KR20220128529A - Heater unit of heat treatment oven - Google Patents

Abstract

Disclosed is a heater unit of a heat treatment oven. The present invention may comprise a heat treatment oven having a chamber which houses a substrate for heating and drying of the substrate and to which a plurality of heater units are mounted to heat or dry the substrate through heat generated from the heater units. The heater units may comprise: a pipe in which a heat emission line emitting heat through electric resistance is embedded to be heated; upper and lower heat transmission plates disposed at upper and lower parts of the pipe; and a plurality of bushing units disposed in a gap of the upper and lower heat transmission plates to maintain the gap of the upper and lower heat transmission plates and support the upper and lower heat transmission plates.

Description

Heater unit of heat treatment oven

The present invention relates to a heater unit of a heat treatment oven for stably maintaining temperature uniformity with respect to a surface of a substrate during heat treatment of a glass substrate in a heat treatment oven chamber.

Recently, the display market has been applied to various types of image devices such as TVs, mobile phones, monitors, and the like, and due to the rapid development of technology, efforts to improve product performance are continuing. Organic light emitting display devices and LCD substrates are one of next-generation display devices and are being applied to various product fields. The glass substrate constituting the display device is manufactured through heat treatment, and in order to satisfy the conditions required for each process during heat treatment, it is necessary to prevent the influence of external air and keep the heat emitted out of the chamber to a minimum to prevent performance degradation. It can reduce the product defect rate. In addition, in order to improve the yield of the finished product, the smaller the variation in the plane of the substrate during heat treatment, the better.

On the other hand, in manufacturing a substrate for a typical organic light emitting diode display of a flat panel display or an LCD glass substrate (hereinafter referred to as a 'substrate' or 'glass substrate'), temperature management and temperature uniformity are essential for maintaining good substrate quality and yield. need. For example, in a substrate manufacturing process through a heat treatment oven, an organic material layer is formed on the substrate surface and may contain a certain amount of moisture, so a drying process is required to evaporate moisture. In the LCD glass substrate manufacturing process, a photosensitive film is formed on the substrate surface A cleaning process is performed before coating, and a heat drying process to remove moisture is performed after the cleaning process, and most of the substrate manufacturing processes are manufactured by performing heating and drying processes. In this way, the moisture generated in the substrate manufacturing process is removed by heating and drying using infrared rays or putting it in a chamber of a heat treatment oven including a heating element such as a heater. In this regard, 'LCD glass oven chamber' is proposed in KR Patent Publication No. 10-1238560 and KR Patent Publication No. 10-2013-0028322. However, there is a limit in satisfying the high temperature performance and temperature uniformity required in the substrate manufacturing process using the heating element arrangement method of the conventional heat treatment oven including the heater as the heating element. Accordingly, a heater of a new heat treatment oven that can satisfy the high temperature performance and temperature uniformity required in the heating element and substrate manufacturing process that can be used inside the chamber of the heat treatment oven and can maintain temperature uniformity without dielectric breakdown even at high temperatures is being requested

Patent Document 1. KR Registered Patent Publication No. 10-1238560 (published on February 28, 2013) Patent Document 2. KR Registered Patent Publication No. 10-0722154 (published on May 28, 2007) Patent Document 3. KR Patent Publication No. 10-2013-0028322 (published on March 19, 2013)

One of the technical problems to be solved by the present invention is to provide a heater unit for a heat treatment oven that stably maintains temperature uniformity with respect to a surface of a substrate during heat treatment of a substrate inside a heat treatment oven chamber.

One of the technical problems to be solved in the present invention is that it can be used inside the chamber of a heat treatment oven, can maintain temperature uniformity without dielectric breakdown even at high temperatures, and can achieve high temperature performance and temperature uniformity required in the substrate manufacturing process. It is to provide a heater unit of a heat treatment oven that can be satisfied.

According to the present invention, there is provided a chamber for accommodating a substrate for heating and drying the substrate, and a plurality of heater units are mounted in the chamber to heat or dry the substrate through heat generated from the heater units. pre-heating oven; and

The heater unit includes a pipe heated by a built-in heating wire that generates heat by electrical resistance; upper and lower heat transfer plates disposed at upper and lower portions of the pipe; and a plurality of bushings disposed between the upper and lower heat transfer plates to maintain the distance between the upper and lower heat transfer plates and support the upper and lower heat transfer plates.

