CN115484739A - Flexible circuit board for lens module and manufacturing method thereof - Google Patents

Flexible circuit board for lens module and manufacturing method thereof Download PDF

Info

Publication number
CN115484739A
CN115484739A CN202110667899.2A CN202110667899A CN115484739A CN 115484739 A CN115484739 A CN 115484739A CN 202110667899 A CN202110667899 A CN 202110667899A CN 115484739 A CN115484739 A CN 115484739A
Authority
CN
China
Prior art keywords
heat
flexible circuit
blind groove
circuit board
cover film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202110667899.2A
Other languages
Chinese (zh)
Inventor
郭志
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Avary Holding Shenzhen Co Ltd
Qing Ding Precision Electronics Huaian Co Ltd
Original Assignee
Avary Holding Shenzhen Co Ltd
Qing Ding Precision Electronics Huaian Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Avary Holding Shenzhen Co Ltd, Qing Ding Precision Electronics Huaian Co Ltd filed Critical Avary Holding Shenzhen Co Ltd
Priority to CN202110667899.2A priority Critical patent/CN115484739A/en
Publication of CN115484739A publication Critical patent/CN115484739A/en
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

The application provides a manufacturing method of a flexible circuit board for a lens module, which comprises the following steps: providing a flexible circuit substrate, wherein a containing groove is formed in the flexible circuit substrate; forming a first blind groove and a second blind groove in the flexible circuit substrate; filling heat conduction materials in the first blind groove and the second blind groove to form a first heat conduction column and a second heat conduction column respectively; forming a reinforcing plate on the flexible circuit substrate, wherein a first opening and a second opening are formed in the reinforcing plate, and the first heat dissipation part and the second heat dissipation part are respectively positioned in the first opening and the second opening; and installing an image sensor in the accommodating groove, and enabling the image sensor to be in soaking conduction with the first heat-conducting column and the second heat-conducting column, thereby obtaining the flexible circuit board. The flexible circuit board manufactured by the manufacturing method provided by the application has a high heat dissipation effect. The application also provides a flexible circuit board for the lens module.

