KR20220094021A - Transfer unit and substrate treating apparatus including the same - Google Patents

Abstract

The present invention relates to a transfer unit. The transfer unit includes: a support body; a hand on which a substrate is placed; a support rod supporting the hand; and a guide rail provided on the support body and guiding movement of the support rod supporting the hand. The support body includes: a driving part for applying a driving force to the support rod to move the hand; a body in which the driving part is disposed; and a plurality of cables connected to the driving part to transmit the driving force. The plurality of cables are positioned on an external path of the body.

Description

A transfer unit and a substrate processing apparatus having the same

The present invention relates to a transfer unit for transferring a substrate, and a substrate processing apparatus including the same.

In order to manufacture a semiconductor device, a desired pattern is formed on the substrate through various processes such as photography, etching, ashing, ion implantation, and thin film deposition. These processes again include a plurality of process processes, and each process process is performed in a different process processing apparatus.

Therefore, in order to perform different types of processes, substrates must be transferred to different devices, and such substrate transfer is performed by a transfer robot. The process equipment is very diverse and is arranged to wrap around the transport robot. Accordingly, the transfer robot can transfer the substrate to each device. In general, a transfer robot is provided with a plurality of hands for supporting the substrate, and can transfer a plurality of substrates.

FIG. 1 is a view showing a general transport robot, and FIG. 2 is a cross-sectional view schematically showing a cross section of the driving unit of FIG. 1 . Referring to FIG. 1 , the transfer robot 1 includes a hand 2 for supporting a substrate, a support rod 3 for supporting the hand 2 , and a support 4 on which the support rod 3 is installed. do.

1 and 2 , a driving unit 5 providing power to each component of the robot 1 is located inside the support 4 , and a plurality of components for moving each component of the robot 1 are located inside the support body 4 . of the cable (5) is located. At this time, the plurality of cables 5 are positioned to pass through the inner center of the support 4 , and positioned to avoid the driving unit.

However, as each component of the robot 1 moves, there is a problem in that the cables 5 are disconnected due to interference between a plurality of cables 5 or between the cables 5 and the drive unit. In addition, in order to prevent disconnection of the cable 5, a separate mechanism such as an inner cover is required inside the support body 4, so that the structure is complicated, the space inside the support body 4 becomes narrow, and the support body 4 becomes large. there is a problem. In addition, in the case of a position where the mounting of the inner cover is impossible, there is a problem that the cable 5 is disconnected depending on the operator.

An object of the present invention is to provide a substrate processing apparatus capable of improving substrate processing efficiency.

An object of the present invention is to provide a transfer unit capable of preventing cable disconnection due to interference with a driving unit by disposing a cable through an external path of a robot, and a substrate processing apparatus including the same.

The object of the present invention is not limited thereto, and other objects not mentioned will be clearly understood by those skilled in the art from the following description.

The present invention provides a unit for transporting a substrate.

The conveying unit includes a support; a hand on which the substrate is placed; a support rod for supporting the hand; a guide rail provided on the support and guiding movement of the support rod supporting the hand, wherein the support includes: a driving unit for applying a driving force to the support rod to move the hand; a body in which the driving unit is disposed; and a plurality of cables connected to the driving unit to transmit the driving force, wherein the plurality of cables are located on an external path of the body.

The support may include a bracket provided on the side of the body, and the plurality of cables may be disposed to pass inside the bracket.

The support may include a first protrusion and a second protrusion provided on a side surface of the base body, and the bracket may be positioned between the first protrusion and the second protrusion.

The first protrusion, the second protrusion, and the bracket may communicate with each other to form an installation path of the plurality of cables.

Among the plurality of cables, only a single stranded or a minimum stranded cable may be installed inside the body to be connected to the driving unit.

The present invention provides an apparatus for processing a substrate.

The substrate processing apparatus includes a first unit and a second unit; a transfer unit for transferring a substrate between the first unit and the second unit, the transfer unit comprising: a support; a hand on which the substrate is placed; a support rod for supporting the hand; a guide rail provided on the support and guiding movement of the support rod supporting the hand, wherein the support includes: a driving unit for applying a driving force to the support rod to move the hand; a body in which the driving unit is disposed; and a plurality of cables connected to the driving unit to transmit the driving force, wherein the support includes a first installation path passing through the interior of the body and a second installation path not passing through the interior of the body, of the cable is provided to be located on the second installation path.

