CN110873069A - Method and device for controlling fan parameters - Google Patents
Method and device for controlling fan parameters Download PDFInfo
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- CN110873069A CN110873069A CN201811011037.9A CN201811011037A CN110873069A CN 110873069 A CN110873069 A CN 110873069A CN 201811011037 A CN201811011037 A CN 201811011037A CN 110873069 A CN110873069 A CN 110873069A
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- heat dissipation
- fan
- temperature
- parameter
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D27/00—Control, e.g. regulation, of pumps, pumping installations or pumping systems specially adapted for elastic fluids
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D27/00—Control, e.g. regulation, of pumps, pumping installations or pumping systems specially adapted for elastic fluids
- F04D27/001—Testing thereof; Determination or simulation of flow characteristics; Stall or surge detection, e.g. condition monitoring
Abstract
One or more embodiments of the present disclosure provide a method and an apparatus for controlling a fan parameter, where the method may include: determining power consumption information for components in a device; determining incoming flow temperature information for the component; determining target fan parameters matched with the power consumption information and the incoming flow temperature information according to the established mapping relation among the power consumption, the incoming flow temperature and the fan parameters; and carrying out parameter control on the cooling fan in the equipment according to the target fan parameter.
Description
Technical Field
One or more embodiments of the present disclosure relate to the field of electronic devices, and in particular, to a method and an apparatus for controlling a fan parameter.
Background
Each component in the equipment can reach better operating efficiency within a certain temperature range, and the operating efficiency of the component and even the operating reliability of the component can be influenced after the temperature exceeds the temperature range. However, the equipment inevitably generates heat continuously in the operation process, so that the equipment needs to be radiated; for example, by installing a heat dissipation fan in the device, air convection may be formed between the inside of the device and the outside, so that cold air flowing into the device may dissipate heat of the components, and then hot air may flow out to the outside of the device.
Disclosure of Invention
In view of this, one or more embodiments of the present disclosure provide a method and an apparatus for controlling fan parameters.
To achieve the above object, one or more embodiments of the present disclosure provide the following technical solutions:
according to a first aspect of one or more embodiments of the present description, there is provided a method for controlling a fan parameter, including:
determining power consumption information for components in a device;
determining incoming flow temperature information for the component;
determining target fan parameters matched with the power consumption information and the incoming flow temperature information according to the established mapping relation among the power consumption, the incoming flow temperature and the fan parameters;
and carrying out parameter control on the cooling fan in the equipment according to the target fan parameter.
According to a second aspect of one or more embodiments of the present specification, there is provided a fan parameter control apparatus including:
a power consumption determination unit that determines power consumption information of a component in a device;
a temperature determination unit that determines incoming flow temperature information of the component;
the parameter determining unit is used for determining target fan parameters matched with the power consumption information and the incoming flow temperature information according to the established mapping relation among the power consumption, the incoming flow temperature and the fan parameters;
and the fan control unit is used for carrying out parameter control on the heat dissipation fan in the equipment according to the target fan parameter.
Drawings
Fig. 1 is a schematic diagram of a device component structure according to an exemplary embodiment.
Fig. 2 is a flowchart of a method for controlling a fan parameter according to an exemplary embodiment.
Fig. 3 is a flowchart illustrating a method for controlling a fan speed to dissipate heat of a PCIE card according to an exemplary embodiment.
Fig. 4 is a schematic diagram of directly detecting an incoming flow temperature of a PCIE card according to an exemplary embodiment.
Fig. 5 is a schematic diagram of another exemplary embodiment for directly detecting an incoming flow temperature of a PCIE card.
Fig. 6 is a schematic diagram of indirectly detecting an incoming flow temperature of a PCIE card according to an exemplary embodiment.
Fig. 7 is a schematic diagram of another indirect detection of an incoming flow temperature of a PCIE card according to an exemplary embodiment.
Fig. 8 is a schematic structural diagram of an apparatus according to an exemplary embodiment.
Fig. 9 is a block diagram of a device for controlling fan parameters according to an exemplary embodiment.
Detailed Description
Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The implementations described in the following exemplary embodiments do not represent all implementations consistent with one or more embodiments of the present specification. Rather, they are merely examples of apparatus and methods consistent with certain aspects of one or more embodiments of the specification, as detailed in the claims which follow.
It should be noted that: in other embodiments, the steps of the corresponding methods are not necessarily performed in the order shown and described herein. In some other embodiments, the method may include more or fewer steps than those described herein. Moreover, a single step described in this specification may be broken down into multiple steps for description in other embodiments; multiple steps described in this specification may be combined into a single step in other embodiments.
