JP2022022519A - Chuck table and processing device - Google Patents

Abstract

To downsize a chuck table.SOLUTION: A chuck table 2 comprises: a holding surface 210 on which a work-piece 14 is held; and a measurement surface 230 formed at a position which is not a position of the holding surface 210 and on a first measurement trajectory 241 of an upper surface height measuring instrument 6 that moves relatively with respect to the chuck table 2 by rotating the chuck table 2 using a table rotating part 25 with the upper surface height measuring instrument 6 positioned above the holding surface 210. When measuring a thickness of the work-piece 14, the chuck table 2 is rotated with the upper surface height measuring instrument 6 positioned on the first measurement trajectory 241. The chuck table 2 is not required to comprise an annular measurement surface, so that the table can be made smaller in size than a conventional chuck table comprising the annular measurement surface.SELECTED DRAWING: Figure 2

Description

The present invention relates to a chuck table and a processing apparatus.

In a processing device including a grinding device that grinds a workpiece held on a holding surface of a chuck table using a grinding wheel, a grinding wheel, a polishing pad, etc. are added while rotating the chuck table around the center of the chuck table. Machining is performed by contacting the tool. The thickness of the workpiece is measured during the machining of the workpiece.
The thickness of the work piece is calculated by calculating the difference between the height of the holding surface and the height of the upper surface of the work piece held on the holding surface. Therefore, in measuring the thickness of the workpiece, it is necessary to measure the height of the holding surface and the height of the upper surface of the workpiece, and as disclosed in Patent Document 1, the holding surface height gauge and the upper surface height gauge A thickness measuring means including the two measuring instruments of the above is used.

In the chuck table 9 shown in FIG. 14 as an example of the conventional chuck table, a holding surface 90 on which the workpiece 14 is held and a holding surface height gauge (not shown) are positioned for measuring the height of the holding surface 90. It is provided with an annular measuring surface 91 on which the height is measured. In the thickness measurement of the workpiece 14, the upper surface height gauge (not shown) is positioned on the upper surface 140 of the workpiece 14 while the workpiece 14 is held on the holding surface 90, and the holding surface height gauge (not shown) is positioned on the measuring surface 91. Is positioned.

Japanese Unexamined Patent Publication No. 2020-049557

A chuck table having an annular measuring surface on the outside of the holding surface for holding the workpiece as described above is large and heavy, which is a workload when attaching the chuck table to the processing apparatus or replacing the chuck table. It has become.
Therefore, in the chuck table provided in the processing apparatus, there is a problem that the work such as mounting / replacement of the chuck table is facilitated.

The present invention comprises a chuck table provided with a holding surface for holding a workpiece, a table rotating portion that rotates around the center of the chuck table, a processing means for processing the workpiece held on the holding surface, and the like. Thickness for calculating the thickness of the work piece using the top surface height measuring device that measures the top surface height of the work piece rotated by the table rotating part in a non-contact manner and the value measured by the top surface height measuring device. A chuck table used in a processing apparatus including at least a calculation unit, and the chuck table is rotated by using the table rotating unit in a state where the upper surface height measuring device is positioned above the holding surface. This is a chuck table provided with a measurement surface formed on the measurement trajectory of the top surface height measuring device that moves relative to the chuck table and at a position other than the holding surface.
It is desirable that the chuck table has a plurality of holding surfaces arranged at positions where the top surface height measuring device can measure.
The chuck table includes a sub-chuck table having the measurement surface and the holding surface, a base having a connecting surface for connecting the sub-chuck tables, and an opening formed in the connecting surface of the base. It is desirable to have a communication passage formed on the surface to be connected of the sub-chuck table and communicating the opening and the holding surface.
The present invention comprises a holding means on which the chuck table is mounted to hold the workpiece on the holding surface, a thickness measuring means for measuring the thickness of the workpiece, and processing the workpiece to a predetermined thickness set in advance. The thickness measuring means is a processing apparatus including a processing means for measuring the height of the upper surface of the workpiece held on the holding surface and a top surface height measuring device for measuring the height of the measuring surface in a non-contact manner. A processing device including a thickness calculation unit for calculating the thickness of the workpiece based on the difference between the height of the upper surface of the workpiece measured by the top surface height measuring device and the height of the measured surface.

