KR20220080655A - Circuit board with embedded copper block structure - Google Patents

Abstract

The present invention discloses a circuit board having an embedded copper block structure, comprising an inner-layer circuit board, a heat-dissipating copper block, and an ink resin. A receiving structure is formed on the inner layer circuit board. A heat dissipating copper block is installed within the receiving structure. A filling gap is formed between the heat dissipating copper block and the receiving structure. An ink resin is filled in the filling gap, and the ink resin is cured to form a buried copper block structure.

Description

A circuit board having an embedded copper block structure {CIRCUIT BOARD WITH EMBEDDED COPPER BLOCK STRUCTURE}

The present invention relates to a circuit board, and more particularly to a circuit board having a buried copper block structure.

In the technical field of printed circuit boards, a heat dissipation copper block may be inserted into the circuit board in order to increase the heat dissipation (or dissipation) effect of the circuit board. Most of the existing copper block insertion process is to insert copper block by pressing method. In order, inner layer, L00 layer pre-bonding, copper block routing and groove creation, Core/PP/PI/PFG recombination, PinLam (copper block insertion), subsequent drilling, electroplating, outer layer, S/M (solder mask), molding, etc. to complete the fabrication of the circuit board. However, this process is complicated, and there may be problems in the influence and reliability of copper block alignment due to the size of the copper block, the accuracy of the groove position of the substrate, and the uniformity of the substrate thickness.

Therefore, overcoming the above-mentioned problem by providing a circuit board having a buried copper block structure is one of the important tasks to be solved in the present project.

The technical problem to be solved by the present invention is to provide a circuit board having a buried copper block structure in order to solve the disadvantages of the prior art.

In order to solve the above technical problem, one of the technical solutions used in the present invention is to provide a circuit board having an embedded copper block structure, including an inner layer circuit board, a heat dissipating copper block, and an ink resin. A receiving structure is formed on the inner layer substrate. A heat dissipating copper block is installed within the receiving structure. A filling gap is formed between the heat dissipating copper block and the receiving structure. An ink resin is filled in the filling gap, and the ink resin is cured to form a buried copper block structure.

The advantageous effect of the present invention is that the buried copper block structure provided by the present invention is "a receiving structure is formed in an inner layer circuit board" and "a heat dissipating copper block is formed in the receiving structure, and a heat dissipation copper block and a receiving structure are formed between the receiving structure. Increasing the reliability between the heat dissipating copper block and the ink resin through the technical solutions of "a filling gap is formed" and "the ink resin is filled in the filling gap, and the ink resin is cured to form a buried copper block structure" It has the advantage that the process is relatively simple.

In order to understand the characteristics and technical content of the present invention in more detail, please refer to the detailed description and drawings related to the present invention. However, the provided drawings are for providing reference and explanation, and not for limiting the present invention.

1 is a view showing a circuit board according to an embodiment of the present invention.
2A is a diagram illustrating step S110 of a method for manufacturing a circuit board according to an embodiment of the present invention.
2B is a diagram illustrating step S120 of a method for manufacturing a circuit board according to an embodiment of the present invention.
2C is a diagram illustrating step S130 of a method for manufacturing a circuit board according to an embodiment of the present invention.
2D is a diagram illustrating step S140 of a method for manufacturing a circuit board according to an embodiment of the present invention.
2E is a diagram illustrating step S150 of a method for manufacturing a circuit board according to an embodiment of the present invention.
3 is a diagram of another embodiment of a receiving structure of an embodiment of the present invention;
4 is a diagram of another embodiment of the circuit board of the embodiment of the present invention.

An embodiment disclosed in the present invention will be described with reference to a specific embodiment. Those skilled in the art will be able to understand the advantages and effects of the present invention from the contents disclosed herein. The present invention may be implemented or applied through other specific embodiments, and each detail of the present specification may be modified and changed based on different viewpoints and applications without departing from the spirit of the present invention. In addition, it is to be noted in advance that the drawings of the present invention are for illustrative purposes and are not drawn according to the actual size. In the following embodiment, the technical content related to the present invention will be described in more detail, but the disclosed content is not used for the purpose of limiting the protection scope of the present invention.