Fig. 1 is a schematic diagram of a device component structure according to an exemplary embodiment. As shown in fig. 1, the device 100 may be a personal computer, a server host, or any other type, which is not limited in this specification. The device 100 includes a chassis 11 (or a rack, a cabinet, etc.), wherein a motherboard 12 is disposed inside the chassis 11, and a processing module 13 is included or mounted on the motherboard 12, for example, the processing module 13 may be a CPU or a BMC (Baseboard Management Controller) module; a heat dissipation fan 14 is further disposed inside the chassis 11, and the heat dissipation fan 14 is used for introducing cold air outside the chassis 11 and sending out hot air inside the chassis 11 to dissipate heat of the apparatus 100.
Among them, there may be two cases for the components provided on the main board 12: for some components, the processing module 13 may obtain the temperatures of the components to determine whether the components are too hot or at risk of being too hot, and perform parameter control on the heat dissipation fan 14 accordingly, so that the heat dissipation fan 14 can meet the heat dissipation requirements of the components; for other components, the processing module 13 cannot acquire the temperatures of the components, and thus cannot perform parameter control on the cooling fan 14 directly based on the temperatures of the components, but the cooling fan 14 may be controlled by the technical solution of the present specification so as to meet the cooling requirements of the components.
The parts of the processing module 13 that cannot acquire temperature may include an expansion part 15 as shown in fig. 1; of course, some non-expanded components may not be able to obtain the temperature by the processing module 13, and the present specification does not limit this, and only the expanded component 15 is taken as an example to describe the technical solution of the present specification. The main board 12 includes a plurality of expansion slots, such as a PCI (Peripheral Component interface) slot, a pcie (Peripheral Component interface) slot, and the like, which is not limited in this specification. The expansion unit 15 can be inserted through the slot to implement a corresponding expansion function, for example, the expansion function may be a function that the motherboard 12 cannot implement, or the effect of the expansion unit 15 is better although the motherboard 12 can implement the function.
Based on the above-mentioned device composition structure, the processing module 13 can perform parameter control on the heat dissipation fan 14, so that the heat dissipation fan 14 can meet the heat dissipation requirement of the extension component 15, and the power consumption of the heat dissipation fan 14 can be controlled within a reasonable range.
FIG. 2 is a flow chart illustrating a method for controlling fan speed according to an exemplary embodiment. As shown in fig. 2, the method is applied to a processing module in a device (for example, the processing module 13 in the device 100 shown in fig. 1), and the processing module can implement the following steps by executing relevant executable instructions:
at step 202A, power consumption information for components in a device is determined.
In an embodiment, the device may include one or more components, and the components cannot be temperature-controlled by a processing module (such as the processing module 13 shown in fig. 1) in the device, and the cooling fan needs to be controlled based on the technical solution of the present specification to meet the cooling requirements of the components. When a component is included, the power consumption information may be power consumption of the component, and when a plurality of components are included, the power consumption information may be a sum of power consumption of the plurality of components.
In an embodiment, the power consumption information may be determined based on power supply information to the component. In other embodiments, the power consumption information of the component may also be determined in other manners, which is not limited in this specification; for example, the operating state of the component or the corresponding port thereof may be determined, and the power consumption information of the component may be determined according to the predetermined power consumption of the component or the corresponding port thereof in each operating state (such as an idle state, a use state, or other states).
In step 202B, incoming flow temperature information for the component is determined.
In an embodiment, the incoming flow temperature information of the component refers to the temperature of air flowing to the component, the lower the air temperature is, the better the heat dissipation effect on the component is, the parameter of the heat dissipation fan may be set to have a relatively smaller heat dissipation intensity, and the higher the air temperature is, the worse the heat dissipation effect on the component is, the parameter of the heat dissipation fan needs to be set to have a relatively larger heat dissipation intensity.
In one embodiment, a measured temperature output by a temperature sensor at the component may be obtained as incoming flow temperature information for the component. Because the temperature sensor is close to the component, the temperature of the air flowing to the temperature sensor is basically consistent with the temperature of the air flowing to the component, so that the measured temperature output by the temperature sensor can directly represent the incoming flow temperature of the component. Wherein the temperature sensor may be located on the component; alternatively, the temperature sensor may be located in the device at a position close to the component, and the temperature sensor may be specifically located on a motherboard or on a chassis in the device, which is not limited in this specification.
In an embodiment, when the component is located at an air outlet of the device and a temperature sensor is arranged at an air inlet of the device, the incoming flow temperature information of the component can be calculated according to the measured temperature output by the temperature sensor and the temperature rise difference value inside the device; wherein the temperature rise difference value is related to the air volume inside the equipment and the remaining total power consumption of other parts except the parts in the equipment. Since the component is located at the air outlet, the cool air flowing into the apparatus through the air inlet has been heated by other components before reaching the component, so that the temperature of the air flowing to the component is increased, and the increased temperature can be characterized by the temperature rise difference described above.