Since the chuck table of the present invention does not require an annular measuring surface, the chuck table can be miniaturized and the weight of the chuck table can be reduced.
Further, in the configuration in which the sub-chuck table is detachably arranged on the base, the sub-chuck table can be replaced on the base, and the weight can be reduced. Since the sub-chuck table is replaceable, the size can be easily changed and the number of workpieces to be held can also be changed.

It is a perspective view which shows the whole of a processing apparatus. It is a perspective view of a chuck table. It is a top view of the chuck table. It is a top view which shows the rotation locus of a holding member when a chuck table rotates. It is a perspective view of a chuck table. It is a top view of the chuck table. It is a top view which shows the rotation locus of a holding member when a chuck table rotates. It is a perspective view of a chuck table. It is a top view of the chuck table. It is a top view which shows the rotation locus of a holding member when a chuck table rotates. It is a perspective view of the 2nd chuck table. It is a perspective view of the 2nd base. (A) is a perspective view showing a base plate with the surface facing upward, and (b) is a perspective view showing a base plate with the connected surface facing upward. It is a perspective view which shows the chuck table which has the annular measurement surface.

The processing device 1 shown in FIG. 1 is a processing device that grinds the workpiece 14 held on the chuck table 2 by using the processing means 3. Hereinafter, the configuration of the processing apparatus 1 will be described.
As shown in FIG. 1, the processing apparatus 1 includes a base 10 extended in the Y-axis direction and a column 11 erected on the + Y direction side of the base 10.

On the side surface of the column 11 on the −Y direction side, a machining feed means 4 that supports the machining means 3 so as to be able to move up and down is arranged. The processing means 3 includes, for example, a spindle 30 having a rotating shaft 35 in the Z-axis direction, a housing 31 that rotatably supports the spindle 30, a spindle motor 32 that rotationally drives the spindle 30 around the rotating shaft 35, and a spindle. It is a grinding means including a mount 33 connected to the lower end of the mount 33 and a grinding wheel 34 detachably mounted on the lower surface of the mount 33.

The grinding wheel 34 includes a wheel base 341 and a plurality of substantially rectangular parallelepiped grinding wheels 340 arranged in an annular shape on the lower surface of the wheel base 341. The lower surface of the grinding wheel 340 is a grinding surface 342 that comes into contact with the workpiece 14.

By rotating the spindle 30 using the spindle motor 32, the mount 33 connected to the spindle 30 and the grinding wheel 34 mounted on the lower surface of the mount 33 are integrally rotated.

The machining feed means 4 rotates the ball screw 40 having a rotation shaft 45 in the Z-axis direction, a pair of guide rails 41 arranged parallel to the ball screw 40, and the ball screw 40 around the rotation shaft 45. It includes a shaft motor 42, an elevating plate 43 in which an internal nut is screwed into a ball screw 40 and a side portion is in sliding contact with a guide rail 41, and a holder 44 which is connected to the elevating plate 43 and supports the processing means 3.

When the ball screw 40 is driven by the Z-axis motor 42 and the ball screw 40 rotates about the rotation shaft 45, the elevating plate 43 is guided by the guide rail 41 and moves up and down in the Z-axis direction. The grinding wheel 34 of the processing means 3 held in the holder 44 moves in the Z-axis direction.

A chuck table 2 is arranged on the base 10. An internal base 100 is disposed inside the base 10, and a horizontal moving means 5 for moving the chuck table 2 in the horizontal direction (Y-axis direction) is disposed on the internal base 100.
The horizontal moving means 5 includes a ball screw 50 having a rotating shaft 55 in the Y-axis direction, a pair of guide rails 51 arranged in parallel with the ball screw 50, and a ball screw connected to the ball screw 50 and centered on the rotating shaft 55. It includes a Y-axis motor 52 that rotates 50, and a movable plate 53 in which a nut at the bottom is screwed into a ball screw 50 and moves in the Y-axis direction along a guide rail 51.
When the ball screw 50 is driven by the Y-axis motor 52 and the ball screw 50 rotates about the rotation shaft 55, the movable plate 53 is guided by the guide rail 51 and moves in the Y-axis direction.