Description

Flexible circuit board for lens module and manufacturing method thereof
Technical Field
The present disclosure relates to circuit boards, and particularly to a flexible circuit board for a lens module and a method for manufacturing the same.
Background
A lens module is an image or video input device, and is widely used in industrial and consumer electronics products. The circuit board is used as a carrier of components such as an image sensor, and is one of the key components in the lens module. A Flexible Printed Circuit (FPC) is a Printed Circuit board having high reliability and good flexibility. With the improvement of the picture quality requirement of the user for taking and recording pictures on the lens module, the pixels of the lens module are higher and higher, and the power of the image sensor is improved.
The image sensor can generate a large amount of heat after working for a long time, so that the temperature of the whole lens module rises, and the user experience is further influenced. The heat generated by the image sensor is conducted out through the flexible circuit board with the conventional design, however, the heat dissipation effect often cannot meet the requirements of the product. At present, a heat dissipation plate is generally attached to one side of a flexible circuit board for heat dissipation, but the heat dissipation effect is poor.
Disclosure of Invention
In view of this, the present application provides a method for manufacturing a circuit board with a good heat dissipation effect.
In addition, a circuit board manufactured by the method is also needed to be provided.
An embodiment of the present application provides a method for manufacturing a flexible circuit board for a lens module, including:
providing a flexible circuit substrate, wherein a containing groove is formed in the flexible circuit substrate;
forming a first blind groove and a second blind groove in the flexible circuit substrate, wherein the first blind groove and the second blind groove correspond to the accommodating groove, and the first blind groove, the second blind groove and the accommodating groove are respectively positioned on two opposite surfaces of the flexible circuit substrate;
filling heat conduction materials in the first blind groove and the second blind groove to form a first heat conduction column and a second heat conduction column respectively, wherein the first heat conduction column comprises a first heat conduction part and a first heat dissipation part connected with the first heat conduction part, the first heat conduction part is positioned in the first blind groove, the first heat dissipation part protrudes out of the surface of the flexible circuit substrate, the second heat conduction column comprises a second heat conduction part and a second heat dissipation part connected with the second heat conduction part, the second heat conduction part is positioned in the second blind groove, and the second heat dissipation part protrudes out of the surface of the flexible circuit substrate;
forming a reinforcing plate on the flexible circuit substrate, wherein a first opening and a second opening are formed in the reinforcing plate, and the first heat dissipation part and the second heat dissipation part are respectively positioned in the first opening and the second opening; and
and an image sensor is arranged in the accommodating groove, is electrically connected with the flexible circuit substrate and is uniformly heated and conducted with the first heat-conducting column and the second heat-conducting column, so that the flexible circuit board is obtained.
An embodiment of the present application further provides a flexible circuit board for a lens module, including:
the flexible circuit board comprises a flexible circuit board, wherein an accommodating groove, a first blind groove and a second blind groove are formed in the flexible circuit board, the first blind groove and the second blind groove correspond to the accommodating groove, the first blind groove, the second blind groove and the accommodating groove are respectively positioned on two opposite surfaces of the flexible circuit board, the first blind groove and the second blind groove respectively form a first heat-conducting column and a second heat-conducting column, the first heat-conducting column comprises a first heat-conducting part and a first heat-radiating part connected with the first heat-conducting part, the first heat-conducting part is positioned in the first blind groove, the first heat-radiating part protrudes out of the surface of the flexible circuit board, the second heat-conducting column comprises a second heat-conducting part and a second heat-radiating part connected with the second heat-conducting part, the second heat-conducting part is positioned in the second blind groove, and the second heat-radiating part protrudes out of the surface of the flexible circuit board;
the reinforcing plate is arranged on the flexible circuit substrate, a first opening and a second opening are formed in the reinforcing plate, and the first heat dissipation part and the second heat dissipation part are respectively positioned in the first opening and the second opening; and
the image sensor is positioned in the accommodating groove, electrically connected with the flexible circuit substrate and uniformly heated and conducted with the first heat-conducting column and the second heat-conducting column.
The heat generated by the image sensor in the present application is transmitted to the first heat conduction part and the second heat conduction part, and is dissipated to the outside through the first heat dissipation part and the second heat dissipation part, respectively. Because the first heat dissipation part and the second heat dissipation part protrude out of the surface of the flexible circuit substrate, the heat dissipation areas of the first heat conduction column and the second heat conduction column are increased, and the heat dissipation effect of the image sensor is improved.
