KR20220120797A - Temperature evaluating device of memory module and operating method thereof - Google Patents

Abstract

Various embodiments of the present disclosure relate to a temperature evaluating device of a memory module. The temperature evaluating device of the memory module comprises: a heater emitting heat; at least one Peltier element configured to absorb heat through one surface between a first surface and a second surface toward a direction opposite to the first surface based on a direction of an input electrode and emit the absorbed heat through another surface between the first surface and the second surface; and a temperature controller. The temperature controller may measure the temperature of the memory module and control driving of the heater and the at least one Peltier element based on whether the measured temperature corresponds to a designated target temperature range. The present invention can save the time consumed in evaluating the reliability of the memory module.

Description

Device for temperature evaluation of memory module and operating method thereof

The present disclosure relates to an apparatus for temperature evaluation of a memory module and an operating method thereof.

Recently, as various kinds of computing devices are provided, the use of a memory module equipped with a random access memory (RAM) is rapidly increasing. For example, a DIMM (dual in-line memory module) in which a DRAM chip is mounted on a circuit board is widely used as a memory device of a computer.

The memory module may generate heat by itself according to usage time and usage purpose. In order to prevent a problem in the operation of the memory module due to self-heating due to the operation of the memory module or the temperature applied to the memory module according to the usage environment, the memory module according to the temperature change before shipment The procedure for testing (or evaluating) the reliability of

In the prior art, a method of testing the reliability of the memory module is provided after seating the entire plurality of boards on which the memory module is mounted inside equipment such as a chamber, setting the temperature inside the chamber to a temperature environment suitable for testing, and have.

However, the conventional test method takes a lot of time to set the temperature, so it is not suitable for testing a large number of memory modules at a high speed.

Accordingly, various embodiments of the present disclosure provide an apparatus for evaluating a temperature of a memory module and an operating method thereof.

Various embodiments of the present disclosure provide an apparatus for evaluating a temperature of a memory module reaching a specified temperature condition using a Peltier element and a heater, and an operating method thereof.

The technical problems to be achieved in this document are not limited to the technical problems mentioned above, and other technical problems not mentioned will be clearly understood by those of ordinary skill in the art to which the present disclosure belongs from the description below. will be able

According to various embodiments of the present disclosure, the apparatus for evaluating the temperature of the memory module includes a first surface, and a second surface facing a direction opposite to the direction of the first surface, based on the direction of the heater and the input electrode for emitting heat. at least one Peltier element configured to absorb heat through one of the sides and dissipate the absorbed heat through the other of the first side and the second side, and a temperature controller; The temperature controller may measure the temperature of the memory module and control driving of the heater and the at least one Peltier element based on whether the measured temperature corresponds to a specified target temperature range.

According to an embodiment, the apparatus for evaluating the temperature of the memory module further includes at least one blower, and the temperature controller may control driving of the at least one blower based on the measured temperature.

According to an embodiment, the memory module, the heater, and the at least one blower may be disposed in an enclosed space.

According to one embodiment, the temperature controller compares the measured temperature with a specified target temperature to determine whether the temperature of the enclosed space needs to be increased or whether the temperature needs to be decreased, and according to the determination result, the heater; It is possible to control the driving of the at least one Peltier element, and the at least one blower.

According to an embodiment, the temperature controller drives the heater, the at least one Peltier element, and the at least one blower, when the temperature of the enclosed space needs to be increased, and the temperature of the closed space decreases If necessary, the at least one Peltier element and the at least one blower may be driven, and the heater may be controlled not to be driven.

According to one embodiment, the temperature controller, when it is necessary to increase the temperature of the enclosed space, the surface facing the heater among the first and second surfaces of the at least one Peltier element to emit heat, Controls the electrode direction of the current supplied to the at least one Peltier element, and when the temperature of the enclosed space needs to be lowered, one of the first and second surfaces of the at least one Peltier element facing the heater In order to absorb this heat, the electrode direction of the current supplied to the at least one Peltier element may be controlled.

According to an embodiment, the temperature controller may detect the number of revolutions per minute of the at least one blower and control the rotation speed of the at least one blower based on the sensed number of revolutions per minute.

According to an embodiment, the apparatus for evaluating the temperature of the memory module may include a plurality of the Peltier elements, and the plurality of Peltier elements may be disposed on both sides of the heater.

According to an embodiment, the apparatus for evaluating the temperature of the memory module includes a plurality of blowers, a first blower of the plurality of blowers is disposed above the heater, and a second blower of the plurality of blowers is disposed between a lower portion of the heater and an upper portion of the memory module, and at least one third blower of the plurality of blowers may be disposed on one side of the Peltier element.

According to various embodiments of the present disclosure, a method of operating an apparatus for evaluating a temperature of a memory module includes, based on an operation of measuring a temperature of the memory module, and whether the measured temperature corresponds to a specified target temperature range, at least one It may include an operation of controlling the driving of the Peltier element and the heater.

