KR20220162639A - Film forming apparatus and manufacturing apparatus of electronic device - Google Patents

Abstract

The present invention is to provide a technique for suitably storing a mask in an inline film forming apparatus. An inline film forming apparatus, which conveys a substrate carrier holding and supporting a substrate and a mask to form a film, comprises: a combination chamber for laminating a substrate carrier and a mask or mounting the substrate carrier on the mask; a deposition chamber for forming a film on a substrate by depositing a material on the substrate laminated or mounted on the mask through the mask; a separation chamber for separating the substrate carrier from the mask; and a mask storage chamber for storing the plurality of masks, which are separated from the substrate in the separation chamber.

Description

Film forming apparatus and electronic device manufacturing apparatus

The present invention relates to a film forming apparatus and an electronic device manufacturing apparatus.

BACKGROUND ART [0002] Conventionally, a film forming apparatus for forming a film by depositing an evaporation material on a substrate such as glass is known, and is used for manufacturing electronic devices such as liquid crystal monitors and organic EL displays. As a film forming apparatus, a cluster type apparatus in which a plurality of chambers in which film is formed on a substrate is arranged in a cluster shape, and an inline type apparatus in which a film formation process is performed while a substrate is transported along a conveyance path are known. In Patent Document 1 (Japanese Unexamined Patent Publication No. 2020-094261), a plurality of layers are formed by subjecting a substrate held by a substrate carrier to an alignment process with a mask or a film formation process in a plurality of chambers while being transported. An in-line film forming apparatus in which a display is manufactured is described.

Patent Document 1: Japanese Unexamined Patent Publication No. 2020-094261

A plurality of substrate carriers and a plurality of masks are circulated in the film formation apparatus of Patent Literature 1, and the substrates sequentially carried into the film formation apparatus are held by the substrate carrier and moved on a conveyance path, positioning with the mask and After installation, it undergoes a film formation process. Here, the substrate carried into the film forming apparatus is moved to the alignment chamber while being held by the substrate carrier, and the entire substrate carrier is aligned with the mask and combined with the mask. Then, the substrate carrier is moved to the film formation chamber while holding both the substrate and the mask, and is subjected to film formation while being transported. After completion of the deposition, the mask is removed from the substrate carrier for use in deposition of the next substrate. Then, the substrate on which the film formation is completed is separated from the carrier and carried out of the film formation apparatus.

However, a method for storing a plurality of masks separated from a substrate carrier in an inline film forming apparatus for use in forming a film of a substrate thereafter has not been sufficiently studied.

The present invention has been made in view of the above problems, and an object of the present invention is to provide a technique for properly storing a mask in an inline film forming apparatus.

In order to solve the above problems, the present invention adopts the following configuration. in other words,

An in-line film formation apparatus for carrying out film formation by conveying a substrate carrier holding a substrate and a mask, comprising:

an assembly chamber for laminating the substrate carrier and the mask or for mounting the substrate carrier on the mask;

a film formation chamber for forming a film on the substrate by depositing a material on the substrate stacked or placed on the mask through the mask;

A separation chamber separating the substrate carrier and the mask;

It is an inline type film forming apparatus characterized in that it has a mask storage room for storing a plurality of the masks spaced apart from the substrate in the separation room.

In order to solve the above problem, the present invention further adopts the following constitution. in other words,

An in-line film formation apparatus for carrying out film formation by conveying a substrate carrier holding a substrate and a mask, comprising:

an assembly chamber for laminating the substrate carrier and the mask or for mounting the substrate carrier on the mask;

a film formation chamber for forming a film on the substrate by depositing a material on the substrate stacked or placed on the mask through the mask;

A separation chamber separating the substrate carrier and the mask;

having a control unit for controlling transport of at least one of the substrate carrier and the mask so that a set of the substrate carrier and the mask spaced apart from each other in the separation chamber are laminated or placed again in the same combination in the merging chamber; It is a film forming apparatus of an inline system characterized by.

According to the present invention, a technique for properly storing a mask in an inline film forming apparatus can be provided.

1 is a schematic diagram showing the configuration of a film forming apparatus according to Example 1;
Fig. 2 is a cross-sectional view showing the configuration of an alignment device of Example 1;
Fig. 3 is a perspective view showing the configuration of an alignment device of Example 1;
4 is a view for explaining a substrate carrier of Example 1;
5 is a view for explaining mounting of a substrate carrier and a mask in Example 1;
Fig. 6 is a diagram for explaining image pickup in alignment in Example 1;
FIG. 7 is a diagram for explaining positional displacement between the substrate carrier and the mask in Example 1. FIG.
Fig. 8 is a cross-sectional view showing the configuration of the mask storage device of Example 1;
9 is a timing diagram showing a combination of a substrate carrier and a mask of Example 1;
10 is a schematic diagram showing the configuration of a film forming apparatus in Example 2;
11 is a schematic diagram showing the configuration of a film forming apparatus in Example 3.
12 is an explanatory diagram of an organic EL display device.

EMBODIMENT OF THE INVENTION Below, the form for implementing this invention is demonstrated in detail illustratively based on an Example with reference to drawings. However, the dimensions, materials, shapes, relative arrangements, and the like of the constituent parts described in this embodiment are not intended to limit the scope of the present invention only to these unless otherwise specified.

In the following description, an in-line film forming apparatus for manufacturing an electronic device will be described as an example. Although the film formation method in the following description is a vacuum deposition method, other methods such as sputtering may be employed as the film formation method. As the substrate applied to the present invention, in addition to glass, any material such as a semiconductor using silicon or the like, a film of a polymer material, or a metal can be selected. On the other hand, in the case of forming a plurality of layers on a substrate, the term "substrate" includes layers already formed up to one previous step. In the case of having a plurality of members identical or corresponding to the constituent elements of the device described below, suffixes such as a and b are given and shown in the drawings. However, when it is not necessary to distinguish a plurality of members, the subscripts are omitted and described.

The present invention can be understood as a deposition apparatus for depositing a deposition material on a substrate or a deposition method using the same, or a film deposition apparatus for forming a film by depositing a material on a substrate or a film formation method using the same. The present invention can also be understood as an electronic device manufacturing apparatus or manufacturing method for manufacturing an electronic device by forming a film on a substrate. The present invention can also be understood as a control method for controlling the various devices described above. The present invention can also be understood as a program for executing a control method on a computer or a storage medium storing the program. The storage medium may be a non-transitory storage medium readable by a computer.

[Example 1]

(Configuration of Film Formation Device)

1 is a schematic configuration diagram of an inline film forming apparatus 300 for manufacturing an organic EL display according to the present embodiment. An organic EL display is generally manufactured through a circuit element formation process of forming a circuit element, an organic light emitting element formation process of forming an organic light emitting element on a substrate, and an encapsulation process of forming a protective layer on the formed organic light emitting element. do. The film forming apparatus 300 according to the present embodiment mainly performs a process of forming an organic light emitting element.