According to an embodiment of the present invention, the pipe may be configured as a circular pipe having a hollow.

According to an embodiment of the present invention, a power sleeve for supplying power to one end of the pipe is connected to a conductive part, and may be configured by disposing a sleeve heat dissipation block based on an arrangement position of the power sleeves.

According to an embodiment of the present invention, the bushing portion has a hollow hole and includes a bushing positioned along the opening hole of the lower heat transfer plate, and the bushing may be configured to be mounted and fixed along the opening hole through a support means. have.

According to an embodiment of the present invention, the support means includes: a fixer that protrudes downward from the upper heat transfer plate to be centered on the opening hole drilled in the lower heat transfer plate and enters along the hollow hole of the bushing; and a fixing nut supporting the fixer on the bottom surface of the lower heat transfer plate.

According to an embodiment of the present invention, a washer may be installed between the lower surface of the lower heat transfer plate and the upper surface of the fixing nut to prevent movement and deformation of the fixer.

The present invention has an effect of stably maintaining the temperature uniformity with respect to the surface of the substrate during the heat treatment of the substrate in the heat treatment oven chamber.

In addition, the present invention can be used inside the chamber of a heat treatment oven, can maintain temperature uniformity without dielectric breakdown even at high temperatures, and has the effect of satisfying high temperature performance and temperature uniformity required in the substrate manufacturing process. have.

In addition, according to the present invention, an insert-type bushing is placed between the upper heat transfer plate and the lower heat transfer plate constituting the heater unit, and heat deformation of the upper heat transfer plate and the lower heat transfer plate through this, or applied to the upper heat transfer plate and the lower heat transfer plate There is an effect that can control various deformation factors, including position deformation due to a falling impact.

In addition, the present invention has the effect of satisfying the high temperature performance and temperature uniformity required in the substrate manufacturing process by maintaining the upper heat transfer plate and the lower heat transfer plate constituting the heater unit at regular intervals.

1 is an example showing a heat treatment oven.
2 is an example showing the front of the heat treatment oven.
3 is an example showing a plan view of a heat treatment oven.
4 is an example showing one side of the heat treatment oven.
5 is an illustration of a heater unit according to an embodiment of the present invention disposed in a heat treatment oven.
6 is a plan view of a heater unit according to an embodiment of the present invention disposed in a heat treatment oven.
7 is an example showing a heater unit according to an embodiment of the present invention.
FIG. 8 is an example in which part A of FIG. 7 is extracted and shown in detail.
9 is an example illustrating a detailed structure of a heater unit according to an embodiment of the present invention.
10 is an example illustrating a structure of a bushing of a heater unit according to an embodiment of the present invention.
11 is an example showing the disassembled state of the bushing of the heater unit according to an embodiment of the present invention.

Hereinafter, a 'heater unit of a heat treatment oven' according to a preferred embodiment of the present invention will be described.

1 is an example showing a heat treatment oven. 2 is an example showing the front of the heat treatment oven. 3 is an example showing a plan view of a heat treatment oven. 4 is an example showing the side of the heat treatment oven.

The drawings shown in FIGS. 1 to 4 show the overall structure of the heat treatment oven 100 , and are examples of the heat treatment oven 100 configured including the chamber 200 .

As shown in FIGS. 1 to 4 , the heat treatment oven 100 puts a heat treatment target substrate into each stage provided in the chamber 200 for heat treatment of the substrate, or a rear portion to take out the heat treatment process-completed substrate from the chamber 200 . A door unit 110 may be provided at the door, and a shutter unit 120 may be provided at the front side, respectively.

In addition, the heat treatment oven 100 includes a chamber 200 for accommodating a substrate requiring heating or drying, and a plurality of heater units 300 made of a heating element are mounted in the chamber 200, and the heater unit ( 300) is configured to heat the substrate with heat generated from them or to evaporate moisture to dryness.

In addition, the heat treatment oven 100 has an air supply port for introducing a fluid containing a process gas to one side of the chamber 200 and an exhaust port for exhausting the fluid in the chamber 200 , and supports and supports the chamber 200 . A frame including lugs and a conductive part 301 to which a plurality of busbars for passing current by connecting the heating wire of the heater unit 300 are connected.