The support may include a bracket disposed on the side of the body, and the plurality of cables may be installed inside the bracket.

The support may include a first protrusion and a second protrusion provided on a side surface of the body, and the bracket may be positioned between the first protrusion and the second protrusion.

The first protrusion, the second protrusion, and the bracket may communicate with each other to form an installation path of the plurality of cables.

Among the plurality of cables, only a single stranded or a minimum stranded cable may be installed inside the body to be connected to the driving unit.

According to the present invention, it is possible to provide a substrate processing apparatus capable of improving substrate processing efficiency.

In addition, the present invention can prevent cable disconnection due to interference with the driving unit by disposing the cable through the external path of the robot.

Effects of the present invention are not limited to the above-described effects, and effects not mentioned will be clearly understood by those of ordinary skill in the art to which the present invention belongs from the present specification and accompanying drawings.

1 is a schematic diagram showing a general transport robot.
FIG. 2 is a cross-sectional view schematically illustrating a cross-section of the support of FIG. 1 .
3 is a perspective view schematically illustrating a substrate processing apparatus according to an embodiment of the present invention.
FIG. 4 is a cross-sectional view of the substrate processing apparatus showing the application block or the developing block of FIG. 3 .
5 is a plan view of the substrate processing apparatus of FIG. 3 .
6 is a perspective view illustrating the transport robot of FIG. 4 .
7 is a cross-sectional view schematically illustrating an internal cross-section of the support of FIG. 6 .
8 is a plan view schematically illustrating an example of the heat treatment chamber of FIG. 5 .
9 is a front view of the heat treatment chamber of FIG. 8 .
10 is a diagram schematically illustrating an example of the liquid processing chamber of FIG. 5 .

Hereinafter, with reference to the accompanying drawings, embodiments of the present invention will be described in detail so that those of ordinary skill in the art to which the present invention pertains can easily implement them. However, the present invention may be implemented in several different forms and is not limited to the embodiments described herein. In addition, in describing a preferred embodiment of the present invention in detail, if it is determined that a detailed description of a related well-known function or configuration may unnecessarily obscure the gist of the present invention, the detailed description thereof will be omitted. In addition, the same reference numerals are used throughout the drawings for parts having similar functions and functions.

"Including" a certain component means that other components may be further included, rather than excluding other components, unless otherwise stated. Specifically, terms such as “comprise” or “have” are intended to designate that a feature, number, step, operation, component, part, or combination thereof described in the specification is present, and includes one or more other features or It should be understood that the existence or addition of numbers, steps, operations, components, parts, or combinations thereof does not preclude the possibility of addition.

The singular expression includes the plural expression unless the context clearly dictates otherwise. In addition, shapes and sizes of elements in the drawings may be exaggerated for clearer description.

The term “and/or” includes any one and all combinations of one or more of those listed items. In addition, in the present specification, "connected" means not only when member A and member B are directly connected, but also when member A and member B are indirectly connected with member C interposed between member A and member B. do.

Embodiments of the present invention may be modified in various forms, and the scope of the present invention should not be construed as being limited to the following embodiments. This embodiment is provided to more completely explain the present invention to those of ordinary skill in the art. Accordingly, the shapes of elements in the drawings are exaggerated to emphasize a clearer description.

A controller (not shown) may control overall operations of the substrate processing apparatus. The controller (not shown) may include a central processing unit (CPU), read only memory (ROM), and random access memory (RAM). The CPU executes desired processing, such as liquid processing and drying processing, which will be described later, according to various recipes stored in these storage areas. In the recipe, process time, process pressure, press temperature, various gas flow rates, etc., which are control information of the device for process conditions, are input. In addition, recipes indicating these programs and processing conditions may be stored in a hard disk or semiconductor memory. In addition, the recipe may be set at a predetermined position in the storage area while being accommodated in a portable computer-readable storage medium such as a CD-ROM or DVD.

The apparatus of this embodiment can be used to perform photo processing on a circular substrate. In particular, the apparatus of this embodiment may be connected to an exposure apparatus and used to perform a coating process and a developing process on a substrate. However, the technical spirit of the present invention is not limited thereto, and may be used in various types of processes for supplying a treatment solution to the substrate while rotating the substrate. Hereinafter, a case in which a wafer is used as a substrate will be described as an example.

