of manufacturing an electronic device.

In the above, the fourth to sixth embodiments have been described.

In the following seventh to ninth embodiments, the step C,

"After the step B, the laminate is installed and fixed so that the polymer film surface of the laminate is in contact with the vacuum adsorption plate, a partition is provided on the side surface of the laminate, and then a nozzle is used to remove the gas from the peeling portion. The process of peeling the polymer film while maintaining it substantially flat by injecting and applying pressure will be described.

That is, the process C in the seventh to ninth embodiments is as follows.

<Process C in the seventh to ninth embodiments>

The laminate 10 is installed and fixed so that the surface of the polymer film 14 of the laminate 10 is in contact with the vacuum adsorption plate 34 (hereinafter also referred to as a vacuum chuck), and the laminate 10 A partition wall 31 is provided on the side surface of the polymer film 14 by injecting gas into the peeling portion 18 by a nozzle 45 (hereinafter also referred to as an air blow nozzle) and applying pressure thereto. is separated from the inorganic substrate 12 while maintaining it substantially flat (Step C).

[Seventh Embodiment]

17 to 19 are schematic cross-sectional views of a peeling device according to a seventh embodiment. 17 and 18 are views during setting of the peeling device, and FIG. 19 is a view immediately before injecting gas from the air blow nozzle 45. 17 to 19, the peeling devices 20, 21, 23 according to the seventh embodiment include a partition 31, a partition support part 33, an air blow nozzle 45, and a vacuum chuck. (34) and a flat plate 39 (hereinafter also referred to as an upper wall).

The vacuum chuck 34 can adsorb and hold the stacked body 10, and peeling can be performed with the stacked body 10 adsorbed. Since the polymer film 14 side of the layered product 10 is adsorbed to the vacuum chuck 34, the polymer film 14 and the inorganic substrate 12 are separated from the air blow nozzle 45 at the separated portion 18. By applying pressure, the polymer film 14 can be peeled from the inorganic substrate 12 while maintaining it substantially flat. In addition, the air blow nozzle 45 corresponds to the pressure forming means of the present invention.

Step C according to the seventh embodiment includes steps H-1 and H-2. The peeling apparatuses 20, 21, and 23 perform step H-1 and step H-2 by operating as follows.

First, the peeling devices 20 , 21 , and 23 adsorb the polymer film 14 side of the laminate 10 with the vacuum chuck 34 . At this time, the inorganic substrate 12 of the laminate 10 is brought into contact with the support part 33 .

Next, in the peeling devices 20 , 21 , and 23 , the air blow nozzle 45 penetrates the partition wall 31 . Then, gas is introduced from the air blow nozzle 45 so as to displace in the direction in which the peeled portion 18 between the inorganic substrate 12 and the polymer film 14 is widened. Further, a rough flat plate parallel to the inorganic substrate 12 and not in contact with the inorganic substrate 12 is provided on the side of the inorganic substrate 12 of the layered product 10 (step H-1). Specifically, deformation of the polymer film 14 is facilitated by making a cut not shown in the vacuum chuck under the polymer film 14 or introducing an air blow nozzle 45 from this end. It is preferable not to curve the inorganic substrate 12 large. It is preferable that the minimum curvature radius of the said curve is 350 mm or more. Since the load of the inorganic substrate 12 can be made small, more preferably it is 500 mm or more, More preferably, it is 800 mm or more. Moreover, in the instantaneous deformation at the time of peeling, since it deforms greatly, it is preferable that it is 1000 mm or less, More preferably, it is 1800 mm or less.

Next, the separation devices 20, 21, and 23 set the non-adhesive surface side 12a of the inorganic substrate 12 that is not in close contact with the polymer film 14 at atmospheric pressure or low pressure, while the air blow nozzle 45 By injecting gas from it, peeling proceeds. Here, the air nozzle may be moved appropriately when the sample size is large (Step H-2). In order to make the said non-adhesion surface low pressure, although not shown in FIGS. 17-19, the vacuum chamber 30 can be used, for example.

Subsequently, the entire polymer film 14 is peeled from the inorganic substrate 12 while maintaining a substantially flat surface. At this time, since the polymer film 14 is always held in the vacuum chuck 34, bending and deformation do not occur. The term "substantially flat" is not only a perfect flat surface, but preferably has a flatness of 1000 µm or less according to JISB0621 (1984), more preferably 500 µm or less, still more preferably 100 µm or less. Further, the deviation from the plane in the range of 1 mm 2 is preferably 10 μm or less, more preferably 3 μm or less, still more preferably 0.5 μm or less.

Here, the low pressure refers to a low pressure compared to the pressure of the gas supplied from the air blow nozzle 45, and refers to a vacuum or reduced pressure state or an open state. When the pressure of the gas supplied from the air blow nozzle 45 is sufficiently high, even a state in which the slightly pressurized state pressure is constantly controlled is included in the low pressure.

The high pressure refers to the pressure generated in the peeled portion by the pressure of the gas supplied from the air blow nozzle 45.

The barrier rib 31 is provided on the side surface of the laminate 10 . The partition wall 31 is a wall for separating the two so that the pressure of the gas supplied from the air blow nozzle 45 does not leak to the non-adhesion surface 12a side of the inorganic substrate. Here, the side surface refers to a position parallel to the thickness direction of the laminate 10 . In addition, since the barrier rib 31 exists on the side surface of the laminate 10, when gas is injected into the peeling portion 18, the pressure difference between the peeling portion 18 and the non-adhesive surface 12a of the inorganic substrate is reduced. outline can be maintained. In addition, the movement of the inorganic substrate 12 may be restricted only in a direction away from the polymer film 14 . The movement in the direction of separation refers to a movement in which the distance between the inorganic substrate 12 and the polymer film 14 increases in a direction substantially perpendicular to the plane of the polymer film 14 during peeling. The high pressure and the low pressure are separated by the partition wall 31.