Various elements or signals may be described using terms such as "first", "second", and "third" in the text, but these elements or signals are not limited by these terms. These terms are primarily intended to distinguish one element from another, or one signal from another. Also, it should be construed that the term “or” as used herein may include a combination of one or more of the listed items that are related to each other in actual situations.

[Circuit board having a buried copper block structure]

As shown in FIG. 1 , an embodiment of the present invention discloses a circuit board E having a buried copper block structure. The circuit board E includes an inner-layer circuit board 1 , a receiving structure 2 , a heat-dissipating copper block 3 , and an ink resin 4 . Next, a specific structure of each component of the circuit board of the present embodiment will be described, and then, a connection relationship between each component of the circuit board will be described at an appropriate time thereafter. First, for a more convenient understanding of the present embodiment, it is to be noted in advance that the drawings show only some structures of the circuit board in order to clearly show the structure and connection relationship of each component of the circuit board.

A receiving structure 2 is formed on the inner-layer circuit board 1 . The heat dissipating copper block 3 is installed in the receiving structure 2 . A filling gap G is formed between the outer wall of the heat dissipating copper block 3 and the inner wall of the receiving structure 2 . In addition, the ink resin 4 is filled in the filling gap G, and the ink resin 4 is cured to form the buried copper block structure.

The inner-layer circuit board 1 includes a plurality of inner-layer substrates 11 , and the inner-layer circuit board 1 is formed through an inner-layer pressing operation of the plurality of inner-layer substrates 11 , and a plurality of A top surface of the inner layer substrate 11 is defined as a first surface 101 , and a bottom surface of the plurality of inner layer substrates 11 is defined as a second surface 102 .

The accommodating structure 2 is formed through a plurality of inner-layer substrates 11, and the accommodating structure 2 is recessed into the first surface 101 and installed in the first groove 21 and the second surface. and a second groove 22 installed by being depressed. At this time, the first groove 21 is spatially connected to the second groove 22 , and the first width W1 of the first groove 21 is the second width W2 of the second groove 22 . ) is greater than

The heat dissipation copper block 3 has a base part 31 and an extension part 32 extending from the base part 31 , and the width of the extension part 32 is smaller than the width of the base part 31 . The first groove 21 is used for accommodating the base 31 of the heat dissipating copper block 3 , and the second groove 22 is used for receiving the extension 32 of the heat dissipating copper block 3 . is used as

The heat dissipation copper block 3 further includes at least two ribs 33 protruding outward from the base part 31 (four in this embodiment). The filling gap G is formed between the outer wall of the base part 31 and the inner wall of the receiving structure 2, and at least two of the ribs 33 of the heat dissipating copper block 3 are connected to the receiving structure ( 2) protrudes in the direction of the inner wall.

At least two ribs 33 of the heat dissipating copper block 3 are supported on the inner wall of the receiving structure 2 so that the heat dissipating copper block 3 is fixed in the receiving structure 2 by means of the at least two ribs 33 . make it possible

In addition, the ink resin 4 located in the filling gap G is positioned on the same plane as the first surface 101 or the second surface 102 of the inner-layer circuit board 1 to form a flat plane.

Referring to FIG. 3 , in another embodiment of the present invention, the receiving structure 2 of the circuit board E includes a first groove 21 installed to be recessed into the first surface 101 , and the first The groove 21 penetrates through at least a portion of the inner layer substrate 11 of the plurality of inner layer substrates 11 . In this case, the first groove 21 has a blind hole structure, and the first groove 21 accommodates the heat dissipation copper block 3 .