A table rotating portion 25 is arranged on the movable plate 53. The table rotating portion 25 includes a rotating member 250 that rotatably supports the chuck table 2 and an annular member 251 arranged around the rotating member 250. The annular member 251 supports the rotating member 250 in a rotatable state.
For example, three through holes 256 (two are shown in FIG. 1) are formed at equidistant positions on the same circumference of the annular member 251, and the annular member is placed on the movable plate 53. Three support columns 257 (two are shown in FIG. 1) that support 251 are erected. Each through hole 256 is penetrated through each support pillar 257, and the support pillar 257 is fixed on the movable plate 53. Further, each support column 257 has, for example, an expansion / contraction mechanism (not shown), and the inclination of the chuck table 2 is adjusted by appropriately expanding / contracting each support column 257 in the Z-axis direction.

The rotating member 250 is connected to, for example, a motor (not shown). By operating the motor to rotate the rotating member 250, it is possible to rotate the chuck table 2 about the center 2000 thereof.

Further, the movable plate 53 moves in the Y-axis direction by using the horizontal moving means 5, so that the table rotating portion 25 and the chuck table 2 move integrally with the movable plate 53 in the Y-axis direction.

A cover 27 and a bellows 28 stretchably connected to the cover 27 are arranged around the chuck table 2. For example, when the chuck table 2 moves in the Y-axis direction, the cover 27 moves in the Y-axis direction together with the chuck table 2, and the bellows 28 expands and contracts.

On the −X direction side on the base 10, a top surface height measuring device 6 for measuring the height of the top surface 140 of the workpiece 14 rotated by the table rotating portion 25 in a non-contact manner is arranged.
The top surface height measuring device 6 is a laser-type height measuring device that measures the height of a portion where the laser beam is projected by, for example, projecting a laser beam and measuring the reflected light.

As shown in FIG. 2, the chuck table 2 includes a substantially disk-shaped base 20 and three substantially rectangular parallelepiped holding members 21 arranged on the upper surface 200 of the base 20. FIG. 3 shows a plan view of the chuck table 2. For example, all of the three holding members 21 are arranged parallel to the Y-axis direction, and one of the three holding members 21 is slightly on the radial back side (+ Y-direction side) of the base 20. They are staggered and arranged.
The upper surface of the holding member 21 is a holding surface 210 on which the plate-shaped workpiece 14 is held. The workpiece 14 can be held on each of the three holding surfaces 210.

A convex portion 23 is formed at a position on the base 20 of the chuck table 2 and not on the holding surface 210. The convex portion 23 is arranged, for example, on the radial front side (−Y direction side) of the upper surface 200 of the base 20.
In FIG. 4, the position of the workpiece 14 when the chuck table 2 is rotated around the center 2000 of the chuck table 2 while the workpiece 14 is held by the holding surface 210 of the holding member 21 is chucked. A diagram is shown in which the table 2 is drawn and superimposed every time the table 2 is rotated by 30 degrees. The convex portion 23 is a locus of the workpiece 14 drawn by rotating the chuck table 2 about the center 2000 of the chuck table 2 using the table rotating portion 25 in a state where the workpiece 14 is held by the holding surface 210. It is provided at a position inside the first maximum locus 291 in which the outermost portion of the locus is connected in a circle and outside the first minimum locus 281 in which the innermost portion is connected in a circle.

The upper surface of the convex portion 23 is a measuring surface 230 whose height is measured by the upper surface height measuring device 6. The height of the measuring surface 230 and the height of the holding surface 210 are, for example, the same, and the height of the holding surface 210 can be recognized by measuring the height of the measuring surface 230.
Alternatively, the holding surface 210 and the measuring surface 230 may not be formed flush with each other, and a predetermined difference may be provided between the height of the measuring surface 230 and the height of the holding surface 210. In this configuration, the measurement surface 230 is formed lower than the upper surface of the processed workpiece 14 held by the holding surface 210. Further, in this configuration, it is possible to recognize the height of the holding surface 210 by measuring the height of the measuring surface 230 and appropriately adding or subtracting a predetermined difference to the measured height of the measuring surface 230. be.