Drawings
Fig. 1 is a schematic structural diagram of a flexible circuit substrate according to an embodiment of the present application.
Fig. 2 is a schematic structural view of the third cover film shown in fig. 1 after a peelable film is attached thereto.
Fig. 3 is a schematic structural view of the flexible circuit substrate and the peelable film shown in fig. 2 after the first blind groove and the second blind groove are formed therein.
Fig. 4 is a schematic structural view after the first blind groove and the second blind groove shown in fig. 3 are filled with heat conduction materials.
Fig. 5 is a schematic view of the peelable film shown in fig. 4 after removal.
Fig. 6 is a schematic structural view of the third coverlay shown in fig. 5 after a reinforcing plate is formed thereon.
Fig. 7 is a schematic structural diagram of a flexible circuit board for a lens module obtained after an image sensor is mounted in the receiving groove shown in fig. 6.
Description of the main elements
Flexible circuit board 100
Flexible circuit board 10
First cover film 11
First adhesive layer 12
First conductive line layer 13
First base copper layer 131
First electroplated copper layer 132
Second cover film 14
Second conductive line layer 15
Second substrate copper layer 151
Second electroplated copper layer 152
Second adhesive layer 16
Third cover film 17
Protective layer 18
Accommodation groove 20
Bonding pad 21
Conductive part 22
Peelable film 30
First blind groove 40
Second blind groove 41
First heat-conducting column 42
First heat conduction part 421
First heat sink member 422
Second heat-conducting post 43
Second heat conduction part 431
The second heat sink member 432
Reinforcing plate 50
First opening 51
Second opening 52
Third adhesive layer 60
Image sensor 70
The following detailed description will further illustrate the present application in conjunction with the above-described figures.
Detailed Description
The technical solutions in the embodiments of the present application will be described clearly and completely with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only some embodiments of the present application, and not all embodiments.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description of the present application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.
To further explain the technical means and effects of the present application for achieving the intended purpose, the following detailed description is given to the present application in conjunction with the accompanying drawings and preferred embodiments.
An embodiment of the present application provides a method for manufacturing a flexible circuit board for a lens module, including the following steps:
in step S11, please refer to fig. 1, a flexible circuit substrate 10 is provided.
In one embodiment, the flexible circuit substrate 10 includes a first cover film 11, a first adhesive layer 12, a first conductive trace layer 13, a second cover film 14, a second conductive trace layer 15, a second adhesive layer 16, and a third cover film 17, which are sequentially stacked.
The first cover film 11, the second cover film 14, and the third cover film 17 may be made of one selected from epoxy resin (epoxy resin), polypropylene (PP), BT resin, polyphenylene Oxide (PPO), polyimide (PI), polyethylene Terephthalate (PET), and Polyethylene Naphthalate (PEN). In this embodiment, the first cover film 11, the second cover film 14, and the third cover film 17 are all made of polyimide.
In one embodiment, the first conductive trace layer 13 includes a first base copper layer 131 disposed on the second cover film 14 and a first copper electroplating layer 132 disposed on the first base copper layer 131. A first gap (not shown) is formed in the first conductive trace layer 13. The first adhesive layer 12 is also filled in the first gap.
In one embodiment, the second conductive trace layer 15 includes a second base copper layer 151 disposed on the second cover film 14 and a second copper electroplating layer 152 disposed on the second base copper layer 151. Wherein, a second gap (not shown) is disposed in the second conductive trace layer 15. The second adhesive layer 16 also fills in the second gap.
The flexible circuit substrate 10 is provided with a receiving groove 20. The accommodating groove 20 sequentially penetrates through the first cover film 11 and the first adhesive layer 12, and the bottom of the accommodating groove 20 corresponds to the first copper electroplating layer 132. A portion of the first conductive trace layer 13 is exposed to the receiving cavity 20 to form a bonding pad 21.
In one embodiment, the flexible circuit substrate 10 further includes a protective layer 18. The protection layer 18 is located in the first gap, and the protection layer 18 is exposed to the receiving groove 20.
The material of the protective layer 18 may be solder mask ink, such as green oil. The protective layer 18 is used to prevent the pads 21 from short-circuiting each other during subsequent soldering.
The flexible circuit board 10 is provided with a conductive portion 22. In one embodiment, the conductive portion 22 has a substantially trapezoidal cross section along the thickness direction of the flexible circuit substrate 10. The conductive part 22 is used to electrically connect the first conductive trace layer 13 and the second conductive trace layer 15.
In step S12, referring to fig. 2, a peelable film 30 is attached to the third cover film 17.
In step S13, referring to fig. 3, a first blind groove 40 and a second blind groove 41 are formed in the flexible circuit substrate 10 and the peelable film 30.
