KR20220017835A - Grinding method - Google Patents

Abstract

A workpiece can be grinded to have a uniform thickness. A workpiece is grinded to have a uniform thickness by performing: an in-feed grinding step of performing in-feed grinding on a workpiece (14) held by a holding surface (211) by bringing a first grinding wheel (310) into close contact with to the holding surface (211) according to the horizontal positional relationship between the holding surface (211) and the first grinding wheel (310) so that the lower surface (312) of the first grinding wheel (310) passes through the center (2000) of the upper surface (210) of a stage (21), and a creep-feed grinding step in which a second grinding wheel (320) is positioned further outward in a horizontal direction than above the holding surface (211), a lower surface (322) of the second grinding wheel (320) is positioned lower than an upper surface (140) of the workpiece (14) by a predetermined distance, the second grinding wheel (320) and a holding means (2) are moved in a creep-feed direction in which the second grinding wheel and the holding means approach each other, and creep-feed grinding is performed on the workpiece (14) on the lower surface (322) and a side surface (323) of the second grinding wheel (320).

Description

GRINDING METHOD

The present invention relates to a grinding method.

As disclosed in Patent Document 1, a grinding device for grinding a rectangular plate-shaped work held on a holding surface using a grinding wheel is positioned so that the annular grinding wheel passes through the center of the plate-shaped work, and the center of the grinding wheel to grind the plate-shaped work that rotates around the center of the plate-shaped work as an axis by rotating the grinding wheel in the direction approaching the plate-shaped work.

During the grinding process of the plate-shaped workpiece, the contact area of the lower surface of the grinding wheel in contact with the plate-shaped workpiece increases or decreases repeatedly. And the load applied to a plate-shaped workpiece|work and a grinding wheel is large in the part with a large contact area with a plate-shaped workpiece|work compared with the part with a small contact area. For this reason, the quantity which a plate-shaped workpiece|work sinks and grinds decreases. As a result, as for the plate-shaped workpiece|work which contacts a grinding wheel, the problem that the part with the larger contact area becomes thicker than the smaller part generate|occur|produces.

Patent Document 1: Japanese Patent Laid-Open No. 2015-205358

Therefore, the grinding apparatus which hold|maintains a square plate-shaped workpiece|work by the holding surface and grinds it with a grinding wheel has the subject of making the plate-shaped workpiece|work after grinding into uniform thickness.

The present invention includes a holding means capable of holding a workpiece on a holding surface and rotating about the center of the holding surface as an axis; A grinding means having a second grinding wheel mounted on the tip of the spindle, an advancing and retreating mechanism for selectively bringing the first grinding wheel or the second grinding wheel closer to the holding surface, the holding unit and the grinding unit being relatively horizontal A grinding method for grinding a workpiece using a grinding device, comprising: horizontal movement means for moving in the direction; and vertical movement means for relatively moving the holding means and the grinding means in a direction perpendicular to the holding surface. , In the relationship between the horizontal position of the grinding wheel and the holding surface such that the lower surface of the grinding wheel of either the first or the second grinding wheel passes through the center of the holding surface, the grinding wheel is An in-feed grinding process of in-feed grinding the workpiece held on the holding surface by moving it in a direction approaching the holding surface, and the grinding wheel on the other side not used in the in-feed grinding process In the horizontal direction outside the upper surface of the holding surface, the lower surface of the grinding wheel is positioned a predetermined distance lower than the upper surface of the workpiece, and the grinding wheel and the holding means are moved in the horizontal direction relative to each other in the creep feed direction. It is a grinding method of a workpiece, which includes a creep feed grinding process of creep-feed grinding the workpiece from the lower surface and the side surface of the grinding wheel by approaching it with a

It is preferable that the to-be-processed object in the said grinding method has a polygonal shape, and the said holding surface is a shape following the shape of a to-be-processed object.

As for the said grinding method, it is preferable that the said infeed grinding process uses the said 1st grinding wheel, and it is preferable that the said creep-feed grinding process uses the said 2nd grinding wheel of a larger diameter than the said 1st grinding wheel.

In the grinding method, the holding means has a plurality of the holding surfaces disposed on the upper surface, and in the in-feed grinding process, the center of the upper surface is positioned so that the grinding wheel passes, and the upper surface is the center of the upper surface as an axis It is preferable to rotate and grind the to-be-processed object held on each said holding surface.