Further, FIG. 4 shows a first measurement orbit 241 which is one of the orbits passing through the measurement surface 230 and the three holding surfaces 210. The first measurement track 241 is a movement path of the top surface height measuring instrument 6 that moves relative to the chuck table 2 when measuring the thickness of the workpiece 14. With the top surface height measuring instrument 6 positioned above one point on the first measuring track 241 by rotating the chuck table 2 using the table rotating portion 25, the top surface height measuring instrument 6 becomes the first. It will pass on the measurement track 241.

Returning to FIG. 2, the base 20 will be described. A recess 22 recessed in the −Z direction is formed on the outermost peripheral side of the base 20 in the radial direction. A plurality of screw holes 223 are formed on the upper surface of the recess 22.
The base 20 is screwed and mounted on a chuck base (not shown) provided at the upper end of the rotating member 250 shown in FIG. 1 by a screw (not shown) corresponding to the screw hole 223. In the processing apparatus 1, the base 20 of the chuck table 2 is mounted on the chuck base, so that the table rotating portion 25 and the chuck table 2 are integrated to form a holding means. By removing the screw, the base 20 can be attached to and detached from the chuck base.

The holding surface 210 of each holding member 21 is connected to a suction source (not shown). The suction source is operated in a state where the workpiece 14 is placed on the holding surface 210, and the generated suction force is transmitted to the holding surface 210 to suck and hold the workpiece 14 on the holding surface 210. can do.

As shown in FIG. 1, a thickness calculation unit 7 is connected to the top surface height measuring instrument 6. The thickness calculation unit 7 has a computer including a CPU, a memory, and the like, and calculates the difference between the height of the upper surface 140 of the workpiece 14 and the height of the measurement surface 230 measured by the upper surface height measuring device 6. The thickness of the workpiece 14 can be calculated by the calculation in the part 7.
The top surface height measuring device 6 and the thickness calculating unit 7 constitute a thickness measuring means for measuring the thickness of the workpiece 14.

The operation of the processing apparatus 1 when grinding the workpiece 14 while calculating the thickness of the workpiece 14 using the processing apparatus 1 will be described.
When grinding the workpiece 14 using the processing apparatus 1, first, three workpieces 14 are placed on the holding surface 210 of the chuck table 2. Then, a suction source (not shown) connected to the chuck table 2 is operated to transmit the generated suction force to the holding surface 210. As a result, the three workpieces 14 are sucked and held on the holding surface 210.

With the workpiece 14 being sucked and held by the holding surface 210, the chuck table 2 is moved in the + Y direction by an appropriate distance using the horizontal moving means 5. As a result, the chuck table 2 is positioned below the processing means 3, and the top surface height measuring instrument 6 is positioned above the first measuring track 241 shown in FIG.

Next, the chuck table 2 is rotated by using the table rotating portion 25 to rotate the workpiece 14 held on the holding surface 210, and the grinding wheel 340 is rotated around the rotating shaft 35 by using the spindle motor 32. To rotate.
When the chuck table 2 rotates while the top surface height measuring instrument 6 is positioned on the first measuring track 241, the top surface height measuring instrument 6 moves the upper surface 140 of the workpiece 14 on the first measuring track 241. It is repeatedly positioned on the top, on the top surface 200 of the base 20, and on the measurement surface 230. When the top surface height measuring instrument 6 is positioned on the upper surface 140 of the workpiece 14, the height of the upper surface 140 of the workpiece 14 is measured. Further, when the upper surface height measuring instrument 6 is positioned on the measuring surface 230, the height of the measuring surface 230 is measured and the height of the holding surface 210 is recognized. Then, the measured height information of the upper surface 140 of the workpiece 14 and the height information of the measurement surface 230 are transmitted to the thickness calculation unit 7, and the difference between the two is calculated by the thickness calculation unit 7. As a result, the thickness of the workpiece 14 is calculated.

In a state where the workpiece 14 is rotating and the grinding wheel 340 is rotating about the rotation shaft 35, the machining means 3 is lowered in the −Z direction by using the machining feed means 4. By lowering the grinding wheel 340 in the −Z direction, the grinding surface 342 of the grinding wheel 340 comes into contact with the upper surface 140 of the workpiece 14.
The workpiece 14 is ground by further lowering the grinding wheel 340 in the −Z direction while the grinding surface 342 is in contact with the upper surface 140 of the workpiece 14.
As the workpiece 14 is ground, the thickness of the workpiece 14 calculated by the thickness calculation unit 7 decreases.