The film forming apparatus 300 generally includes a mask carrying room 90, an alignment room 100, a plurality of film forming rooms 110a and 110b, inverting chambers 111a and 11lb, and a transfer room 112. , a mask separation room 113 , a substrate separation room 114 , a carrier transport room 115 , a mask transport room 116 , and a substrate loading room 117 .

The film forming apparatus 300 further has conveying means (to be described later) for conveying the substrate carrier 9 . The substrate carrier 9 is transported along a predetermined transport path passing through each chamber of the film forming apparatus 300 . Specifically, the substrate carrier 9 includes a substrate carrying-in room 117, an inverting chamber 111a, a mask carrying-in room 90, an alignment room 100, a plurality of film forming rooms 110a and 110b, and a transfer room ( 112), the mask separation chamber 113, the inverting chamber 111b, the substrate separation chamber 114, the carrier conveyance chamber 115, and then back to the substrate loading chamber 117.

On the other hand, the mask 6 is provided in a mask carrying room 90, an alignment room 100, a plurality of film forming rooms 110a and 110b, a transfer room 112, a mask separation room 113, and a mask transfer room 116. It is conveyed in the order of, and returns to the mask carrying room 90 again. In this way, the substrate carrier 9 and the mask 6 are circulated and transported along a predetermined transport path. Each chamber will be described below.

The unformed substrate 5 is first carried into the substrate carrying room 117 and mounted on the substrate carrier 9 . Specifically, the substrate 5 is carried into the substrate loading chamber 117 with the film-formed surface facing upward in the vertical direction. In the substrate carrying-in chamber 117, the substrate carrier 9 is disposed with the holding surface facing upward in the vertical direction. The substrate 5 carried into the substrate loading room 117 is placed on the holding surface of the substrate carrier 9 and held by the substrate carrier 9 .

The substrate carrier 9 holding the substrate 5 moves to the inversion chamber 111a. Here, in the reversing chambers 111a and 11lb, reversing mechanisms 120a and 120b for inverting the direction of the substrate holding surface of the substrate carrier 9 from vertically upward to vertically downward, or from vertically downward to vertically upward. ) is provided. As the reversal mechanisms 120a and 120b, a known mechanism that can change the posture (direction) by holding the substrate carrier 9 or the like may be appropriately employed. When the inversion mechanism 120a operates, the substrate carrier 9 is inverted with the substrate 5, and the film-formed surface of the substrate 5 is in a state in which the film-formation surface faces downward in the vertical direction.

On the other hand, when the substrate carrier 9 is carried from the mask separation chamber 113 to the inversion chamber 111b after completion of film formation on the substrate 5 described later, the film-formed surface of the substrate 5 is directed downward in the vertical direction. It is brought in as directed. Accordingly, the inversion mechanism 120b inverts the substrate carrier 9 with the entire substrate 5 so that the film-formed surface of the substrate 5 faces upward in the vertical direction.

On the other hand, the present invention is not limited to the configuration of upward deposition (Deposition Up) (a configuration in which the film-formed surface of the substrate 5 faces downward in the vertical direction during film formation) as in the present embodiment. Deposition Down configuration (configuration in which the film-formed surface of the substrate 5 faces upward in the vertical direction during film formation) or side deposition configuration (substrate 5 is vertical during film formation) configuration) may be used. In the present invention, not only the structure of mounting the substrate carrier 9 on the mask 6 and the structure of mounting the mask 6 on the substrate carrier 9, but also the structure of stacking the substrate carrier 9 and the mask 6 configuration is applicable.

Through inversion in the inversion chamber 111a, the substrate carrier 9 is carried into the mask loading chamber 90 . In line with this, the mask 6 is also carried into the mask carrying room 90 . Then, the substrate carrier 9 holding the substrate 5 and the mask 6 are carried into the alignment chamber 100 . The alignment chamber 100 may also be called a merging chamber where the mask 6 and the substrate carrier 9 are united. The combination of the substrate carrier 9 and the mask 6 here and the transport and storage method of the mask 6 will be described later.

The alignment device 1 is mounted in the alignment chamber 100 . The alignment device 1 aligns the substrate carrier 9 (and the substrate 5 held by it) and the mask 6, and attaches the substrate carrier 9 (substrate 5) to the mask 6. to wit The alignment device 1 then transfers the mask 6 on which the substrate carrier 9 is placed to the conveyance roller 15, and starts conveyance toward the next step. As shown in FIGS. 2 and 3 , a plurality of conveying rollers 15 as conveying means are disposed along the conveying direction on both sides of the conveying path, and rotated by the driving force of an AC servo motor (not shown), respectively, so that the substrate carrier ( 9) or the mask 6 is conveyed. Meanwhile, a speed control room for adjusting the speed of the substrate carrier 9 may be provided between the alignment chamber 100 and the deposition chamber 110a or between the deposition chamber 110a and the deposition chamber 110b. By adjusting the speed, a plurality of substrate carriers 9 are conveyed at predetermined intervals in the film formation chamber 110 .

In the film formation chamber 110, an evaporation source 7 that discharges evaporation materials upward in the vertical direction is disposed. The substrate 5 carried into the film formation chamber 110 while being held by a substrate carrier with the surface to be film formed facing downward in the vertical direction passes over the evaporation source 7 and is covered by the mask 6. A surface to be deposited other than the position is deposited. Inside the chamber of the film formation chamber 110, the internal pressure is adjusted by a real pressure control unit (not shown) equipped with a vacuum pump or a pressure gauge to form a film formation space. The evaporation source 7 includes a material accommodating portion such as a crucible for accommodating the evaporation material, and a heating unit such as a sheath heater for heating the evaporation material. In addition, the evaporation source 7 may include a mechanism for moving the material container within a plane substantially parallel to the substrate carrier 9 (substrate 5) and the mask 6, or a mechanism for moving the entire evaporation source. . In this way, the position of the ejection orifice for injecting the deposition material is relatively displaced within the chamber 4 with respect to the substrate 5, so that film formation on the substrate 5 can be made uniform.

After film formation in the film formation chamber 110 is completed, the substrate carrier 9 and the mask 6 reach the mask separation chamber 113 and are separated from each other in the mask separation chamber 113 . The mask separation room 113 may also be called a separation room in which the substrate carrier 9 and the mask 6 are separated. The mask 6 separated from the substrate carrier 9 is transported to the mask transfer room 116 and returned to the film formation process of a new substrate 5 . As will be described later, a mask storage device 310 is disposed in the mask conveyance room 116 of the present embodiment, and a plurality of masks 6 circulated in the film formation device are stored, and masks are selectively stored according to the substrate carrier 9. carry out export The mask transfer room 116 may also be called a mask storage room if attention is paid to its function of storing masks. Alternatively, the mask conveyance room 116 may also be called a waiting room where masks wait.