The first blind groove 40 and the second blind groove 41 sequentially penetrate through the peelable film 30, the third cover film 17, the second adhesive layer 16, the second conductive trace layer 15, and the second cover film 14. The bottoms of the first blind groove 40 and the second blind groove 41 correspond to the first substrate copper layer 131, and the first blind groove 40 and the second blind groove 41 correspond to the accommodating groove 20.
In an embodiment, the first blind groove 40 and the second blind groove 41 can be formed by laser drilling or depth cutting. The shapes of the first blind groove 40 and the second blind groove 41 are not limited in the present application, and the shapes of the first blind groove 40 and the second blind groove 41 may be rectangular, circular, or any other regular or irregular shapes.
Wherein the inner diameter D of the first blind groove 40 1 Greater than or equal to 100 μm, the inner diameter D of the second blind groove 41 2 Greater than or equal to 100 μm. The inner diameter of the first blind groove 40 and the inner diameter of the second blind groove 41 may be equal or unequal.
Wherein a distance L between the first blind groove 40 and the second blind groove 41 1 Greater than or equal to 150 μm.
The number of the first blind grooves 40 and the second blind grooves 41 is not limited in the present application.
In step S14, referring to fig. 4, the first blind groove 40 and the second blind groove 41 are filled with a heat conductive material to form a first heat conductive pillar 42 and a second heat conductive pillar 43, respectively.
In one embodiment, the first heat-conducting pillar 42 includes a first heat-conducting portion 421 and a first heat-dissipating portion 422 connected to the first heat-conducting portion 421. The first heat-conducting portion 421 is located in the first blind groove 40 in the flexible wiring substrate 10, and the first heat-dissipating portion 422 is located in the first blind groove 40 in the peelable film 30.
In one embodiment, the second heat-conducting pillar 43 includes a second heat-conducting portion 431 and a second heat-dissipating portion 432 connected to the second heat-conducting portion 431. The second heat conduction portion 431 is located in the second blind groove 41 in the flexible wiring substrate 10, and the second heat dissipation portion 432 is located in the second blind groove 41 in the peelable film 30.
In one embodiment, an end surface of the first heat sink member 422 away from the first heat conduction member 421 and an end surface of the second heat sink member 432 away from the second heat conduction member 431 are substantially flush with a surface of the peelable film 30 away from the third cover film 17.
In one embodiment, the thermally conductive material comprises at least one of a thermally conductive copper paste, a thermally conductive silver paste, and a ceramic frit. That is, the first heat-conducting pillar 42 and the second heat-conducting pillar 43 may be made of at least one of heat-conducting copper paste, heat-conducting silver paste, and ceramic powder.
The first conductive trace layer 13 is thermally conductive to the first thermal conductive pillar 42 and the second thermal conductive pillar 43.
It is understood that the diameters of the first heat-conducting post 42 and the second heat-conducting post 43 are equal to the inner diameters of the first blind groove 40 and the second blind groove 41, respectively.
In step S15, please refer to fig. 5, the peelable film 30 is removed.
After the peelable film 30 is removed, the first heat sink member 422 and the second heat sink member 432 each protrude out of the surface of the third cover film 17 away from the second adhesive layer 16.
In step S16, referring to fig. 6, a reinforcing plate 50 is formed on the third cover film 17.
Specifically, a third adhesive layer 60 is formed on the third cover film 17, and the reinforcing plate 50 is formed on the third adhesive layer 60.
In one embodiment, the reinforcing plate 50 has a first opening 51 and a second opening 52. Wherein the first opening 51 and the second opening 52 both further penetrate the third adhesive layer 60.
Wherein the first heat sink member 422 and the second heat sink member 432 are located in the first opening 51 and the second opening 52, respectively.
Wherein the first opening 51 has an inner diameter D 3 Greater than or equal to (D) 1 + 100) μm, of saidInner diameter D of the two openings 52 4 Greater than or equal to (D) 2 + 100) μm. In this way, gaps can be left between the first heat sink member 422 and the reinforcing plate 50 and between the second heat sink member 432 and the reinforcing plate 50.
The first opening 51 has a first inner wall (not shown), and a distance L between the first heat sink member 422 and the first inner wall 2 Greater than or equal to 50 μm. The second opening 52 has a second inner wall (not shown), and the distance L between the second heat sink portion 432 and the second inner wall 3 Greater than or equal to 50 μm.
Wherein the total thickness H of the third adhesive layer 60 and the reinforcing plate 50 1 15-500 μm, the height H of the first heat sink member 422 2 Is (H) 1 -10) μm, height H of the second heat sink part 432 3 Is (H) 1 -10) μm. That is, the height of the first heat sink member 422 and the height of the second heat sink member 432 are both smaller than the total thickness of the third adhesive layer 60 and the reinforcing plate 50, so as to ensure that the thickness of the subsequent flexible circuit board (see fig. 7) is not increased and the flatness of the flexible circuit board is ensured.
In step S17, referring to fig. 7, an image sensor 70 is installed in the accommodating groove 20, and the image sensor 70 is electrically connected to the pad 21, so as to obtain the flexible circuit board 100.