When the workpiece 14 is ground to a predetermined thickness, the grinding process of the workpiece 14 is finished, the machining means 3 is moved in the + Z direction by using the machining feed means 4, and the grinding wheel 340 is moved to the upper surface of the workpiece 14. After being separated from 140, the workpiece 14 is carried out from the holding surface 210 of the chuck table 2.

The conventional chuck table 9 shown in FIG. 14 has an annular measuring surface 91 on which the measuring device is positioned when measuring the thickness, whereas the chuck table 2 shown in FIG. 2 has such an annular shape. It does not have a measuring surface. Therefore, the chuck table 2 can be made smaller and lighter.

The position, number, and the like of the holding members 21 arranged on the base 20 of the chuck table 2 are not limited to the above contents.
For example, as shown in FIG. 5, the three holding members 21 are arranged parallel to the upper surface 200 of the base 20 in the X-axis direction with their short sides aligned in the Y-axis direction. It may be configured. FIG. 6 shows a plan view of the chuck table 2 at that time. Further, in FIG. 7, the position of the workpiece 14 when the chuck table 2 is rotated around the center 2000 of the base 20 of the chuck table 2 while the workpiece 14 is held by the chuck table 2. Is drawn and superimposed every time the chuck table 2 is rotated by 45 degrees.
In this configuration, the convex portion 23 is a second portion in which the outermost portion of the rotation locus of the workpiece 14 is connected in a circular shape to the inside of the second maximum locus 292 and the innermost portion is connected in a circular shape. It is provided at a position outside the minimum locus 282.
A second measurement track 242 is defined as one of the tracks passing through the holding surface 210 of each of the three holding members 21 and the upper surface 200 of the base 20, and is used when measuring the thickness of the workpiece 14. The top surface height measuring instrument 6 is positioned on the second measuring track 242.

Further, as shown in FIG. 8, four holding members 21 may be arranged on the base 20 of the chuck table 2. Also in this case, the maximum locus of the workpiece 14 drawn when the chuck table 2 rotates about the center 2000 while the workpiece 14 is held on the holding surface 210 of each holding member 21. The measurement surface 230 is provided on the inside and on the outside of the minimum locus. A third measurement track 243 is defined as one of the tracks passing through the holding surface 210 and the measuring surface 230 of each of the four holding members 21, and the upper surface is measured when the thickness of the workpiece 14 is measured. The height measuring instrument 6 is positioned on the third measuring track 243. In this configuration, by holding the workpiece 14 on each of the holding surfaces 210 of the four holding members 21, a maximum of four workpieces 14 can be ground at the same time.

Further, as shown in FIG. 9, one holding member 21 may be arranged on the base 20 of the chuck table 2. In FIG. 10, the workpiece 14 of the workpiece 14 is rotated around the center 2000 of the base 20 of the chuck table 2 while the workpiece 14 is held by the holding member 21. The figure which draws and superimposes the position of 14 every time the chuck table 2 rotates 45 degrees is shown. In this configuration, the convex portion 23 is a fourth portion in which the outermost portion of the rotation locus of the workpiece 14 is connected in a circular shape to the inside of the fourth maximum locus 294 and the innermost portion is connected in a circular shape. It is provided at a position outside the minimum locus 284. A fourth measurement track 244 is defined as one of the tracks passing through the holding surface 210 of the holding member 21 and the upper surface 200 of the base 20, and the height of the upper surface is measured when the thickness of the workpiece 14 is measured. The measuring instrument 6 is positioned on the fourth measuring track 244.

Further, instead of providing the convex portion 23 on the upper surface 200 of the base 20 and using the upper surface of the convex portion 23 as the measurement surface 230 as described above, the upper surface 200 of the base 20 may be used as the measurement surface. .. In this configuration, for example, the difference between the height of the upper surface 200 of the base 20 and the height of the holding surface 210 is obtained in advance, and the difference is added or subtracted from the measured height of the upper surface 200 of the base 20. By doing so, the height of the holding surface 210 can be recognized.