Hereinafter, an embodiment of the present invention will be described with reference to FIGS. 3 to 10 .

3 is a perspective view schematically showing a substrate processing apparatus according to an embodiment of the present invention, FIG. 4 is a cross-sectional view of the substrate processing apparatus showing the application block or the developing block of FIG. 3, and FIG. 5 is the substrate processing apparatus of FIG. It is a flat view.

3 to 5 , the substrate processing apparatus 100 includes an index module 20 , a processing module 30 , and an interface module 40 . According to an embodiment, the index module 20 , the processing module 30 , and the interface module 40 are sequentially arranged in a line. Hereinafter, a direction in which the index module 20 , the processing module 30 , and the interface module 40 are arranged is referred to as a first direction 12 , and a direction perpendicular to the first direction 12 when viewed from the top is referred to as a first direction 12 . A second direction 14 is referred to, and a direction perpendicular to both the first direction 12 and the second direction 14 is referred to as a third direction 16 .

The index module 20 transfers the substrate W from the container 10 in which the substrate W is accommodated to the processing module 30 , and accommodates the processed substrate W in the container 10 . The longitudinal direction of the index module 20 is provided in the second direction 14 . The index module 20 has a load port 22 and an index frame 24 . With reference to the index frame 24 , the load port 22 is located on the opposite side of the processing module 30 . The container 10 in which the substrates W are accommodated is placed on the load port 22 . A plurality of load ports 22 may be provided, and the plurality of load ports 22 may be disposed along the second direction 14 .

As the container 10, a closed container 10 such as a Front Open Unified Pod (FOUP) may be used. The container 10 may be placed in the load port 22 by an operator or a transfer means (not shown) such as an overhead transfer, an overhead conveyor, or an automatic guided vehicle. can

An index robot 2200 is provided inside the index frame 24 . A guide rail 2300 having a longitudinal direction in the second direction 14 is provided in the index frame 24 , and the index robot 2200 may be provided to be movable on the guide rail 2300 . The index robot 2200 includes a hand 2220 on which the substrate W is placed, and the hand 2220 moves forward and backward, rotates about the third direction 16 , and moves in the third direction 16 . It may be provided to be movable along with it.

The processing module 30 performs a coating process and a developing process on the substrate W. The processing module 30 has an application block 30a and a developing block 30b. The coating block 30a performs a coating process on the substrate W, and the developing block 30b performs a development process on the substrate W. A plurality of application blocks 30a are provided, and they are provided to be stacked on each other. A plurality of developing blocks 30b are provided, and the developing blocks 30b are provided to be stacked on each other. According to the embodiment of Fig. 3, two application blocks 30a are provided, and two development blocks 30b are provided. The application blocks 30a may be disposed below the developing blocks 30b. According to an example, the two application blocks 30a may perform the same process as each other, and may be provided in the same structure. In addition, the two developing blocks 30b may perform the same process as each other, and may be provided in the same structure.

The application block 30a includes a heat treatment chamber 3200 , a transfer chamber 3400 , a liquid processing chamber 3600 , and a buffer chamber 3800 . The heat treatment chamber 3200 performs a heat treatment process on the substrate W. The heat treatment process may include a cooling process and a heating process. The liquid processing chamber 3600 supplies a liquid on the substrate W to form a liquid film. The liquid film may be a photoresist film or an antireflection film. The transfer chamber 3400 transfers the substrate W between the heat treatment chamber 3200 and the liquid treatment chamber 3600 in the application block 30a.

The transfer chamber 3400 is provided so that its longitudinal direction is parallel to the first direction 12 . A transfer unit is provided in the transfer chamber 3400 . The transfer unit includes a transfer robot 3422 and a transfer rail 3300 . The transfer robot 3422 transfers a substrate between the heat treatment chamber 3200 , the liquid processing chamber 3600 , and the buffer chamber 3800 .

FIG. 6 is a perspective view showing the transport robot of FIG. 4 , and FIG. 7 is a cross-sectional view schematically illustrating an internal cross-section of the support body of FIG. 6 .