On the other hand, after separation from the mask 6, the substrate carrier 9 holding the substrate 5 is inverted upside down in the inverting chamber 111b and conveyed to the substrate separation chamber 114. In the substrate separation chamber 114 , the substrate 5 on which film formation has been completed is separated from the substrate carrier 9 and carried out from the film formation apparatus 300 . The substrate carrier 9 is transported to the substrate loading room 117 via the carrier transport room 115 and is used for holding a new substrate 5 .

(substrate carrier)

The structure of the substrate carrier 9 is explained. 4( a ) is a schematic plan view of the substrate carrier 9 . Fig. 4(b) is a cross-sectional view seen from A in Fig. 4(a), showing a state in which the substrate holding surface faces upward (towards the front of the paper). The substrate carrier 9 is a flat structure having a substantially rectangular shape in plan view.

During conveyance of the substrate carrier 9 , of the four sides of the substrate carrier 9 , two opposing sides along the conveyance direction are supported by the conveyance roller 15 . The conveying roller 15 is constituted by a plurality of conveying rotation bodies arranged on both sides of the conveying path of the substrate carrier 9 . As the conveying roller 15 rotates, the substrate carrier 9 moves while being guided in the conveying direction.

The substrate carrier 9 has a carrier face plate 30 which is a rectangular flat member, a plurality of chuck members 32 and a plurality of supports 33 . The substrate carrier 9 holds the substrate 5 on the holding surface 31 of the carrier face plate 30 . In the drawings, for convenience, a broken line corresponding to the outer edge of the substrate 5 when the substrate 5 is held is shown. The area inside the broken line is also called the substrate holding portion, and the area outside the broken line is also called the outer periphery. The substrate holding portion and the outer peripheral portion are defined for convenience, and there may be no structural difference between them.

The chuck member 32 is a projection having a chuck surface for chucking the substrate 5 . The chuck surface in this embodiment is an adhesive surface composed of a physical sticky chuck (PSC), and holds the substrate 5 by physical adhesive force or physical adsorption. By chucking the substrate 5 by each of the plurality of chuck members 32 , the substrate 5 is held along the holding surface 31 of the carrier face plate 30 . Each of the plurality of chuck members 32 is disposed so that the chuck faces protrude from the holding surface 31 of the carrier face plate 30 by a predetermined distance.

The chuck member 32 is preferably disposed according to the shape of the mask 6, and is disposed corresponding to the boundary portion (lattice portion) for demarcating the area to be deposited on the substrate 5 of the mask 6. more preferable In this way, the influence of the contact of the chuck member 32 with the substrate 5 on the temperature distribution of the film formation area of the substrate 5 can be suppressed. Also, the chuck member 32 is preferably disposed outside the active area of the display. This is because there is a fear that the stress due to adsorption by the chuck member 32 may deform the substrate 5 or affect the temperature distribution during film formation.

As will be described later, when the substrate carrier 9 is inverted so that the holding surface 31 of the carrier face plate 30 holding the substrate 5 faces downward and placed on the mask 6, the support body 33 supports the substrate carrier 9 relative to the mask 6 . In some embodiments, the support body 33 is configured as a convex portion protruding from the holding surface 31 of the carrier face plate 30, but the entire substrate 5 adheres to the mask 6 after inversion. It is becoming. In another embodiment, the support body 33 supports the substrate carrier 9 so that the substrate 5 held by the substrate carrier 9 and the mask 6 are separated from each other at least in the vicinity of the support body 33 . .

(alignment device)

FIG. 2 is a schematic cross-sectional view showing a configuration for alignment of the film forming apparatus 300, and corresponds to the cross section BB in FIG. The alignment device 1 is disposed in the alignment chamber 100 and performs relative alignment of the substrate 5 held by the substrate carrier 9 and the mask 6 .

The alignment device 1 has a chamber 4 inside which is maintained in a vacuum atmosphere or an inert gas atmosphere. The chamber 4 has an upper partition wall 4a, a side wall 4b, and a bottom wall 4c. Above the upper partition wall 4a, an alignment mechanism 60 (alignment unit) for driving the substrate carrier 9 and relatively aligning the position with the mask 6 is disposed. By arranging the positioning mechanism 60 including many movable parts outside the chamber, generation of dust in the chamber can be suppressed. The alignment device 1 further has a carrier support 8 holding the substrate carrier 9 , a mask stand 16 holding the mask 6 , and a conveyance roller 15 .

The alignment mechanism 60 changes or stably holds the relative positional relationship between the substrate carrier 9 (substrate 5) and the mask 6 . The alignment mechanism 60 includes an in-plane moving unit 11, a Z-lifting base 13, and a Z-lifting slider 10. The in-plane moving means 11 is connected to the upper partition wall 4a of the chamber 4 and drives the Z elevating base 13 in the XYθ directions. The Z elevating base 13 is connected to the in-plane moving means 11 and serves as a base when the substrate carrier 9 moves in the Z direction. The Z lifting slider 10 is a member that can move in the Z direction along the Z guide 18 (18a to 18d). The Z elevating slider is connected to the carrier support portion 8 via a carrier holding shaft 12 .

When the substrate carrier 9 (substrate 5) is moved XYθ in a plane parallel to the substrate 5, the Z elevating base 13, the Z elevating slider 10 and the carrier holding shaft 12 are integrated and transmits a driving force to the carrier support 8. As the in-plane moving means 11 for this purpose, a plurality of driving units generating driving force in different directions can be used, for example. When each driving unit generates a driving force corresponding to the amount of movement, the position of the Z lifting base 13 in the XYθ direction can be controlled.

Further, when Z-moving the substrate carrier 9 (substrate 5), the Z-lifting slider 10 is driven relative to the Z-lifting base 13 in the Z direction. At this time, the driving force is transmitted to the carrier support portion 8 via the carrier holding shaft 12 (12a to 12d). In this way, the relative distance between the substrate carrier 9 and the mask 6 is changed when the Z-moving slider or the like functions as a distance changing unit.

On the other hand, it is not limited to the configuration in which the alignment mechanism 60 moves the substrate 5 as in the present embodiment, and the alignment mechanism 60 may move the mask 6, and the substrate 5 and the mask ( Both sides of 6) may be moved. That is, the alignment mechanism 60 is a mechanism for aligning the relative positions of the substrate 5 and the mask 6 by moving at least one of the substrate 5 and the mask 6 .

3 : is a perspective view which shows one form of the alignment device 1. As shown in FIG. The mask stand 16 moves up and down along the platform guide 34 mounted on the mask stand base 19 . In addition, the conveyance roller 15 is mounted on the lower part of the side along the conveyance direction of the mask 6, and the mask 6 is conveyed to the conveyance roller 15 when the mask stand 16 descends. For example, a mask used in the manufacture of an organic EL display has a configuration in which a mask foil 6b having openings conforming to a film formation pattern is fixed to a highly rigid mask frame 6a in a tensioned state. With this structure, the mask accommodating portion can hold the mask foil 6b in a reduced sagging state.