The gas is not particularly limited, and air, nitrogen, helium, neon, argon and the like can be used.

[Eighth Embodiment]

20 to 24 are schematic cross-sectional views of modified examples of the peeling device according to the eighth embodiment. As shown in Figs. 20 to 24, the peeling apparatus 24, 25, 26, 27, 28 according to the eighth embodiment is a holding mechanism of the inorganic substrate 12 with respect to the peeling apparatus 20 described above. As such, there is no bulkhead support part 33. For this reason, the high-pressure gas can move from the edge (end|tip) of the inorganic substrate 12 peeled off to the non-adhesive surface 12a of the inorganic substrate. For this reason, the material of the partition wall 31 is selected, the distance between the inorganic substrate 12 and the partition wall 31 is narrowed, or the air is released by making a blank part in the upper wall, or the vacuum pump is sucked from the upper wall. Separation can be realized by maintaining a pressure difference between the peeling portion 18 and the non-adhesive surface 12a of the inorganic substrate as a measure. Since the inorganic substrate 12 follows the upper wall 39, it is mechanically restricted so as not to bend more than the minimum radius of curvature of the inorganic substrate 12. Thereby, the load on the inorganic substrate 12 at the time of peeling can be reduced. In particular, as with the peeling device 27, the upper wall 39 is parallel to the vacuum chuck 34, but slightly slanted, so that the range in which the inorganic substrate can be peeled can be limited. It is also an effective means to limit the movement at the time of peeling of an inorganic substrate by doing in this way. Further, in the peeling device 28, the O-ring 63 is used to couple the vacuum chuck 34 and the upper wall 39 between the partition walls 31, so that air leakage is strictly prevented. This is also a valid means.

The peeling device 25 performs the same operation as the peeling device 20 described above. However, since the vacuum chuck 37 for inorganic substrates is provided in the peeling device 25, the inorganic substrate 12 can be deformed in a direction in which the peeling portion widens while limiting the inorganic substrate 12 so as not to bend more than the minimum radius of curvature.

Step C according to the eighth embodiment includes step H-1 and step H-2. The peeling apparatuses 22 and 23 are the same as in the seventh embodiment except that there is no partition support part 33, and the steps H-1 and the step H-2 are performed by operating in the same manner as in the seventh embodiment.

[Ninth Embodiment]

In the ninth embodiment, a case where the polymer film 14 having the functional elements 16 is separated from the layered body 11 having the functional elements is described.

25 to 26 are schematic cross-sectional views of a peeling device according to a ninth embodiment. 25 to 26, the peeling devices 50 and 51 according to the ninth embodiment include a partition support part 33, an air blow nozzle 45, a vacuum chuck 34, and a vacuum for embedding. A chuck 65, an upper wall 39, and a vacuum chuck 37 for inorganic substrates are provided.

Since the bulkhead support part 33, the air blow nozzle 45, the vacuum chuck 34, the upper wall 39, and the vacuum chuck 37 for inorganic substrates have already been described in the section of the seventh embodiment, here The description of is omitted.

The vacuum chuck 65 for embedding is disposed on the vacuum chuck 34, and when the layered body 11 having functional elements is disposed on the surface opposite to the vacuum chuck 34, the polymer film 14 is removed. it is possible to keep 25 and 26, it is in contact with the polymer film 14, but it may be positioned outside the polymer film 14. The vacuum chuck 65 for embedding is not particularly limited as long as it is porous and has flexibility. can hear

Step C according to the ninth embodiment includes steps H-1 and H-2. The operation of the peeling device 50 is the same as that of the seventh embodiment, and 51 is the same as that of the seventh embodiment except that there is no bulkhead support part 33, and by operating in the same way as the seventh embodiment, step H- 1, process H-2 is performed.

First, the peeling device 50 adsorbs the polymer film 14 side of the layered body 11 having functional elements with the vacuum chuck 65 for embedding, and places it above the vacuum chuck 34 . At this time, the functional element 16 of the laminate 11 is positioned so as to be positioned in the opening of the vacuum chuck 65 for embedding.

Next, in the peeling device 50 , the air blow nozzle 45 penetrates the partition wall 31 . Then, gas is introduced from the air blow nozzle 45 so as to displace in the direction in which the peeled portion 18 between the inorganic substrate 12 and the polymer film 14 is widened. Further, a rough flat plate parallel to the inorganic substrate 12 and not in contact with the inorganic substrate 12 is provided on the side of the inorganic substrate 12 of the layered product 10 (step H-1). Specifically, deformation of the polymer film 14 is facilitated by making a cut not shown in the vacuum chuck 65 under the polymer film 14 or introducing an air blow nozzle 45 from this end. . It is preferable not to curve the inorganic substrate 12 too much.

While the non-adhesive surface side 12a of the inorganic substrate 12 that is not in close contact with the polymer film 14 is set to a low pressure, gas is injected from the air blow nozzle 45 to advance the separation. Here, the air nozzle may be moved appropriately when the sample size is large (Step H-2). In order to make the said non-adhesion surface low pressure, although not shown in FIGS. 25-26, the vacuum chamber 30 can be used, for example.

Subsequently, the entire polymer film 14 is peeled from the inorganic substrate 12 while maintaining a substantially flat surface.

In the peeling device 50, in a state where the functional element 16 is embedded in the vacuum chuck 65 for embedding, pressure is applied to separate the polymer film 14 from the inorganic substrate 12, so that the functional element 16 ) can be suppressed from being excessively loaded on the polymer film 14 at the location. In addition, since the embedding member has some flexibility but maintains a flat surface, the polymer film 14 is also peeled while maintaining a substantially flat surface. This also suppresses an excessive load applied to the polymer film 14 .

In addition, the air blow nozzle 45 corresponds to the pressure forming means of the present invention.