In the grinding method, the plurality of the holding surfaces are arranged in a horizontal direction perpendicular to the creep feed direction, and in the creep feed grinding step, the holding surfaces are arranged in a horizontal direction orthogonal to the creep feed direction. is fixed so as not to rotate in a state of being in a state of being rotated, and the grinding wheel and the holding unit disposed outside the upper surface of the holding unit are relatively approached in the creep feed direction, and a plurality of workpieces are disposed on the lower surface and the side surface of the grinding wheel. It is preferable to grind

In the above grinding method, it is preferable that the holding surface is a rectangle having a long side and a short side, and the long side is extended in the creep feed direction to arrange a plurality of the holding surfaces in a horizontal direction orthogonal to the creep feed direction. .

In the grinding apparatus of the present invention, by performing creep-feed grinding after in-feed grinding, it is possible to grind a rectangular to-be-processed object to a uniform thickness. In particular, when the workpiece is a rectangular plate-shaped workpiece, the long side of the plate-like workpiece is extended in the creep feed direction to approach the second grinding wheel from the short side during creep-feed grinding, so that the workpiece can be finished with a uniform thickness. .

BRIEF DESCRIPTION OF THE DRAWINGS It is a perspective view which shows the whole grinding apparatus.
2 is a cross-sectional view showing a grinding means and a holding means.
It is a top view which shows the positional relationship of the holding means and grinding means at the time of infeed grinding.
It is a top view which shows the positional relationship of the holding means and grinding means at the time of infeed grinding.
It is a top view which shows the positional relationship of the holding means and grinding means at the time of infeed grinding.
It is a top view which shows the positional relationship of the holding means and grinding means at the time of creep-feed grinding.
It is a top view which shows the positional relationship of the holding means and grinding means at the time of creep feed grinding.
It is a top view which shows the positional relationship of the holding means and grinding means at the time of creep-feed grinding.
It is a perspective view which shows the whole grinding apparatus.

1 grinding device

The grinding apparatus 1 shown in FIG. 1 is a grinding apparatus which grinds the to-be-processed object 14 using the grinding means 3 . The workpiece 14 is, for example, a rectangular parallelepiped thin plate. The grinding apparatus 1 is provided with the base 10 extended in the Y-axis direction, and the column 11 which stands on the +Y-direction side in the base 10, and is provided.

On the side surface of the column 11 on the -Y direction side, vertical movement means 4 for supporting the grinding means 3 so as to be able to move up and down is arranged. The vertical movement means 4 includes a ball screw 40 having a rotation shaft 45 in the Z-axis direction, a pair of guide rails 41 arranged parallel to the ball screw 40, and a rotation shaft 45 . A Z-axis motor 42 for rotating the ball screw 40 with the axis of , and a holder 44 connected to the lifting plate 43 to support the grinding means 3 .

When the ball screw 40 is driven by the Z-axis motor 42 and the ball screw 40 rotates about the rotation shaft 45 as an axis, the lifting plate 43 is guided to the guide rail 41 accordingly. It moves up and down in the Z-axis direction, and the grinding means 3 held in the holder 44 moves in the Z-axis direction.

By using the vertical movement means (4) to move the grinding means (3) up and down in the Z-axis direction, the holding means (2) and the grinding means (3) are relatively moved in a direction perpendicular to the holding surface (211). can

The grinding means 3 includes a spindle 38 having a rotation shaft 35 in the Z-axis direction, a housing 39 rotatably supporting the spindle 38, and a spindle 38 with the rotation shaft 35 as an axis. ) is provided with a spindle motor 30 for rotationally driving.

A cylinder 63 is connected to the spindle 38 as shown in FIG. 2 . The cylinder 63 includes a large-diameter portion 630 and a small-diameter portion 631 formed at the lower end of the large-diameter portion 630 . A first mount 331 is connected to the lower end of the small diameter portion 631 . In addition, inside the large diameter portion 630, the rod 620 and the disk piston 621 connected to the upper end of the rod 620 is accommodated, the second mount 332 is connected to the lower end of the rod 620. . Further, between the lower surface of the large-diameter portion 630 and the first mount 331 , a guide portion 449 connecting the two is disposed, and the second mount 332 has a through hole through which the guide portion 449 passes. this is formed

A first grinding wheel 31 is mounted on the first mount 331 . In addition, a second grinding wheel 32 is mounted on the second mount 332 .