According to an embodiment, the operation of controlling the driving of the at least one Peltier element and the heater based on whether the measured temperature corresponds to a specified target temperature range may include whether the measured temperature corresponds to a specified target temperature range. based on whether the at least one blower is driven, the operation of controlling the at least one blower may be included.

According to an embodiment, the memory module, the heater, and the at least one blower may be disposed in an enclosed space.

According to an embodiment, the operation of controlling the driving of the at least one Peltier element and the heater compares the measured temperature with a specified target temperature to determine whether the temperature of the enclosed space needs to rise, or whether a temperature drop is required. It may include an operation of determining, and an operation of controlling driving of the heater, the at least one Peltier element, and the at least one blower according to the determination result.

According to one embodiment, the operation of controlling the driving of the heater, the at least one Peltier element, and the at least one blower according to the determination result, when the temperature of the enclosed space needs to rise, the heater, the When it is necessary to drive at least one Peltier element, and the at least one blower, and to lower the temperature of the enclosed space, the at least one Peltier element and the at least one blower are driven, and the heater is driven It may include an operation to control so that it does not occur.

According to one embodiment, the operation of controlling the driving of the at least one Peltier element according to the determination result, when the temperature of the closed space needs to be increased, the side facing the heater from both surfaces of the at least one Peltier element When it is necessary to control the electrode direction of the electric current supplied to the at least one Peltier element to dissipate this heat, and to lower the temperature of the enclosed space, the side facing the heater among both surfaces of the at least one Peltier element To absorb this heat, it may include an operation of controlling the electrode direction of the current supplied to the at least one Peltier element.

According to one embodiment, the operation of controlling the driving of the heater, the at least one Peltier element, and the at least one blower according to the determination result may include detecting the number of revolutions per minute of the at least one blower, and and controlling the rotation speed of the at least one blower based on the sensed rotation speed per minute.

According to an embodiment, when there are a plurality of Peltier elements, the plurality of Peltier elements may be disposed on both sides of the heater.

According to an embodiment, when there are a plurality of blowers, a first blower among the plurality of blowers is disposed above the heater, and a second blower is disposed between a lower portion of the heater and an upper portion of the memory module, and at least One third blower may be disposed on one side of the Peltier element.

The apparatus and method for evaluating the temperature of a memory module according to various embodiments of the present disclosure may use a Peltier element and a heater to quickly reach a specified temperature condition, thereby saving time required for evaluating the reliability of the memory module. .

1 is a structural diagram of a temperature box for evaluation of a memory module according to an embodiment of the present disclosure;
2 shows an atmospheric circulation structure in a closed space of a temperature box according to an embodiment of the present disclosure.
3 is a block diagram of an apparatus for evaluating a temperature of a memory module according to an embodiment of the present disclosure;
4 illustrates a detailed structure of an apparatus for evaluating a temperature of a memory module according to an embodiment of the present disclosure.
5 is a flowchart illustrating an operation of an apparatus for evaluating a temperature of a memory module according to an embodiment of the present disclosure.
6 is a structural diagram of a temperature box for evaluation of a memory module according to another embodiment of the present disclosure;
In connection with the description of the drawings, the same or similar reference numerals may be used for the same or similar components.

Hereinafter, various embodiments will be described in detail with reference to the accompanying drawings. Regardless of the reference numerals, the same or similar components may be assigned the same reference numerals and redundant descriptions thereof may be omitted.

The suffixes 'module' or 'part' for components used in the following description are given or used interchangeably for ease of writing the specification, and do not have distinct meanings or roles by themselves. In addition, 'module' or 'unit' refers to software or hardware components such as field programmable gate array (FPGA) or application specific integrated circuit (ASIC), but is not limited to software or hardware. A 'unit' or 'module' may be configured to reside on an addressable storage medium or may be configured to reproduce one or more processors. Thus, as an example, 'part' or 'module' refers to components such as software components, object-oriented software components, class components, and task components, and processes, functions, properties, and programs. may include procedures, subroutines, segments of program code, drivers, firmware, microcode, circuitry, data, databases, data structures, tables, arrays, and variables. The functionality provided in one component, 'unit' or 'module' may be combined into a smaller number of components and 'unit' or 'module' or additional components and 'unit' or 'module' can be further separated.

The steps of a method or algorithm described in connection with some embodiments of the present disclosure may be implemented directly in hardware executed by a processor, a software module, or a combination of the two. A software module may reside in RAM memory, flash memory, ROM memory, EPROM memory, EEPROM memory, registers, hard disk, a removable disk, a CD-ROM, or any other form of recording medium known in the art. An exemplary recording medium is coupled to the processor, the processor capable of reading information from, and writing information to, the storage medium. Alternatively, the recording medium may be integral with the processor. The processor and recording medium may reside within an application specific integrated circuit (ASIC). The ASIC may reside within the user terminal.