Further, in the step C, step J-1 of vacuum adsorbing the polymer film 14;

Step J-2 of providing a wall so as to also surround the nozzle portion and placing the gas injected into the layered body in a shielded space that does not blow out from the peeling portion;

It is also preferable to include a step J-3 of applying pressure from a nozzle and injecting gas after the step J-1 and the step J-2.

By providing a wall so as to surround the nozzle portion, the peeling portion 18 can be sealed, and a pressure difference between the polymer film 14 of the inorganic substrate 12 and the non-adhesive surface side 12a that is not in close contact can be efficiently provided. can

The polymer film 14 having the functional element 16 peeled off in step C can be used as an electronic device, particularly a flexible electronic device. That is, the method including the step A-1, the step B and the step C is also a method of manufacturing an electronic device.

In the above, the seventh to ninth embodiments have been described.

In the polymer film peeling method described above, step B is "spraying gas to a region including the boundary between the polymer film and the inorganic substrate at the end of the laminate to form a peeling region at the end" It may be "fair".

Hereinafter, for the case where step B is "a step of spraying a gas into a region including a boundary between the polymer film and the inorganic substrate at the end of the laminate, and forming a peeling region at the end", the first It demonstrates as 10th embodiment - 11th embodiment.

[Tenth Embodiment]

<Process A>

In the polymer film peeling method according to the tenth embodiment, first, a laminate in which the polymer film and the inorganic substrate are in close contact is prepared (Step A). Fig. 27 is a schematic cross-sectional view showing an example of a laminate, and Fig. 28 is a plan view thereof. As shown in FIGS. 27 and 28 , the laminate 110 includes an inorganic substrate 112 and a polymer film 114 . The inorganic substrate 112 and the polymer film 114 are in close contact. The inorganic substrate 112 and the polymer film 114 may be in close contact with a silane coupling agent layer (not shown) therebetween.

On the polymer film 114, circuit patterns and/or functional elements are formed (not shown). That is, in the present embodiment, both circuit patterns and functional elements may be formed on the polymer film 114, or circuit patterns may be formed and functional elements may not be formed, and functional elements may be formed and circuits may be formed. The pattern may not be formed.

The circuit pattern can be formed by a conventionally known method. The thickness of the circuit pattern is usually about 0.05 μm to 20 μm, preferably about 0.1 μm to 15 μm, and more preferably about 0.15 μm to 0.5 μm.

As shown in FIG. 28 , at the left and right ends of the laminate 110, the end faces of the inorganic substrate 112 and the polymer film 114 are flush with each other. In addition, there are portions where the polymer film 114 does not exist on the inorganic substrate 112 at the upper and lower ends of the laminate 110 . That is, in the laminate 110, the size of the polymer film 114 is smaller than that of the inorganic substrate 112 in plan view. In this embodiment, the case of using the laminate 110 shown in FIGS. 27 and 28 will be described, but the laminate that can be used in the present invention is not limited to the laminate 110, and on the inorganic substrate A polymer film may be laminated on at least a part thereof, or a laminate in which a polymer film is laminated on the entire surface of an inorganic substrate may be used. Moreover, a protective film may be further provided on the polymer film. The size of the protective film and the size of the polymer film may be the same, or the size of the protective film may be smaller. In addition, there may be cases where the size of the protective film and the size of the polymer film are the same in some sides, and the size of the protective film in some sides is smaller than the size of the polymer film. Depending on the device configuration, there may be cases where the size of the protective film is larger than the size of the polymer film on some sides.

As a method of obtaining the layered product 110, a method similar to the method of obtaining the layered product 10 described above can be employed.

As the inorganic substrate 112, the same thing as the inorganic substrate 12 described above can be used.

As the polymer film 114, the same polymer film 14 described above can be used.

<Process W>

Fig. 29 is a schematic cross-sectional view showing a laminate after forming an extremely finely peeled portion, and Fig. 30 is a plan view thereof. After Step A, if necessary, a micro-exfoliated portion 115 is formed in a region including the boundary between the polymer film 114 and the inorganic substrate 112 at the end of the layered product 110 (Step W) . This step W is a step that may be performed as needed before step B described below. In a layered product, an extremely minute peeling part may exist even if especially the process of forming a very minute peeling part is not performed. That is, at the time of process A, a very small peeling part may exist. In this case, it is not necessary to perform this step W. For example, when a laminate of a large-area polymer film and an inorganic substrate is divided into a laminate, microscopically separated portions are usually formed in the course of division. Here, the extremely minutely peeled portion refers to a peeled portion in which the distance from the end face of the laminate (the horizontal width of the extremely minutely peeled portion 115 in FIG. 30 ) is less than 3 mm. The distance from the end surface of the laminate is 1 mm or less, and the length in the width direction of the end (vertical width of the ultra-micro peeling portion 115 in FIG. 30) is 5 mm or less. Preferably, the distance from the end surface of the laminate is 3 mm or less, and the length in the width direction of the end is more preferably 10 mm or less.

In addition, when the distance from the end surface of a laminated body is 0.5 mm or more and 3 mm or less, and there exists a peeling part in the whole surface in the width direction of an edge part, it is not necessary to perform process W.

On the other hand, in the case where there is no exfoliation area at all at the end of the layered product 110 (when no micro exfoliation portion exists), it is preferable to perform the step W above. If the step W is performed, it becomes possible to easily form the peeling region in the step B described below.

The method of forming the micro-exfoliated portion 115 is not particularly limited, but is a method of lightly touching the end of the laminate 110 with tweezers or a rotating brush, or a method of slightly moving tweezers or the like up and down after lightly touching it. , A method of inserting a knife made of a polymer between an inorganic substrate and a polymer film, and a method of irradiating a laser having a wavelength that is transmitted through the glass but absorbed by the polymer film from the side of the inorganic substrate (glass side) when glass is used as the inorganic substrate. , a method in which an inorganic substrate is cut and the polymer film is intentionally slightly peeled off during peeling. Since the step W is a step of only forming a slight peeling portion, air bubbles are usually generated at the boundary between the polymer film and the inorganic substrate simply by lightly touching the end portion, and this becomes the microscopic peeling portion 115. .