The transfer robot 3422 includes a hand 3420 , a support rod 3423 , a guide rail 1100 , a support 1000 , a rotation shaft 3425 , and a base 3426 . The hand 3420 supports the substrate W. The hand 3420 is provided to enable horizontal linear movement including forward and backward movement, rotational movement rotating about the third direction 16 , and lifting movement toward the third direction.

The hand 3420 directly supports the substrate W. A plurality of hands 3420 are provided and are positioned to be stacked on each other. The hands 3420 are positioned on top of the support 1000 . For example, the hand may be provided as a first hand 3420a positioned at an upper portion and a second hand 3420b positioned at a lower portion. The first hand 3420a and the second hand 3420b have the same shape. However, the first hand 3420a and the second hand 3420b may perform different functions. For example, the first hand 3420a is used for unloading the substrate W from a chamber or a unit processing the substrate W, and the second hand 3420b is a substrate to the chamber or a unit processing the substrate W. It can be used for the purpose of bringing in (W). In the embodiment of FIG. 5 , the transfer robot 3422 is illustrated and described as having two hands 3420 , but the number of hands 3420 may be increased or decreased according to process efficiency of the substrate processing system.

The hand 3420 has a support 3421a and a support protrusion 3421b. The support 3421a is provided to have an annular ring shape in which a part of the circumference is bent. The support 3421a has a larger diameter than the substrate W, and the hand 3420 supports the substrate W so that the support 3421a surrounds the periphery of the substrate W. The support protrusion 3421b extends inwardly from the support 3421a. The support protrusion 3421b is provided in plurality, and is positioned to be spaced apart from each other in the circumferential direction of the supporter 3421a. The support protrusion 3421b functions as a seating surface on which the substrate W is placed. Four support protrusions 3421b are provided and support the side of the substrate W. As shown in FIG.

The support rod 3423 connects the support 3421a and the guide rail 1100 to each other. The support rod 3423 may be linearly moved in the front-rear direction by the guide rail 1100 . The support rod 3423 includes a first support rod 3423a supporting the first hand 3420a and a second support rod 3423b supporting the second hand 3420b. For this reason, the hand 3420 is stably supported while the hand 3420 is being driven, and vibration of the hand 3420 can be minimized. The guide rail 1100 guides the direction in which the support rod 3423 is moved. For example, the support rods 3423 may be moved in a horizontal straight direction.

The support rods 3423 installed on the guide rail 1100 are movable in the first direction along the longitudinal direction of each guide rail 1100 . The guide rail 1000 is installed on one side and the other side of the support body 1000 , respectively. Here, one side and the other side may be opposite sides. When viewed from the side, the guide rails 1100 may be positioned to overlap each other. The first support rod 3423a is provided on the guide rail 1100 installed on one side of the support body 1000 , and the second support rod 3423b is provided on the other side of the support body 1000 . The guide rail 1100 is installed on the other side of the support body 1000 . is provided on

The support 1000 is supported and rotated by a rotation shaft 3425 . The rotating shaft 3425 is installed on the base 3426 and is provided to be rotatable about the central axis on the base 3426 . The support 1000 and the hand may be rotated together by the rotation of the rotation shaft 3425 . The base 3426 is provided to enable elevating and lowering. The rotation shaft 3425 and the hand 3420 may be raised and lowered together by the elevation of the base 3426 . Also, the base 3426 is movable from a position adjacent to the front end buffer 3802 to a position adjacent to the rear end buffer 3804 along the transport rail 3300 . The transport rail 3300 is provided to have a longitudinal direction toward the first direction. The base 3426 installed on the transport rail 3300 may be moved in the first direction by a driving member (not shown).

6 and 7 , the support 1000 includes a body 1200 . A driving unit 1220 for applying a driving force to each configuration of the transport robot 3422 is disposed inside the body 1200 . For example, the driving unit 1220 may be disposed in the center of the inside of the body 1200 . The driving unit 1220 provides a driving force for the linear movement and rotational movement of the hand 3420 through the cable 1240 . The support 1000 includes a first protrusion 1300 protruding from the side surface of the body 1200, and a second protrusion 1400 protruding from the side surface of the body 1200 and spaced apart from the first protrusion 1300.