As shown in FIG. 1, the 1st grinding wheel 31 is the 1st wheel base 311 and the some 1st grinding grindstone 310 of the substantially rectangular parallelepiped shape arranged in an annular shape on the lower surface of the 1st wheel base 311. ) is provided.

The second grinding wheel 32 includes a second wheel base 321 and a plurality of second grinding wheels 320 having a substantially rectangular parallelepiped shape arranged in an annular shape on the lower surface of the second wheel base 321 . The ring formed by the plurality of second grinding wheels 320 has the same diameter as that surrounding the ring formed by the plurality of first grinding wheels 310 . In addition, the ring which the 2nd grinding grindstone 320 makes is an annular ring concentric with the 1st grinding grindstone 310.

The particle diameter of the 1st grinding grindstone 310 and the particle diameter of the 2nd grinding grindstone 320 may be the same or different.

By rotating the spindle 38 using the spindle motor 30 , the first grinding wheel 31 and the second grinding wheel 32 are rotated.

The rod 620 and the disk piston 621 shown in FIG. 2 constitute the upper and lower means 62 , and the upper and lower means 62 can move up and down in the space inside the large-diameter portion 630 in the Z-axis direction. The disk piston 621 is connected to the air supply source 60 , and a switching control unit 61 is disposed between the disk piston 621 and the air supply source 60 . The switching control unit 61 is, for example, a control valve, and has a function of switching whether the air supplied from the air supply source 60 is ejected from above the disk piston 621 or from below the disk piston 621 .

For example, when the air supplied from the air supply source 60 is switched to be injected in the +Z direction from the lower side of the disk piston 621 by using the switching control unit 61 and the air is injected from the lower side of the disk piston 621, the disk The piston 621 is elastically supported in the +Z direction by air so that the disk piston 621, the rod 620, and the second mount 332 are guided by the guide part 449 and integrally rises in the +Z direction. . Thereby, the 2nd mount 332 rises in the +Z direction, and the 1st grinding grindstone 310 comes closer to the holding surface 211 rather than the 2nd grinding grindstone 320.

In addition, when the air supplied from the air supply source 60 is injected from the upper side of the disk piston 621 in the -Z direction by using the switching control unit 61 to inject air from above the disk piston 621, the disk The piston 621 is elastically supported in the -Z direction by air so that the disk piston 621, the rod 620, and the second mount 332 are guided by the guide part 449 while integrally descending in the -Z direction. . Thereby, the 2nd mount 332 descend|falls in -Z direction, and the 2nd grinding grindstone 320 comes closer to the holding surface 211 rather than the 1st grinding grindstone 310.

Thus, the air supply source 60, the switching control part 61, and the up-and-down means 62 control the relationship of the height position of the 1st grinding grindstone 310 and the 2nd grinding grindstone 320, The 1st grinding wheel (310) or the 2nd grinding wheel 320 comprises the advancing and retreating mechanism 6 which selectively approaches the holding surface 211.

On the base 10, as shown in FIG. 1, the holding means 2 is arrange|positioned. The holding means 2 is, for example, a chuck table holding the workpiece 14 .

The holding means 2 includes a disk-shaped stage 21 and a frame body 22 for supporting the stage 21 . On the upper surface 210 of the stage 21 , for example, a plurality of (four in FIG. 1 ) holding surfaces 211 on which the workpiece 14 is held are arranged. The holding surface 211 is, for example, formed in a rectangular shape having a long side 212 extending in the Y-axis direction and a short side 213 extending in the X-axis direction, and is located on the upper surface 210 of the stage 21 by the X axis. arranged to be aligned in the direction.

A suction source (not shown) is connected to each holding surface 211 . For example, by exerting a suction force using the suction source in a state in which the workpiece 14 is placed on the holding surface 211 , the generated suction force is transmitted to the holding surface 211 and the workpiece 14 disposed on the holding surface 211 . The workpiece 14 is sucked from the holding surface 211 . Thereby, the to-be-processed object 14 can be sucked and held by the holding surface 211 .