Referring to FIG. 4 , after the heat dissipation copper block 3 is inserted into the first groove 21 , the outer wall of the heat dissipation copper block 3 and the inner wall of the first groove 21 are The filling gap G is formed and the ink resin is filled therein. In addition, the bottom portion of the heat dissipating copper block (3) is in contact with the bottom wall of the first groove (2). That is, the ink resin is not included between the bottom portion of the heat dissipating copper block 3 and the bottom wall of the first groove 21, but the present invention is not limited thereto. For reference, in one embodiment of the present invention, the bottom wall of the first groove 21 is a metallized surface, such as a copper surface. Accordingly, the bottom portion of the heat dissipation copper block 3 may contact the bottom wall of the first groove 21 to provide a heat dissipation effect, but the present invention is not limited thereto.

[Manufacturing method of printed circuit board]

The above is a description of the circuit board of this embodiment, and next, a manufacturing method of the circuit board of this embodiment will be described. Although the circuit board was manufactured by the method of manufacturing the circuit board of the present embodiment, the present invention is not limited thereto. That is, the circuit board of the present invention may be manufactured by other circuit board manufacturing methods.

An embodiment of the present invention provides a method of manufacturing a circuit board having a buried copper block structure, including steps S110, S120, S130, S140, and S150. The order of each step and the actual operation method described in this embodiment are adjustable as needed, and are not limited to those described in this embodiment.

The manufacturing method of the circuit board may provide additional operations before, during, and after each step, and some of the operations described may implement additional embodiments of the manufacturing method through replacement, erasing, or reinstallation. Hereinafter, a method of manufacturing the circuit board will be described with reference to FIGS. 2A to 2E .

As shown, FIG. 2A is a diagram illustrating step S110 of the method for manufacturing a circuit board according to an embodiment of the present invention. The step S110 is a preparation step, and includes a step of providing an inner-layer circuit board 1 , wherein the inner-layer circuit board 1 has a first surface 101 and a second surface 102 positioned on opposite sides of each other. ) is included.

In this embodiment, the inner-layer circuit board 1 includes a plurality of inner-layer substrates 11, and each of the inner-layer substrates 11 includes a panel structure and an inner-layer circuit (not shown) formed on the panel structure. do.

In addition, the inner-layer circuit board 1 is formed by stacking a plurality of inner-layer boards 11 on each other through an inner-layer pressing operation. In this case, the top surface of the plurality of inner layer substrates 11 is defined as the first surface 101 , and the bottom surface of the plurality of inner layer substrates 11 is defined as the second surface 102 . The number of the plurality of inner-layer substrates may be, for example, 4, 6, 8, 10, or more than 10, that is, the inner-layer substrate 1 is a multilayer circuit board.

For reference, 'first' and 'second' described for each element or structure in the text conveniently describe different elements or structures, such as, for example, a first surface, a second surface, a first groove, and a second groove. It is intended to distinguish, and is not intended to limit the installation order of each element or structure or the vertical positional relationship. For example, in this embodiment, the first surface 101 is the upper surface of the inner circuit board 1 and the second surface 102 is the lower surface of the inner circuit board 1 as an example. In this case, the first surface 101 may be the lower surface of the inner-layer circuit board 1 , and the second surface 102 may be the upper surface of the inner-layer circuit board 1 , and the present embodiment is not limited thereto. does not

As shown, FIG. 2B is a diagram illustrating step S120 of the method for manufacturing a circuit board according to an embodiment of the present invention. The step S120 is a blind hole forming step, wherein the blind hole forming step is performed by using a blind hole forming machine to form a receiving structure 2 in the inner layer circuit board 1 . 1) includes performing blind hole formation. At this time, the receiving structure 2 is used for inserting the heat dissipation copper block therein.

For reference, since the shape and size of the inner layer circuit board 1 are already approximately fixed after the inner layer pressing operation, in the subsequent blind hole forming step, the blind hole forming machine is a heat dissipating copper block to be subsequently inserted It is possible to form a receiving structure of an appropriate size by appropriately controlling the depth and accuracy of forming the blind hole according to the size.