The first protrusion 1300 is provided in plurality. For example, the first protrusion 1300 is provided on both sides of the body 1200 facing each other. The second protrusion 1400 is provided in plurality. For example, the second protrusion 1400 is provided on both sides of the body 1200 facing each other. The first protrusion 1300 and the second protrusion 1400 are provided on the same side of the body 1200 . The first protrusion 1300 and the first protrusion 1300 are provided on the side where the guide rail 1100 is provided.

The support 1000 includes a bracket 1500 provided on the side. The bracket 1500 is disposed between the first protrusion 1300 and the second protrusion 1400 . The bracket 1500 is provided between the first and second protrusions 1300 and 1400 to be spaced apart from the side surface of the support 1000 . The bracket 1200 is provided with a hollow inside. Through this, the cable 1240 may be disposed inside the bracket 15000 . The first protrusion 1300 , the bracket 1500 , and the second protrusion 1400 function as a path through which the cable 1240 is disposed. Through this, the installation path of the plurality of cables 1240 installed in the transport robot 3422 can be installed by bypassing the inside of the body 1200 . By installing a plurality of cables 1240 to the outside of the body 1200, not inside the body 1200, interference between the cables 1240 and the driving unit 1220 is minimized, thereby preventing disconnection of the cables 1240 can do. A plurality of cables 1240 are provided inside the bracket 1500 . A single strand or a minimum strand of cables among the plurality of cables 1240 may be disposed inside the body 1200 . Through this, interference between the cable 1240 and the driving unit 1220 inside the body 1200 can be minimized.

The plurality of cables 1240 may be coupled to different driving units. For example, some of the plurality of cables 1240 may be utilized as a camera and a pressure cage cable, and another part may be utilized as a WCS cable.

A plurality of heat treatment chambers 3202 are provided. The heat treatment chambers 3202 are arranged in a row along the first direction 12 . The heat treatment chambers 3202 are located at one side of the transfer chamber 3400 .

8 is a plan view schematically illustrating an example of the heat treatment chamber of FIG. 5 , and FIG. 9 is a front view of the heat treatment chamber of FIG. 8 .

8 and 9 , the heat treatment chamber 3202 includes a housing 3210 , a cooling unit 3220 , a heating unit 3230 , and a conveying plate 3240 .

The housing 3210 is provided in the shape of a substantially rectangular parallelepiped. An inlet (not shown) through which the substrate W enters and exits is formed on the sidewall of the housing 3210 . The inlet may remain open. Optionally, a door (not shown) may be provided to open and close the inlet. A cooling unit 3220 , a heating unit 3230 , and a conveying plate 3240 are provided in the housing 3210 . The cooling unit 3220 and the heating unit 3230 are provided side by side along the second direction 14 . According to an example, the cooling unit 3220 may be located closer to the transfer chamber 3400 than the heating unit 3230 .

The cooling unit 3220 has a cooling plate 3222 . The cooling plate 3222 may have a generally circular shape when viewed from the top. A cooling member 3224 is provided on the cooling plate 3222 . According to an example, the cooling member 3224 is formed inside the cooling plate 3222 and may be provided as a flow path through which the cooling fluid flows.

The heating unit 3230 has a heating plate 3232 , a cover 3234 , and a heater 3233 . The heating plate 3232 has a generally circular shape when viewed from the top. The heating plate 3232 has a larger diameter than the substrate W. A heater 3233 is installed on the heating plate 3232 . The heater 3233 may be provided as a heating resistor to which current is applied. The heating plate 3232 is provided with lift pins 3238 drivable in the vertical direction along the third direction 16 . The lift pin 3238 receives the substrate W from the transfer means outside the heating unit 3230 and puts it down on the heating plate 3232 or lifts the substrate W from the heating plate 3232 to the outside of the heating unit 3230 hand over by means of transport. According to an example, three lift pins 3238 may be provided. The cover 3234 has a space with an open lower portion therein. The cover 3234 is positioned on the heating plate 3232 and is moved in the vertical direction by the driver 3236 . When the cover 3234 is in contact with the heating plate 3232 , the space surrounded by the cover 3234 and the heating plate 3232 is provided as a heating space for heating the substrate W .