The carrier holding shaft 12 is installed across the outside and inside of the chamber 4 through a through hole provided in the upper partition wall 4a of the chamber 4 . A carrier support portion 8 is provided below the carrier holding shaft 12, and the substrate 5 can be held via the substrate carrier 9. Of the carrier holding shaft 12, the section from the through hole to the fixed portion to the Z lifting slider 10 (a portion above the through hole) is a bellows fixed to the Z lifting slider 10 and the upper bulkhead 4a ( 40) is covered by Thus, the entire carrier holding shaft 12 can be maintained in the same vacuum state as that of the film formation space 2 .

On the side surface of the Z lifting base 13, four Z guides 18a to 18d for guiding the Z lifting slider 10 in the vertical Z direction are fixed. The ball screw 27 disposed at the center of the Z-lifting slider transmits the driving force transmitted from the motor 26 fixed to the Z-lifting base 13 to the Z-lifting slider 10 . The Z-direction position of the Z-moving slider 10 can be measured according to the number of rotations of a rotary encoder (not shown) built in the motor 26 . On the other hand, the lifting mechanism of the Z lifting slider 10 is not limited to the ball screw 27 and the rotary encoder, and any mechanism such as a combination of a linear motor and a linear encoder can be employed.

Various operations by the alignment device 1 (alignment by the in-plane moving means 11, elevation of the Z-moving slider 10, substrate holding by the carrier support 8, deposition by the evaporation source 7, etc.) is controlled by the controller 70. The controller 70 can be configured by, for example, a computer having a processor, memory, storage, I/O, and the like. In this case, the function of the control unit 70 is realized when the processor executes a program stored in memory or storage. As the computer, a general-purpose personal computer may be used, or an embedded computer or PLC (programmable logic controller) may be used. Alternatively, some or all of the functions of the controller 70 may be configured with circuits such as ASICs or FPGAs. Meanwhile, the control unit 70 may be provided for each chamber of the film forming apparatus 300, or one control unit 70 may control a plurality of chambers or the entire film forming apparatus. The recording unit 71 is a memory for the control unit 70 to record and read information. As the recording unit 71, the internal memory of the control unit 70 may be used.

In order to detect the positions of the substrate 5 and the mask 6 at the time of alignment, the imaging device 14 (14a to 14d) is used. Outside the upper partition wall 4a of the chamber 4, an imaging device 14 for acquiring the positions of the alignment marks on the mask 6 and the alignment marks on the substrate 5 is disposed. In the upper partition 4a, a through hole for imaging is provided on the optical axis of the camera of the imaging device 14 so that the imaging device 14 can capture an image of the inside of the chamber. A window glass 17 (17a to 17d) is inserted into the imaging through-hole to maintain the atmospheric pressure inside the chamber.

(mounting of substrate and mask)

FIG. 5 is a schematic cross-sectional view showing a state from when the substrate 5 is mounted on the substrate carrier 9 until the substrate carrier 9 is inverted and placed on the mask 6 . The carrier surface plate 30 of the substrate carrier 9 is a plate-shaped member made of metal or the like, and holds the substrate 5 by the holding surface 31 . The carrier face plate 30 has a certain degree of rigidity (at least higher than that of the substrate 5), and by holding the substrate 5 along the holding surface 31, sagging of the substrate 5 is suppressed. do. 5( a ) shows a state in which the substrate 5 is placed on the substrate carrier 9 with the holding surface 31 facing upward in the substrate loading chamber 117 .

In the inversion chamber 111a, the substrate carrier 9 is vertically inverted with the first substrate 5, so that the state of Fig. 5(b) is changed to the state of Fig. 5(c). The substrate carrier 9 is in an attitude with the holding surface 31 facing downward, and the substrate 5 is attached downward to the holding surface 31 by the holding force of the chuck member 32, avoiding The film formation surface is in a state facing downward. Then, in the state of FIG. 5( c ), the substrate carrier 9 is carried into the alignment chamber 100 and moved upward of the mask 6 .

Then, as shown in Fig. 5(d), the substrate carrier 9 is placed on the mask 6. A plurality of support bodies 33 are disposed protruding from the holding surface 31 and the chuck member 32 on the outer periphery of the carrier face plate 30 . The support body 33 protrudes from the substrate 5 toward the mask 6 side in a state where the substrate 5 is held by the substrate carrier 9 . The substrate carrier 9 is seated on the outer peripheral frame of the mask frame 6a via the support body 33 through an alignment operation. At this time, the entire substrate 5 is in contact with the mask 6 . With this structure, it is possible to reduce material entrapment between the mask and the substrate during film formation.

In another embodiment, as shown in FIG. 5(e), when the substrate carrier 9 is seated on the outer peripheral frame of the mask frame 6a via the support 33, at least in the vicinity of the support 33, The substrate 5 and the mask 6 are spaced apart. With this structure, the precision of alignment can be improved. “Nearby” here refers to any part of the substrate 5 that is closer to the support 33 than the part of the substrate 5 that is in contact when a part of the substrate 5 is in contact with the mask 6. . In FIG. 5(e), the entire substrate 5 is separated from the mask 6. In this case, naturally, the substrate 5 and the mask 6 are spaced apart even in the vicinity of the support 33 . On the other hand, due to the sagging of the substrate 5, a part of the substrate 5 may contact the mask 6, or the entire substrate 5 may contact the mask 6.

The substrate carrier 9 may further have magnetic force generating means (not shown) for pulling the mask 6 by magnetic force via the substrate 5 held thereon. As the magnetic force generating means, a magnet plate equipped with a permanent magnet, an electromagnet, or a zero electromagnet can be used. Further, the magnetic force generating means may be provided so as to be relatively movable relative to the carrier face plate 30 . More specifically, the magnetic force generating means may be provided so that the distance between them and the carrier face plate 30 can be changed.

On the other hand, the configuration for holding the substrate 5 by the substrate carrier 9 is not limited to the chuck member 32 . For example, you may use the substrate carrier 9 provided with the support part which structurally supports the board|substrate 5 from below at the time of inversion. Alternatively, an electrostatic chuck may be used, which holds the substrate 5 by electrostatic force generated by applying a voltage to an electrode provided inside the carrier face plate 30. Alternatively, a clamping mechanism that clamps both the substrate 5 and the mask 6 may be used.