In an embodiment, the temperature rise difference △ t is 1.76W/Q, where W is the remaining total power consumption, Q is the air volume, and 1.76 may be an empirical coefficient or an experimentally obtained coefficient, and in some scenarios, other larger or smaller coefficient values may also be adopted, which is not limited in this specification.
In an embodiment, when the component is located at an air inlet of the equipment and a temperature sensor is arranged at an air outlet of the equipment, the incoming flow temperature information of the component can be calculated according to the measured temperature output by the temperature sensor and the temperature drop difference value inside the equipment; wherein the temperature drop difference value is related to the air volume inside the equipment and the total power consumption of the equipment. Because the component is positioned at the air inlet, the cold air flowing to the component is not influenced by other components in the equipment; meanwhile, the cold air is heated up under the action of the components and other components in the equipment, and the temperature sensor at the air outlet measures the temperature of the heated hot air, so that the temperature drop difference is used for representing the temperature influence of the components and other components in the equipment on the cold air.
Similar to the temperature rise difference, the temperature drop difference may be △ t ' ═ α W '/Q, where W ' is the total power consumption of the device, Q is the air volume, and α is the empirical coefficient or the coefficient obtained by the experiment, and will not be described herein again.
And 204, determining a target fan parameter matched with the power consumption information and the incoming flow temperature information according to the established mapping relation among the power consumption, the incoming flow temperature and the fan parameter.
In an embodiment, a mapping relation between power consumption, incoming flow temperature and fan parameters can be obtained in advance by performing a background test or a simulation test on equipment; alternatively, the mapping relationship may be set empirically; alternatively, the mapping relationship may be determined in other ways, which is not limited in this specification.
In an embodiment, the mapping relationship may be adjusted, so that the adjusted mapping relationship better meets the actual situation or requirement, and a better heat dissipation effect of the device is achieved.
In an embodiment, the parameter of the heat dissipation fan may include one or more of any type of rotation speed, input current, input voltage, and the like, as long as the heat dissipation intensity of the heat dissipation fan can be adjusted, and the specification does not limit this. Taking the rotation speed as an example: when the rotating speed is higher, the heat dissipation intensity of the heat dissipation fan is larger, and when the rotating speed is lower, the heat dissipation intensity of the heat dissipation fan is smaller; of course, the parameter value and the heat dissipation strength do not necessarily have to have a positive correlation, and some parameters may also have a negative correlation, which depends on the specific type of the parameter, and this specification does not limit this.
And step 206, performing parameter control on the heat dissipation fan in the equipment according to the target fan parameter.
In one embodiment, the cooling fan can be directly adjusted to the target fan parameter.
In an embodiment, when the heat dissipation intensity represented by the target fan parameter is greater than the heat dissipation intensity represented by the operating parameter of the heat dissipation fan, it indicates that the operating parameter being adopted by the heat dissipation fan cannot meet the heat dissipation requirement, and therefore, the heat dissipation fan may be adjusted to the target fan parameter so as to meet the heat dissipation requirement of the component.
In an embodiment, when the heat dissipation intensity represented by the target fan parameter is not greater than the heat dissipation intensity represented by the operating parameter of the heat dissipation fan, it indicates that the heat dissipation fan can meet the heat dissipation requirement of the component, and the heat dissipation fan may be maintained at the operating parameter.
In an embodiment, when the heat dissipation intensity represented by the target fan parameter is not greater than the heat dissipation intensity represented by the operating parameter of the heat dissipation fan, if the difference between the heat dissipation intensity represented by the target fan parameter and the heat dissipation intensity represented by the operating parameter is not greater than a preset difference, the heat dissipation fan may be maintained at the operating parameter, so that under the condition that the heat dissipation requirement of the component can be met, the heat dissipation fan is not wasted due to excessive energy consumption, device loss and fan noise, and the heat dissipation intensity is prevented from being increased again after the temperature of the component is increased after the heat dissipation intensity is decreased, and the heat dissipation fan is prevented from being frequently adjusted.
In an embodiment, when the heat dissipation intensity represented by the target fan parameter is not greater than the heat dissipation intensity represented by the operating parameter of the heat dissipation fan, if the difference between the heat dissipation intensity represented by the target fan parameter and the heat dissipation intensity represented by the operating parameter is greater than the preset difference, the heat dissipation fan may be adjusted to the target fan parameter, so as to avoid excessive energy consumption waste, device loss, and fan noise generated by the heat dissipation fan.