The transfer plate 3240 is provided in a substantially disk shape, and has a diameter corresponding to that of the substrate W. As shown in FIG. A notch 3244 is formed at the edge of the conveying plate 3240 . The notch 3244 may have a shape corresponding to the support protrusion 3421b formed on the hand 3420 of the transfer robot 3422 described above. In addition, the notch 3244 is provided in a number corresponding to the support protrusion 3421b formed on the hand 3420 and is formed at a position corresponding to the support protrusion 3421b. When the upper and lower positions of the hand 3420 and the carrier plate 3240 are changed in a position where the hand 3420 and the carrier plate 3240 are vertically aligned, the substrate W between the hand 3420 and the carrier plate 3240 is transfer takes place The transport plate 3240 is mounted on the guide rail 3249 , and may be moved between the first region 3212 and the second region 3214 along the guide rail 3249 by a driver 3246 . A plurality of slit-shaped guide grooves 3242 are provided in the carrying plate 3240 . The guide groove 3242 extends from the end of the carrying plate 3240 to the inside of the carrying plate 3240 . The length direction of the guide grooves 3242 is provided along the second direction 14 , and the guide grooves 3242 are spaced apart from each other along the first direction 12 . The guide groove 3242 prevents the transfer plate 3240 and the lift pins 1340 from interfering with each other when the substrate W is transferred between the transfer plate 3240 and the heating unit 3230 .

The substrate W is heated in a state where the substrate W is placed directly on the support plate 1320 , and the substrate W is cooled by the transfer plate 3240 on which the substrate W is placed and the cooling plate 3222 . made in contact with The transfer plate 3240 is made of a material having a high heat transfer rate so that heat transfer between the cooling plate 3222 and the substrate W is well achieved. According to one example, the transport plate 3240 may be provided with a metal material.

The heating unit 3230 provided in some of the heat treatment chambers 3200 may supply a gas while heating the substrate W to improve the adhesion rate of the photoresist to the substrate W. According to an example, the gas may be hexamethyldisilane gas.

A plurality of liquid processing chambers 3600 are provided. Some of the liquid processing chambers 3600 may be provided to be stacked on each other. The liquid processing chambers 3600 are disposed at one side of the transfer chamber 3402 . The liquid processing chambers 3600 are arranged side by side in the first direction 12 . Some of the liquid processing chambers 3600 are provided adjacent to the index module 20 . Hereinafter, these liquid treatment chambers will be referred to as a front liquid treating chamber 3602 (front liquid treating chamber). Other portions of the liquid processing chambers 3600 are provided adjacent to the interface module 40 . Hereinafter, these liquid treatment chambers are referred to as rear heat treating chambers 3604 (rear heat treating chambers).

The front stage liquid processing chamber 3602 applies the first liquid on the substrate W, and the rear stage liquid processing chamber 3604 applies the second liquid on the substrate W. The first liquid and the second liquid may be different types of liquid. According to one embodiment, the first liquid is an anti-reflection film, and the second liquid is a photoresist. The photoresist may be applied on the substrate W on which the anti-reflection film is applied. Optionally, the first liquid may be a photoresist, and the second liquid may be an anti-reflection film. In this case, the anti-reflection film may be applied on the photoresist-coated substrate (W). Optionally, the first liquid and the second liquid are the same type of liquid, and they may both be photoresist.

10 is a diagram schematically illustrating an example of the liquid processing chamber of FIG. 5 .

Referring to FIG. 10 , the liquid processing chamber 3600 includes a housing 3610 , a cup 3620 , a substrate support unit 3640 , and a liquid supply unit 1000 . The housing 3610 is provided in the shape of a substantially rectangular parallelepiped. An inlet (not shown) through which the substrate W enters and exits is formed on the sidewall of the housing 3610 . The inlet may be opened and closed by a door (not shown). The cup 3620 , the support unit 3640 , and the liquid supply unit 1000 are provided in the housing 3610 . A fan filter unit 3670 that forms a downdraft in the housing 3260 may be provided on an upper wall of the housing 3610 . The cup 3620 has a processing space with an open top. The substrate support unit 3640 is disposed in the processing space and supports the substrate W. The substrate support unit 3640 is provided so that the substrate W is rotatable during liquid processing. The liquid supply unit 1000 supplies a liquid to the substrate W supported by the substrate support unit 3640 .