In this embodiment, the receiving structure 2 is formed through a plurality of inner-layer circuit boards 11 , and the receiving structure 2 is provided with a first groove 21 recessed into the first surface 101 . and a second groove (22) recessed into the second surface (102). At this time, the first groove 21 is spatially connected to the second groove 22 , and the first width W1 of the first groove 21 is the second width ( W2) (see Fig. 3).

Continuing to refer to FIG. 2B together with FIG. 3 , in the receiving structure 2 , the first width W1 of the first groove 21 is equal to the second width W2 of the second groove 22 . 120% to 140%, and the first height H1 of the first groove 21 is 600% to 700% of the second height H2 of the second groove 22, but the present invention is limited thereto it doesn't happen

In the forming manner, the first groove 21 is formed by performing blind hole formation toward the first surface 101 of the inner-layer circuit board 1 through a blind hole forming machine, and the second groove 22 is formed by performing blind hole formation toward the second surface 102 of the inner-layer circuit board 1 through a blind hole forming machine.

Referring to FIG. 3 , in another embodiment of the present invention, the receiving structure 2 includes a first groove 21 installed to be recessed into a first surface 101, and the first groove 21 is At least a portion of the plurality of inner-layer substrates 11 penetrates through the inner-layer substrate 11 . In this case, the first groove 21 has a blind hole structure, and the first groove 21 accommodates the following heat dissipation copper block 3 .

As shown, FIG. 2C is a diagram illustrating step S130 of the method for manufacturing a circuit board according to an embodiment of the present invention. The step S130 is a copper block inserting step. The copper block inserting step includes providing a heat dissipating copper block 3 and inserting the heat dissipating copper block 3 into the receiving structure 2 . At this time, a filling gap (G) is formed between the outer wall of the heat dissipation copper block (3) and the inner wall of the receiving structure (2), and the filling gap (G) is the ink filled therein It is used to provide resin.

In this embodiment, a special brass having a thermal conductivity between 350W/mk and 400W/mk and a thermal conductivity of 80% to 99% can be selected and used as the copper block 3, which has a relatively good thermal conductivity effect. can provide

In this embodiment, the filling gap G formed between the outer wall of the heat dissipating copper block 3 and the inner wall of the receiving structure 2 has a width between 500 μm and 1000 μm. That is, the distance between the outer wall of the heat dissipating copper block 3 and the inner wall of the receiving structure 2 is between 500 μm and 1000 μm, but the present invention is not limited thereto. Therefore, after the ink resin is filled in the filling gap G and planarized, there is adequate reliability between the ink resin and the heat dissipating copper block 3 .

Specifically, referring to FIG. 2C , the heat dissipation copper block 3 includes a base part 31 and an extension part 32 extending from one end of the base part 31, and the extension part The width of 32 is smaller than the width of the base part 31 , so that the heat dissipation copper block 3 has an inverted 凸 shape as a whole.

In addition, the heat dissipation copper block 3 has at least two ribs 33 protruding to the outside from opposite sides of the base part 31 . In this embodiment, the number of the ribs 33 is four, but the present invention is not limited thereto. At this time, after the heat dissipation copper block 3 is inserted into the receiving structure 2 , the filling gap G is formed on the outer wall of the base part 31 and the inner wall of the receiving structure 2 , , at least two ribs 33 of the heat dissipating copper block 3 protrude toward the inner wall of the receiving structure 2 .

In this embodiment, the at least two ribs 33 of the heat dissipating copper block 3 are supported on the inner wall of the receiving structure 2 so that the heat dissipating copper block 3 is supported by the at least two ribs 33 in the receiving structure. (2) to be fixed.

In the receiving structure (2), the first groove (21) and the second groove (22) together form a step-like structure, in the step-like structure, on the first surface (101) or the second surface (102) The parallel portion is defined as the support portion 23 . At this time, the support part 23 is positioned between the first groove 21 and the second groove 22 . When the receiving structure 2 accommodates the heat dissipating copper block 3 , the receiving structure 2 supports the heat dissipating copper block 3 through the support portion 23 .