In summary, the heat dissipation requirement of the component can be accurately known by determining the power consumption information and the incoming flow temperature information of the component, so that the most reasonable target fan parameter of the heat dissipation fan can be selected based on the mapping relationship among the power consumption, the incoming flow temperature and the fan parameter, and the energy consumption, the device loss and the noise of the heat dissipation fan can be reasonably controlled under the condition that the heat dissipation fan meets the heat dissipation requirement of the component.
Fig. 3 is a flowchart illustrating a method for controlling a fan speed to dissipate heat of a PCIE card according to an exemplary embodiment. When a PCIE slot on the device motherboard is plugged with a card for function expansion (i.e., a PCIE card), the embodiment shown in fig. 3 can control the rotation speed of the cooling fan in the device, so that the cooling fan can meet the cooling requirement of the PCIE card; wherein the process of controlling the rotation speed of the fan may include the steps of:
in step 302, a PID (proportional-integral-derivative) throttling function is initiated.
In an embodiment, the PID speed adjusting function can perform closed-loop automatic control on the rotation speed of the cooling fan according to the state parameter of the PCIE card, so that the control on the rotation speed of the cooling fan is more accurate and stable, thereby completing the fan rotation speed control scheme of this embodiment.
In one embodiment, the PID throttling function may be automatically enabled after the device is powered on. In another embodiment, the PID throttling function can be manually turned on by an administrator or other user.
In an embodiment, when the device of this embodiment is a server host, a BMC module may be integrated on a device motherboard, and the BMC module may implement processing control processing of the PID speed adjustment function. In another embodiment, the processing control logic for the PID throttling function may be implemented by a CPU or other controller on the motherboard of the device.
In step 304, the fan speed S is read.
In one embodiment, the cooling fan may be determined and operated at a certain speed S according to a default setting or other factors.
In an embodiment, the actual power consumption of the PCIE card may be determined according to power supply data of the PCIE card. Since the processes of collecting, transmitting, processing and the like of the power supply data can be implemented without any intentional delay, the actual read power consumption can be considered as the real-time power consumption of the PCIE card.
In step 306B, the incoming flow temperature of the PCIE card is read.
In an embodiment, when the temperature sensor is located near the windward side of the PCIE card, the incoming flow temperature of the PCIE card may be directly detected by the temperature sensor.
For example, fig. 4 is a schematic diagram of directly detecting an incoming flow temperature of a PCIE card according to an exemplary embodiment; as shown in fig. 4, when the PCIE card and the temperature sensor are both located at the air inlet of the equipment chassis, assuming that the air flow direction in the equipment chassis is from left to right, if the temperature sensor is located near the left side of the PCIE card (i.e., the windward side of the PCIE card), for example, in fig. 4, the temperature sensor is located below the left side of the PCIE card, then the temperature of the incoming flow of the PCIE card may be directly detected by the temperature sensor.
For another example, fig. 5 is a schematic diagram of another exemplary embodiment for directly detecting an incoming flow temperature of a PCIE card; as shown in fig. 5, when the PCIE card and the temperature sensor are both located at the air outlet of the equipment chassis, assuming that the air flowing direction in the equipment chassis is from left to right, if the temperature sensor is located near the left side of the PCIE card (i.e., the windward side of the PCIE card), for example, located below the left side of the PCIE card in fig. 5, the incoming temperature of the PCIE card can be directly detected by the temperature sensor.
In an embodiment, when the temperature sensor is not located near the PCIE card, the incoming flow temperature of the PCIE card may be indirectly calculated according to the temperature sensor.
For example, fig. 6 is a schematic diagram for indirectly detecting an incoming flow temperature of a PCIE card according to an exemplary embodiment, as shown in fig. 6, when the PCIE card is located at an air outlet of an apparatus chassis and a temperature sensor is located at an air inlet of the apparatus chassis, an incoming flow temperature of the PCIE card is T1, but the temperature sensor can only directly detect an air inlet temperature T2 of the apparatus chassis, and the incoming flow temperature T1 is affected by components other than the PCIE card in the apparatus on the basis of the air inlet temperature T2 and increases by a temperature rise difference value △ T1, where remaining total power consumption W of the components other than the PCIE card in the apparatus and an air volume Q in the apparatus chassis may be respectively obtained, so that the temperature rise difference value △ T1 is calculated to be 1.76W/Q, and therefore, the incoming flow temperature T1 of the PCIE card may be determined to be T2+ △ T1.