The nozzle 1100 supplies a liquid onto the substrate at a process position facing the substrate supported by the substrate support unit. For example, the liquid may be a photosensitive liquid such as a photoresist. The process position may be a position at which the nozzle 1100 can discharge the photoresist to the center of the substrate.

Referring back to FIGS. 4 and 5 , a plurality of buffer chambers 3800 are provided. Some of the buffer chambers 3800 are disposed between the index module 20 and the transfer chamber 3400 . Hereinafter, these buffer chambers will be referred to as a front buffer 3802 (front buffer). The front-end buffers 3802 are provided in plurality, and are positioned to be stacked on each other in the vertical direction. Another portion of the buffer chambers 3802 and 3804 is disposed between the transfer chamber 3400 and the interface module 40 hereinafter. These buffer chambers are referred to as rear buffer 3804 (rear buffer). The rear end buffers 3804 are provided in plurality, and are positioned to be stacked on each other in the vertical direction. Each of the front-end buffers 3802 and the back-end buffers 3804 temporarily stores a plurality of substrates W. As shown in FIG. The substrate W stored in the shear buffer 3802 is loaded or unloaded by the index robot 2200 and the transfer robot 3422 . The substrate W stored in the downstream buffer 3804 is carried in or carried out by the transfer robot 3422 and the first robot 4602 .

The developing block 30b has a heat treatment chamber 3200 , a transfer chamber 3400 , and a liquid treatment chamber 3600 . The heat treatment chamber 3200 and the transfer chamber 3400 of the developing block 30b are provided in a structure and arrangement substantially similar to those of the heat treatment chamber 3200 and the transfer chamber 3400 of the application block 30a, so a description thereof is omitted.

In the developing block 30b, all of the liquid processing chambers 3600 are provided as the developing chamber 3600 for processing the substrate by supplying a developer in the same manner.

The interface module 40 connects the processing module 30 to the external exposure apparatus 50 . The interface module 40 includes an interface frame 4100 , an additional process chamber 4200 , an interface buffer 4400 , and a transfer member 4600 .

A fan filter unit for forming a descending airflow therein may be provided at an upper end of the interface frame 4100 . The additional process chamber 4200 , the interface buffer 4400 , and the transfer member 4600 are disposed inside the interface frame 4100 . The additional process chamber 4200 may perform a predetermined additional process before the substrate W, which has been processed in the application block 30a, is loaded into the exposure apparatus 50 . Optionally, the additional process chamber 4200 may perform a predetermined additional process before the substrate W, which has been processed in the exposure apparatus 50 , is loaded into the developing block 30b. According to one example, the additional process is an edge exposure process of exposing the edge region of the substrate W, a top surface cleaning process of cleaning the upper surface of the substrate W, or a bottom surface cleaning process of cleaning the lower surface of the substrate W can A plurality of additional process chambers 4200 may be provided, and these may be provided to be stacked on each other. All of the additional process chambers 4200 may be provided to perform the same process. Optionally, some of the additional process chambers 4200 may be provided to perform different processes.

The interface buffer 4400 provides a space in which the substrate W transferred between the application block 30a, the additional process chamber 4200, the exposure apparatus 50, and the developing block 30b temporarily stays during the transfer. A plurality of interface buffers 4400 may be provided, and a plurality of interface buffers 4400 may be provided to be stacked on each other.

According to an example, the additional process chamber 4200 may be disposed on one side of the transfer chamber 3400 along the lengthwise extension line, and the interface buffer 4400 may be disposed on the other side thereof.

The transfer member 4600 transfers the substrate W between the application block 30a, the addition process chamber 4200, the exposure apparatus 50, and the developing block 30b. The transfer member 4600 may be provided as one or a plurality of robots. According to an example, the conveying member 4600 includes a first robot 4602 and a second robot 4606 . The first robot 4602 transfers the substrate W between the application block 30a, the additional process chamber 4200, and the interface buffer 4400, and the interface robot 4606 uses the interface buffer 4400 and the exposure apparatus ( 50), and the second robot 4604 may be provided to transfer the substrate W between the interface buffer 4400 and the developing block 30b.

The first robot 4602 and the second robot 4606 each include a hand on which the substrate W is placed, and the hand moves forward and backward, rotates about an axis parallel to the third direction 16, and It may be provided to be movable along three directions (16).