And, although it varies depending on the specifications, in general, the upper and lower heat transfer plates 321 and 322 are installed in close contact with the upper and lower portions of the pipe 310 which is a heating element constituting the heater unit 300 to effectively perform the substrate heating process in the chamber. is configured to perform.

Here, the heater unit 300 functioning as a heating element of the heat treatment oven embeds a heating wire (heating coil) that generates heat by electrical resistance in a pipe (metal protection tube), puts magnesium oxide (MgO), an insulating powder, and fills it with the heating wire and the pipe It may be a heater insulated from 310 . The pipe 310 may be used as a mineral insulated heater, and in this case, it has a feature of being thinly manufactured.

Meanwhile, in FIGS. 1 and 4 , unexplained reference numerals '210' and '220' denote 'internal and external casings' of the chamber 200 . Further, unexplained reference numeral '230' denotes a 'cooling jacket' that forms a cooling airflow in the chamber 200 and cools the chamber to a uniform temperature distribution through a cooling airflow induction path configured inside the chamber 200 . Unexplained reference numeral '240' denotes a 'power supply unit' that protrudes feed-throughs and supplies power to the chamber 200 through them.

For reference, as shown in FIGS. 1 and 4, the basic components constituting the heat treatment oven, for example, the structure of the chamber and the supply and exhaust system of the process gas, and a bus bar for supplying power to the heater unit. The configuration of the conductive part and the power supply part is not directly related to the present invention. In addition, the basic corresponding configurations of the heat treatment oven are not related to the gist of the present invention and are known configurations, and thus will be omitted from the description of the configuration and operation of the present invention.

1 to 4, the heat treatment oven generally puts the heat treatment target substrate in each stage provided in the chamber where the heater is installed in order to heat the substrate, or has a door on the rear side to take out the substrate on which the heat treatment process is completed from the chamber, and the front side Each of the units may be provided with a shutter.

In addition, the heat treatment oven has a chamber for accommodating a substrate requiring heating or drying, and a heater unit made of a heating element is mounted in the chamber to heat the substrate through heat generated from the heater unit or to evaporate moisture to dryness. can be configured.

And, although it varies depending on specifications, in general, upper and lower heat transfer plates are installed so as to be in close contact with the upper and lower portions of the heating element constituting the heater to effectively perform the substrate heating process.

In addition, one side of the chamber of the heat treatment oven is provided with an air supply port for introducing a fluid containing a process gas and an exhaust port for exhausting the fluid in the chamber, and a frame including lugs for supporting and supporting the chamber and the heating wire of the heater are connected. It is configured to include a conductive part to which a plurality of busbars for passing a current are connected.

On the other hand, the heat treatment oven includes a heater in the chamber to remove moisture remaining on the substrate during the heat treatment process of the substrate, and requires a more efficient and high-performance processing capability to improve product quality.

In addition, in order to mass-produce a larger amount of products by shortening the heat treatment process time, the heater unit installed inside the chamber requires high performance and structurally enhanced durability.

However, in the heater unit of the conventional heat treatment oven, it is difficult to maintain temperature uniformity without dielectric breakdown even at high temperatures, and it is difficult to sufficiently satisfy high temperature performance and temperature uniformity required in the substrate manufacturing process.

Accordingly, the present invention can be used inside the chamber of a heat treatment oven, can maintain temperature uniformity without dielectric breakdown even at high temperatures, and can satisfy the high temperature performance and temperature uniformity required in the substrate manufacturing process. A heater unit for a heat treatment oven is presented.

A main configuration constituting the heater unit of the heat treatment oven according to the present invention will be described in detail with reference to FIGS. 5 to 11 .

5 is an illustration of a heater unit according to an embodiment of the present invention disposed in a heat treatment oven. 6 is a plan view of a heater unit according to an embodiment of the present invention disposed in a heat treatment oven. 7 is an example showing a part of a heater unit cut off according to an embodiment of the present invention. FIG. 8 is an example in which part A of FIG. 7 is extracted and shown in detail. 9 is an example illustrating a detailed structure of a heater unit according to an embodiment of the present invention.

The heater unit 300 of the heat treatment oven according to the embodiment of the present invention is mounted in plurality in the chamber 200 for accommodating the substrate for heating and drying the substrate (not shown), as shown in FIGS. 5 to 9 . can be placed. The heat treatment oven 100 may be configured to heat or dry the substrate through heat generated from the heater units 300 .