The microscopically peeled portion 115 may be located at a plurality of places in the width direction of the end, or on the entire adjacent surface.

<Process B>

Next, at the end of the laminate 110, a gas is sprayed on a region including the boundary between the polymer film 114 and the inorganic substrate 112 to form a peeling region 118 at the end (step B). ). In this process B, when the said process W is performed, gas is sprayed to the area|region containing the micro peeling part 115, and the peeling area|region 118 is formed in the edge part.

31 is a schematic sectional view of a peeling device according to a tenth embodiment. As shown in FIG. 31 , the peeling device 120 according to the tenth embodiment includes a nozzle 122 (hereinafter, also referred to as an air blow nozzle 122) and a press plate 124 .

The air blow nozzle 122 is applied to the region including the boundary between the polymer film 114 and the inorganic substrate 112 at the end of the laminate 110 (in the case of forming the micro-exfoliation portion 115, the micro-exfoliation is performed). It is arranged so that it is possible to spray gas to the area including the portion 115). The gas is not particularly limited, and examples thereof include inert gases such as air, nitrogen gas, argon gas, and carbon dioxide gas. In order to prevent the polymer film from absorbing moisture, the gas is preferably in a dry state. However, when giving priority to preventing electrification, it is preferable that it is a gas containing humidity. In the case of a gas containing humidity, the humidity of the gas is preferably about 50% RH or more and 80% RH or less.

The flow velocity of the gas when spraying the gas is preferably 100 m/s or more, more preferably 200 m/s or more, and still more preferably 300 m/s or more. The upper limit of the flow velocity is not particularly limited, but it can be, for example, 500 m/s or less, preferably 343 m/s or less, etc., from the influence of shock wave vibration in the supersonic speed range. The 90° peel strength between the polymer film 114 and the inorganic substrate 112 in the laminate 110 is generally within the range of 0.05 N/cm or more and 3 N/cm or less, more preferably 0.08 It is N/cm or more and 2 N/cm or less. More preferably, it is 0.1 N/cm or more and 0.8 N/cm or less. Therefore, when the flow rate at the time of spraying the gas is within the above numerical range, the peeling region 118 can be suitably formed between the polymer film 114 and the inorganic substrate 112 bonded with the peel strength. .

In addition, the measurement conditions of the said 90 degree peel strength are as follows.

The polymer film was held at an angle of 90° with respect to the inorganic substrate and peeled off.

The measurement is performed 5 times, and the average value is taken as the measured value.

measuring temperature; Room temperature (25℃)

peeling rate; 100mm/min

atmosphere; Waiting

measurement sample width; 1cm

The pressing plate 124 has a rod shape with a rectangular cross section, and can press the upper surface of the polymer film 114, and can regulate the size of the peeling area 118 formed by the air blow nozzle 122. By pressing the upper surface of the polymer film 114 with the pressure plate 124, it is possible to prevent the peeling region 118 from spreading inward from the pressure plate 124. Here, a peeling area|region means the area|region where the distance from the end surface of a laminated body peeled in the range of 3 mm or more and 20 mm or less. The material of the pressing plates 124, 126, 127 is not particularly limited, but may be a metal or a material covered with a polymer film on the outside of the metal, or a material that is made of a polymer and is less likely to damage the glass.

When a circuit pattern is formed on the polymer film 114 or when a functional element is formed, it is preferable that the circuit pattern is not bent as much as possible. In addition, it is preferable that the polymer film 114 is not bent as much as possible in a location where a functional element is formed. That is, it is preferable that the peeling area is formed in a range where no circuit pattern or functional element is formed. Circuit patterns and functional elements are usually formed in the center of the polymer film 114 and are not formed so as to cover the outer periphery. Therefore, if the exfoliation area is formed within the above numerical range, it is possible to form the exfoliation area within a range where no circuit pattern or functional element is formed.

In step B, the peeling device 120 blows air into the region including the boundary between the polymer film 114 and the inorganic substrate 112 while pressing the upper surface of the polymer film 114 with the pressure plate 124. A gas is sprayed by a nozzle 122 to form a peeled area 118 at the end. In addition, the air blow nozzle 122 and the pressing plate 124 correspond to the exfoliation area forming means of the present invention.

32 is a schematic cross-sectional view of a modified example of the peeling device according to the tenth embodiment. As shown in FIG. 32, the peeling device 121 differs in the shape of the press plate from the peeling device 120 described above.

The peeling device 121 includes an air blow nozzle 122 and a pressure plate 126 .

The pressure plate 126 is rod-shaped, and the surface on the side facing the air blow nozzle 122 (the right side of the cross section shown in Fig. 32) has a constant curvature.

In the peeling device 121, in step B, when gas is sprayed from the air blow nozzle 122 to the region including the boundary between the polymer film 114 and the inorganic substrate 112, the rolled up polymer film 114 ) is pressed along the face of the pressing plate 126. This makes it possible to prevent the polymer film 114 from bending beyond a certain curvature. As an example of said curvature, the range of curvature radius of 3 mm - 500 mm is mentioned. When a circuit pattern is formed on the polymer film 114, it is preferable that the circuit pattern is not bent as much as possible, so it is preferable that the radius of curvature is 10 mm or more.

33 is a schematic cross-sectional view of another modified example of the peeling device according to the tenth embodiment. As shown in FIG. 33, the peeling apparatus 123 is the structure which added the support plate 128 with respect to the peeling apparatus 121 demonstrated above. As a support plate, any of glass, metal, ceramics, a polymer, or these composite materials can be used. A polymer or fiber-reinforced plastic that is difficult to damage the inorganic substrate and easily follows deformation of the inorganic substrate is preferable.