Inside the base 10, the inner base 100 is disposed. On the inner base 100 , horizontal moving means 5 for moving the holding means 2 in the horizontal direction are arranged.

The horizontal moving means 5 includes a ball screw 50 having a rotation shaft 55 in the Y-axis direction, a pair of guide rails 51 arranged in parallel with the ball screw 50 , and a ball screw 50 . ) connected to the Y-axis motor 52 that rotates the ball screw 50 with the rotating shaft 55 as an axis, and the nut at the bottom is screwed to the ball screw 50 and Y along the guide rail 51 A movable plate 53 that moves in the axial direction is provided.

When the ball screw 50 is driven by the Y-axis motor 52 and the ball screw 50 rotates about the rotation shaft 55 as an axis, the movable plate 53 is guided by the guide rail 51 to the Y-axis direction. It is configured to move horizontally.

A rotation means 26 for rotating the holding means 2 is disposed on the upper surface 530 of the movable plate 53 , and an annular base 23 is disposed around the rotation means 26 .

For example, three (two are shown in FIG. 1) through-holes 230 are formed at positions at equal intervals on the same circumference of the base 23, and the upper surface 530 of the movable plate 53 is formed. ), three supporting columns 24 (two are shown in Fig. 1) supporting the base 23 are erected and installed. Each of the through-holes 230 is penetrated by each support post 24 , and the support post 24 is fixed to the upper surface 530 of the movable plate 53 . Each support post 24 has, for example, an expansion and contraction mechanism (not shown), and the inclination of the holding means 2 is adjusted when each support post 24 moves up and down appropriately in the Z-axis direction.

When the movable plate 53 moves in the Y-axis direction, the rotation means 26 , the base 23 , and the holding means 2 supported by the movable plate 53 are integrated with the movable plate 53 in the Y-axis direction. It moves horizontally in the axial direction.

By horizontally moving the holding means 2 in the Y-axis direction using the horizontal moving means 5 , the holding means 2 and the grinding means 3 can be relatively moved in the horizontal direction.

The rotating means 26 is equipped with a motor etc. which are not shown in figure, for example. By operating the motor, it becomes possible to rotate the holding means 2 with the axis in the Z-axis direction passing through the center 2000 as an axis.

Around the holding means (2), a cover (27) and a corrugated box (28) connected to the cover (27) so as to be stretchable are arranged. For example, when the holding means 2 moves in the Y-axis direction, the cover 27 moves together with the holding means 2 in the Y-axis direction so that the pleated box 28 expands and contracts.

2 grinding method

(Infeed grinding process)

The method of performing the grinding process of the to-be-processed object 14 using the grinding device 1 is demonstrated. First, by supplying air from the air supply source 60 while operating the switching control unit 61 of the advancing and retreating mechanism 6 in advance, the air is sprayed from the lower side of the disk piston 621 in the +Z direction, the second mount 332 raise the Thereby, the 2nd grinding wheel 320 moves in the +Z direction with respect to the 1st grinding grindstone 310, and the 1st grinding grindstone 310 approaches the holding surface 211 rather than the 2nd grinding grindstone 320. become one state.

And the to-be-processed object 14 is arrange|positioned on each of the some holding surface 211 of the holding means 2, and the said suction source is operated. Thereby, the generated suction force is transmitted to the holding surface 211 , and the workpiece 14 is suctioned and held by the holding surface 211 .

In addition, the holding unit 2 is rotated using the rotating unit 26 to rotate the workpiece 14 held on the holding surface 211 , and the first grinding wheel 310 using the spindle motor 30 . ) and the second grinding wheel 320 is rotated.

Next, the holding means 2 is moved in the +Y direction using the horizontal movement means 5, and as shown in FIG. 3 , the lower surface 312 of the first grinding wheel 310 is the upper surface of the stage 21 . The workpiece 14 is positioned at the same position as passing through the center 2000 of 210 .

The state in which the workpiece 14 held by the holding surface 211 rotates about the center 2000 as the rotation center, and the first grinding wheel 310 rotates about the rotation shaft 35 as the axis , the grinding means 3 is lowered in the -Z direction by using the vertical movement means 4 . When the holding surface 211 is brought closer to the holding surface 211 by lowering the first grinding wheel 310 in the -Z direction, the lower surface 312 of the first grinding wheel 310 is in contact with the upper surface 140 of the workpiece 14 . . In a state where the lower surface 312 of the first grinding wheel 310 is in contact with the upper surface 140 of the work piece 14, the work piece ( 14) is infeed grinding. 4 and 5, the workpiece 14 held by the holding surface 211 is shown in contact with the first grinding wheel 310 while rotating about the center 2000 of the upper surface 210 as an axis.

During infeed grinding of the workpiece 14, for example, in the upper surface 210 of the stage 21, the measurement trajectory 219 which is a circumferential trajectory passing through the measurement surface 218 formed in the same plane as the holding surface 211. ) on the upper surface 140 of the object 14, a height gauge not shown is placed, and the height of the holding surface 211 and the height of the upper surface 140 of the object 14 are measured. , the thickness of the workpiece 14 is measured by calculating the difference between the heights. If the workpiece 14 has been ground to a predetermined thickness, the infeed grinding is terminated.

(Creep Feed Grinding Process)

After in-feed grinding as described above, the grinding means 3 is raised in the +Z direction using the vertical movement means 4 shown in FIG. 1 , and the first grinding wheel 310 is removed from the workpiece 14 . to separate Then, the holding means 2 is moved in the -Y direction by using the horizontal moving means 5 to move the first grinding wheel 310 and the second grinding wheel 320 from above the holding surface 211 in the horizontal direction. retreat to the outside.

Thereafter, the second grinding wheel 320 is lowered with respect to the first grinding wheel 310 using the advancing and retreating mechanism 6, so that the second grinding wheel 320 is a holding surface (rather than the first grinding wheel 310) 211) is approached.

Subsequently, the grinding means 3 is lowered in the -Z direction using the vertical movement means 4 so that the lower surface 322 of the second grinding wheel 320 is lower than the upper surface 140 of the workpiece 14 in advance. The second grinding wheel 320 is positioned at the same height as being lowered by a predetermined distance.

Further, by rotating the holding means 2 by an appropriate angle using the rotating means 26, the four holding surfaces 211 are arranged in the X-axis direction as shown in Fig. 6, and held in this state. The rotation of the holding means 2 by the rotating means 26 is stopped so that the means 2 does not rotate. Thereby, the four holding surfaces 211 are fixed in a state arranged in the X-axis direction.

Then, the holding means 2 is moved in the +Y direction using the horizontal moving means 5 . Thereby, the 2nd grinding grindstone 320 and the holding means 2 disposed on the outside of the upper surface 210 of the stage 21 move in the creep feed direction (Y-axis direction) relative to each other in the horizontal direction. It approaches, and the to-be-processed object 14 hold|maintained by the 2nd grinding wheel 320 and the holding surface 211 approaches in the Y-axis direction.

As the 2nd grinding wheel 320 and the to-be-processed object 14 hold|maintained by the holding surface 211 approach in the Y-axis direction, as shown in FIG. 7, the side surface 323 of the 2nd grinding wheel 320 and When the lower surface 322 contacts the upper surface 140 of the workpiece 14, the workpiece 14 is subjected to creep feed grinding. As shown in Fig. 8, if the holding means 2 has moved in the +Y direction to a horizontal position such that the entire surfaces of the four workpieces 14 held on the holding surfaces 211 are ground, creep feed grinding is performed. It ends.

In the grinding apparatus 1, by performing creep-feed grinding after performing in-feed grinding, the rectangular to-be-processed object 14 can be grind-processed to uniform thickness. In particular, when the workpiece 14 is a rectangular plate-shaped workpiece, by approaching the second grinding wheel 320 from the short side 213 during creep feed grinding, the workpiece 14 can be finished to a uniform thickness. can

Moreover, in the said grinding method, after infeed grinding of the to-be-processed object 14 using the 2nd grinding wheel 320 is performed, creep-feed grinding of the to-be-processed object 14 using the 1st grinding grindstone 310 is carried out. may be done.

Note that the upper surface 210 of the stage 21 may not have a configuration in which the rectangular holding surfaces 211 are arranged in the same direction. For example, each holding surface 211 is rectangular, the directions may not be aligned in one direction, and the sizes of the rectangles may not match. In addition, the shape of each holding surface 211 may be a polygon other than a rectangle, and a circular shape or an ellipse may be sufficient as it.

The grinding apparatus 1 may be equipped with the 2nd holding means 8 shown in FIG. 9 instead of the holding means 2, and may be provided. The 2nd holding means 8 is provided with the disk-shaped suction part 80 and the frame body 81 which supports the suction part 80, as shown in FIG. The upper surface of the suction part 80 is a holding surface 800 on which the disk-shaped second to-be-processed object 15 is held, and the upper surface 810 of the frame body 81 is formed flush with the holding surface 800 . .

In addition, the suction part 80 is connected to a suction source (not shown). For example, by operating the suction source in a state in which the second to-be-processed object 15 is arranged on the holding surface 800 , the generated suction force is transmitted to the holding surface 800 , and the second to-be-processed object 15 is transferred to the holding surface 800 . ) can be aspirated and maintained.

When grinding the 2nd to-be-processed object 15 hold|maintained by the 2nd holding means 8, first, using the advancing and retreating mechanism 6 in advance, the 1st grinding grindstone 310 is compared with the 2nd grinding grindstone 320. The second workpiece 15 is held on the holding surface 800 of the second holding means 8 while being brought close to the holding surface 800 .

In addition, the first grinding wheel 310 and the second grinding wheel 320 are rotated using the spindle motor 30 , and the second blood held in the second holding unit 8 using the rotating unit 26 is used. The workpiece 15 is rotated.

In addition, by using the horizontal moving means 5 to move the second holding means 8 in the +Y direction, the lower surface 312 of the first grinding wheel 310 is the center 8000 of the holding surface 800 The relationship of the horizontal position of the 2nd holding means 8 and the grinding means 3 is adjusted so that it passes.

And, by using the vertical movement means (4) to lower the grinding means (3) in the -Z direction to bring the first grinding wheel 310 close to the holding surface 800, the lower surface of the first grinding wheel 310 ( 312) and the second to-be-processed object 15 held on the holding surface 800 are brought into contact. Thereby, the 2nd to-be-processed object 15 is infeed-ground.

After the in-feed grinding is finished, the grinding means 3 is raised in the +Z direction using the vertical movement means 4, and the first grinding wheel 310 and the second grinding wheel 320 are moved to the second workpiece 15 ) and spaced apart in the +Z direction. Further, by using the horizontal movement means 5, the second workpiece 15 held by the second holding means 8 is moved in the -Y direction, and the second workpiece 15 is moved to the first grinding wheel 310 ) and the second grinding wheel 320 is spaced apart in the -Y direction. Thereby, the lower surface 322 of the 2nd grinding wheel 320 is located outward in the horizontal direction rather than the upper side of the holding surface 800 .

After that, the second grinding wheel 320 is brought closer to the holding surface 800 than the first grinding wheel 310 by using the advancing and retreating mechanism 6, and the grinding means 3 using the vertical moving means 4 by moving in the -Z direction so that the lower surface 322 of the second grinding wheel 320 is lower than the upper surface 150 of the second workpiece 15 by a predetermined distance, the height position of the second grinding wheel 320 is Adjust.

Then, the second workpiece 15 held by the second holding means 8 is moved in the +Y direction by using the horizontal moving means 5 , and the second grinding wheel 320 and the second holding means 8 are moved. ) is relatively approached in the creep feed direction. Thereby, the lower surface 322 and the side surface 323 of the 2nd grinding wheel 320 come into contact with the upper surface 150 of the 2nd to-be-processed object 15, and the 2nd to-be-processed object 15 is creep-feed-ground.

Even with the disk-shaped second to-be-processed object 15, by selecting the 2nd holding means 8 which has the holding surface 800 of the shape suitable for the shape, and performing in-feed grinding and creep-feed grinding, the 2nd to-be-processed object (15) can be grinded to a uniform thickness.

In addition, in the above grinding method, after infeed grinding of the second to-be-processed object 15 using the 2nd grinding wheel 320 is performed, the 2nd to-be-processed object 15 using the 1st grinding grindstone 310 is used. of creep feed grinding may be performed.

Further, for example, even when a plurality of square-shaped chips are formed on the upper surface 150 of the second to-be-processed object 15 and the chips are sealed with resin, after infeed grinding the resin in the same manner By exposing the chip by creep-feed grinding, grinding marks in the same direction can be formed on the exposed surface of the chip.

1: grinding device 10: base
100: inner base 2: retaining means
21: stage 210: top surface of the stage
211: holding surface 212: long side
213: short side 22: frame body
220: upper surface of the frame body 23: base
230: through hole 24: support pillar
26: rotation means 27: cover
28: pleated box 2000: center
3: grinding means 30: spindle
38: spindle motor 39: housing
33: mount 31: first grinding wheel
310: first grinding wheel 311: first wheel base
312: bottom 313: side
32: second grinding wheel 320: second grinding wheel
321: second wheel base 322: lower surface
323: side 4: vertical movement means
40: ball screw 41: guide rail
42: Z-axis motor 43: lift plate
44: holder 45: rotation shaft
5: horizontal moving means 50: ball screw
51: guide rail 52: Y-axis motor
53: movable plate 530: upper surface of the movable plate
6: advance and retreat mechanism 60: air supply
61: switching control unit 62: up and down means
620: rod 621: disk piston
63: cylinder 630: large diameter part
631: small diameter portion 449: guide portion
8: second holding means 80: suction unit
800: holding surface 81: frame body
810: upper surface of the frame 8000: center
14: workpiece 140: upper surface of the workpiece
15: second to-be-processed object 150: upper surface of second to-be-processed object

Claims (6)

Holding means for holding the workpiece on the holding surface and rotatable about the center of the holding surface as an axis; a grinding means mounted on the tip of the spindle, a forward/backward mechanism for selectively bringing the first or second grinding grindstones closer to the holding surface, and moving the holding means and the grinding means in a relatively horizontal direction A grinding method for grinding a workpiece using a grinding device, comprising: horizontal moving means; and vertical moving means for relatively moving the holding means and the grinding means in a direction perpendicular to the holding surface;
In the relationship between the horizontal position of the grinding wheel and the holding surface such that the lower surface of the grinding wheel of either the first grinding wheel or the second grinding wheel passes through the center of the holding surface, an in-feed grinding process of in-feed grinding the workpiece held on the holding surface by moving it in a downward direction approaching the holding surface;
The other side of the grinding wheel not used in the in-feed grinding process is positioned in a horizontal direction outside the upper side of the holding surface, and the lower surface of the grinding wheel is positioned a predetermined distance lower than the upper surface of the workpiece, the grinding wheel and the A creep feed grinding process of creep-feed grinding the workpiece from the lower surface and the side surface of the grinding wheel by approaching the holding means in the creep-feed direction, which is a relative movement direction in the horizontal direction to each other. The grinding method of the workpiece. According to claim 1,
The workpiece is a polygon, and the holding surface is a shape that follows the shape of the workpiece, the grinding method of the workpiece. 3. The method of claim 1 or 2,
In the infeed grinding process, the first grinding wheel is used,
In the said creep-feed grinding process, the grinding method of what uses the said 2nd grinding wheel of a diameter larger than the said 1st grinding wheel. 3. The method of claim 1 or 2,
The holding means has a plurality of the holding surfaces disposed on the upper surface,
In the infeed grinding process, the center of the upper surface is positioned so that the grinding wheel passes, and the upper surface is rotated about the center of the upper surface as an axis to grind the workpiece held on each of the holding surfaces, grinding method. 5. The method of claim 4,
The plurality of the holding surfaces are arranged to be arranged in a horizontal direction orthogonal to the creep feed direction,
In the creep-feed grinding step, the holding surface is fixed so as not to rotate in a state in which it is arranged in a horizontal direction perpendicular to the creep-feed direction, and the grinding wheel is arranged outside the upper surface of the holding means in the horizontal direction; The grinding method according to claim 1, wherein the holding means is relatively approached in the creep feed direction to grind the plurality of workpieces on the lower surface and the side surface of the grinding wheel. 4. The method of claim 3,
The holding surface is a rectangle having a long side and a short side,
The long side is extended in the creep feed direction to arrange a plurality of the holding surfaces in a horizontal direction orthogonal to the creep feed direction.

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