(Construction of the mask)

As shown in FIG. 6(b), the mask 6 has a structure in which a mask foil 6b having a thickness of several μm to several tens of μm is welded and fixed to a frame-shaped mask frame 6a. The mask frame 6a supports the mask foil 6b while being pulled in the direction of its surface so that the mask foil 6b does not sag. The mask foil 6b includes a boundary portion for demarcating a region to be filmed on the substrate. The boundary portion of the mask foil 6b adheres to the substrate 5 when the mask 6 is attached to the substrate 5, and shields the film forming material. On the other hand, the mask 6 may be an open mask in which the mask foil 6b has only a border portion, or a fine opening formed in a portion other than the border portion, that is, a portion corresponding to a film deposition area of the substrate, corresponding to a pixel or subpixel. It may be a mask. When using a glass substrate or a substrate on which a resin film such as polyimide is formed as the substrate 5, an iron alloy can be used as the main material for the mask frame 6a and the mask foil 6b. , it is preferred to use an iron alloy containing nickel.

(alignment)

A method of measuring the positions of the substrate mark 37 and the mask mark 38 using the imaging device 14 will be described with reference to FIGS. 6(a) to 6(c). Fig. 6(a) is a view of the substrate 5 on the carrier face plate 30 held by the carrier support 8 as viewed from above. For illustrative purposes, the carrier face plate 30 is shown as translucent and in dotted lines. Substrate marks 37a to 37d are formed at four corners of the substrate 5 . The imaging devices 14a to 14d simultaneously measure the substrate marks 37a to 37d. The control unit 70 calculates the X-direction movement amount, the Y-direction movement amount, and the rotation amount of the substrate 5 from the positional relationship between the four central positions of the substrate marks 37a to 37d, thereby calculating the positional information of the substrate 5. can be acquired.

Fig. 6(b) is a view of the mask frame 6a viewed from the top, and mask marks 38a to 38d are formed at four corners. Imaging devices 14a to 14d simultaneously measure mask marks 38a to 38d. The control unit 70 calculates the X-direction movement amount, Y-direction movement amount, rotation amount, etc. of the mask 6 from the positional relationship of the four central positions of each mask mark 38a to 38d, thereby calculating the positional information of the mask 6. can be acquired.

Fig. 6(c) schematically shows the field of view 44 of a captured image when one set of four sets of mask marks 38 and substrate marks 37 is measured by the imaging device 14. it is a drawing In this example, since the substrate mark 37 and the mask mark 38 are simultaneously measured within the field of view 44 of the imaging device 14, it is possible to measure the relative positions of the centers of the marks. On the other hand, the shapes of the mask mark 38 and the substrate mark 37 are not limited to the illustrated examples, and are preferably symmetrical to easily calculate the center position.

When high-precision alignment is required, a high-magnification CCD camera having a high resolution in the order of several μm is used as the imaging device 14 . Since such a high-magnification CCD camera has a narrow field of view of several millimeters, if the displacement of the substrate carrier 9 when placed on the carrier receiving finger is large, the substrate mark 37 is out of the field of view, making measurement impossible. do. Therefore, as the imaging device 14, it is preferable to provide a high-magnification CCD camera and a low-magnification CCD camera having a wide field of view. In that case, a two-step alignment may be performed. That is, after rough alignment (rough alignment) is performed using a low-magnification CCD camera so that the mask mark 38 and the substrate mark 37 simultaneously enter the field of view of the high-magnification CCD camera, a mask mark ( 38) and the substrate mark 37 are measured to perform highly accurate alignment (fine alignment).

Relative positional information between the mask frame 6a and the substrate 5 can be obtained from the positional information of the mask frame 6a and the positional information of the substrate 5 obtained by the imaging device 14 . This relative position information is fed back to the control unit 70 of the alignment device, and the driving amount of each drive unit such as the lift slider 10, the in-plane moving unit 11, the carrier support unit 8, and the like is controlled.

Using the captured image of the imaging device 14, the alignment device 1 aligns the substrate 5 and the mask 6 on the substrate carrier 9, and the substrate carrier 9 (substrate 5) is placed on the mask 6. At that time, first, the substrate carrier 9 is carried into the chamber 4 and placed on the carrier receiving fingers on both sides of the carrier support 8 .

Subsequently, the substrate carrier 9 is lowered and moved to the alignment height. And the imaging device 14 performs imaging, and acquires the positional information of the board|substrate mark 37 and the mask mark 38. The controller 70 repeats the in-plane movement of the substrate carrier 9 and imaging until the substrate mark 37 and the mask mark 38 approach within a range of a predetermined positional relationship. The controller 70 determines that the alignment is complete when the amount of displacement between the substrate 5 and the mask 6 is equal to or less than a predetermined threshold based on the captured image of the alignment mark. Then, the control unit places the substrate carrier 9 on the mask 6 .

(Displacement between substrate carrier and mask)

Here, the effect of the combination of the substrate carrier 9 (substrate 5) and the mask 6 on the alignment accuracy will be explained. 7(a) to 7(c) are schematic diagrams showing how the substrate carrier 9 (substrate 5) is mounted on the mask 6 inside the alignment device 1. For convenience, in order to simplify the drawing, the carrier support 8, the chuck member 32 or the support body 33 of the substrate carrier 9 are omitted.

7(a) is a cross-sectional view when the substrate 5 held by the substrate carrier 9 is aligned with the mask 6, and the control unit 70 moves the substrate carrier by the carrier support unit 8. (9) shows a state moved to the alignment height in the Z direction. The control unit 70 moves the substrate carrier 9 by the in-plane moving unit 11, and moves the substrate mark 37 and the mask mark 38 in a predetermined positional relationship in the field of view 44 of the imaging device 14. By doing so, the substrate 5 is aligned with the mask 6 as shown in the plan view of Fig. 7(b).

Next, the controller 70 controls the Z lifting slider 10 to lower the substrate carrier 9 and place it on the mask 6 . However, in this example, as shown in FIG. 7(c), positional displacement between the substrate carrier 9 and the mask 6 occurs during mounting, and the substrate carrier 9 shifts in the direction of arrow A. If this positional displacement exceeds the permissible range, it is necessary to move the substrate carrier 9 up again and then move it in the plane by the in-plane moving means 11, which increases the time required for film formation. Alternatively, as a result of the misalignment, there is a possibility that the alignment accuracy is lowered and the quality of the film formation is lowered.

Such positional displacement mainly occurs due to individual differences resulting from limitations in the processing accuracy of the substrate carrier 9 and the mask 6, respectively. Accordingly, the positional displacement amount varies for each combination of the substrate carrier 9 and the mask 6 . However, according to the conventional film formation method, since the combination of the substrate carrier 9 and the mask 6 used for film formation of a certain substrate 5 is not constant, random positional displacement has occurred for each substrate 5 . Accordingly, a method of reducing positional displacement due to the individual difference when combining the substrate carrier 9 and the mask 6, which is related to the study of the inventors of the present application, will be described below.

(Storage and transportation of masks)

8 is a cross-sectional view showing the configuration of the mask storage device 310 disposed in the mask transfer room 116, which is one of the chambers of the film forming device 300 of the present embodiment.