In the peeling device 123, in step B, the support plate 128 is disposed next to the inorganic substrate 112. Specifically, the support plate 128 is disposed next to the inorganic substrate 112 so that its upper surface is flush with the upper surface of the inorganic substrate 112 . In addition, the air blow nozzle 122 is arranged so as to follow the support plate 128 . In this way, the gas from the air blow nozzle 122 can be reliably sprayed onto the region including the boundary between the polymer film and the inorganic substrate. Further, when the gas from the air blow nozzle 122 can be reliably sprayed along the support plate 128 to a region including the boundary between the polymer film and the inorganic substrate, the air blow nozzle for the support plate 128 The arrangement of (122) and the blowing angle are not particularly limited.

34 and 35 are schematic cross-sectional views of another modified example of the peeling device according to the tenth embodiment. As shown in FIG. 34 , the peeling device 130 has a configuration in which a support plate 128 is added to the peeling device 120 described above, and a step of adhering the adhesive tape 132 is added. is a composition

In the peeling device 130, as shown in FIG. 34, immediately before performing step B, the adhesive tape 132 is adhered to the upper surface of the polymer film 114 so as to protrude from the polymer film 114. The bonding position of the adhesive tape 132 is set as the position where the support plate 128 exists below the protruding part.

As the adhesive tape 132, a conventionally known one can be employed as long as the adhesive strength between the polymer film 114 and the adhesive tape 132 is higher than the adhesive strength between the inorganic substrate 112 and the polymer film 114. As the adhesive tape 132, it is preferable to laminate a substrate having a certain level of hardness (for example, a PET film) and a conventionally known adhesive layer.

In the peeling apparatus 130, gas is blown off from the air blow nozzle 122 in the state of FIG. Thereby, the gas from the air blow nozzle 122 can be more reliably blown into the space between the upper surface of the support plate 128 and the lower surface of the adhesive tape 132, and as shown in FIG. 35, the pressure As a result, the polymer film 114 is rolled up together with the adhesive tape 132 .

In the peeling device 130 and the peeling method described with reference to FIGS. 34 and 35 , the polymer film 114 can be rolled up from the inorganic substrate 112 with a particularly large force. Therefore, even when the extremely minute peeling part 115 does not exist in the layered product 110 in the state immediately before performing process B, it becomes possible to form the peeling area|region 118 suitably.

In the above, process B according to the tenth embodiment has been described.

<Process C>

Next, using the peeling region 118 as the starting point, the polymer film 114 is peeled from the inorganic substrate 112 (Step C).

The method of peeling the polymer film 114 from the inorganic substrate 112 is not particularly limited. For example, the inorganic substrate 112 is bent and stretched in a direction away from the polymer film 114 to separate the peeling region 118. Using as a starting point, the method of peeling is mentioned. At this time, gas may be ejected from the air blow nozzle 122 to further promote the separation. The above device (a device for bending the inorganic substrate 112, stretching it in a direction away from the polymer film 114, and separating it from the peeling region 118 as a starting point), or air that ejects gas during the peeling The blow nozzle 122 corresponds to the peeling means of the present invention.

In the above, process C according to the tenth embodiment has been described.

In addition, since the peeling method of the polymer film according to the tenth embodiment includes the step A, the step B, and the step C, it is also a method for manufacturing an electronic device.

In the case of using a laminate having functional elements, in step C, it is preferable to peel the polymer film 114 from the inorganic substrate 112 while keeping the functional element formation region of the polymer film 114 flat. . When the polymer film 114 is peeled from the inorganic substrate 112 while the functional element formation region of the polymer film 114 is kept flat, an excessive load is applied to the polymer film 114 at the location where the functional element is located. can suppress it.

Further, in the tenth embodiment, the shape of the pressure plate is not limited to the same shape as the pressure plate 124 or pressure plate 126, as long as it is possible to press the upper surface of the polymer film 114.

[Eleventh Embodiment]

<Process A>

In the polymer film peeling method according to the eleventh embodiment, first, a laminate in which the polymer film and the inorganic substrate are in close contact is prepared (Step A).

36 is a schematic sectional view of a peeling device according to an eleventh embodiment. 36 also shows a layered body having functional elements together with the peeling device. As shown in FIG. 36, the laminate 111 having functional elements is composed of the laminate 110 (a laminate in which the inorganic substrate 112 and the polymer film 114 are in close contact), and the polymer of the laminate 110. It has a functional element 116 provided on the film 114. The functional element 116 is formed on the polymer film 114 in such a way that it does not touch the outer periphery of the polymer film 114 .

<Process W>

After Step A, if necessary, a micro-exfoliated portion 115 is formed in a region including the boundary between the polymer film 114 and the inorganic substrate 112 at the end of the layered product 110 (Step W) . Since the process W was described in the tenth embodiment, the description here is omitted.

In 11th Embodiment, the following process is performed as a step before process B.

First, the protective film 152 is adhered to the polymer film 114 side of the multilayer body 111 having functional elements. In the protective film 152, holes are formed at positions corresponding to the locations where the functional elements 116 are provided. The functional element 116 is inserted through the hole and protrudes onto the protective film 152 .

Next, a porous body 154 having a concave portion corresponding to the shape of the functional element 116 is prepared, and the functional element is formed on the porous body 154 so that the functional element 116 is fitted into the concave portion. Laminate 111 is disposed.

Next, the outer periphery of the laminated body 111 having functional elements and the outer periphery of the vacuum chuck 142 are bonded together with the adhesive 158 so that the porous body 154 is sandwiched therebetween. As the material of the porous body, any of a polymer porous body, a metal porous body, and a ceramic porous body can be used. As the polymeric porous material, low density polyethylene, high density polyethylene, ultra high density polyethylene, polypropylene, polymethacrylic, polyvinyl chloride, fluororesin, etc. are used. As a metal porous body, Cu, SUS, titanium, etc. are used. As the ceramic porous body, alumina, aluminum nitride, silicon nitride, zirconia and the like are used.