For another example, fig. 7 is a schematic diagram of another indirect detection of an incoming flow temperature of a PCIE card provided in an exemplary embodiment, as shown in fig. 7, when the PCIE card is located at an air inlet of an apparatus chassis and a temperature sensor is located at an air outlet of the apparatus chassis, the incoming flow temperature of the PCIE card is equal to an air inlet temperature T3 of the apparatus chassis, but the temperature sensor can only directly detect an air outlet temperature T4 of the apparatus chassis, and after the incoming flow temperature T3 rises by a temperature rise difference value of △ T2 under the influence of all components in the apparatus, the incoming flow temperature T3 is detected as an air outlet temperature T4, where the total power consumption W 'of all components including the PCIE card in the apparatus chassis may be respectively obtained, so that the temperature rise difference value △ T2 is calculated as α W'/Q, where α is a preset coefficient, and therefore, the incoming flow temperature T3 of the PCIE card may be determined as T4- △ T2.
In one embodiment, since the detection or calculation process of the incoming flow temperature of the PCIE card can be implemented without any delay, the incoming flow temperature can be regarded as the real-time incoming flow temperature of the PCIE card.
In step 308, the target fan speed Sr of the cooling fan is queried.
In an embodiment, a thorough test may be performed on the rotation speed of the cooling fan in advance, and the fan rotation speed required by the PCIE card under the conditions of different power consumption and different incoming flow temperatures is determined, so as to construct a three-way mapping relationship between the power consumption, the incoming flow temperature, and the fan rotation speed, for example, the mapping relationship may be as shown in table 1 below.
TABLE 1
Therefore, according to the actual power consumption of the PCIE card read in step 306A and the incoming flow temperature of the PCIE card read in step 306B, the corresponding target fan rotation speed Sr may be queried based on the above table 1.
And step 312, when S-Sr is larger than m, the step is shifted to step 314B, otherwise, the step is shifted to step 314A.
In step 314A, the fan speed remains unchanged.
In step 314B, the fan speed is adjusted to Sr.
In one embodiment, when the target fan speed Sr > S, it indicates that the target fan cannot meet the heat dissipation requirement of the PCIE card, and therefore, the fan speed needs to be adjusted to ensure that the fan speed can meet the heat dissipation requirement of the PCIE card.
In an embodiment, when the target fan speed Sr is less than or equal to the rotation speed S, if the difference between the target fan speed Sr and the rotation speed S is greater than the preset threshold m, which indicates that the heat dissipation capability of the heat dissipation fan is excessive, the rotation speed may be reduced from S to Sr, so as to reduce the energy consumption and noise of the heat dissipation fan, and also reduce the usage loss of the heat dissipation fan. If the difference between the target fan rotation speed Sr and the target fan rotation speed S is not greater than the preset threshold m, it indicates that the heat dissipation capability of the heat dissipation fan is slightly greater than the heat dissipation requirement of the PCIE card, so that the rotation speed of the heat dissipation fan can be maintained unchanged to meet the greater heat dissipation requirement or the fluctuation of the heat dissipation requirement that may occur at any time in the PCIE card, which is helpful for reducing the adjustment times of the heat dissipation fan.
In one embodiment, when the target fan speed Sr > S, the fan speed is adjusted to the target fan speed Sr; when the target fan rotation speed Sr is less than or equal to the rotation speed S, the cooling fan can meet the cooling requirement of the PCIE card, so that the rotation speed of the cooling fan can be kept unchanged, and the number of times of adjusting the cooling fan is reduced.
In one embodiment, the fan speed may be adjusted to the target fan speed Sr as long as the target fan speed Sr is not consistent with the rotation speed S; the "inconsistency" may be understood as a difference in value or a difference greater than a predetermined difference.
FIG. 8 is a schematic block diagram of an apparatus provided in an exemplary embodiment. Referring to fig. 8, at the hardware level, the apparatus includes a processor 802, an internal bus 804, a network interface 806, a memory 808, and a non-volatile memory 810, but may also include hardware required for other services. The processor 802 reads a corresponding computer program from the non-volatile memory 810 into the memory 808 and runs the computer program, thereby forming a control device of the fan parameter on a logic level. Of course, besides software implementation, the one or more embodiments in this specification do not exclude other implementations, such as logic devices or combinations of software and hardware, and so on, that is, the execution subject of the following processing flow is not limited to each logic unit, and may also be hardware or logic devices.
Referring to fig. 9, in a software implementation, the control device for fan parameters may include:
a power consumption determination unit 91 that determines power consumption information of components in the device;
a temperature determining unit 92 for determining incoming flow temperature information of the component;
a parameter determining unit 93, configured to determine, according to an established mapping relationship between power consumption, incoming flow temperature, and fan parameter, a target fan parameter that matches the power consumption information and the incoming flow temperature information;
and a fan control unit 94 for performing parameter control on the heat dissipation fan in the device according to the target fan parameter.
Optionally, the power consumption determining unit 91 is specifically configured to:
determining the power consumption information according to power supply information of the component.