Further, when the receiving structure 2 accommodates the heat dissipating copper block 3 , the first groove 21 can accommodate the base portion 31 and the lip 33 of the heat dissipating copper block 3 , The second groove 22 may accommodate the extended portion 22 of the heat dissipating copper block 3. In this embodiment, the top surface of the base 31 and the first surface of the internal circuit board 1 ( 101) are horizontal to each other, and the bottom surface of the extension part 32 and the second surface 102 of the internal circuit board 1 are also horizontal to each other, but the present invention is not limited thereto.

As shown, FIG. 2D is a diagram illustrating step S140 of the method for manufacturing a circuit board according to an embodiment of the present invention. The step S140 is a resin filling step, wherein the resin filling step fills the ink resin 4 in the filling gap G and hardens the ink resin 4 to form an embedded copper block structure (embedded copper). block structure).

The main component of the ink resin 4 includes, for example, epoxy resin, polyimide, cyanate ester, bismaleimide triazine, or a combination thereof, and a polymer composite It could be a material.

More specifically, in the resin filling step, the air in the filling gap G is removed through a vacuum plug machine, and the ink resin 4 is filled into the filling gap G through a vacuum plug machine. More specifically, the ink resin 4 is completely filled in the filling gap G, so that substantially no air is present in the filling gap G.

Also, as shown in Fig. 2D, the ink resin 4 partially overflows onto the first surface 101 and the second surface 102 of the inner-layer circuit board 1, and thus the overflowed ink The resin must be removed in a subsequent step.

After the ink resin (4) is filled in the filling gap (G), the ink resin (4) is the base part (31), the extension part (32), and at least two ribs (33) of the heat-dissipating copper block (3) ) is covered. In addition, after the ink resin 4 is cured, the heat dissipation copper block 3 forms a structure in which the ink resin 4 and each other are fitted, so that the heat dissipation copper block 3 is more firmly It is fixed in the receiving structure (2).

As shown, FIG. 2E is a diagram illustrating step S150 of the method for manufacturing a circuit board according to an embodiment of the present invention. The step S150 is a planarization step. The planarization step is performed by polishing, exposing, or scrubbing the ink resin 4 so that the ink resin 4 located in the filling gap G is the first surface 101 or the second surface of the inner-layer circuit board 1 . (102) and parallel to each other to form a flat plane.

At this time, in the planarization step, the ink resin 4 is polished or scrubbed using a polishing machine or a scrub machine, so that the ink overflowed onto the first surface 101 or the second surface 102 of the inner-layer circuit board 1 . Remove the resin (4). In a relatively preferred embodiment of the present invention, in the planarization step, the first surface 101 or the second surface 102 of the inner-layer circuit board 1 is polished by polishing the ink resin 4 using an 8-axis ceramic polishing exposure machine. ) to remove the ink resin (4) overflowing to the top.

In an embodiment not shown in the present invention, in the planarization step, the method of manufacturing the circuit board sequentially includes a drilling step, an electroplating step, an outer circuit forming step, Manufacturing of the circuit board E may be completed including a solder mask step and a molding step. Since all of the above-described steps fall within the scope of the prior art, detailed descriptions thereof will be omitted herein.

According to the above configuration, in the circuit board manufacturing method of the embodiment of the present invention, the periphery of the heat-dissipating copper block is filled with a resin ink, and a PP semi-cured sheet replacing it is filled; With the blind hole forming machine, appropriately adjusting the depth and precision of the blind hole to form a receiving groove matching the size of the heat dissipating copper block; By matching the vacuum plug machine to the plug hole to remove the air, insert the resin ink, and flatten it with an 8-axis ceramic abrasive exposure machine, the reliability between the heat dissipating copper block and the ink resin is ensured, and the process is relatively simple.