The hands of the index robot 2200 , the first robot 4602 , and the second robot 4606 may all have the same shape as the hand 3420 of the transfer robot 3422 . Optionally, the hand of the robot directly exchanging the substrate W with the transfer plate 3240 of the heat treatment chamber is provided in the same shape as the hand 3420 of the transfer robot 3422, and the hands of the other robot are provided in a different shape. can be

According to one embodiment, the index robot 2200 is provided to directly exchange the substrate W with the heating unit 3230 of the front heat treatment chamber 3200 provided in the application block 30a.

In addition, the transfer robot 3422 provided in the application block 30a and the developing block 30b may be provided to directly transfer the substrate W with the transfer plate 3240 located in the heat treatment chamber 3200 .

The processing block of the above-described substrate processing apparatus 100 has been described as performing a coating processing process and a developing processing process. However, unlike this, the substrate processing apparatus 100 may include only the index module 20 and the processing block 37 without an interface module. In this case, the processing block 37 performs only the coating process, and the film applied on the substrate W may be a spin-on hard mask film (SOH).

The above detailed description is illustrative of the present invention. In addition, the above description shows and describes preferred embodiments of the present invention, and the present invention can be used in various other combinations, modifications, and environments. That is, changes or modifications are possible within the scope of the concept of the invention disclosed herein, the scope equivalent to the written disclosure, and/or within the scope of skill or knowledge in the art. The written embodiment describes the best state for implementing the technical idea of the present invention, and various changes required in specific application fields and uses of the present invention are possible. Accordingly, the detailed description of the present invention is not intended to limit the present invention to the disclosed embodiments. Also, the appended claims should be construed to include other embodiments.

1000: support 1100: guide rail
1200: body 1220: driving unit
1240: cable 1300: first protrusion
1400: second protrusion 1500: bracket

Claims (10)

A unit for transporting a substrate, comprising:
a support;
a hand on which the substrate is placed;
a support rod for supporting the hand;
It is provided on the support and includes a guide rail for guiding the movement of the support rod supporting the hand,
The support is
a driving unit for moving the hand by applying a driving force to the support rod;
a body in which the driving unit is disposed;
and a plurality of cables connected to the driving unit to transmit the driving force,
wherein the plurality of cables are located on an external path of the body. According to claim 1,
The support includes a bracket provided on the side of the body,
The plurality of cables is a conveying unit disposed to pass through the inside of the bracket. 3. The method of claim 2,
The support is
It includes a first protrusion and a second protrusion provided on the side surface of the body,
The bracket is a conveying unit positioned between the first protrusion and the second protrusion. 4. The method of claim 3,
The first protrusion, the second protrusion and the bracket communicate with each other to form an installation path of the plurality of cables. 5. The method of claim 4,
A transport unit in which only a single strand or a minimum strand of cables among the plurality of cables is installed inside the body and is connected to the driving unit. An apparatus for processing a substrate, comprising:
a first unit and a second unit;
a transfer unit for transferring a substrate between the first unit and the second unit;
The conveying unit is
a support;
a hand on which the substrate is placed;
a support rod for supporting the hand;
It is provided on the support and includes a guide rail for guiding the movement of the support rod supporting the hand,
The support is
a driving unit for moving the hand by applying a driving force to the support rod;
a body in which the driving unit is disposed;
and a plurality of cables connected to the driving unit to transmit the driving force,
In the support,
A first installation path passing through the inside of the body,
and a second installation path that does not pass through the interior of the body,
The plurality of cables are provided to be positioned on the second installation path. 7. The method of claim 6,
The support includes a bracket disposed on the side of the body,
The plurality of cables is a substrate processing apparatus installed inside the bracket. 8. The method of claim 7,
The support is
It includes a first protrusion and a second protrusion provided on the side surface of the body,
The bracket is positioned between the first protrusion and the second protrusion. 9. The method of claim 8,
The first protrusion, the second protrusion, and the bracket communicate with each other to form an installation path of the plurality of cables. 10. The method of claim 9,
A substrate processing apparatus in which only a single strand or a minimum strand of cables among the plurality of cables is installed inside the body to be connected to the driving unit.

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