The holding member arranged on the upper surface 200 of the base 20 is not limited to the plate-shaped holding member 21. For example, when grinding a disk-shaped workpiece, it is possible to efficiently grind by disposing a disk-shaped holding member instead of the holding member 21 on the upper surface 200 of the base 20.

The processing apparatus 1 may include a second chuck table 8 as shown in FIG. 11 instead of the chuck table 2. The second chuck table 8 includes a substantially disk-shaped second base 84 and a sub-chuck table 80 detachably connected to the second base 84.
As shown in FIG. 12, the second base 84 has a connecting surface 840 for connecting the sub-chuck table 80, and an opening 841 is formed in the center of the connecting surface 840.
Further, a recess 842 recessed in the −Z direction is formed on the outermost peripheral side in the radial direction of the second base 84, and a plurality of screw holes 843 are formed on the upper surface of the recess 842. The second base 84 is mounted by, for example, screwing to the chuck base described above with a screw (not shown) corresponding to the screw hole 843. By removing the screw, the second base 84 can be attached to and detached from the chuck base.

The sub-chuck table 80 includes a base plate 82 formed in a substantially square shape as shown in FIG. 13A, and three substantially rectangular parallelepiped second holding members 81 arranged on the surface 820 of the base plate 82. And have. For example, all of the three second holding members 81 are arranged parallel to the Y axis, and one of the three members in the middle is the radial back side (+ Y direction side) of the second base 84. ) Is slightly offset. The upper surface of the second holding member 81 is a holding surface 810 on which the workpiece 14 is held.

Further, a convex portion 83 is formed on the surface 820 of the base plate 82. The convex portion 83 is provided inside the maximum locus and outside the minimum locus drawn by the second holding member 81 when the chuck table 2 rotates about its center 2000. The upper surface of the convex portion 83 is the measurement surface 830.
In this configuration, the fifth measurement track 245 is defined as one of the tracks passing above the holding surface 810 and above the measuring surface 830 of each of the three second holding members 81, and the thickness of the workpiece 14 is defined as one. At the time of measurement, the top surface height measuring instrument 6 is positioned on the fifth measurement orbit 245.

For example, the holding surface 810 and the measuring surface 830 are formed flush with each other, and the height of the holding surface 810 can be recognized by measuring the height of the measuring surface 830.
Alternatively, the holding surface 810 and the measuring surface 830 may not be formed flush with each other, and a predetermined difference may be provided between the height of the measuring surface 830 and the height of the holding surface 810. In this configuration, the height of the holding surface 810 can be recognized by measuring the height of the measuring surface 830 and adding or subtracting a predetermined difference to the measured height of the measuring surface 830.

FIG. 13B shows a state in which the connected surface 821, which is the opposite surface of the surface 820 of the base plate 82, is directed to the + Z direction side. The connected surface 821 of the base plate 82 is formed with a communication passage 822 that communicates the opening 841 and the holding surface 810. The communication passage 822 has, for example, two rectangular portions formed adjacent to each other as shown in the figure and a circular portion formed so as to straddle the two rectangular portions.
When the sub-chuck table 80 is connected to the second base 84, the surface 820 of the sub-chuck table 80 is oriented toward the + Z direction as shown in FIG. 13 (a), and the second base is shown in FIG. The sub-chuck table 80 is placed on the connecting surface 840 of the second base 84 so that the central portion 8220 of the communication passage 822 shown in FIG. 13B coincides with the opening 841 of the two base 84.
Then, with the sub-chuck table 80 mounted on the second base 84, a suction means (not shown) connected to the opening 841 of the connecting surface 840 is operated. As a result, the generated suction force is transmitted to the communication passage 822, and the sub-chuck table 80 is connected to the second base 84. Further, the suction force is transmitted to the holding surface 810 of the second holding member 81 arranged on the sub-chuck table 80. Therefore, by placing the workpiece 14 on the holding surface 810 in this state, the workpiece 14 can be sucked and held on the holding surface 810.
The connecting surface 840 may be formed with a groove (not shown) extending in the radial direction through, for example, the opening 841. When the groove is formed, the suction force is more efficiently transmitted from the opening 841 to the connected surface 821 of the sub-chuck table 80, and the sub-chuck table 80 is easily transferred to the second base 84. It becomes possible to connect.