Optionally, the temperature determining unit 92 is specifically configured to:
and acquiring the measured temperature output by the temperature sensor at the part as the incoming flow temperature information of the part.
Optionally, the temperature sensor is located on the component; alternatively, the temperature sensor is located in the device at a position close to the component.
Optionally, the temperature determining unit 92 is specifically configured to:
when the component is positioned at the air outlet of the equipment and the air inlet of the equipment is provided with a temperature sensor, calculating the incoming flow temperature information of the component according to the measured temperature output by the temperature sensor and the temperature rise difference value inside the equipment; wherein the temperature rise difference value is related to the air volume inside the equipment and the remaining total power consumption of other parts except the parts in the equipment.
Optionally, the temperature rise difference △ t is 1.76W/Q, where W is the remaining total power consumption and Q is the air volume.
Optionally, the temperature determining unit 92 is specifically configured to:
when the component is positioned at an air inlet of the equipment and a temperature sensor is arranged at an air outlet of the equipment, calculating the incoming flow temperature information of the component according to the measured temperature output by the temperature sensor and the temperature drop difference value inside the equipment; wherein the temperature drop difference value is related to the air volume inside the equipment and the total power consumption of the equipment.
Optionally, the fan control unit 94 is specifically configured to:
when the heat dissipation intensity represented by the target fan parameter is greater than the heat dissipation intensity represented by the operating parameter of the heat dissipation fan, adjusting the heat dissipation fan to the target fan parameter;
when the heat dissipation intensity represented by the target fan parameter is not greater than the heat dissipation intensity represented by the operating parameter of the heat dissipation fan, maintaining the heat dissipation fan at the operating parameter; or when the intensity difference between the heat dissipation intensity represented by the target fan parameter and the heat dissipation intensity represented by the operating parameter is not greater than a preset difference, maintaining the heat dissipation fan at the operating parameter, and when the intensity difference is greater than the preset difference, adjusting the heat dissipation fan to the target fan parameter.
The systems, devices, modules or units illustrated in the above embodiments may be implemented by a computer chip or an entity, or by a product with certain functions. A typical implementation device is a computer, which may take the form of a personal computer, laptop computer, cellular telephone, camera phone, smart phone, personal digital assistant, media player, navigation device, email messaging device, game console, tablet computer, wearable device, or a combination of any of these devices.
In a typical configuration, a computer includes one or more processors (CPUs), input/output interfaces, network interfaces, and memory.
The memory may include forms of volatile memory in a computer readable medium, Random Access Memory (RAM) and/or non-volatile memory, such as Read Only Memory (ROM) or flash memory (flash RAM). Memory is an example of a computer-readable medium.
Computer-readable media, including both non-transitory and non-transitory, removable and non-removable media, may implement information storage by any method or technology. The information may be computer readable instructions, data structures, modules of a program, or other data. Examples of computer storage media include, but are not limited to, phase change memory (PRAM), Static Random Access Memory (SRAM), Dynamic Random Access Memory (DRAM), other types of Random Access Memory (RAM), Read Only Memory (ROM), Electrically Erasable Programmable Read Only Memory (EEPROM), flash memory or other memory technology, compact disc read only memory (CD-ROM), Digital Versatile Discs (DVD) or other optical storage, magnetic cassettes, magnetic disk storage, quantum memory, graphene-based storage media or other magnetic storage devices, or any other non-transmission medium that can be used to store information that can be accessed by a computing device. As defined herein, a computer readable medium does not include a transitory computer readable medium such as a modulated data signal and a carrier wave.
It should also be noted that the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
The foregoing description has been directed to specific embodiments of this disclosure. Other embodiments are within the scope of the following claims. In some cases, the actions or steps recited in the claims may be performed in a different order than in the embodiments and still achieve desirable results. In addition, the processes depicted in the accompanying figures do not necessarily require the particular order shown, or sequential order, to achieve desirable results. In some embodiments, multitasking and parallel processing may also be possible or may be advantageous.
The terminology used in the description of the one or more embodiments is for the purpose of describing the particular embodiments only and is not intended to be limiting of the description of the one or more embodiments. As used in one or more embodiments of the present specification and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should also be understood that the term "and/or" as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items.
It should be understood that although the terms first, second, third, etc. may be used in one or more embodiments of the present description to describe various information, such information should not be limited to these terms. These terms are only used to distinguish one type of information from another. For example, first information may also be referred to as second information, and similarly, second information may also be referred to as first information, without departing from the scope of one or more embodiments herein. The word "if" as used herein may be interpreted as "at … …" or "when … …" or "in response to a determination", depending on the context.