The mask storage device 310 is roughly configured by placing a mask stocker 312 (also referred to as a cassette) inside a case 311 . The drive mechanism 314 and the linear movement mechanism 315 are lifting mechanisms (lifting means) of the mask stocker 312 . That is, the mask stocker 312 is moved in the vertical direction along the linear movement mechanism 315 provided with a ball screw or the like when the drive mechanism 314 operates according to the instructions of the control unit 70 . The mask stocker 312 of the illustrated example can hold a plurality of masks 6 in a state aligned in the vertical direction by means of a plurality of conveying and holding mechanisms 313 . The position where the mask stocker 312 holds the mask 6 is also called a slot, and the mask stocker 312 of the illustrated example has a plurality of slots in the vertical direction (eight in this example). The slot of the mask stocker 312 can also be referred to as a mask support portion that supports a mask being stored.

When the mask 6 separated from the substrate carrier 9 in the mask separation room 113 is transported to the mask transport room 116 by the transport roller 15, the control unit 70 determines that the mask 6 is Examine empty slots that are not held. As a method for the control unit 70 to check the empty slots, for example, positions of all the substrate carriers 9 are always recorded in advance, and this may be referred to. Alternatively, a sensor such as a weight sensor, an optical sensor, or a contact sensor may be provided for each slot. And the control part 70 changes the height of the mask stocker 312 by controlling the drive mechanism 314 so that the height of an empty slot may match the conveyance height of the mask 6 by the conveyance roller 15. Thereby, the mask 6 is conveyed from the conveyance roller 15 to the conveyance holding mechanism 313 of the empty slot.

When one of the masks 6 stored in the mask storage device 310 is used in the next film forming process, the mask 6 is delivered from the mask transfer room 116 to the mask loading room 90 . In this case, the control unit 70 selects the mask 6 from among the plurality of masks 6 held by the mask stocker 312 . And the drive mechanism 314 is controlled so that the slot in which the selected mask 6 is held may match the height of the conveyance roller 15 of the mask loading room 90 . And the transport holding mechanism 313 carries out the selected mask 6.

In this way, by arranging the mask storage device 310 capable of holding a plurality of masks 6 in the mask transfer room 116, it is possible to temporarily store the masks 6 in an inline film forming device. As a result, it is possible to prevent the circulation of the mask 6 from becoming stagnant. Furthermore, it becomes possible to selectively carry out an arbitrary mask 6 out of a plurality of masks 6 . Thus, the use of a mask according to the substrate carrier 9 becomes possible. On the other hand, the mechanism used for holding and conveying the mask 6 is not limited to the illustrated example. For example, the arrangement direction of the slots holding the mask 6 does not have to be in the vertical direction (vertical direction), and a moving means such as a robot hand may be used to transfer the mask 6 .

(example of combination)

An example of combination control of the substrate carrier 9 and the mask 6 using the mask storage device 310 will be described. 9 shows combinations of the substrate carrier 9, substrate 5, and mask 6 in each chamber of the film forming apparatus 300 at each substrate loading timing indicated on the vertical axis. In the figure, the substrates 5 are represented by (S1, S2, S3...) in the order of being carried into the film forming apparatus 300. Further, the substrate carriers 9 circulating in the conveyance path are distinguished by attaching codes (C1, C2, C3...). In addition, the mask 6 similarly circulating in the conveyance path is distinguished by attaching codes (M1, M2, M3...).

When the 1st board|substrate S1 is carried in, it is held by the 1st board|substrate carrier C1 in the board|substrate loading room 117 ((circle)). After that, it is attached to the first mask M1 in the mask carrying room 90 (2). Thereafter, through alignment and film formation, the mask M1 is separated from the mask separation chamber 113 and held in the mask storage device 310 in the mask conveyance chamber 116 ((3)). On the other hand, the substrate carrier C1 separates the substrate S1 from the substrate separation chamber 114, moves to the substrate loading chamber 117 again, and holds the eleventh substrate S11 (⑤).

As described above, in this embodiment, the substrate carrier 9 and the mask 6 are made in a specific combination. Accordingly, in order to combine the mask M1 with the substrate carrier C1, the control unit 70 moves from the mask transfer room 116 at the timing (⑥) when the substrate carrier C1 enters the mask carrying room 90. The mask M1 is moved to the mask carrying room 90 . Here, the combination of the substrate carrier and the mask combined with the substrate S11 is the same as the combination before the mask is separated after completion of the previous film formation. At this time, the masks M2 to M5 are stored in the mask transfer room 116 (7). By performing the same processing at the time of loading of other substrates, a combination of a specific substrate carrier 9 and a specific mask 6 is realized.

(Position alignment according to combination)

In order to perform control according to the combination of the substrate carrier 9 and the mask 6, the control unit 70 measures the positional displacement amount (direction and distance of the positional displacement) at the time of placement in advance, (71)). At this time, the displacement amount may be recorded in association with substrate carrier identification information or mask identification information described later. Further, for each combination of the substrate carrier 9 and the mask 6, the substrate carrier identification information and the mask identification information may be recorded in association with the positional displacement amount. On the other hand, it is also possible to calculate an offset amount to eliminate positional displacement and store it in a memory. For example, the positional relationship between the substrate mark 37 and the mask mark 38 at the time of alignment is within a predetermined reference range as shown in Fig. 7(b), and the positional relationship after mounting is in Fig. 7(d). ), when it is out of the standard range, the positional displacement amount is calculated based on the change in the positional relationship of the mark. Measurement of such displacement may be performed in a maintenance mode, such as during installation of the film forming apparatus 300 or during periodic inspection.

Further, the control unit 70 stores the amount of positional displacement due to the combination of the substrate carrier 9 and the mask 6 at a timing prior to mounting the substrate carrier 9 in alignment during actual film formation. acquire from And, using the in-plane moving means 11, the substrate carrier 9 is moved by an offset amount that eliminates the displacement. As a result, since positional displacement at the time of coalescence can be corrected, the time required for alignment can be shortened.

The control unit 70 stores and manages a unique ID (substrate carrier identification information) for identifying the substrate carrier 9 and a unique ID (mask identification information) for identifying the mask 6 in a memory. The control unit 70 determines the initial position of each substrate carrier 9 and each mask 6 and movement information of each substrate carrier 9 and mask 6 using the conveying means, in the film forming apparatus. The position of the substrate carrier 9 or the mask 6 can be specified. Thereby, combination control of the specific substrate carrier 9 and mask 6 as described above can be realized. However, the location specifying method is not limited to this, and for example, a wireless tag may be disposed on the substrate carrier 9 or the mask 6, or image recognition processing may be performed.

It is preferable that the controller 70 records the amount of displacement in the recording unit 71 for a specific combination of the substrate carrier 9 and the mask 6 . In this case, the controller 70 controls the mask conveyance room 116 so that the combination of the substrate carrier 9 and the mask 6 in the alignment chamber 100 is a combination in which the amount of misalignment is recorded in the recording section 71. ), the mask 6 can be taken out. In this way, an appropriate offset amount can be set according to the combination of the substrate carrier 9 and the mask 6 . The controller 70 controls the mask transfer room so that a set of substrate carriers 9 and masks 6 spaced apart from each other in the mask separation room 113 are laminated or placed again in the alignment room 100 in the same combination. It is also preferable to carry out the mask 6 from (116).