<Process B>

Next, at the end of the laminate 110, a gas is sprayed on a region including the boundary between the polymer film 114 and the inorganic substrate 112 to form a peeling region 118 at the end (step B). ).

As shown in FIG. 36 , the peeling device 140 according to the eleventh embodiment includes an air blow nozzle 122 and a pressure plate 126 . Since the air blow nozzle 122 and the pressure plate 126 were described in the tenth embodiment, the description here is omitted.

In step B, the peeling device 140 blows air into the region including the boundary between the polymer film 114 and the inorganic substrate 112 while pressing the upper surface of the polymer film 114 with the pressure plate 126. A gas is sprayed by a nozzle 122 to form a peeled area 118 at the end. In addition, the air blow nozzle 122 and the pressing plate 126 correspond to the exfoliation area forming means of the present invention.

37 is a schematic cross-sectional view of a modified example of the peeling device according to the eleventh embodiment. As shown in FIG. 37, the peeling device 144 differs in the shape of the press plate from the peeling device 140 described above.

The peeling device 144 includes an air blow nozzle 122 and a pressure plate 127 .

The press plate 127 has a flat upper surface and is arranged below the end of the polymer film 114 . In addition, the pressure plate 127 is arranged so that it does not touch the upper surface of the polymer film 114 before the start of process B (before gas spraying).

In step B, the peeling device 144 sprays gas with the air blow nozzle 122 to a region including the boundary between the polymer film 114 and the inorganic substrate 112, and then the peeling region 118 is formed at the end. ) to form The peeled portion of the polymer film 114 sags to the pressure plate 127, but the peeled area 118 can be prevented from spreading further by the pressure plate 127. In addition, the air blow nozzle 122 and the pressing plate 127 correspond to the exfoliation area forming means of the present invention.

38 and 39 are schematic cross-sectional views of another modified example of the peeling device according to the eleventh embodiment. As shown in FIG. 38 , the peeling device 146 has a structure in which a support plate 168 is added to the peeling device 140 described above, and a structure in which the step of adhering the adhesive tape 162 is added. to be. It is also different in that, instead of using the press plate 126, a soft press plate 164 made of a soft porous material typified by a nonwoven fabric or a sponge is used.

In the peeling device 146, as shown in FIG. 38 , immediately before performing step B, an adhesive tape ( 162). A soft pressure plate 164 is placed under the adhesive tape 162 . In addition, a fixing member 166 is disposed below the soft pressing plate 164 to fix the position of the soft pressing plate 164 .

As the adhesive tape 162, the same adhesive tape 132 described above can be employed.

The material of the protective film 152 is not particularly limited, but examples include PET, PP, OPP, PEN, PE, PVC, etc. as the base material, and as the adhesive material layer on the polymer film 114 side, silicone-based or urethane-based , acrylic type, synthetic rubber type, etc. are mentioned. It is preferable that the protective film 152 is treated with antistatic treatment on the substrate or the adhesive material layer. The adhesive strength of the protective film is 0.1 N/cm or less, more preferably 0.06 N/cm or less, at 90 degree peeling. However, if the peel strength is too weak, peeling may occur between the protective film and the polymer film, so 0.001 N/cm or more is preferable.

In the peeling apparatus 146, in process B, the support plate 168 is arrange|positioned next to the inorganic substrate 112. Specifically, the support plate 168 is disposed next to the inorganic substrate 112 so that its upper surface (lower side in FIG. 38 ) is flush with the upper surface (lower side in FIG. 38 ) of the inorganic substrate 112 . In addition, the air blow nozzle 122 is arranged so as to follow the support plate 128 . In this way, the gas from the air blow nozzle 122 can be reliably sprayed onto the region including the boundary between the polymer film and the inorganic substrate.

In the peeling device 146, gas is ejected from the air blow nozzle 122 in the state of FIG. 38 . In this way, gas from the air blow nozzle 122 is blown into the space between the upper surface of the support plate 168 (lower side in FIG. 38 ) and the lower surface of the adhesive tape 162 (upper side in FIG. 38 ). As shown in 39, the polymer film 114 is rolled up together with the adhesive tape 162 by the pressure.

At this time, since the nonwoven fabric 164 (soft holding plate 164) exists under the adhesive tape 162, the polymer film 114 is rolled up to a certain extent, but the nonwoven fabric 164 (soft holding plate 164) As a result, the exfoliated region 118 can be prevented from widening any further.

In the peeling device 146 and the peeling method described with reference to FIGS. 38 and 39 , the polymer film 114 can be rolled up from the inorganic substrate 112 with a particularly large force. Therefore, even when the extremely minute peeling part 115 does not exist in the layered product 110 in the state immediately before performing the step B, it becomes possible to form the peeling region 118 suitably.

In the eleventh embodiment, since the functional element 116 is arranged on the polymer film 114, it is preferable not to bend as much as possible at the location where the functional element 116 is arranged. That is, it is preferable that the exfoliation region 118 is formed in a range where the functional element 116 is not formed. In the eleventh embodiment, the functional element 116 is formed on the polymer film 114 in such a way that it does not touch the outer periphery of the polymer film 114, and the peeling region 118 formed in the step B is functional element formation Since it is outside the area, when forming the peeling area 118, excessive load applied to the polymer film 114 can be suppressed.

In the above, process B according to the eleventh embodiment has been described.

<Process C>

Next, using the peeling region 118 as the starting point, the polymer film 114 is peeled from the inorganic substrate 112 (Step C).