The image sensor 70 is electrically connected to the pad 21, so that the image sensor 70 is electrically connected to the first conductive trace layer 13, and the image sensor 70 is electrically connected to the second conductive trace layer 15.
In practical applications, a filter (not shown) and a lens (not shown) may be installed on one side of the image sensor 70 of the flexible circuit board 100, so that the image sensor 70 is opposite to the filter, and the filter is opposite to the lens, so as to obtain a lens module.
Referring to fig. 7, an embodiment of the present invention further provides a flexible circuit board 100 for a lens module, including a flexible circuit substrate 10, a stiffener 50, a third adhesive layer 60, and an image sensor 70.
In one embodiment, the flexible circuit substrate 10 includes a first cover film 11, a first adhesive layer 12, a first conductive trace layer 13, a second cover film 14, a second conductive trace layer 15, a second adhesive layer 16, and a third cover film 17, which are sequentially stacked.
The first cover film 11, the second cover film 14, and the third cover film 17 may be made of one selected from epoxy resin (epoxy resin), polypropylene (PP), BT resin, polyphenylene Oxide (PPO), polyimide (PI), polyethylene Terephthalate (PET), and Polyethylene Naphthalate (PEN). In this embodiment, the first cover film 11, the second cover film 14, and the third cover film 17 are all made of polyimide.
In one embodiment, the first conductive trace layer 13 includes a first base copper layer 131 disposed on the second cover film 14 and a first copper electroplating layer 132 disposed on the first base copper layer 131. A first gap (not shown) is formed in the first conductive trace layer 13. The first adhesive layer 12 is also filled in the first gap.
In one embodiment, the second conductive trace layer 15 includes a second base copper layer 151 disposed on the second cover film 14 and a second copper electroplating layer 152 disposed on the second base copper layer 151. Wherein, a second gap (not shown) is disposed in the second conductive trace layer 15. The second adhesive layer 16 is also filled in the second gap.
The flexible circuit substrate 10 is provided with a receiving groove 20. The receiving groove 20 sequentially penetrates through the first cover film 11 and the first adhesive layer 12, and the bottom of the receiving groove 20 corresponds to the first copper electroplating layer 132. A portion of the first conductive trace layer 13 is exposed to the receiving cavity 20 to form a pad 21.
In one embodiment, the flexible circuit substrate 10 further includes a protective layer 18. The protection layer 18 is located in the first gap, and the protection layer 18 is exposed to the receiving groove 20.
The material of the protective layer 18 may be solder mask ink, such as green oil. The protective layer 18 is used to prevent the pads 21 from forming a short circuit with each other.
The flexible circuit board 10 is provided with a conductive portion 22. In one embodiment, the conductive portion 22 has a substantially trapezoidal cross section along the thickness direction of the flexible circuit substrate 10. The conductive part 22 is used to electrically connect the first conductive trace layer 13 and the second conductive trace layer 15.
A first blind slot 40 and a second blind slot 41 are formed in the flexible circuit substrate 10. The first blind groove 40 and the second blind groove 41 sequentially penetrate through the peelable film 30, the third cover film 17, the second adhesive layer 16, the second conductive trace layer 15, and the second cover film 14. The bottoms of the first blind groove 40 and the second blind groove 41 both correspond to the first substrate copper layer 131, and the first blind groove 40 and the second blind groove 41 both correspond to the receiving groove 20.
The shapes of the first blind groove 40 and the second blind groove 41 are not limited in the present application, and the shapes of the first blind groove 40 and the second blind groove 41 may be rectangular, circular, or any other regular or irregular shapes.
Wherein the inner diameter D of the first blind groove 40 1 Greater than or equal to 100 μm, the inner diameter D of the second blind groove 41 2 Greater than or equal to 100 μm. The inner diameter of the first blind groove 40 and the inner diameter of the second blind groove 41 may be equal or different.
Wherein a distance L between the first blind groove 40 and the second blind groove 41 1 Greater than or equal to 150 μm.
The number of the first blind grooves 40 and the second blind grooves 41 is not limited in the present application.
The first blind groove 40 and the second blind groove 41 are filled with a heat conductive material to form a first heat conductive pillar 42 and a second heat conductive pillar 43, respectively.
In one embodiment, the first heat-conducting pillar 42 includes a first heat-conducting portion 421 and a first heat-dissipating portion 422 connected to the first heat-conducting portion 421. The first heat-conducting portion 421 is located in the first blind groove 40, and the first heat-dissipating portion 422 protrudes out of the surface of the third cover film 17 away from the second adhesive layer 16.
In one embodiment, the second heat conductive pillar 43 includes a second heat conductive portion 431 and a second heat sink portion 432 connected to the second heat conductive portion 431. The second heat-conducting portion 431 is located in the second blind groove 41, and the second heat-dissipating portion 432 protrudes out of the surface of the third cover film 17 away from the second adhesive layer 16.