On the other hand, the control unit 70 may control the transport of at least one of the mask 6 and the substrate carrier 9 to control the combination of the substrate carrier 9 and the mask 6 . Therefore, the control unit 70 may control the circulation of the mask 6 in the device to be constant, and control the conveyance on the side of the substrate carrier 9 in accordance with the mask 6 .

As described above, in this embodiment, by installing the mask storage device 310, storage and transportation of the mask 6 can be managed, and the timing of mounting the mask 6 on the substrate carrier 9 can be adjusted. As a result, since a specific substrate carrier 9 and mask 6 can be combined, offset processing in consideration of misalignment during alignment can be performed, thereby reducing processing time and improving alignment accuracy.

[Example 2]

Next, Example 2 will be described. The same reference numerals are attached to the same parts as in Example 1, and explanations are omitted.

10 is a schematic configuration diagram of an inline film forming apparatus 300 according to the present embodiment. In Example 1, the mask storage device 310 is disposed inside the mask transfer room 116 on the path from the mask separation room 113 to the mask loading room 90. On the other hand, the mask storage device 310 of this embodiment is arranged so as to be able to come and go with the mask conveyance room 116 along the route for conveying the mask. According to this configuration, a plurality of masks 6 can be stored regardless of the physical configuration of the chamber of the mask transfer room 116 or the size of the internal space.

[Example 3]

Next, Example 3 will be described. The same reference numerals are attached to the same parts as those in Example 1 and Example 2, and descriptions thereof are omitted.

11 is a schematic configuration diagram of an inline film forming apparatus 300 according to the present embodiment. In Example 1, the mask storage device 310 was disposed on a path from the mask separation room 113 to the mask carrying room 90, and in Example 2, it was disposed along a path for transporting masks. On the other hand, the mask storage device 310 of this embodiment is connected to the mask loading and unloading room 90 and is disposed in a position where the mask 6 can be carried in and out between the mask loading and unloading room 90 . According to this configuration, a large number of masks 6 can be stored regardless of the physical configuration of the chamber of the mask conveyance room 116 or the size of the internal space. Furthermore, since the mask storage device 310 is directly connected to the mask carrying room 90, the time required for carrying in and out can be shortened.

<Method of manufacturing electronic device>

A method of manufacturing an electronic device using the above substrate processing apparatus will be described. Here, as an example of an electronic device, the case of an organic EL element used in a display device such as an organic EL display device will be described as an example. On the other hand, the electronic device according to the present invention is not limited to this, and may be a thin film solar cell or an organic CMOS image sensor. In this embodiment, there is a step of forming an organic film on the substrate 5 using the above film formation method. Further, after forming the organic film on the substrate 5, there is a step of forming a metal film or a metal oxide film. The structure of the organic EL display device 600 obtained by these steps will be described below.

FIG. 12(a) is an overall view of the organic EL display device 600, and FIG. 12(b) shows a cross-sectional structure of one pixel. As shown in Fig. 12(a), in the display area 61 of the organic EL display device 600, a plurality of pixels 62 having a plurality of light emitting elements are arranged in a matrix form. Each of the light emitting elements has a structure including an organic layer sandwiched between a pair of electrodes. On the other hand, the term "pixel" as used herein refers to a minimum unit capable of displaying a desired color in the display area 61 . In the case of the organic EL display device of this figure, a pixel 62 is constituted by a combination of a first light emitting element 62R, a second light emitting element 62G, and a third light emitting element 62B that emit different light. . The pixel 62 is often composed of a combination of a red light emitting element, a green light emitting element, and a blue light emitting element, but may be a combination of a yellow light emitting element, a cyan light emitting element, and a white light emitting element, and is not particularly limited as long as it is of at least one color. don't Further, each light emitting element may be configured by laminating a plurality of light emitting layers.

In addition, the pixel 62 is constituted by a plurality of light emitting elements that emit the same light emission, and a plurality of different color conversion elements are arranged in a pattern to correspond to each light emitting element, and a color filter is used so that one pixel is a display area. In (61), display of a desired color may be enabled. For example, a color filter may be used in which the pixel 62 is composed of at least three white light emitting elements, and red, green, and blue color conversion elements are arranged so as to correspond to each light emitting element. Alternatively, a color filter may be used in which the pixel 62 is composed of at least three blue light emitting elements, and red, green, and colorless color conversion elements are arranged so as to correspond to each light emitting element. In the latter case, by using a quantum dot color filter (QD-CF) using a quantum dot (QD) material as a material constituting the color filter, the display color is higher than that of a normal organic EL display device that does not use a quantum dot color filter. area can be widened.

Fig. 12(b) is a partial cross-sectional schematic view along the line A-B in Fig. 12(a). The pixel 62 includes, on the substrate 5, a first electrode (anode) 64, a hole transport layer 65, any one of the light emitting layers 66R, 66G, and 66B, an electron transport layer 67, It has an organic EL element provided with the 2nd electrode (cathode) 68. Among these, the hole transport layer 65, the light emitting layers 66R, 66G, and 66B, and the electron transport layer 67 correspond to organic layers. In this embodiment, the light emitting layer 66R is an organic EL layer emitting red, the light emitting layer 66G is an organic EL layer emitting green, and the light emitting layer 66B is an organic EL layer emitting blue. On the other hand, in the case of using the color filter or quantum dot color filter as described above, the color filter or quantum dot color filter is disposed on the light exit side of each light emitting layer, that is, the upper or lower part of FIG. 12(b), but the illustration is omitted. do.

The light-emitting layers 66R, 66G, and 66B are formed in patterns corresponding to light-emitting elements that emit red, green, and blue (sometimes described as organic EL elements). Also, the first electrode 64 is formed separately for each light emitting element. The hole transport layer 65, the electron transport layer 67, and the second electrode 68 may be formed in common with the plurality of light emitting elements 62R, 62G, and 62B, or may be formed for each light emitting element. On the other hand, in order to prevent the first electrode 64 and the second electrode 68 from being shorted by foreign matter, an insulating layer 69 is provided between the first electrodes 64 . Furthermore, since the organic EL layer is degraded by moisture or oxygen, a protective layer P is provided to protect the organic EL element from moisture or oxygen.

Next, an example of a manufacturing method of an organic EL display device as an electronic device will be described in detail. First, a circuit (not shown) for driving an organic EL display device and a substrate 5 on which a first electrode 64 is formed are prepared.