For step C, the same method as in the tenth embodiment can be employed. In particular, in the eleventh embodiment, since the polymer film 114 having the functional element 116 is peeled from the inorganic substrate 112, in step C, the functional element formation region of the polymer film 114 is kept flat. It is preferable to peel the polymer film 114 from the inorganic substrate 112 without leaving it. In the eleventh embodiment, in a state where the polymer film 114 having the functional element 116 is fixed on the flat vacuum chuck 142, the inorganic substrate 112 is bent (in FIG. 39, the right end is bent upward) ), and is stretched in a direction away from the polymer film 114. In this way, the polymer film 114 can be separated from the inorganic substrate 112 while maintaining the functional element formation region of the polymer film 114 flat. As a result, excessive load applied to the polymer film 114 at the location where the functional element 116 is located can be suppressed.

In addition, in this specification, the "plane" of "peeling while holding|maintained flat" includes the case of not only a perfect plane but also a substantially plane. The above-mentioned substantially flat means that the flatness defined by JIS B 0621 (1984) is 1000 μm or less, preferably 500 μm or less, more preferably 100 μm or less. Further, the deviation from the plane in the range of 1 mm 2 is preferably 10 μm or less, more preferably 3 μm or less, still more preferably 0.5 μm or less.

In the above, process C according to the eleventh embodiment has been described.

In addition, since the peeling method of the polymer film according to the eleventh embodiment includes the step A, the step B, and the step C, it is also a method for manufacturing an electronic device.

According to the polymer film peeling method, electronic device manufacturing method, and peeling apparatus according to the tenth and eleventh embodiments, the polymer film 114 is attached to an inorganic substrate (without mechanically holding the polymer film 114). 112). As a result, it is possible to easily peel the polymer film from the inorganic substrate without damaging the quality of the polymer film, circuits or devices formed on the surface of the polymer film, and elements mounted on the polymer film.

In the above-described embodiment, the end faces of the inorganic substrate 112 and the polymer film 114 are on the same plane at the end (right end in FIG. A case has been described. However, the laminate that can be used in the present invention is not limited to this example, and the end faces of the inorganic substrate and the polymer film do not have to be the same plane at the end where the peeling region is to be formed.

Fig. 40 is a schematic cross-sectional view showing another example of a laminate, and Fig. 41 is a plan view thereof. As shown in FIGS. 40 and 41 , the laminate 170 includes an inorganic substrate 112 and a polymer film 174 . The inorganic substrate 112 and the polymer film 174 are in close contact.

At the upper end, lower end, and right end of the laminate 170 , there is a portion where the polymer film 174 is not present on the inorganic substrate 112 . That is, in the laminate 170, the polymer film 174 is not formed on the inorganic substrate 112 at the end (right end in FIG. 41) where the exfoliation region is to be formed.

In the laminate 170, the portion 76 of the inorganic substrate 112 on which the polymer film 174 is not formed on the upper surface is the support plate (support plate 128 or support plate 168) described above. can combine the functions of That is, in process B, when arranging the air blow nozzle 122, it can be arranged so that it may follow this part 76. In this case, the support plate can be made unnecessary.

As mentioned above, although the embodiment of the present invention has been described, the present invention is not limited to the above examples, and it is possible to make appropriate design changes within a range satisfying the configuration of the present invention.

10 laminate
Laminate with 11 functional elements
12 inorganic substrate
12a non-contact surface of inorganic substrate
14 polymer film
14a Secret Encounter
16 functional elements
18 peeling part
20, 21, 22, 23, 24, 25, 26, 27, 28, 40, 50 Peeling device
30 vacuum chamber
31 bulkhead
32 roller
33 support parts
34 vacuum chuck
35 board contact
36 dummy film
37 vacuum chuck for inorganic substrates
38 mesh type seat
39 Rough Reputation (Upper Wall)
42 diaphragm
45 air blow nozzle
52 porous flexible body
54 pressure inlet
62 spacer
63 O-ring
64 Material for landfill
65 landfill vacuum chuck
66 flexible support
110, 170 laminate
Laminate with 111 functional elements
112 inorganic substrate
114, 174 polymer film
115 Micro-exfoliation part
116 functional elements
118 Exfoliation zone
120, 121, 123, 130, 140, 144, 146 peeling device
122 nozzle
124, 126, 127 pressure plate
128 support plate
132 adhesive tape
142 vacuum chuck
152 protective film
154 porous body
158 adhesive
162 adhesive tape
164 soft pressing plate
166 Fixing member
168 support plate

Claims (23)