In addition, the heater unit 300 may be configured as a pipe 310 in which a heating wire 302 that generates heat by electric resistance is built-in.

Here, the pipe 310 functioning as a heating element may be preferably configured by selecting a circular-shaped pipe 310 having a silver hollow in which the heating wire 302 is embedded. The circular-shaped pipe 310 may preferably be arranged in a bent shape by maintaining a constant interval as shown in FIGS.

In the case of applying the circular-shaped pipe 310 in this way, it can be manufactured as a heating element of a softly bent shape without abrupt bending while maintaining a constant interval, so it plays an important role in maintaining the temperature uniformly, while reducing the thickness and reducing the thickness. It is possible to narrow the bending limit and the gap, which has the advantage of improving the overall performance when applied as a heating element of a heat treatment oven.

In addition, the heater unit 300 is disposed between the upper and lower heat transfer plates 321 and 322 and the upper and lower heat transfer plates 321 and 322 disposed in the upper and lower portions of the pipe 310 as shown in FIG. It may be configured to include a plurality of bushings 330 for maintaining the distance between the heat transfer plates 321 and 322 and supporting the upper and lower heat transfer plates 321 and 322 .

In addition, as shown in FIG. 8 , the conductive part 301 is connected to one end of the pipe 310 constituting the heater unit 300 and a power sleeve 311 for supplying power is mounted, and the power sleeve 311 . It may be configured by disposing the sleeve heat dissipation block 312 based on their arrangement position.

Here, the power sleeve 311 may be configured to induce the connection of the conductive part 301 and block heat loss radiated to the outside from the pipe 310 . To this end, based on the arrangement position of the power sleeves 311, a sleeve heat dissipation block 312 is mounted on the periphery thereof, and through this, high-temperature heat is dissipated. The portion 301 can be effectively protected.

The sleeve heat dissipation block 312 may be preferably selected from an aluminum alloy or a ceramic material that withstands high heat and has excellent heat dissipation performance and electrical insulation.

10 is an example illustrating a structure of a bushing of a heater unit according to an embodiment of the present invention. 11 is an example showing the disassembled state of the bushing of the heater unit according to an embodiment of the present invention.

In addition, as shown in FIGS. 9 to 11 , the bushing part 330 constituting the heater unit 300 has a hollow hole 332 and is positioned along the opening hole 323 of the lower heat transfer plate 322 . It may be configured to include a bushing 331 that is. In addition, the bushing 331 may be mounted and fixed along the opening hole 323 through the support means.

Here, the bushing 331 is positioned between the upper and lower heat transfer plates 321 and 322 in contact with the upper and lower heat transfer plates 321 and the upper heat transfer plate 321 without breaking the insulation even at high temperatures without breaking the insulation at high temperatures. The flow or deformation of the lower heat transfer plate 322 is controlled, and a constant gap is formed, thereby inducing constant temperature uniformity.

For example, the upper heat transfer plate 321 and the lower heat transfer plate 322 finally radiate the heat conducted from the pipe 310 into the chamber of the heat treatment oven. At this time, the upper heat transfer plate 321 and the lower heat transfer plate ( 322), thermal stress strain or the like may cause temperature uniformity deviation. This may appear as a problem of causing a sudden change in thermal equilibrium and deformation of the heat radiation area set in the heat treatment oven.

The temperature uniformity and temperature management of the heater unit 300 disposed in the chamber of the heat treatment oven directly or indirectly affects the yield and performance maintenance in the heat treatment of the substrate according to the difference.

According to the present invention, the bushing portion 330 interposed between the upper heat transfer plate 321 and the lower heat transfer plate 322 in an insert manner is thermally deformed, or the upper portion of the upper heat transfer plate 321 and the lower heat transfer plate 322 . By effectively controlling various deformation factors, including positional deformation due to impact applied to the heat transfer plate 321 and the lower heat transfer plate 322 , and maintaining the upper heat transfer plate 321 and the lower heat transfer plate 322 at regular intervals, It is possible to satisfy high temperature performance and temperature uniformity required in the substrate manufacturing process.

To this end, the bushing 331 may be configured by being disposed at a plurality of places between the upper heat transfer plate 321 and the lower heat transfer plate 322 through a support means, and the support means is a hole in the lower heat transfer plate 322 . The fixer 340 and the fixer 340 protruding downward from the upper heat transfer plate 321 so as to be centered in the opening hole 323 and entering along the hollow hole 332 of the bushing 331 are installed on the lower heat transfer plate 322 . It may be configured to include a fixing nut 341 supported on the bottom surface of the.