In one embodiment, the thermally conductive material comprises at least one of a thermally conductive copper paste, a thermally conductive silver paste, and a ceramic frit. That is, the first heat-conducting pillar 42 and the second heat-conducting pillar 43 may be made of at least one of a heat-conducting copper paste, a heat-conducting silver paste, and a ceramic powder.
The first conductive trace layer 13 is thermally conductive to the first thermal conductive pillar 42 and the second thermal conductive pillar 43.
It is understood that the diameters of the first heat-conducting post 42 and the second heat-conducting post 43 are equal to the inner diameters of the first blind groove 40 and the second blind groove 41, respectively.
The reinforcing plate 50 is disposed on the third cover film 17 through the third adhesive layer 60.
In one embodiment, the reinforcing plate 50 has a first opening 51 and a second opening 52. Wherein the first opening 51 and the second opening 52 both further penetrate the third adhesive layer 60.
Wherein the first heat sink member 422 and the second heat sink member 432 are respectively located in the first opening 51 and the second opening 52.
Wherein the first opening 51 has an inner diameter D 3 Greater than or equal to (D) 1 + 100) μm, inner diameter D of said second opening 52 4 Is greater than or equal to (D) 2 + 100) μm. In this way, gaps can be left between the first heat sink member 422 and the reinforcing plate 50 and between the second heat sink member 432 and the reinforcing plate 50.
The first opening 51 has a first openingAn inner wall (not shown), a distance L between the first heat sink piece 422 and the first inner wall 2 Greater than or equal to 50 μm. The second opening 52 has a second inner wall (not shown), and the distance L between the second heat sink piece 432 and the second inner wall 3 Greater than or equal to 50 μm.
Wherein the total thickness H of the third adhesive layer 60 and the reinforcing plate 50 1 15-500 μm, the height H of the first heat sink member 422 2 Is (H) 1 10) μm, height H of the second heat sink part 432 3 Is (H) 1 -10) μm. That is, the height of the first heat sink member 422 and the height of the second heat sink member 432 are both smaller than the total thickness of the third adhesive layer 60 and the reinforcing plate 50, so as to ensure that the thickness of the flexible circuit board 100 is not increased and the flatness of the flexible circuit board 100 is ensured.
The image sensor 70 is installed in the receiving groove 20. The image sensor 70 is electrically connected to the pad 21, so that the image sensor 70 is electrically connected to the first conductive trace layer 13, and the image sensor 70 is electrically connected to the second conductive trace layer 15.
In practical applications, a filter (not shown) and a lens (not shown) may be installed on one side of the image sensor 70 of the flexible circuit board 100, so that the image sensor 70 is opposite to the filter, and the filter is opposite to the lens, so as to obtain a lens module.
The heat generated from the image sensor 70 in the present application is transmitted to the first and second heat conductive parts 421 and 431 through the first conductive trace layer 13, and is radiated to the outside through the first and second heat sink members 422 and 432, respectively. Since the first heat sink part 422 and the second heat sink part 432 protrude from the surface of the third cover film 17 away from the second adhesive layer 16, the heat dissipation areas of the first heat conduction column 42 and the second heat conduction column 43 are increased, and the heat dissipation effect of the image sensor 70 is improved. Meanwhile, gaps are reserved between the first heat dissipation part 422 and the first inner wall and between the second heat dissipation part 432 and the second inner wall, so that convection of air is facilitated, limitation of the reinforcing plate 50 on heat dissipation of the first heat dissipation part 422 and the second heat dissipation part 432 is reduced, and the heat dissipation effect of the image sensor 70 is improved.
Compared with the arrangement of only one first heat-conducting column 42 or only one second heat-conducting column 43, the arrangement of at least one first heat-conducting column 42 and at least one second heat-conducting column 43 is beneficial to uniform heat dissipation of the image sensor 70 because the first heat-conducting column 42 and the second heat-conducting column 43 respectively correspond to different positions of the image sensor 70. Meanwhile, the reinforcing plate 50 is disposed between the first heat-conducting pillar 42 and the second heat-conducting pillar 43, which is beneficial for the reinforcing plate 50 to support the flexible circuit substrate 10 and the image sensor 70.
In addition, compared with the mode of attaching a heat dissipation sheet to one side of the flexible circuit board for heat dissipation, the height of the first heat dissipation part 422 and the height of the second heat dissipation part 432 are both set to be smaller than the total thickness of the third adhesive layer 60 and the reinforcing plate 50, so that the thickness of the flexible circuit board 100 is not increased, thinning of the flexible circuit board 100 is facilitated, and the flatness of the flexible circuit board 100 is ensured. Meanwhile, the first and second heat-conducting pillars 42 and 43 are closer to the image sensor 70, thereby facilitating heat conduction and heat dissipation of the image sensor 70. The application also is beneficial to reducing the production cost due to the fact that the attached radiating fins are omitted.
The above description is only an embodiment optimized for the present application, but in practical application, the present invention is not limited to this embodiment. Other modifications and variations to the technical concept of the present application should fall within the scope of the present application for those skilled in the art.