A step A of preparing a laminate in which a polymer film having a circuit pattern and/or functional element formed thereon and an inorganic substrate are in close contact with each other;
Step B of forming a peeling portion between the polymer film and the inorganic substrate at the end of the laminate;
Step C of separating the inorganic substrate from the inorganic substrate while keeping the polymer film substantially flat by bending the inorganic substrate in a direction away from the polymer film
A peeling method of a polymer film comprising a. The method of claim 1, wherein the step C,
After the step B, a static pressure difference is provided between the non-adhesive surface of the inorganic substrate that is not in close contact with the polymer film and the peeling portion, and the inorganic substrate is bent in a direction away from the polymer film, thereby forming the polymer film A method of peeling a polymer film, characterized in that it is a step of peeling from the inorganic substrate while maintaining a substantially flat surface. The step C according to claim 1 or 2,
Step D-1 of arranging a roller or substrate contact on the non-adhesion surface side of the inorganic substrate and pressing the inorganic substrate in the direction of the peeling portion by the roller or substrate contact;
Step D-2 of providing the static pressure difference by setting the non-adhesive surface side to atmospheric pressure while setting the peeling portion to atmospheric pressure;
After Step D-1 and Step D-2, Step D of moving the roller or substrate contactor in parallel with the non-adhesion surface of the inorganic substrate, and proceeding with the separation in accordance with the movement of the roller or substrate contactor. A peeling method of a polymer film, characterized in that it comprises -3. The step C according to any one of claims 1 to 3,
A method of peeling a polymer film, characterized in that a pressure difference between the non-adhesive surface side of the inorganic substrate and the peeling portion is set to a pressure higher than atmospheric pressure. The step C according to any one of claims 1 to 4,
Step E of disposing an embedding member or spacer on the non-adhesive surface side of the polymer film and pressing the inorganic substrate in the direction of the peeling portion with a porous flexible body while embedding the functional element in the embedding member or spacer A method for peeling a polymer film characterized by including -1 and step E-2 of providing the positive pressure difference by setting the non-adhesive surface side of the inorganic substrate to less than atmospheric pressure and setting the peeling portion to atmospheric pressure. The method of claim 1, wherein the step C,
A method for peeling a polymer film, characterized in that, after the step B, a step of peeling the polymer film from the inorganic substrate by applying a dynamic pressure to the peeling portion while keeping the polymer film substantially flat. The step C according to claim 1 or 6,
Step F-1 of displacing the inorganic substrate to the side of the non-adhesive surface that is not in close contact with the polymer film;
Step F-2 of applying the dynamic pressure by applying a flow of gas to the peeling portion while lowering the pressure on the non-adhesive surface side of the inorganic substrate to be less than atmospheric pressure. The step C according to claim 1, 6 or 7,
Step G-1 of arranging a roller or substrate contact on the non-adhesion surface side of the inorganic substrate and pressing the inorganic substrate in the direction of the peeling portion by the roller or substrate contact;
Step G-2 of applying the dynamic pressure by applying a flow of fluid to the peeling portion;
After Step G-1 and Step G-2, Step G of moving the roller or substrate contactor in parallel with the non-adhesion surface of the inorganic substrate, and advancing the peeling in accordance with the movement of the roller or substrate contactor. A peeling method of a polymer film, characterized in that it comprises -3. The peeling method for a polymer film according to claim 7 or 8, wherein the displacement is a curve, and the minimum radius of curvature of the curve is 350 mm or more. The method of claim 1, wherein the step C,
After step B, the laminate is installed and fixed so that the polymer film surface of the laminate is in contact with the vacuum adsorption plate, a partition wall is provided on the side surface of the laminate, and gas is then supplied to the peeling portion by a nozzle. A method of peeling a polymer film, characterized in that it is a step of peeling the polymer film while maintaining it substantially flat by injecting and applying pressure. The process C according to claim 1 or 10,
Step H-1 of placing a rough flat plate parallel to the inorganic substrate and not in contact with the inorganic substrate;
Step H-2 of applying pressure to the peeling portion by injecting gas into the peeling portion while the side of the non-adhesive surface of the inorganic substrate with the polymer film is subjected to atmospheric pressure or low pressure. peeling method. The step C according to claim 1, 10 or 11,
Step J-1 of vacuum adsorbing the polymer film;
Step J-2 of providing a wall so as to also surround the nozzle portion and placing the gas injected into the layered body in a shielded space that does not blow out from the peeling portion;
A peeling method for a polymer film characterized by comprising a step J-3 of injecting a gas by applying pressure from a nozzle after the step J-1 and the step J-2. The process B according to any one of claims 1 to 12,
A step of forming a peeling region at the end portion of the laminate by spraying a gas into a region including a boundary between the polymer film and the inorganic substrate at the end portion of the laminate. The method for peeling a polymer film according to any one of claims 1 to 13, wherein the circuit pattern and/or the functional element are formed in such a way that they do not touch the outer periphery of the polymer film. The peeling method of a polymer film according to claim 13 or 14, wherein the peeling region formed in step B is outside the circuit pattern and/or functional element forming region. The step C according to any one of claims 13 to 15,
A step of peeling the polymer film from the inorganic substrate while maintaining the circuit pattern and/or the functional element formation region of the polymer film flat. The process W according to any one of claims 13 to 16, wherein, before the process B, at an end of the layered body, a micro-exfoliated portion is formed in a region including a boundary between the polymer film and the inorganic substrate. including,
The peeling method for a polymer film, characterized in that step B is, after the step W, a step of spraying a gas to a region containing the micro-exfoliated portion to form the peeled region at the end. The circuit pattern and/or the functional element according to any one of claims 1 to 17, on a surface of the polymer film on which the circuit pattern and/or the functional element are not provided before step C. A method for peeling a polymer film characterized by comprising step X of providing a spacer having a thickness approximately equal to the thickness of The method according to any one of claims 1 to 18, wherein at least one selected from the group consisting of an embedding member, a spacer, and a vacuum chuck for embedding is disposed on the non-adhesive surface side of the polymer film before the step C, A peeling step Y is performed while embedding the circuit pattern and/or functional element in at least one selected from the group consisting of the embedding member, the spacer, and the embedding vacuum chuck. The method according to any one of claims 1 to 19, wherein a step Z of attaching an adhesive protective film to protect the circuit pattern and/or functional element of the polymer film of the laminate is included before the step C. A peeling method of a polymer film, characterized in that for doing. A step A of preparing a laminate in which a polymer film having a circuit pattern and/or functional element formed thereon and an inorganic substrate are in close contact with each other;
Step B of forming a peeling portion between the polymer film and the inorganic substrate at the end of the laminate;
and step C of separating the inorganic substrate from the inorganic substrate while keeping the polymer film substantially flat by bending the inorganic substrate in a direction away from the polymer film. 22. The method of manufacturing an electronic device according to claim 21, wherein there is no attachment of laser smear. A peeling device for peeling a polymer film from an inorganic substrate in a laminate in which a polymer film having a circuit pattern and/or functional element in close contact with an inorganic substrate is adhered thereto,
At an end of the laminate, means for forming a separation portion between the polymer film and the inorganic substrate;
A peeling device comprising: a peeling means for separating the inorganic substrate from the inorganic substrate while keeping the polymer film substantially flat by bending the inorganic substrate in a direction away from the polymer film.

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