As shown in FIG. 10 , the bushing part 330 may be mounted between the upper heat transfer plate 321 and the lower heat transfer plate 322 , and the bushing 331 is an upper heat transfer plate as shown in FIG. 11 . It is positioned in the lower heat transfer plate 322 through the fixer 340 protruding downward from 321 and entering along the hollow hole 332 of the bushing 331, and the upper heat transfer plate 321 and the lower heat transfer plate ( 322), a certain gap is formed between the upper heat transfer plate 321 and the lower heat transfer plate 322 so that the upper heat transfer plate 321 and the lower heat transfer plate 322 maintain a constant distance even under high heat conditions. function to support

In addition, as shown in FIG. 10 , the fixer 340 protrudes from the upper heat transfer plate 321 and passes through the hollow hole 332 of the bushing 331 , and then the opening hole of the lower heat transfer plate 322 ( 323) and fastening the fixing nut 341 at the bottom of the lower heat transfer plate 322 to be supported and fixed in a solid state. Here, when the washer 342 is installed between the bottom surface of the lower heat transfer plate 322 and the contact surface of the fixing nut 341 , the flow and deformation of the fixer 340 can be effectively prevented.

As described above, the heater unit of the heat treatment oven according to the present invention can be used inside the chamber of the heat treatment oven, and can maintain temperature uniformity without dielectric breakdown even at high temperatures, and high temperature performance and temperature required in the substrate manufacturing process. There is an advantageous advantage that uniformity can be satisfied.

In addition, through a bushing placed between the upper heat transfer plate and the lower heat transfer plate in an insert manner, thermal deformation of the upper heat transfer plate and the lower heat transfer plate, or positional deformation due to the impact applied to the upper heat transfer plate and the lower heat transfer plate. There is an advantage in that the deformation factors can be effectively controlled.

In addition, by maintaining the upper heat transfer plate and the lower heat transfer plate at regular intervals, there is an advantage in that high temperature performance and temperature uniformity required in the substrate manufacturing process can be satisfied.

Although the present invention has been described with reference to an embodiment shown in the drawings, it is not limited to the embodiment and can be implemented by modification and modification within the scope of the present invention, and the modifications and variations are within the technical spirit of the present invention. Included.

100: heat treatment oven 200: chamber
300: heater unit 301: conductive part
302: heating wire 310: pipe
311: power sleeve 312: sleeve heat dissipation block
321: upper heat transfer plate 322: lower heat transfer plate
323: opening hole 330: bushing part
331: bushing 332: hollow hole
340: fixer 341: fixing nut
342: washer

Claims (6)

a heat treatment oven having a chamber for accommodating the substrate for heating and drying the substrate, and mounting a plurality of heater units in the chamber to heat or dry the substrate through heat generated from the heater units; and
The heater unit is disposed between a pipe heated by a built-in heating wire generating heat by electrical resistance, an upper and lower heat transfer plate disposed at the upper and lower portions of the pipe, and a gap between the upper and lower heat transfer plates to maintain the distance between the upper and lower heat transfer plates and the upper and lower parts A heater unit for a heat treatment oven including a plurality of bushings for supporting a heat transfer plate. The method of claim 1,
The pipe is a heater unit of a heat treatment oven, characterized in that it has a hollow circular shape. The method of claim 1,
A power sleeve for supplying power to one end of the pipe is connected to a conductive part, and a sleeve heat dissipation block is disposed based on an arrangement position of the power sleeves. The method of claim 1,
The bushing part has a hollow hole and includes a bushing positioned along the opening hole of the lower heat transfer plate, wherein the bushing is mounted and fixed along the opening hole through a support means. 5. The method of claim 4,
The support means may include a fixer protruding downward from the upper heat transfer plate to be centered on the opening hole drilled in the lower heat transfer plate and entering along the hollow hole of the bushing; and a fixing nut supporting the fixer on the bottom surface of the lower heat transfer plate. 6. The method of claim 5,
and a washer installed between the lower surface of the lower heat transfer plate and the upper surface of the fixing nut to prevent movement and deformation of the fixer.

Images