Terms including ordinal numbers such as first, second, etc. may be used to describe various elements, but the elements are not limited by the terms. The above terms are used only for the purpose of distinguishing one component from another.

When it is said that an element is 'connected' or 'connected' to another element, it is understood that it may be directly connected or connected to the other element, but other elements may exist in between. it should be On the other hand, when it is mentioned that a certain element is 'directly connected' or 'directly connected' to another element, it should be understood that the other element does not exist in the middle.

1 is a structural diagram of a temperature box for evaluation of a memory module according to an embodiment of the present disclosure; Here, the operation of at least some components of the temperature box will be described with reference to FIG. 2 . 2 shows an atmospheric circulation structure in a closed space of a temperature box according to an embodiment of the present disclosure.

Referring to FIG. 1 , the temperature box 100 for evaluation of the memory module 141 includes first blowers 131 and 132 , Peltier elements 111 and 112 , a heat exchanger 121 , and a second blower. may include the ones 133 and 134 . According to some embodiments, the memory module 141 may be a dual in-line memory module (DIMM).

The first blowers 131 and 132 may be disposed on both sides of the case 101 forming the exterior of the temperature box 100 . Each of the first blowers 131 and 132 may be disposed adjacent to the Peltier elements 111 and 112 to radiate heat emitted from the Peltier elements 111 and 112 to the outside of the case 101 .

Each of the Peltier elements 111 and 112 may be disposed adjacent to the first blowers 131 and 132 . Each of the Peltier elements 111 and 112 may increase or decrease (or cool) the ambient temperature based on the polarity of the input electricity. Each of the Peltier elements 111 and 112 may be configured with a first surface absorbing heat and a second surface emitting heat according to an input electrode. For example, when the first surface of the first Peltier element 111 absorbs heat according to the input electrode, the second surface may emit heat according to the input electrode. As another example, when the second surface of the first Peltier element 111 absorbs heat according to the input electrode, the first surface may emit heat according to the input electrode. The second Peltier element 112 may be configured the same as the first Peltier element 111 . The Peltier element may be referred to as a thermoelectric element.

The heat exchanger 121 may be disposed between the Peltier elements 111 and 112 . The heat exchanger 121 may be configured to include at least one AC heater 122 . The heat exchanger 121 may increase the temperature of the fluid by heating the fluid. According to an embodiment, the heat exchanger 121 may be disposed in the sealed chamber 120 formed by the coupling of the case 101 and the module cup 102 . The module cup 102 may be referred to as a test tray unit. The module cup 102 may surround at least one mounting slot in which the memory module 1410 may be mounted.

The second blowers 133 and 134 may be disposed above and below the heat exchanger 121 . The second blowers 133 and 134 may be disposed in the heat exchanger 121 and the sealed chamber 120 . The second blowers 133 and 134 operate in the upper and lower portions of the closed chamber 120, respectively, so that the closed chamber 120, for example, the Peltier elements 111 and 112 in the enclosed space, and the heat exchanger ( 121) can circulate a fluid (eg gas) with a temperature transition. For example, the fluid to which the temperature is transferred due to the Peltier elements 111 and 112 and the heat exchanger 121 in the temperature box is circulated inside the sealed chamber 120, and to the outside, as shown in FIG. does not leak Accordingly, the temperature box 100 according to the embodiment of the present disclosure may rapidly increase the temperature inside the closed chamber 120 to a specified target temperature.

The memory module 141 may refer to a DIMM in which several DRAM chips are mounted on a circuit board. The memory module 141 may be disposed in the module cup 102 . The module cup 102 may be combined with the case 101 of the temperature box 100 to form an airtight chamber 120 . The memory module 141 may be driven in a high temperature environment and/or a low temperature environment formed in the sealed chamber 120 , and the manufacturer can evaluate the reliability of the memory module 141 driven in the sealed chamber 120 . have.

3 is a block diagram of an apparatus for evaluating a temperature of a memory module according to an embodiment of the present disclosure; Here, the temperature box 100 may be the temperature box 100 of FIG. 1 .

Referring to FIG. 3 , the temperature evaluation apparatus 300 of the memory module may include a temperature box 100 , a temperature controller 320 , and a motherboard 310 . The memory module 312 for temperature evaluation may be mounted on the motherboard 310 .

The temperature box 100 may provide a high temperature environment and/or a low temperature environment required for testing the memory module under the control of the temperature controller 320 . The temperature box 100, for example, using the Peltier elements 111 and 112, and the AC heater 122, may adjust the temperature of the designated test space. According to an embodiment, the designated test space may mean the sealed chamber 120 of FIG. 1 .