Next, a resin layer such as acrylic resin or polyimide is formed by spin coating on the substrate 5 on which the first electrode 64 is formed, and the resin layer is formed on the portion where the first electrode 64 is formed by lithography. An insulating layer 69 is formed by patterning to form an opening therein. This opening corresponds to a light emitting region in which the light emitting element actually emits light.

Next, the substrate 5 on which the insulating layer 69 has been patterned is carried into the first film forming apparatus, the substrate is held by the substrate holding unit, and the hole transport layer 65 is attached to the first electrode 64 of the display area. ) is formed as a common layer on top. The hole transport layer 65 is formed by vacuum deposition. In practice, since the hole transport layer 65 is formed in a size larger than that of the display region 61, a very fine (high definition) mask is unnecessary. Here, the film formation apparatus used in the film formation in this step and the film formation of the following layers is the film formation apparatus described in any one of the above embodiments.

Next, the substrate 5 formed up to the hole transport layer 65 is carried into the second film forming apparatus and held by a substrate holding unit. The substrate and the mask are aligned, the substrate is placed on the mask, and a red light emitting layer 66R is formed on a portion of the substrate 5 where the red light emitting element is arranged. According to this example, the mask and the substrate can be overlapped satisfactorily, and high-precision film formation can be performed.

Similar to the film formation of the light emitting layer 66R, the green light emitting layer 66G is formed by the third film forming device, and further, the blue light emitting layer 66B is formed by the fourth film forming device. After the film formation of the light emitting layers 66R, 66G, and 66B is completed, the electron transport layer 67 is formed over the entire display region 61 by a fifth film forming apparatus. Each of the light emitting layers 66R, 66G, and 66B may be a single layer or a layer formed by stacking a plurality of different layers. The electron transport layer 67 is formed as a layer common to the three color light emitting layers 66R, 66G, and 66B. In this embodiment, the electron transport layer 67 and the light emitting layers 66R, 66G, and 66B are formed by vacuum deposition.

Next, a second electrode 68 is formed on the electron transport layer 67 . The second electrode may be formed by vacuum deposition or sputtering. Thereafter, the substrate on which the second electrode 68 is formed is moved to a sealing device, and the protective layer P is formed by plasma CVD (sealing step), and the organic EL display device 600 is completed. On the other hand, although it was assumed that the protective layer P was formed by the CVD method here, it is not limited to this, You may form it by the ALD method or the inkjet method.

When the substrate 5 on which the insulating layer 69 is patterned is carried into the film forming apparatus until the film formation of the protective layer P is completed, when exposed to an atmosphere containing moisture or oxygen, the light emitting layer made of organic EL material is formed. It may be deteriorated by moisture or oxygen. Therefore, in this example, loading and unloading of substrates between film forming apparatuses is performed under a vacuum atmosphere or an inert gas atmosphere.

6: mask
9: substrate carrier
90: mask carrying room
100: alignment room
110: Tabernacle
113: mask separation room
300: tabernacle device
310: mask storage device

Claims (18)

An in-line film formation apparatus for carrying out film formation by conveying a substrate carrier holding a substrate and a mask, comprising:
an assembly chamber for laminating the substrate carrier and the mask or for mounting the substrate carrier on the mask;
a film formation chamber for forming a film on the substrate by depositing a material on the substrate stacked or placed on the mask through the mask;
A separation chamber separating the substrate carrier and the mask;
and a mask storage room for storing a plurality of the masks spaced apart from the substrate in the separation room. According to claim 1,
The film forming apparatus, characterized in that the mask storage room is disposed on a path from the separation room to the merging room. According to claim 1,
The film forming apparatus, characterized in that the mask storage room is disposed along a path from the separation room to the merging room. According to claim 1,
The mask storage room has a plurality of mask support portions each supporting the mask;
The film forming apparatus according to claim 1, wherein the plurality of mask supporters are arranged in a vertical direction. According to claim 1,
The mask storage room,
cassettes each supporting the mask and having a plurality of mask support portions arranged in a vertical direction;
A film forming apparatus characterized by having an elevating means for elevating the cassette. According to claim 1,
The film forming apparatus further comprising an alignment unit for aligning the substrate carrier and the mask in the merging chamber. According to claim 1,
a recording unit for recording an amount of misalignment when the substrate carrier and the mask are laminated or placed;
further comprising an alignment section for aligning the substrate carrier and the mask in the merging chamber;
The film forming apparatus according to claim 1 , wherein the alignment unit performs alignment using the amount of displacement recorded in the recording unit. According to claim 7,
The positioning unit includes in-plane moving means for moving at least one of the substrate carrier or the mask in a plane parallel to the substrate held by the substrate carrier, and changing a relative distance between the substrate carrier and the mask. having a distance change means,
The film forming apparatus according to claim 1, wherein the in-plane moving means performs the movement by including an offset amount based on the amount of positional deviation recorded in the recording unit. According to claim 7,
The film deposition apparatus according to claim 1 , wherein the recording unit records the displacement amount in association with substrate carrier identification information for identifying the substrate carrier. According to claim 7,
The film forming apparatus according to claim 1, wherein the recording unit records the displacement amount in association with mask identification information for identifying the mask. According to claim 7,
The film deposition apparatus according to claim 1 , wherein the recording unit records the displacement amount in association with substrate carrier identification information for identifying the substrate carrier and mask identification information for identifying the mask. According to claim 7,
and a control unit that carries out the mask from the mask storage chamber so that a combination of the substrate carrier and the mask in the merging chamber is a combination in which the amount of misalignment is recorded in the recording unit. According to claim 1,
and a control unit for carrying out a mask from the mask storage room so that a set of the substrate carrier and the mask, which are spaced apart from each other in the separation room, are stacked or placed again in the same combination in the merging room. . An in-line film formation apparatus for carrying out film formation by conveying a substrate carrier holding a substrate and a mask, comprising:
an assembly chamber for laminating the substrate carrier and the mask or for mounting the substrate carrier on the mask;
a film formation chamber for forming a film on the substrate by depositing a material on the substrate stacked or placed on the mask through the mask;
A separation chamber separating the substrate carrier and the mask;
having a control unit for controlling transport of at least one of the substrate carrier and the mask so that a set of the substrate carrier and the mask spaced apart from each other in the separation chamber are laminated or placed again in the same combination in the merging chamber; Characterized by an in-line film forming device. According to claim 14,
The film forming apparatus further comprises a waiting room in which the mask is kept on standby for conveyance control by the control unit. According to claim 14,
The film forming apparatus further comprising an alignment unit for aligning the substrate carrier and the mask in the merging chamber. According to claim 14,
a recording unit for recording an amount of misalignment when the substrate carrier and the mask are laminated or placed;
further comprising an alignment section for aligning the substrate carrier and the mask in the merging chamber;
The film forming apparatus according to claim 1 , wherein the alignment unit performs alignment using the amount of displacement recorded in the recording unit. An electronic device manufacturing apparatus for manufacturing an electronic device using the film forming apparatus according to any one of claims 1 to 17.

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