The above description is only for the purpose of illustrating the preferred embodiments of the one or more embodiments of the present disclosure, and is not intended to limit the scope of the one or more embodiments of the present disclosure, and any modifications, equivalent substitutions, improvements, etc. made within the spirit and principle of the one or more embodiments of the present disclosure should be included in the scope of the one or more embodiments of the present disclosure.
Claims (16)
1. A method for controlling fan parameters, comprising:
determining power consumption information for components in a device;
determining incoming flow temperature information for the component;
determining target fan parameters matched with the power consumption information and the incoming flow temperature information according to the established mapping relation among the power consumption, the incoming flow temperature and the fan parameters;
and carrying out parameter control on the cooling fan in the equipment according to the target fan parameter.
2. The method of claim 1, wherein determining power consumption information for components in a device comprises:
determining the power consumption information according to power supply information of the component.
3. The method of claim 1, wherein the determining incoming flow temperature information for the component comprises:
and acquiring the measured temperature output by the temperature sensor at the part as the incoming flow temperature information of the part.
4. The method of claim 3, wherein the temperature sensor is located on the component; alternatively, the temperature sensor is located in the device at a position close to the component.
5. The method of claim 1, wherein the determining incoming flow temperature information for the component comprises:
when the component is positioned at the air outlet of the equipment and the air inlet of the equipment is provided with a temperature sensor, calculating the incoming flow temperature information of the component according to the measured temperature output by the temperature sensor and the temperature rise difference value inside the equipment; wherein the temperature rise difference value is related to the air volume inside the equipment and the remaining total power consumption of other parts except the parts in the equipment.
6. The method of claim 5, wherein said temperature rise difference △ t is 1.76W/Q, where W is said total power consumption remaining and Q is said air volume.
7. The method of claim 1, wherein the determining incoming flow temperature information for the component comprises:
when the component is positioned at an air inlet of the equipment and a temperature sensor is arranged at an air outlet of the equipment, calculating the incoming flow temperature information of the component according to the measured temperature output by the temperature sensor and the temperature drop difference value inside the equipment; wherein the temperature drop difference value is related to the air volume inside the equipment and the total power consumption of the equipment.
8. The method of claim 1, wherein the performing parameter control on a heat dissipation fan in the device according to the target fan parameter comprises:
when the heat dissipation intensity represented by the target fan parameter is greater than the heat dissipation intensity represented by the operating parameter of the heat dissipation fan, adjusting the heat dissipation fan to the target fan parameter;
when the heat dissipation intensity represented by the target fan parameter is not greater than the heat dissipation intensity represented by the operating parameter of the heat dissipation fan, maintaining the heat dissipation fan at the operating parameter; or when the intensity difference between the heat dissipation intensity represented by the target fan parameter and the heat dissipation intensity represented by the operating parameter is not greater than a preset difference, maintaining the heat dissipation fan at the operating parameter, and when the intensity difference is greater than the preset difference, adjusting the heat dissipation fan to the target fan parameter.
9. A fan parameter control apparatus, comprising:
a power consumption determination unit that determines power consumption information of a component in a device;
a temperature determination unit that determines incoming flow temperature information of the component;
the parameter determining unit is used for determining target fan parameters matched with the power consumption information and the incoming flow temperature information according to the established mapping relation among the power consumption, the incoming flow temperature and the fan parameters;
and the fan control unit is used for carrying out parameter control on the heat dissipation fan in the equipment according to the target fan parameter.
10. The apparatus of claim 9, wherein the power consumption determining unit is specifically configured to:
determining the power consumption information according to power supply information of the component.
11. The apparatus according to claim 9, wherein the temperature determination unit is specifically configured to:
and acquiring the measured temperature output by the temperature sensor at the part as the incoming flow temperature information of the part.
12. The apparatus of claim 11, wherein the temperature sensor is located on the component; alternatively, the temperature sensor is located in the device at a position close to the component.
13. The apparatus according to claim 9, wherein the temperature determination unit is specifically configured to:
when the component is positioned at the air outlet of the equipment and the air inlet of the equipment is provided with a temperature sensor, calculating the incoming flow temperature information of the component according to the measured temperature output by the temperature sensor and the temperature rise difference value inside the equipment; wherein the temperature rise difference value is related to the air volume inside the equipment and the remaining total power consumption of other parts except the parts in the equipment.
14. The apparatus of claim 13, wherein said temperature rise difference △ t is 1.76W/Q, where W is said total power consumption remaining and Q is said air volume.
15. The apparatus according to claim 9, wherein the temperature determination unit is specifically configured to:
when the component is positioned at an air inlet of the equipment and a temperature sensor is arranged at an air outlet of the equipment, calculating the incoming flow temperature information of the component according to the measured temperature output by the temperature sensor and the temperature drop difference value inside the equipment; wherein the temperature drop difference value is related to the air volume inside the equipment and the total power consumption of the equipment.