The motherboard 310 on which the memory module 312 is mounted may measure the temperature of the designated test space and/or the memory module 312 , and provide the measured temperature to the temperature controller 320 . According to an embodiment, the memory module 312 mounted on the motherboard 310 may be arranged to be located in a designated test space. For example, the memory module 312 may be disposed in a module cup 102 coupled with the case 101 of the temperature box 100 , as shown in FIG. 1 . According to one embodiment, the memory module 312 may be a DIMM including a temperature sensor. The motherboard 310 may measure a temperature using a temperature sensor included in the memory module 312 and transmit the measured temperature to the temperature controller 320 . The measured temperature may mean the temperature of the designated test space or the temperature of the memory module affected by the temperature of the designated test space.

The temperature controller 320 may receive measured temperature information from the motherboard 310 and control the temperature box 100 based on the measured temperature information. For example, the temperature controller 320 may determine whether the measured temperature corresponds to a target temperature range designated for testing the memory module. When the measured temperature does not correspond to the specified target temperature range, the temperature controller 320 controls the elements ( Example: The Peltier elements 111 and 112 of FIG. 1 , the AC heater 122 , and the first and second blowers 131 , 132 , 133 and 134 ) may be controlled.

According to an embodiment, the temperature controller 320 controls the operation of the Peltier elements 111 and 112 and the AC heater 122 when the measured temperature is lower than the specified target temperature range, so that heat is transferred to the specified test space. can be released. In this case, the temperature controller 320 may drive the second blowers 133 and 134 to circulate the fluids whose temperature has risen in the designated test space.

According to an embodiment, the temperature controller 320 stops the operation of the AC heater 122 when the measured temperature is higher than the specified target temperature range, and uses the Peltier elements 111 and 112 in the designated test space. can absorb heat. At this time, the temperature controller 320 drives the second blowers 133 and 134 so that the fluids whose temperature has been lowered are circulated within the designated test space, and drives the first blowers 131 and 132 to drive the Peltier element. It is possible to control the heat absorbed by the 111 and 112 to be released to the outside.

When the measured temperature corresponds to the specified target temperature range, the temperature controller 320 may control the elements inside the temperature box 100 so that the temperature for the specified test space is maintained within the specified range until the test is finished. have.

When a test termination event for the memory module occurs, the temperature controller 320 may end the control operation of the elements inside the temperature box 100 . According to an embodiment, when the measured temperature information corresponds to a specified target temperature range, the temperature controller 320 may immediately terminate the control operation for the elements inside the temperature box 100 .

4 illustrates a detailed structure of an apparatus for evaluating a temperature of a memory module according to an embodiment of the present disclosure. The apparatus 400 for evaluating the temperature of the memory module of FIG. 4 embodies the structure of the apparatus for evaluating the temperature of the memory module of FIG. 3 .

Referring to FIG. 4 , the temperature evaluation apparatus 300 of the memory module may include a temperature box 100 , a motherboard 310 , and a temperature controller 320 .

The motherboard 310 may include a dual in-line memory module (DIMM) 410 , and a central processing unit (CPU) 412 . According to one embodiment, the DIMM 410 may include a Serial Presence Detect (SDP) coupled with a temperature sensor. The SDP is an EEPRPOM chip, and may store information on at least one of a size, speed, voltage, drive size, number of matrix addresses, DIMM manufacturer, and RAM manufacturer. The DIMM 410 may measure the temperature of the designated test space, and/or the temperature of the DIMM 410 . The DIMM 410 may be the memory module 141 of FIG. 1 , and/or the memory module 312 of FIG. 2 .

The CPU 412 may acquire temperature information measured from the DIMM 410 through I2C (Inter-Integrated Circuit) communication. The CPU 412 may provide the temperature information obtained from the DIMM 410 to the host controller 420 of the temperature controller 320 through Ethernet. The CPU 412 may be, for example, an X86 CPU.

The temperature controller 320 may include a host controller 420 , DC-DC converters 422 and 424 , and switches 4221 , 423 , and 425 .

The host controller 420 may obtain temperature information measured from the motherboard 310 at a specified event occurrence time point or at a specified period, and control elements of the temperature box 100 based on the obtained temperature information. According to an embodiment, the host controller 420 may determine whether the temperature control of the specified test space is required based on the acquired temperature information and the specified target temperature range. For example, when the measured temperature does not correspond to the specified target temperature range and is lower than the minimum temperature of the specified target temperature range, the host controller 420 may determine that the temperature of the specified test space needs to be increased. When the measured temperature does not correspond to the specified target temperature range and is higher than the maximum temperature of the specified target temperature range, the host controller 420 may determine that the temperature of the specified test space needs to be lowered.

According to an embodiment, the host controller 420 controls the operation of the Peltier element 430 , the AC heater 432 , and the blower 434 of the temperature box 100 when the temperature of the designated test space needs to be increased. can For example, the host controller 420 may control the first switch 421 to drive the AC heater 432 to provide power to the AC heater 432 . The host controller 420 controls both ends of the Peltier device 430 by controlling the DC-DC converters 422 and 424 and the second and third switches 423 and 425 to drive the Peltier device 430 . DC voltage can be applied to Also, the host controller 420 may drive the blower 434 (eg, the second blowers 133 and 134 of FIG. 1 ) disposed in the designated test space.