The advantageous effect of the present invention is that the buried copper block structure provided by the present invention is "a receiving structure is formed in an inner layer circuit board" and "a heat dissipating copper block is formed in the receiving structure, and a heat dissipation copper block and a receiving structure are formed between the receiving structure. Increasing the reliability between the heat dissipating copper block and the ink resin through the technical solutions of "a filling gap is formed" and "the ink resin is filled in the filling gap, and the ink resin is cured to form a buried copper block structure" It has the advantage that the process is relatively simple.

The contents disclosed above are only preferred and practicable embodiments of the present invention, and since the scope of protection of the rights of the present invention is not limited thereby, equivalent technical changes made using the specification and drawings of the present invention are all It is included within the scope of protection of the right of the invention.

E, E': circuit board
1: inner layer circuit board
101: first surface
102: second surface
11: inner layer substrate
2: Receiving structure
21: first groove
W1: first width
H1: first depth
22: second groove
W2: second width
H2: second depth
23: support
3: Heat dissipation copper block
31: base part
32: extension
33: lip
4: ink resin
G: filling gap

Claims (10)

an inner-layer circuit board on which a receiving structure is formed;
a heat dissipating copper block installed in the receiving structure, wherein a filling gap is formed between an outer wall of the heat dissipating copper block and the receiving structure; and
A circuit board having a buried copper block structure, comprising an ink resin formed in the filling gap, wherein the ink resin is cured to form a buried copper block structure. The circuit board having a buried copper block structure according to claim 1, wherein the filling gap formed between the outer wall of the heat dissipating copper block and the inner wall of the receiving structure is between 500 μm and 1000 μm. According to claim 1, wherein the inner-layer circuit board comprises a plurality of inner-layer substrates, the inner-layer circuit board is formed through an inner-layer pressing operation by a plurality of the inner-layer substrate, the top surface of the plurality of inner-layer substrates is defined as a first surface, and a bottom surface of the plurality of innerlayer substrates is defined as a second surface. The accommodating structure according to claim 3, wherein the receiving structure is formed through a plurality of the inner layer substrates, and the receiving structure includes a first groove recessed in the first surface and a second groove recessed in the second surface. and; The circuit board having a buried copper block structure, wherein the first groove is spatially connected to the second groove, and a first width of the first groove is greater than a second width of the second groove. The heat dissipation copper block of claim 4, wherein the heat dissipation copper block includes a base portion and an extension portion extending from the base portion, a width of the extension portion is smaller than a width of the base portion, and the first groove is formed to cover the base portion of the heat radiation copper block. A circuit board having a buried copper block structure, which is used for accommodating, and the second groove is used for accommodating the extended portion of the heat dissipating copper block. 5. The method of claim 4, wherein the heat dissipation copper block includes a base portion and at least two ribs protruding outwardly from the base portion; The filling gap is formed between the outer wall of the base portion and the inner wall of the receiving structure, wherein at least two of the ribs of the heat dissipating copper block protrude in the direction of the inner wall of the receiving structure. a circuit board having 7. The method of claim 6, wherein at least two of said ribs of said heat dissipating copper block are configured to rest against said inner wall of said receiving structure such that said block of heat dissipating copper can be secured within said receiving structure by said at least two said ribs. A circuit board having a buried copper block structure. 4. The method of claim 3, wherein the receiving structure includes a first groove recessed in the first surface, the first groove being installed through at least some of the plurality of inner-layer substrates through the inner-layer substrate; A circuit board having a buried copper block structure, wherein the first groove is a blind hole structure, and the first groove is configured to receive the heat dissipation copper block. The method according to claim 8, wherein the bottom portion of the heat dissipation copper block is in contact with the bottom wall of the first groove, and an ink resin is not included between the bottom portion of the heat dissipation copper block and the bottom wall of the first groove. A circuit board having a buried copper block structure. The circuit board having a buried copper block structure according to claim 1, wherein the ink resin located in the filling gap is parallel to the first surface or the second surface of the inner layer circuit board to form a flat plane.

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