16. The apparatus of claim 9, wherein the fan control unit is specifically configured to:
when the heat dissipation intensity represented by the target fan parameter is greater than the heat dissipation intensity represented by the operating parameter of the heat dissipation fan, adjusting the heat dissipation fan to the target fan parameter;
when the heat dissipation intensity represented by the target fan parameter is not greater than the heat dissipation intensity represented by the operating parameter of the heat dissipation fan, maintaining the heat dissipation fan at the operating parameter; or when the intensity difference between the heat dissipation intensity represented by the target fan parameter and the heat dissipation intensity represented by the operating parameter is not greater than a preset difference, maintaining the heat dissipation fan at the operating parameter, and when the intensity difference is greater than the preset difference, adjusting the heat dissipation fan to the target fan parameter.
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113594574A (en) * | 2021-07-22 | 2021-11-02 | 上汽通用五菱汽车股份有限公司 | Temperature control method for battery pack, vehicle, and readable storage medium |
| CN113727580A (en) * | 2021-07-28 | 2021-11-30 | 苏州浪潮智能科技有限公司 | Method, device and equipment for replacing heat dissipation module and storage medium |
| CN114153299A (en) * | 2021-12-08 | 2022-03-08 | 紫光计算机科技有限公司 | Movable fan module and control method thereof, host and storage medium |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101662922A (en) * | 2009-09-08 | 2010-03-03 | 华为技术有限公司 | Multiple-slot chassis and radiating method thereof |
| CN101922464A (en) * | 2010-06-23 | 2010-12-22 | 北京星网锐捷网络技术有限公司 | Method, device and network equipment for adjusting fan speed |
| CN203362568U (en) * | 2013-06-27 | 2013-12-25 | 龙芯中科技术有限公司 | CPU cooling device |
| CN104373366A (en) * | 2013-08-14 | 2015-02-25 | 纬创资通股份有限公司 | fan control system and method for controlling rotating speed of fan |
| CN106502349A (en) * | 2016-10-31 | 2017-03-15 | 郑州云海信息技术有限公司 | A kind of air intake vent temperature correction based on GPU power consumptions and ring temperature |
| US20170276140A1 (en) * | 2016-03-24 | 2017-09-28 | Nec Platforms, Ltd. | Fan control apparatus and fan control method for computer equipment |
| CN107882763A (en) * | 2017-11-09 | 2018-04-06 | 英业达科技有限公司 | Revolution speed control device and its method |
-
2018
- 2018-08-31 CN CN201811011037.9A patent/CN110873069B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101662922A (en) * | 2009-09-08 | 2010-03-03 | 华为技术有限公司 | Multiple-slot chassis and radiating method thereof |
| CN101922464A (en) * | 2010-06-23 | 2010-12-22 | 北京星网锐捷网络技术有限公司 | Method, device and network equipment for adjusting fan speed |
| CN203362568U (en) * | 2013-06-27 | 2013-12-25 | 龙芯中科技术有限公司 | CPU cooling device |
| CN104373366A (en) * | 2013-08-14 | 2015-02-25 | 纬创资通股份有限公司 | fan control system and method for controlling rotating speed of fan |
| US20170276140A1 (en) * | 2016-03-24 | 2017-09-28 | Nec Platforms, Ltd. | Fan control apparatus and fan control method for computer equipment |
| CN106502349A (en) * | 2016-10-31 | 2017-03-15 | 郑州云海信息技术有限公司 | A kind of air intake vent temperature correction based on GPU power consumptions and ring temperature |
| CN107882763A (en) * | 2017-11-09 | 2018-04-06 | 英业达科技有限公司 | Revolution speed control device and its method |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113594574A (en) * | 2021-07-22 | 2021-11-02 | 上汽通用五菱汽车股份有限公司 | Temperature control method for battery pack, vehicle, and readable storage medium |
| CN113727580A (en) * | 2021-07-28 | 2021-11-30 | 苏州浪潮智能科技有限公司 | Method, device and equipment for replacing heat dissipation module and storage medium |
| CN113727580B (en) * | 2021-07-28 | 2023-01-24 | 苏州浪潮智能科技有限公司 | Heat dissipation module replacement method, device, equipment and storage medium |
| CN114153299A (en) * | 2021-12-08 | 2022-03-08 | 紫光计算机科技有限公司 | Movable fan module and control method thereof, host and storage medium |
| CN114153299B (en) * | 2021-12-08 | 2023-12-22 | 紫光计算机科技有限公司 | Movable fan module, control method thereof, host and storage medium |
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