Claims (10)

1. A manufacturing method of a flexible circuit board for a lens module is characterized by comprising the following steps:
providing a flexible circuit substrate, wherein a containing groove is formed in the flexible circuit substrate;
forming a first blind groove and a second blind groove in the flexible circuit substrate, wherein the first blind groove and the second blind groove correspond to the accommodating groove, and the first blind groove, the second blind groove and the accommodating groove are respectively positioned on two opposite surfaces of the flexible circuit substrate;
filling heat conduction materials in the first blind groove and the second blind groove to form a first heat conduction column and a second heat conduction column respectively, wherein the first heat conduction column comprises a first heat conduction part and a first heat dissipation part connected with the first heat conduction part, the first heat conduction part is positioned in the first blind groove, the first heat dissipation part protrudes out of the surface of the flexible circuit substrate, the second heat conduction column comprises a second heat conduction part and a second heat dissipation part connected with the second heat conduction part, the second heat conduction part is positioned in the second blind groove, and the second heat dissipation part protrudes out of the surface of the flexible circuit substrate;
forming a reinforcing plate on the flexible circuit substrate, wherein a first opening and a second opening are formed in the reinforcing plate, and the first heat dissipation part and the second heat dissipation part are respectively positioned in the first opening and the second opening; and
and an image sensor is arranged in the accommodating groove, is electrically connected with the flexible circuit substrate and is uniformly heated and conducted with the first heat-conducting column and the second heat-conducting column, so that the flexible circuit board is obtained.
2. The method of manufacturing a flexible circuit board according to claim 1, wherein the first opening has a first inner wall, the second opening has a second inner wall, a distance between the first heat sink member and the first inner wall is 50 μm or more, and a distance between the second heat sink member and the second inner wall is 50 μm or more.
3. The method according to claim 1, wherein the flexible circuit board includes a first cover film, a first adhesive layer, a first conductive trace layer, a second cover film, a second conductive trace layer, a second adhesive layer, and a third cover film, which are sequentially stacked, the accommodating groove sequentially penetrates through the first cover film and the first adhesive layer, the bottom of the accommodating groove corresponds to the first conductive trace layer, the first blind groove and the second blind groove sequentially penetrate through the third cover film, the second adhesive layer, the second conductive trace layer, and the second cover film, the bottoms of the first blind groove and the second blind groove correspond to the first conductive trace layer, the first heat dissipation portion and the second heat dissipation portion respectively protrude out of the third cover film and away from the surface of the second adhesive layer, and the image sensor is thermally connected to the first heat conductive pillar and the second heat conductive pillar through the first conductive trace layer.
4. The method of manufacturing a flexible circuit board according to claim 3, wherein before the first blind groove and the second blind groove are formed in the flexible circuit substrate, the method further comprises:
attaching a peelable film to the third cover film;
the first blind groove and the second blind groove both penetrate through the peelable film, and the end face of the first heat dissipation part, which is far away from the first heat conduction part, and the end face of the second heat dissipation part, which is far away from the second heat conduction part, are flush with the surface of the peelable film, which is far away from the third cover film;
after forming the first and second thermally conductive pillars, the method of making further comprises:
removing the peelable film.
5. The method of manufacturing a flexible circuit board according to claim 3, wherein the step of forming a reinforcing plate on the flexible wiring substrate includes:
forming a third adhesive layer on the third cover film, wherein the first opening and the second opening both penetrate through the third adhesive layer; and
forming the reinforcing plate on the third adhesive layer;
wherein the total thickness H of the third adhesive layer and the reinforcing plate 1 15-500 μm, the height H of the first heat sink member 2 Is (H) 1 -10) μm, height H of the second heat sink part 3 Is (H) 1 -10)μm。
6. A flexible circuit board for a lens module, comprising:
the flexible circuit board comprises a flexible circuit board, wherein an accommodating groove, a first blind groove and a second blind groove are formed in the flexible circuit board, the first blind groove and the second blind groove correspond to the accommodating groove, the first blind groove, the second blind groove and the accommodating groove are respectively positioned on two opposite surfaces of the flexible circuit board, the first blind groove and the second blind groove respectively form a first heat-conducting column and a second heat-conducting column, the first heat-conducting column comprises a first heat-conducting part and a first heat-radiating part connected with the first heat-conducting part, the first heat-conducting part is positioned in the first blind groove, the first heat-radiating part protrudes out of the surface of the flexible circuit board, the second heat-conducting column comprises a second heat-conducting part and a second heat-radiating part connected with the second heat-conducting part, the second heat-conducting part is positioned in the second blind groove, and the second heat-radiating part protrudes out of the surface of the flexible circuit board;
the reinforcing plate is arranged on the flexible circuit substrate, a first opening and a second opening are formed in the reinforcing plate, and the first heat dissipation part and the second heat dissipation part are respectively positioned in the first opening and the second opening; and
the image sensor is positioned in the accommodating groove, electrically connected with the flexible circuit substrate and uniformly heated and conducted with the first heat-conducting column and the second heat-conducting column.
7. The flexible circuit board according to claim 6, wherein the first opening has a first inner wall, the second opening has a second inner wall, a distance between the first heat sink member and the first inner wall is greater than or equal to 50 μm, and a distance between the second heat sink member and the second inner wall is greater than or equal to 50 μm.
8. The flexible circuit board of claim 6, wherein the flexible circuit substrate includes a first cover film, a first adhesive layer, a first conductive trace layer, a second cover film, a second conductive trace layer, a second adhesive layer, and a third cover film, which are stacked in sequence, the accommodating groove sequentially penetrates through the first cover film and the first adhesive layer, the bottom of the accommodating groove corresponds to the first conductive trace layer, the first blind groove and the second blind groove sequentially penetrate through the third cover film, the second adhesive layer, the second conductive trace layer, and the second cover film, the bottoms of the first blind groove and the second blind groove correspond to the first conductive trace layer, the first heat dissipation portion and the second heat dissipation portion protrude out of the surface of the third cover film away from the second adhesive layer, and the image sensor is thermally connected to the first heat conduction pillar and the second heat conduction pillar through the first conductive trace layer.
9. The flexible circuit board of claim 8, further comprising:
the third adhesive layer is arranged on the third cover film, and the reinforcing plate is arranged on the third adhesive layer;
wherein the total thickness H of the third adhesive layer and the reinforcing plate 1 15-500 μm, height H of the first heat sink member 2 Is (H) 1 -10) μm, height H of the second heat sink part 3 Is (H) 1 -10)μm。
10. The flexible circuit board of claim 8, wherein the first conductive trace layer comprises a first base copper layer disposed on the second coverlay film and a first electroplated copper layer disposed on the first base copper layer, and the second conductive trace layer comprises a second base copper layer disposed on the second coverlay film and a second electroplated copper layer disposed on the second base copper layer.
CN202110667899.2A 2021-06-16 2021-06-16 Flexible circuit board for lens module and manufacturing method thereof Pending CN115484739A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202110667899.2A CN115484739A (en) 2021-06-16 2021-06-16 Flexible circuit board for lens module and manufacturing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202110667899.2A CN115484739A (en) 2021-06-16 2021-06-16 Flexible circuit board for lens module and manufacturing method thereof