According to an embodiment, the host controller 420 may control the operation of the Peltier element 430 and the blower 434 of the temperature box 100 when the temperature of the designated test space needs to be lowered. For example, the host controller 420 controls the DC-DC converters 422 and 424 and the second and third switches 423 and 425 to drive the Peltier device 430 to drive the Peltier device 430 . ) can be applied to both ends of the DC voltage. In this case, the host controller 420 may control the first switch 421 so that power is not supplied to the AC heater 432 . This is because the AC heater 432 does not need to operate in order to lower the temperature. Also, the host controller 420 may drive all the blowers 434 in the temperature box 100 . For example, the host controller 420 drives the first blowers 131 and 132 to radiate heat emitted from the Peltier elements 430, 111, and 112 that has absorbed heat from the designated test space to the outside, The second blowers 133 and 134 may be driven to circulate the fluids whose temperature is transferred within the designated test space.

According to an embodiment, the host controller 420 includes the DC-DC converters 422 and 424 and the second and third switches 423 and 425 according to whether the temperature of the designated test space needs to be increased or decreased. By controlling the electrode direction of the current provided to the Peltier element 420 can be adjusted. This is because the heat dissipation direction of the Peltier element 420 is determined according to the electrode direction of the input current. For example, when it is necessary to increase the temperature of the designated test space, the host controller 420 determines that among both surfaces of the Peltier element 420, the first surface facing the designated test space emits heat and the second surface facing the opposite direction is In order to absorb heat, the electrode direction of the current provided to the Peltier element 420 may be adjusted. As another example, when the temperature of the designated test space needs to be lowered, the host controller 420 may cause the first surface of the Peltier device 420 to absorb heat, and the second surface facing the opposite direction of the two surfaces of the Peltier element 420 absorbs heat. It is possible to adjust the electrode direction of the current provided to the Peltier element 420 so as to emit .

According to an embodiment, the host controller 420 controls the DC-DC converters 422 and 424 and the second and third switches 423 and 425 based on the difference between the measured temperature and the specified target temperature. By controlling it, the intensity of the current provided to the Peltier element 420 may be adjusted. The host controller 420 adjusts the intensity of the current provided to the Peltier element 420 in order to control the amount of heat dissipation of the Peltier element 420 . For example, the host controller 420 may control the intensity of the current supplied to the Peltier device 420 to increase as the difference between the measured temperature and the specified target temperature increases. In the embodiment of the present disclosure, through this, the temperature of the designated test space may be rapidly increased, and the temperature of the designated test space and/or the memory module may be controlled to reach the designated target temperature within a short time.

According to an embodiment, when there are a plurality of AC heaters in the heat exchanger 121 of the temperature box 100 , the host controller 420 sets the plurality of AC heaters based on the difference between the measured temperature and the specified target temperature. The number of AC heaters to be driven among the heaters may be determined. For example, the host controller 420 drives more AC heaters as the difference between the measured temperature and the specified target temperature increases, and the smaller the difference between the measured temperature and the specified target temperature, the smaller the number of AC heaters. can drive them.

According to an embodiment, the host controller 420 may detect the revolutions per minute of the blower 434 and adjust the speed of the corresponding blower 434 based on the sensed revolutions per minute.

The DC-DC converters 422 and 424 may convert and output the DC voltage. For example, each of the DC-DC converters 422 and 424 may step-down and/or step-up the input voltage provided from the host controller 420 to output the voltage. The DC-DC converters 422 and 424 may be, for example, switching regulators.

Each of the switches 421 , 423 , and 425 may open and close a circuit by performing a switching operation according to a control signal input from the host controller 420 .

The temperature box 100 may include a Peltier element 430 , an AC heater 432 , and a blower 434 . The Peltier device 430 may emit heat to a designated test space or absorb heat in a designated test space according to an electrode direction of a current input under the control of the host controller 420 . The Peltier element 430 may emit and/or absorb heat corresponding to the intensity of the current input under the control of the host controller 420 . The Peltier element 430 may be the Peltier elements 111 and 112 of FIG. 1 .

The AC heater 432 may receive power under the control of the host controller 420 and may radiate heat within a designated test space. The AC heater 432 may be the AC heater 122 of FIG. 1 .

The blower 434 may be driven or stopped under the control of the host controller 420 . The rotation speed of the blower 434 may be changed according to the control of the host controller 420 . The blower 434 may include at least one of the first blowers 131 and 132 and the second blowers 133 and 134 of FIG. 1 .

5 is a flowchart illustrating an operation of an apparatus for evaluating a temperature of a memory module according to an embodiment of the present disclosure. In the following embodiment, each operation may be sequentially performed, but is not necessarily performed sequentially. For example, the order of each operation may be changed, and at least two operations may be performed in parallel. Here, the temperature evaluation apparatus of the memory module may be the temperature evaluation apparatus 300 of the memory module of FIGS. 3 and 4 . 5 , an operation indicated by a dotted line may be omitted according to an exemplary embodiment.

Referring to FIG. 5 , the apparatus 300 for evaluating the temperature of the memory module may measure the temperature of the memory module in operation S501 . According to an embodiment, the apparatus 300 for evaluating the temperature of the memory module may measure the temperature of the memory module located in a designated test space. The designated test space means an enclosed space formed by the coupling of the case 101 and the module cup 102 of the temperature box 100 included in the temperature evaluation device 300 of the memory module, as shown in FIG. 1 . can do. The temperature evaluation apparatus 300 of the memory module may measure the temperature by using a temperature sensor of a memory module (eg, DIMMs 141 and 410 ) located in a designated test space. The measured temperature may mean the temperature of the memory module affected by the temperature of the designated test space. According to one embodiment, the memory module may be a DIMM including an SDP coupled with a temperature sensor.

The temperature evaluation apparatus 300 of the memory module may determine whether the temperature measured in operation S503 corresponds to a specified target temperature range. The designated target temperature range may be set and/or changed by a user (inspector) performing a test on the memory module. The host controller 420 of the apparatus 300 for evaluating the temperature of the memory module may obtain the measured temperature from the motherboard 310 and determine whether the measured temperature corresponds to a specified target temperature range.

When the measured temperature does not correspond to the specified target temperature range, the temperature evaluation apparatus 300 of the memory module may control the Peltier element and the heater in operation S505 . For example, when the temperature controller 320 included in the temperature evaluation device 300 of the memory module does not correspond to the specified target temperature range, the temperature box ( 100) included in the Peltier elements (111, 112, 430), it is possible to control the AC heater (122, 432).

According to an embodiment, the host controller 420 of the temperature evaluation device 300 of the memory module determines whether the temperature of the specified test space needs to be increased or the temperature needs to be decreased based on the measured temperature and the specified target temperature range. can When the measured temperature is lower than the minimum temperature of the specified target temperature range, the host controller 420 determines that the temperature of the specified test space needs to be increased, and when the measured temperature is higher than the maximum temperature of the specified target temperature range, the specified test It can be determined that a temperature drop in the space is necessary. When the temperature of the designated test space needs to be increased, the host controller 420 of the temperature evaluation device 300 of the memory module includes the Peltier elements 111 , 112 , 430 and/or the AC heaters 122 and 432 of the temperature box 100 . ) can be driven. The host controller 420 may control the Peltier elements 111 , 112 , and 430 of the temperature box 100 to be driven and the AC heaters 122 and 432 not to be driven when the temperature of the designated test space needs to be lowered. .

According to an embodiment, the host controller 420 may adjust the electrode direction of the current provided to the Peltier devices 111 , 112 , and 420 according to whether the temperature of the designated test space needs to be increased or decreased. This is because the heat dissipation direction of the Peltier element 420 is determined according to the electrode direction of the input current.

According to an embodiment, the host controller 420 may adjust the intensity of the current provided to the Peltier device 420 based on a difference between the measured temperature and the specified target temperature. The host controller 420 adjusts the intensity of the current provided to the Peltier element 420 in order to control the amount of heat dissipation of the Peltier element 420 .

According to an embodiment, when a plurality of AC heaters are present in the temperature evaluation apparatus 300 of the memory module, the host controller 420 may select the plurality of AC heaters based on a difference between the measured temperature and the specified target temperature. It is possible to determine the number of AC heaters to be driven. For example, the host controller 420 drives more AC heaters as the difference between the measured temperature and the specified target temperature increases, and the smaller the difference between the measured temperature and the specified target temperature, the smaller the number of AC heaters. can drive them. Also, when the difference between the measured temperature and the specified target temperature is smaller than a preset value, the temperature evaluation apparatus 300 of the memory module may control only the Peltier element 420 without driving all AC heaters.

The temperature evaluation apparatus 300 of the memory module may control the blower in operation S507. According to an embodiment, operation S507 of controlling the blower may be performed in parallel with S505. For example, the operation of controlling the blower may be started at substantially the same time as when the operation of controlling the Peltier element and the heater is started.

According to an embodiment, when the temperature controller 320 included in the temperature evaluation device 300 of the memory module does not correspond to the specified target temperature range, the temperature controller 320 may adjust the temperature so that the measured temperature reaches the specified target temperature range. It is possible to control the operation of at least one blower (131, 132, 133, 134) included in the box (100).

According to an embodiment, the host controller 420 of the device 300 for evaluating the temperature of the memory module requires at least one of the blowers included in the temperature box 100 to be driven according to whether a temperature rise or a temperature drop is required. You can select and drive the blower of For example, when it is necessary to increase the temperature of the designated test space, the host controller 420 may drive the second blowers 133 and 134 disposed in the designated test space. The host controller 420 may drive all the blowers 131 , 132 , 133 , and 134 in the temperature box when the temperature of the designated test space needs to be lowered. This is merely an example, and embodiments of the present disclosure are not necessarily limited thereto. For example, the host controller 420 may drive all the blowers 131 , 132 , 133 , and 134 in the temperature box irrespective of whether a temperature increase or decrease is required.

According to an embodiment, the host controller 420 may detect the revolutions per minute of the blowers 131 , 132 , 133 and 134 , and adjust the speed of the corresponding blower based on the sensed revolutions per minute.

When the measured temperature falls within the specified target temperature range, the temperature evaluation apparatus 300 of the memory module may end the control operation. According to one embodiment, the temperature evaluation device 300 of the memory module controls the elements inside the temperature box 100 so that the temperature of the specified test space and/or the memory module is maintained within the specified target range until the test is finished. And, when a test termination event occurs, the control operation for the elements inside the temperature box 100 may be terminated. According to an embodiment, the apparatus 300 for evaluating the temperature of the memory module may immediately terminate the control operation for the elements inside the temperature box 100 when the measured temperature corresponds to a specified target temperature range.

In the examples of the present disclosure described above, as shown in FIG. 1, a temperature box ( 100) has been described as an example. However, embodiments of the present disclosure are not necessarily limited thereto. For example, the number of Peltier elements included in the temperature box 100, the number of AC heaters, or the number of blowers may be changed. As another example, the arrangement structure of the Peltier elements, the AC heater, and the blowers included in the temperature box may be changed. As another example, the temperature box may include a heater other than an AC heater. For example, a DC cartridge heater may be included. In this case, the elements in the temperature box may have an arrangement structure as shown in FIG. 6 .

6 is a structural diagram of a temperature box for evaluation of a memory module according to another embodiment of the present disclosure;

6, the temperature box 600 for evaluation of the memory module 641, the first Peltier elements (611, 612), the second Peltier elements (613, 614), DC cartridge heaters 621 , 622 , 623 , and 624 may include a heat exchanger 620 , a first blower 631 , and a second blower 632 .

Each of the first Peltier elements 611 and 612 and the second Peltier elements 613 and 614 may increase or decrease (or cool) the ambient temperature based on the polarity of the input electricity. Each of the first Peltier elements 611 and 612 and the second Peltier elements 613 and 614 may include a first surface that absorbs heat and a second surface that emits heat according to an input electrode. Each of the first Peltier elements 611 and 612 and the second Peltier elements 613 and 614 may operate in the same manner as the Peltier elements 111 and 112 of FIG. 1 .

The heat exchanger 620 may be disposed in a space between the first Peltier elements 611 and 612 and the second Peltier elements 613 and 614 . The heat exchanger 620 may be configured to include a plurality of DC cartridge heaters 621 , 622 , 623 , 624 . The heat exchanger 620 may increase the temperature of the temperature transfer material using a plurality of DC cartridge heaters 621 , 622 , 623 , and 624 .

The memory module 641 for evaluation may refer to a DIMM in which several DRAM chips are mounted on a circuit board. The memory module 641 may be disposed under the heat exchanger 620 .

The first blower 631 may be disposed on one side of the heat exchanger 620 . The second blower 632 may be disposed on one side of the memory module 641 , and may be disposed in a direction opposite to the direction in which the first blower is disposed based on the heat exchanger 620 and the memory module 641 .

According to an embodiment, the heat exchanger 620 , the first blower 631 , and the second blower 632 may be disposed in a closed space formed by the temperature evaluation device of the memory module. The memory module 6410 for evaluation may also be disposed in the formed closed space. Accordingly, the fluid whose temperature is transferred due to the Peltier elements 611 , 612 , 613 , 614 and the heat exchanger 620 in the enclosed space may be circulated in the enclosed space without flowing out to the outside.

According to various embodiments of the present disclosure described above, the evaluation apparatus 300 of the memory module, even if it includes the temperature box 600 as shown in FIG. 6, in FIGS. 3, 4, and 5 It can operate as described. That is, compared to the case including the temperature box 600 as shown in FIG. 6 , it is different only in that a DC cartridge heater is used instead of an AC heater, and all other operating methods will be the same.

100: temperature box 101: case
102: module cup 111, 112: Peltier elements
121: heat exchanger 122: AC heater
131, 132: first blower 133, 134: second blower
141: memory module
600: temperature box
611, 612: first Peltier elements 613, 614: second Peltier elements
620: heat exchangers 621, 622, 623, 624: DC cartridge heaters
631: first blower 632: second blower
641: memory module

Claims (18)

A temperature evaluation device for a memory module, comprising:
heaters that dissipate heat;
Based on the direction of the input electrode, heat is absorbed through any one of the first surface and the second surface facing the direction opposite to the direction of the first surface, and the other of the first surface and the second surface at least one Peltier element configured to dissipate the absorbed heat through one side; and
A temperature controller comprising:
Measuring the temperature of the memory module,
Based on whether the measured temperature corresponds to a specified target temperature range, a temperature evaluation apparatus of a memory module for controlling driving of the heater and the at least one Peltier element.
According to claim 1,
It further comprises at least one blower,
The temperature controller is configured to control the driving of the at least one blower based on whether the measured temperature corresponds to a specified target temperature range.
3. The method of claim 2,
The memory module, the heater, and the at least one blower are disposed in an enclosed space.
4. The method of claim 3,
The temperature controller compares the measured temperature with the specified target temperature to determine whether the temperature of the enclosed space needs to be increased or the temperature needs to be decreased,
A temperature evaluation apparatus of a memory module for controlling driving of the heater, the at least one Peltier element, and the at least one blower according to the determination result.
5. The method of claim 4,
The temperature controller is
When it is necessary to increase the temperature of the enclosed space, driving the heater, the at least one Peltier element, and the at least one blower,
When it is necessary to lower the temperature of the enclosed space, the at least one Peltier element and the at least one blower are driven, and the heater is not driven.
5. The method of claim 4,
The temperature controller is
When it is necessary to increase the temperature of the enclosed space, the surface facing the heater among the first and second surfaces of the at least one Peltier element emits heat, the current provided to the at least one Peltier element control the electrode orientation,
When it is necessary to lower the temperature of the enclosed space, the side facing the heater among the first and second surfaces of the at least one Peltier element absorbs heat, the current provided to the at least one Peltier element A temperature evaluation device for a memory module that controls the electrode orientation.
5. The method of claim 4,
The temperature controller detects the number of revolutions per minute of the at least one blower,
A temperature evaluation device of a memory module for controlling a rotation speed of the at least one blower based on the sensed rotation speed per minute.
4. The method of claim 3,
The temperature evaluation device of the memory module includes a plurality of the Peltier elements,
The plurality of Peltier elements is a temperature evaluation device of a memory module disposed on both sides of the heater.
4. The method of claim 3,
The temperature evaluation device of the memory module includes a plurality of blowers,
A first blower among the plurality of blowers is disposed above the heater,
A second blower among the plurality of blowers is disposed between a lower portion of the heater and an upper portion of the memory module,
At least one third blower of the plurality of blowers is a temperature evaluation device of a memory module disposed on one side of the Peltier element.
A method of operating a temperature evaluation device for a memory module, the method comprising:
measuring the temperature of the memory module; and
and controlling driving of at least one Peltier element and a heater based on whether the measured temperature corresponds to a specified target temperature range.
11. The method of claim 10,
Based on whether the measured temperature corresponds to a specified target temperature range, the operation of controlling the driving of the at least one Peltier element and the heater,
and controlling the operation of the at least one blower based on whether the measured temperature corresponds to a specified target temperature range.
12. The method of claim 11,
The memory module, the heater, and the at least one blower are disposed in an enclosed space.
13. The method of claim 12,
The operation of controlling the driving of the at least one Peltier element and the heater,
comparing the measured temperature with a specified target temperature to determine whether the temperature of the enclosed space needs to be increased or the temperature needs to be decreased; and
and controlling driving of the heater, the at least one Peltier element, and the at least one blower according to the determination result.
14. The method of claim 13,
The operation of controlling the driving of the heater, the at least one Peltier element, and the at least one blower according to the determination result,
driving the heater, the at least one Peltier element, and the at least one blower when the temperature of the enclosed space needs to be raised; and
When it is necessary to lower the temperature of the enclosed space, driving the at least one Peltier element and the at least one blower, and controlling the heater not to be driven.
14. The method of claim 13,
The operation of controlling the driving of the at least one Peltier element according to the determination result,
Controlling the electrode direction of the current provided to the at least one Peltier element so that the side facing the heater among both surfaces of the at least one Peltier element emits heat when the temperature of the enclosed space needs to rise; and
When it is necessary to lower the temperature of the closed space, control the electrode direction of the current provided to the at least one Peltier element so that the side facing the heater among both surfaces of the at least one Peltier element absorbs heat. How to.
14. The method of claim 13,
The operation of controlling the driving of the heater, the at least one Peltier element, and the at least one blower according to the determination result,
sensing the number of revolutions per minute of the at least one blower; and
and controlling a rotation speed of the at least one blower based on the sensed rotation speed per minute.
13. The method of claim 12,
When the plurality of Peltier elements are, the plurality of Peltier elements are disposed on both sides of the heater.
13. The method of claim 12,
If there are multiple blowers,
Among the plurality of blowers, a first blower is disposed above the heater, a second blower is disposed between a lower portion of the heater and an upper portion of the memory module, and at least one third blower is one side of the Peltier element How to be placed on.

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