Similar to the chuck table 2, the second chuck table 8 does not have an annular measuring surface on which the top surface height measuring instrument 6 is positioned, so that the size can be reduced and the processing apparatus itself can be reduced in size.
Further, in the past, the base of the chuck table was replaced according to the size and number of the workpiece 14, whereas the second chuck table 8 has the size and number of the workpiece 14 to be ground. At the same time, the sub-chuck table 80 is replaced. Therefore, it can be easily replaced and is suitable.

The holding member arranged on the sub-chuck table 80 is not limited to the plate-shaped second holding member 81. For example, when grinding a disk-shaped workpiece, it is possible to efficiently grind by disposing a disk-shaped holding member.

Further, the processing device 1 is not limited to the grinding device provided with the grinding wheel 34 shown in FIG. 1, and may be, for example, a polishing device provided with a polishing pad or the like (not shown) instead of the grinding wheel 34.

1: Processing equipment 10: Base 100: Internal base 2: Chuck table 20: Base 200: Base top surface 21: Holding member 210: Holding surface 22: Recessed 223: Screw hole 23: Convex part 230: Measuring surface 25: Table rotating part 250: Rotating member 251: Circular member 256: Through hole 257: Support pillar 3: Machining means 30: Spindle 31: Spindle housing 32: Spindle motor 33: Mount 34: Grinding wheel 340: Grinding grindstone 341: Wheel base 342: Grinding surface 35: Rotating shaft 4: Machining feed means 40: Ball screw 41: Guide rail 42: Z-axis motor 43: Elevating plate 44: Holder 45: Rotating shaft 5: Horizontal moving means 50: Ball screw 51: Guide rail 52: Y-axis motor 53: Movable plate 55: Rotating shaft 6: Top surface height measuring instrument 7: Thickness calculation unit 8: Second chuck table 80: Sub-chuck table 81: Second holding member 810: Holding surface 82: Base plate 820: Base plate surface 821: Connected surface 822: Linked passage 83: Convex part 830: Measurement surface 84: Second base 840: Top surface of second base 841: Opening 842: Recessed 843: Screw hole 241: First measurement Orbit 242: 2nd measurement orbit 243: 3rd measurement orbit 244: 4th measurement orbit 245: 5th measurement orbit 281: 1st minimum locus 282: 2nd minimum locus 284: 4th minimum locus 291: 1st maximum locus 292 : 2nd maximum locus 294: 4th maximum locus 9: Chuck table 90: Holding surface 91: Measuring surface

Claims (4)

A chuck table with a holding surface for holding the workpiece,
A table rotating part that rotates around the center of the chuck table,
A processing means for processing the workpiece held on the holding surface, and
A top surface height measuring device that measures the height of the top surface of the workpiece rotated by the table rotating portion in a non-contact manner.
A chuck table used in a processing apparatus including at least a thickness calculation unit for calculating the thickness of a workpiece using a value measured by the top surface height measuring device.
With the top surface height measuring device positioned above the holding surface, the top surface height measuring device moves relative to the chuck table by rotating the chuck table using the table rotating portion. A chuck table provided with a measurement surface formed on the measurement trajectory of the above and at a position other than the holding surface. The chuck table according to claim 1, wherein a plurality of the holding surfaces are arranged at positions where the top surface height measuring device can measure. A sub-chuck table having the measuring surface and the holding surface,
A base having a connecting surface for connecting the sub-chuck tables,
An opening formed in the connecting surface of the base and
The chuck table according to claim 1, further comprising a communication passage formed on a connected surface of the sub-chuck table and communicating the opening and the holding surface. A holding means to which the chuck table according to claim 1 is mounted and holds the workpiece on the holding surface,
A thickness measuring means for measuring the thickness of the workpiece,
A processing means for processing the workpiece to a predetermined thickness, and
It is a processing device equipped with
The thickness measuring means is
A top surface height measuring instrument that measures the height of the upper surface of the workpiece held on the holding surface and the height of the measured surface in a non-contact manner, and the height of the upper surface of the workpiece measured by the top surface height measuring instrument and the said. A processing device including a thickness calculation unit that calculates the thickness of the workpiece by calculating the difference from the height of the measurement surface.

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