Publications (1)

Publication Number Publication Date
CN115484739A true CN115484739A (en) 2022-12-16

Family

ID=84420072

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202110667899.2A Pending CN115484739A (en) 2021-06-16 2021-06-16 Flexible circuit board for lens module and manufacturing method thereof

Country Status (1)

Country Link
CN (1) CN115484739A (en)

Similar Documents

Publication Publication Date Title
KR100704936B1 (en) Printed Circuit Board Having Embedded Electronic Parts and Methods of Fabrication therefor
JP3910045B2 (en) Method for manufacturing electronic component internal wiring board
WO1985002515A1 (en) Printed-circuit board for mounting electronic element and method of manufacture thereof
US20020020916A1 (en) Semiconductor package and method for producing the same
US7808786B2 (en) Circuit board with cooling function
TWI692998B (en) Hot-pressed tin soldered circuit board and manufacturing method thereof
CN111050459A (en) Printed circuit board and optical module
JP4854770B2 (en) Printed circuit board unit and electronic device
US11588089B2 (en) Printed wiring board having thermoelectric emlement accommodatred therein
CN115484739A (en) Flexible circuit board for lens module and manufacturing method thereof
US20190373740A1 (en) Method for manufacturing printed wiring board
JP2012209590A (en) Electronic component mounting multilayer wiring board and manufacturing method of the same
US11367825B2 (en) Printed wiring board
JP2010003718A (en) Heat-dissipating substrate and its manufacturing method, and module using heat-dissipating substrate
CN114126189B (en) Circuit board with embedded element and manufacturing method thereof
JP6633151B2 (en) Circuit module
JP6969891B2 (en) Manufacturing method of printed wiring board
JP2014149489A (en) Light emission device and electronic equipment
US20200051887A1 (en) Semiconductor device, printed circuit board, electronic device, and image pickup apparatus
JP2007299870A (en) Relay substrate, and three-dimensional electronic circuit structure using same
JP2016207956A (en) Manufacturing method of hollow package, manufacturing method of solid state image sensor, hollow package, and solid state image sensor
CN114126187B (en) Circuit board with embedded heat dissipation structure and manufacturing method thereof
TWI768914B (en) Circuit board with heat dissipation function and manufacturing method
US11553616B2 (en) Module with power device
US20240196512A1 (en) Circuit board with embedded electronic component and manufacturing method thereof

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination