CN114055270A - Grinding method - Google Patents

Grinding method Download PDF

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Publication number
CN114055270A
CN114055270A CN202110855032.XA CN202110855032A CN114055270A CN 114055270 A CN114055270 A CN 114055270A CN 202110855032 A CN202110855032 A CN 202110855032A CN 114055270 A CN114055270 A CN 114055270A
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CN
China
Prior art keywords
grinding
holding
workpiece
unit
whetstone
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202110855032.XA
Other languages
Chinese (zh)
Inventor
宫本弘树
中野恵助
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
Original Assignee
Disco Corp
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Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of CN114055270A publication Critical patent/CN114055270A/en
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00—Drives or gearings; Equipment therefor
    • B24B47/10—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0076—Other grinding machines or devices grinding machines comprising two or more grinding tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B24B41/068—Table-like supports for panels, sheets or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00—Drives or gearings; Equipment therefor
    • B24B47/10—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces
    • B24B47/12—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces by mechanical gearing or electric power
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00—Drives or gearings; Equipment therefor
    • B24B47/20—Drives or gearings; Equipment therefor relating to feed movement
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/04—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor involving a rotary work-table

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

A grinding method is provided for grinding a workpiece to a uniform thickness. The following steps are carried out: a plunge-cut grinding step of plunge-cutting the workpiece (14) held by the holding surface by bringing the 1 st grinding burr close to the holding surface in a horizontal positional relationship between the 1 st grinding burr and the holding surface (211) such that the lower surface (312) of the 1 st grinding burr (310) passes through the center (2000) of the upper surface (210) of the stage (21); and a slow-feed grinding step of positioning the 2 nd grinding whetstone (320) at a position outside the holding surface in the horizontal direction and positioning the lower surface (322) of the 2 nd grinding whetstone at a position lower than the upper surface (140) of the workpiece by a predetermined distance, moving the 2 nd grinding whetstone and the holding unit (2) in a slow-feed direction relatively approaching each other, and performing slow-feed grinding on the workpiece by using the lower surface (322) and the side surface (323) of the 2 nd grinding whetstone.

Description

Grinding method
Technical Field
The present invention relates to a grinding method.
Background
As disclosed in patent document 1, a grinding apparatus grinds a quadrangular plate-shaped workpiece held on a holding surface by using a grinding wheel, positions the grinding wheel so that the annular grinding wheel passes through the center of the plate-shaped workpiece, rotates the grinding wheel about the center of the grinding wheel, moves the grinding wheel in a direction approaching the plate-shaped workpiece, and grinds the plate-shaped workpiece rotated about the center of the plate-shaped workpiece.
In the grinding of the plate-shaped workpiece, the contact area of the lower surface of the grinding whetstone and the plate-shaped workpiece is repeatedly increased and decreased. Further, a portion having a large contact area with the plate-shaped workpiece applies a large load to the plate-shaped workpiece and the grinding stone, as compared with a portion having a small contact area with the plate-shaped workpiece. Therefore, the plate-shaped workpiece sinks, and the amount of grinding decreases. As a result, the following problems occur: with respect to the plate-shaped workpiece that contacts the grinding stone, the thickness of the portion having a large contact area is thicker than the portion having a small contact area.
Patent document 1: japanese patent laid-open publication No. 2015-205358
Therefore, a grinding apparatus for grinding a rectangular plate-shaped workpiece by a grinding wheel while holding the workpiece by a holding surface has a problem that the plate-shaped workpiece after grinding has a uniform thickness.
Disclosure of Invention
The present invention is a grinding method for grinding a workpiece using a grinding apparatus, the grinding apparatus including: a holding unit that holds a workpiece on a holding surface and is rotatable about a center of the holding surface; a grinding unit, wherein an annular 1 st grinding wheel and a concentric annular 2 nd grinding wheel surrounding the diameter of the 1 st grinding wheel are arranged at the front end of the main shaft; a driving and reversing mechanism for selectively bringing the 1 st grindstone or the 2 nd grindstone close to the holding surface; a horizontal moving unit that moves the holding unit and the grinding unit in a horizontal direction relative to each other; and a vertical movement unit that relatively moves the holding unit and the grinding unit in a direction perpendicular to the holding surface, wherein the grinding method includes the steps of: a plunge grinding step of moving the grinding wheel closer to a lower side of the holding surface in accordance with a horizontal position of the holding surface with respect to the grinding wheel such that a lower surface of the grinding wheel of either the 1 st grinding wheel or the 2 nd grinding wheel passes through a center of the holding surface, and plunge grinding the workpiece held by the holding surface; and a slow feed grinding step of positioning the other grinding whetstone, which is not used in the plunge grinding step, at a position outside the upper side of the holding surface in the horizontal direction and positioning the lower surface of the grinding whetstone at a position lower than the upper surface of the workpiece by a predetermined distance, bringing the grinding whetstone and the holding unit closer to each other in a slow feed direction which is a relative movement direction in the horizontal direction, and performing slow feed grinding of the workpiece by using the lower surface and the side surface of the grinding whetstone.
Preferably, the workpiece in the grinding method is a polygon, and the shape of the holding surface follows the shape of the workpiece.
In the above-described grinding method, it is preferable that the 1 st grinding whetstone is used in the plunge grinding step, and the 2 nd grinding whetstone having a larger diameter than the 1 st grinding whetstone is used in the creep feed grinding step.
In the above grinding method, it is preferable that the holding means has a plurality of holding surfaces arranged on an upper surface, and the plunge grinding step is performed by positioning the grinding whetstone so as to pass through a center of the upper surface, and grinding the workpiece held by each of the holding surfaces by rotating the upper surface around the center of the upper surface.
In the above-described grinding method, it is preferable that the plurality of holding surfaces are arranged in a horizontal direction perpendicular to the slow feed direction, and in the slow feed grinding step, the holding surfaces are fixed so as not to rotate in a state of being arranged in a horizontal direction perpendicular to the slow feed direction, the grinding whetstone arranged at a position outside the upper surface of the holding means in the horizontal direction and the holding means are relatively brought close to each other in the slow feed direction, and the plurality of workpieces are ground by the lower surface and the side surface of the grinding whetstone.
In the above-described grinding method, it is preferable that the holding surface is a rectangle having long sides and short sides, the long sides extend in the slow feeding direction, and the plurality of holding surfaces are arranged in a horizontal direction perpendicular to the slow feeding direction.
In the grinding apparatus of the present invention, the workpiece having a rectangular shape can be ground to a uniform thickness by performing the plunge grinding and then performing the creep feed grinding. In particular, when the workpiece is a rectangular plate-like workpiece, the workpiece can be finished to a uniform thickness by extending the long side of the plate-like workpiece in the creep feed direction and approaching the 2 nd grinding wheel from the short side during creep feed grinding.
Drawings
Fig. 1 is a perspective view showing the whole of the grinding apparatus.
Fig. 2 is a sectional view showing the grinding unit and the holding unit.
Fig. 3 is a plan view showing a positional relationship between the holding unit and the grinding unit at the time of plunge grinding.
Fig. 4 is a plan view showing a positional relationship between the holding unit and the grinding unit at the time of plunge grinding.
Fig. 5 is a plan view showing a positional relationship between the holding unit and the grinding unit at the time of plunge grinding.
Fig. 6 is a plan view showing a positional relationship between the holding unit and the grinding unit at the time of the creep feed grinding.
Fig. 7 is a plan view showing a positional relationship between the holding unit and the grinding unit at the time of the creep feed grinding.
Fig. 8 is a plan view showing a positional relationship between the holding unit and the grinding unit at the time of the creep feed grinding.
Fig. 9 is a perspective view showing the whole of the grinding apparatus.
Description of the reference symbols
1: a grinding device; 10: a base; 100: an inner base; 2: a holding unit; 21: a stage; 210: the upper surface of the carrier; 211: a holding surface; 212: a long side; 213: a short side; 22: a frame body; 220: an upper surface of the frame; 23: a base station; 230: a through hole; 24: a support column; 26: a rotation unit; 27: a cover; 28: creasing; 2000: a center; 3: a grinding unit; 30: a main shaft; 38: a spindle motor; 39: a housing; 33: a mounting seat; 31: 1, grinding a grinding wheel; 310: 1, grinding a grinding tool; 311: 1, grinding wheel base; 312: a lower surface; 313: a side surface; 32: 2, grinding the grinding wheel; 320: 2, grinding the grinding tool; 321: 2, grinding wheel base; 322: a lower surface; 323: a side surface; 4: a vertical moving unit; 40: a ball screw; 41: a guide rail; 42: a Z-axis motor; 43: a lifting plate; 44: a holder; 45: a rotation axis; 5: a horizontal moving unit; 50: a ball screw; 51: a guide rail; 52: a Y-axis motor; 53: a movable plate; 530: an upper surface of the movable plate; 6: an advancing and retreating mechanism; 60: an air supply source; 61: a switching control unit; 62: an upper and lower unit; 620: a rod; 621: a circular plate piston; 63: a cylinder; 630: a large diameter portion; 631: a small diameter part; 449: a guide section; 8: a 2 nd holding unit; 80: a suction part; 800: a holding surface; 81: a frame body; 810: an upper surface of the frame; 8000: a center; 14: a workpiece; 140: an upper surface of the workpiece; 15: the 2 nd object to be processed; 150: the upper surface of the No. 2 workpiece.
Detailed Description
1 grinding device
The grinding apparatus 1 shown in fig. 1 is a grinding apparatus that grinds a workpiece 14 using a grinding unit 3. The workpiece 14 is, for example, a rectangular parallelepiped thin plate. The grinding device 1 has a base 10 extending in the Y-axis direction and a column 11 erected on the + Y-direction side on the base 10.
A vertical moving unit 4 for supporting the grinding unit 3 to be movable up and down is disposed on a side surface of the column 11 on the-Y direction side. The vertical movement unit 4 has: a ball screw 40 having a rotation axis 45 in the Z-axis direction; a pair of guide rails 41 arranged in parallel with the ball screw 40; a Z-axis motor 42 that rotates the ball screw 40 about a rotation axis 45; a lifting plate 43, the inner nut of which is screwed with the ball screw 40, and the side part of the lifting plate 43 is in sliding contact with the guide rail 41; and a holder 44 coupled to the lifting plate 43 and supporting the grinding unit 3.
When the ball screw 40 is driven by the Z-axis motor 42 to rotate the ball screw 40 about the rotation axis 45, the lifting plate 43 is guided by the guide rail 41 to move up and down in the Z-axis direction, and the grinding unit 3 held by the holder 44 moves in the Z-axis direction.
By moving the grinding unit 3 up and down in the Z-axis direction using the vertical moving unit 4, the holding unit 2 and the grinding unit 3 can be relatively moved in a direction perpendicular to the holding surface 211.
The grinding unit 3 has: a main shaft 38 having a rotation axis 35 in the Z-axis direction; a housing 39 rotatably supporting the main shaft 38; and a spindle motor 30 for rotationally driving the spindle 38 about the rotation axis 35.
As shown in fig. 2, an air cylinder 63 is connected to the main shaft 38. The cylinder 63 has a large diameter portion 630 and a small diameter portion 631 formed at a lower end of the large diameter portion 630. The 1 st mounting seat 331 is connected to the lower end of the small diameter portion 631. Further, a rod 620 and a disc piston 621 connected to an upper end of the rod 620 are housed in the large-diameter portion 630, and a 2 nd mounting seat 332 is connected to a lower end of the rod 620. Further, a guide portion 449 for coupling the lower surface of the large diameter portion 630 and the 1 st mounting seat 331 is disposed between the two, and a through hole through which the guide portion 449 passes is formed in the 2 nd mounting seat 332.
The 1 st grinding wheel 31 is mounted on the 1 st mounting seat 331. Further, the 2 nd grinding wheel 32 is attached to the 2 nd mounting seat 332.
As shown in fig. 1, the 1 st grinding wheel 31 includes a 1 st grinding wheel base 311 and a plurality of 1 st grinding stones 310 arranged in a circular ring shape on a lower surface of the 1 st grinding wheel base 311 in a substantially rectangular parallelepiped shape.
The 2 nd grinding wheel 32 includes a 2 nd grinding wheel base 321 and a plurality of 2 nd grinding stones 320 arranged in a circular ring shape on the lower surface of the 2 nd grinding wheel base 321 in a substantially rectangular parallelepiped shape. The plurality of 2 nd grinding tools 320 form a ring having a diameter about the size of the ring formed by the plurality of 1 st grinding tools 310. In addition, the 2 nd grinding stone 320 forms a ring concentric with the 1 st grinding stone 310.
The particle size of the 1 st grinding stone 310 and the particle size of the 2 nd grinding stone 320 may be the same or different.
The spindle 38 is rotated using the spindle motor 30, whereby the 1 st grinding wheel 31 and the 2 nd grinding wheel 32 are rotated.
The rod 620 and the disk piston 621 shown in fig. 2 constitute the up-down unit 62, and the up-down unit 62 can move up and down in the Z-axis direction in the space inside the large diameter portion 630. The disc piston 621 is connected to the air supply source 60, and a switching control unit 61 is disposed between the disc piston 621 and the air supply source 60. The switching control unit 61 is, for example, a control valve, and has the following functions: the ejection of air supplied from the air supply source 60 from above the disc piston 621 or from below the disc piston 621 is switched.
For example, when the air supplied from the air supply source 60 is switched by the switching control unit 61 so that the air is ejected from the lower side of the disc piston 621 in the + Z direction, the disc piston 621 is biased in the + Z direction by the air, and the disc piston 621, the rod 620, and the 2 nd mounting seat 332 are integrally raised in the + Z direction while being guided by the guide portion 449. Thereby, the 2 nd mounting seat 332 is raised in the + Z direction, and the 1 st grinding stone 310 is closer to the holding surface 211 than the 2 nd grinding stone 320.
When the air is ejected from above the disc piston 621 by switching the air supply from the air supply source 60 using the switching control unit 61 so that the air is ejected from above the disc piston 621 in the-Z direction, the disc piston 621 is biased in the-Z direction by the air, and the disc piston 621, the rod 620, and the 2 nd mounting seat 332 are integrally lowered in the-Z direction while being guided by the guide portion 449. Thereby, the 2 nd mounting seat 332 is lowered in the-Z direction, and the 2 nd grinding stone 320 is closer to the holding surface 211 than the 1 st grinding stone 310.
In this way, the air supply source 60, the switching control unit 61, and the up-down unit 62 constitute the advancing-retreating mechanism 6, and the advancing-retreating mechanism 6 controls the relationship between the height positions of the 1 st grindstone 310 and the 2 nd grindstone 320 so as to selectively bring the 1 st grindstone 310 or the 2 nd grindstone 320 close to the holding surface 211.
As shown in fig. 1, a holding unit 2 is disposed on a base 10. The holding unit 2 is, for example, a chuck table for holding the workpiece 14.
The holding unit 2 includes a disk-shaped stage 21 and a frame 22 that supports the stage 21. On the upper surface 210 of the stage 21, for example, a plurality of (4 in fig. 1) holding surfaces 211 for holding the workpiece 14 are arranged. The holding surface 211 is formed in a rectangular shape having a long side 212 extending in the Y axis direction and a short side 213 extending in the X axis direction, for example, and is arranged on the upper surface 210 of the stage 21 in the X axis direction.
A suction source, not shown, is connected to each holding surface 211. For example, the suction source is used to generate a suction force in a state where the workpiece 14 is placed on the holding surface 211, and the generated suction force is transmitted to the holding surface 211 to suck the workpiece 14 placed on the holding surface 211 from the holding surface 211. This allows the workpiece 14 to be sucked and held on the holding surface 211.
An internal base 100 is disposed inside the base 10. A horizontal movement unit 5 for moving the holding unit 2 in the horizontal direction is disposed on the internal base 100.
The horizontal movement unit 5 has: a ball screw 50 having a rotation axis 55 in the Y-axis direction; a pair of guide rails 51 arranged in parallel with the ball screw 50; a Y-axis motor 52 coupled to the ball screw 50 to rotate the ball screw 50 about a rotation axis 55; and a movable plate 53 having a nut at the bottom thereof screwed to the ball screw 50, the movable plate 53 moving in the Y-axis direction along the guide rail 51.
When the ball screw 50 is driven by the Y-axis motor 52 to rotate the ball screw 50 about the rotation axis 55, the movable plate 53 is guided by the guide rail 51 to move horizontally in the Y-axis direction.
A rotating unit 26 for rotating the holding unit 2 is disposed on the upper surface 530 of the movable plate 53, and an annular base 23 is disposed around the rotating unit 26.
Three (two in fig. 1) through holes 230 are formed at equally spaced positions on the same circumference of the base 23, and three (two in fig. 1) support columns 24 that support the base 23 stand on the upper surface 530 of the movable plate 53. Each through hole 230 is penetrated by each support column 24, and the support column 24 is fixed to the upper surface 530 of the movable plate 53. Each support column 24 has, for example, a telescopic mechanism not shown, and the tilt of the holding unit 2 is adjusted by appropriately raising and lowering each support column 24 in the Z-axis direction.
When the movable plate 53 moves in the Y-axis direction, the rotation unit 26, the base 23, and the holding unit 2 supported by the movable plate 53 move horizontally in the Y-axis direction integrally with the movable plate 53.
By horizontally moving the holding unit 2 in the Y-axis direction using the horizontal moving unit 5, the holding unit 2 and the grinding unit 3 can be relatively moved in the horizontal direction.
The rotation unit 26 includes, for example, a motor not shown. By operating this motor, the holding unit 2 can be rotated about the axis passing through the center 2000 in the Z-axis direction.
A cover 27 and a bellows 28 connected to the cover 27 so as to be extendable and retractable are disposed around the holding unit 2. For example, when the holding unit 2 moves in the Y-axis direction, the cover 27 moves in the Y-axis direction together with the holding unit 2, and the bellows 28 expands and contracts.
2 grinding method
(plunge grinding Process)
A method of grinding the workpiece 14 using the grinding apparatus 1 will be described. First, the switching control unit 61 of the advancing-retreating mechanism 6 is operated in advance, and air is supplied from the air supply source 60, whereby air is injected from the lower direction + Z direction of the disc piston 621 to raise the 2 nd mount 332. Thereby, the 2 nd grinding whetstone 320 moves in the + Z direction with respect to the 1 st grinding whetstone 310, and the 1 st grinding whetstone 310 is brought closer to the holding surface 211 than the 2 nd grinding whetstone 320.
Then, the workpiece 14 is placed on each of the plurality of holding surfaces 211 of the holding unit 2, and the suction source is operated. The generated suction force is transmitted to the holding surface 211, and the workpiece 14 is sucked and held on the holding surface 211.
Further, the holding unit 2 is rotated by the rotating unit 26 in advance to rotate the workpiece 14 held by the holding surface 211, and the 1 st and 2 nd grindstones 310 and 320 are rotated by the spindle motor 30.
Next, the holding unit 2 is moved in the + Y direction by the horizontal movement unit 5, and as shown in fig. 3, the workpiece 14 is positioned at a position where the lower surface 312 of the 1 st grindstone 310 passes through the center 2000 of the upper surface 210 of the stage 21.
The grinding unit 3 is lowered in the-Z direction by the vertical moving unit 4 in a state where the workpiece 14 held by the holding surface 211 rotates about the center 2000 as a rotation center and the 1 st grindstone 310 rotates about the rotation axis 35 as an axis. When the 1 st grinding stone 310 is lowered in the-Z direction to approach the holding surface 211, the lower surface 312 of the 1 st grinding stone 310 comes into contact with the upper surface 140 of the workpiece 14. In a state where the lower surface 312 of the 1 st grinding burr 310 is in contact with the upper surface 140 of the workpiece 14, the 1 st grinding burr 310 is further lowered in the-Z direction to perform plunge grinding of the workpiece 14. Fig. 4 and 5 show a case where the workpiece 14 held by the holding surface 211 is in contact with the 1 st grindstone 310 while rotating around the center 2000 of the upper surface 210.
In plunge grinding of the workpiece 14, for example, a height gauge or the like, not shown, is positioned on the upper surface 210 of the stage 21 on a measurement orbit 219, which is a circumferential orbit of the measurement surface 218 formed on the same plane as the holding surface 211, and the upper surface 140 of the workpiece 14, the height of the holding surface 211 and the height of the upper surface 140 of the workpiece 14 are measured, and the difference between the two heights is calculated, thereby measuring the thickness of the workpiece 14. When the workpiece 14 is ground to a predetermined thickness, the plunge grinding is terminated.
(Slow feed grinding Process)
After the plunge grinding is performed as described above, the grinding unit 3 is raised in the + Z direction by using the vertical movement unit 4 shown in fig. 1, and the 1 st grindstone 310 is separated from the workpiece 14. Then, the holding unit 2 is moved in the-Y direction by the horizontal moving unit 5, and the 1 st grinding stone 310 and the 2 nd grinding stone 320 are retracted from above the holding surface 211 to the outside in the horizontal direction.
Then, the 2 nd grindstone 320 is raised with respect to the 1 st grindstone 310 by the advancing/retreating mechanism 6, and the 2 nd grindstone 320 is brought closer to the holding surface 211 than the 1 st grindstone 310.
Next, the grinding unit 3 is lowered in the-Z direction by the vertical movement unit 4, and the 2 nd grindstone 320 is positioned at a height position where the lower surface 322 of the 2 nd grindstone 320 is lower than the upper surface 140 of the workpiece 14 by a predetermined distance.
Further, by rotating the holding unit 2 by an appropriate angle using the rotating unit 26, as shown in fig. 6, the four holding surfaces 211 are aligned in the X axis direction, and in this state, the rotation of the holding unit 2 by the rotating unit 26 is stopped so that the holding unit 2 does not rotate. Thereby, the four holding surfaces 211 are fixed in a state of being arranged in the X-axis direction.
Then, the holding unit 2 is moved in the + Y direction by the horizontal moving unit 5. Thus, the 2 nd grinding stone 320 and the holding unit 2 disposed outside the upper surface 210 of the stage 21 approach each other in the slow feed direction (Y-axis direction), which is the relative movement direction in the horizontal direction, and the workpiece 14 held by the 2 nd grinding stone 320 and the holding surface 211 approaches each other in the Y-axis direction.
When the 2 nd grinding stone 320 and the workpiece 14 held by the holding surface 211 approach each other in the Y-axis direction, the side surface 323 and the lower surface 322 of the 2 nd grinding stone 320 contact the upper surface 140 of the workpiece 14 as shown in fig. 7, and the workpiece 14 is ground by gradual feed. As shown in fig. 8, the slow feed grinding is finished when the holding unit 2 moves in the + Y direction to a horizontal position where the entire surfaces of the four workpieces 14 held by the holding surface 211 are ground.
In the grinding apparatus 1, the workpiece 14 having a square shape can be ground to a uniform thickness by performing the plunge grinding and then performing the creep feed grinding. In particular, when the workpiece 14 is a rectangular plate-shaped workpiece, the workpiece 14 can be finished to a uniform thickness by approaching the 2 nd grinding wheel 320 from the short side 213 during the creep feed grinding.
In the above-described grinding method, after plunge grinding of the workpiece 14 is performed using the 2 nd grinding whetstone 320, creep feed grinding of the workpiece 14 may be performed using the 1 st grinding whetstone 310.
The upper surface 210 of the stage 21 may not have a structure in which rectangular holding surfaces 211 are arranged in the same direction. For example, the holding surfaces 211 may be rectangular, and the orientations may not be aligned in one direction, and the sizes of the rectangles may not be uniform. The shape of each holding surface 211 may be a polygon other than a rectangle, or may be a circle or an ellipse.
The grinding apparatus 1 may have a 2 nd holding unit 8 shown in fig. 9 instead of the holding unit 2. As shown in fig. 9, the 2 nd holding unit 8 includes a disc-shaped suction portion 80 and a frame 81 that supports the suction portion 80. The upper surface of the suction portion 80 is a holding surface 800 for holding the disk-shaped 2 nd workpiece 15, and the upper surface 810 of the frame 81 is formed on the same plane as the holding surface 800.
The suction unit 80 is connected to a suction source, not shown. For example, by operating the suction source in a state where the 2 nd workpiece 15 is placed on the holding surface 800, the generated suction force can be transmitted to the holding surface 800, and the 2 nd workpiece 15 can be sucked and held on the holding surface 800.
When grinding the 2 nd workpiece 15 held by the 2 nd holding unit 8, first, the 1 st grindstone 310 is moved closer to the holding surface 800 than the 2 nd grindstone 320 by using the advancing and retreating mechanism 6, and the 2 nd workpiece 15 is held on the holding surface 800 of the 2 nd holding unit 8.
Further, the 1 st and 2 nd grindstones 310 and 3200 are rotated by the spindle motor 30 in advance, and the 2 nd workpiece 15 held by the 2 nd holding means 8 is rotated by the rotating means 26.
Further, the horizontal moving means 5 is used to move the 2 nd holding means 8 in the + Y direction, and the relationship of the horizontal positions of the 2 nd holding means 8 and the grinding means 3 is adjusted so that the lower surface 312 of the 1 st grinding stone 310 passes through the center 8000 of the holding surface 800.
Then, the grinding unit 3 is lowered in the-Z direction by the vertical movement unit 4, the 1 st grindstone 310 is brought close to the holding surface 800, and the 2 nd workpiece 15 held by the holding surface 800 is brought into contact with the lower surface 312 of the 1 st grindstone 310. Thereby, the 2 nd workpiece 15 is subjected to plunge grinding.
After the plunge grinding is completed, the grinding unit 3 is raised in the + Z direction by the vertical movement unit 4, and the 1 st grindstone 310 and the 2 nd grindstone 320 are separated in the + Z direction from the 2 nd workpiece 15. Further, the horizontal moving means 5 moves the 2 nd workpiece 15 held by the 2 nd holding means 8 in the-Y direction, and moves the 2 nd workpiece 15 away from the 1 st grindstone 310 and the 2 nd grindstone 320 in the-Y direction. Thereby, the lower surface 322 of the 2 nd grinding stone 320 is positioned horizontally outward of the upper side of the holding surface 800.
Then, the 2 nd grinding whetstone 320 is moved closer to the holding surface 800 than the 1 st grinding whetstone 310 by the advancing/retreating mechanism 6, and the grinding unit 3 is moved in the-Z direction by the vertical moving unit 4, so that the height position of the 2 nd grinding whetstone 320 is adjusted so that the lower surface 322 of the 2 nd grinding whetstone 320 is lower than the upper surface 150 of the 2 nd workpiece 15 by a predetermined distance.
Then, the 2 nd workpiece 15 held by the 2 nd holding unit 8 is moved in the + Y direction by the horizontal moving unit 5, and the 2 nd grinding stone 320 and the 2 nd holding unit 8 are relatively moved closer in the slow feed direction. Thereby, the lower surface 322 and the side surface 323 of the 2 nd grinding wheel 320 contact the upper surface 150 of the 2 nd workpiece 15, and the 2 nd workpiece 15 is ground by the slow feed.
Even in the case of the disk-shaped 2 nd workpiece 15, the 2 nd workpiece 15 can be ground to a uniform thickness by performing plunge grinding and rough feed grinding by selecting the 2 nd holding means 8 having the holding surface 800 having a shape suitable for the shape.
In the above-described grinding method, after the plunge grinding of the 2 nd workpiece 15 is performed using the 2 nd grinding whetstone 320, the 2 nd workpiece 15 may be subjected to the creep feed grinding using the 1 st grinding whetstone 310.
For example, when a plurality of quadrangular chips are formed on the upper surface 150 of the 2 nd workpiece 15 and the chips are sealed with a resin, the chips can be exposed by performing the plunge grinding after the resin is cut, and grinding marks in the same direction can be formed on the exposed surfaces of the chips.

Claims (6)

1. A grinding method for grinding a workpiece by using a grinding apparatus, the grinding apparatus comprising:
a holding unit that holds a workpiece on a holding surface and is rotatable about a center of the holding surface;
a grinding unit, wherein an annular 1 st grinding wheel and a concentric annular 2 nd grinding wheel surrounding the diameter of the 1 st grinding wheel are arranged at the front end of the main shaft;
a driving and reversing mechanism for selectively bringing the 1 st grindstone or the 2 nd grindstone close to the holding surface;
a horizontal moving unit that moves the holding unit and the grinding unit in a horizontal direction relative to each other; and
a vertical moving unit that relatively moves the holding unit and the grinding unit in a direction perpendicular to the holding surface,
the grinding method comprises the following steps:
a plunge grinding step of moving the grinding wheel closer to a lower side of the holding surface in accordance with a horizontal position of the holding surface with respect to the grinding wheel such that a lower surface of the grinding wheel of either the 1 st grinding wheel or the 2 nd grinding wheel passes through a center of the holding surface, and plunge grinding the workpiece held by the holding surface; and
and a slow feed grinding step of positioning the other grinding whetstone, which is not used in the plunge grinding step, at a position outside the upper side of the holding surface in the horizontal direction and positioning the lower surface of the grinding whetstone at a position lower than the upper surface of the workpiece by a predetermined distance, bringing the grinding whetstone and the holding unit closer to each other in a slow feed direction which is a relative movement direction in the horizontal direction, and performing slow feed grinding of the workpiece by using the lower surface and the side surface of the grinding whetstone.
2. The grinding method according to claim 1,
the workpiece is polygonal, and the shape of the holding surface follows the shape of the workpiece.
3. The grinding method according to claim 1 or 2,
in the plunge grinding step, the 1 st grinding wheel was used,
in the creep feed grinding process, the 2 nd grinding stone having a larger diameter than the 1 st grinding stone is used.
4. The grinding method according to claim 1 or 2,
the holding unit is provided with a plurality of holding surfaces on the upper surface,
the plunge grinding step positions the grinding wheel so as to pass through the center of the upper surface, rotates the upper surface about the center of the upper surface, and grinds the workpiece held by each of the holding surfaces.
5. The grinding method according to claim 4,
a plurality of the holding surfaces are arranged in a horizontal direction perpendicular to the slow feeding direction,
in the slow feed grinding step, the holding surfaces are fixed so as not to rotate in a state of being arranged in a horizontal direction perpendicular to the slow feed direction, the grinding whetstone disposed at a position outside the upper surface of the holding means in the horizontal direction and the holding means are relatively brought close to each other in the slow feed direction, and the plurality of workpieces are ground by the lower surface and the side surface of the grinding whetstone.
6. A grinding method according to claim 3 or 5,
the holding surface is rectangular with long sides and short sides,
the long side is extended in the slow feeding direction, and the plurality of holding surfaces are arranged in a horizontal direction perpendicular to the slow feeding direction.
CN202110855032.XA 2020-08-05 2021-07-28 Grinding method Pending CN114055270A (en)

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JP2020132959A JP2022029598A (en) 2020-08-05 2020-08-05 Grinding method
JP2020-132959 2020-08-05

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TW (1) TW202206228A (en)

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Publication number Priority date Publication date Assignee Title
JP6292958B2 (en) 2014-04-18 2018-03-14 株式会社ディスコ Grinding equipment

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KR20220017835A (en) 2022-02-14
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