KR20220000523A - Substrate supporting member and substrate treating apparatus including the same - Google Patents

Abstract

Provided are a substrate supporting member for inserting a nozzle tip into the pipe of a back nozzle and fixing the pipe of the back nozzle using a Teflon ferrule, and a substrate processing apparatus including the same. The substrate supporting member may include: a body; a plurality of support pins installed on the body and supporting the substrate; and a back nozzle installed in the body and supplying a first fluid for processing the substrate to the bottom surface of the substrate. The back nozzle includes: a piping member providing a path through which the first fluid flows; a nozzle member sealing the upper portion of the piping member and having a hole for spraying the first fluid to the substrate; and a fitting member that fixes the pipe member and is coupled to the nozzle member.

Description

A substrate supporting member and a substrate processing apparatus having the same

The present invention relates to a substrate supporting member for supporting a substrate and a substrate processing apparatus having the same. More particularly, it relates to a substrate supporting member for supporting a substrate when cleaning the substrate, and a substrate processing apparatus having the same.

A semiconductor device can be manufactured by forming a predetermined pattern on a substrate. When a predetermined pattern is formed on a substrate, a plurality of processes may be continuously performed in a semiconductor manufacturing facility.

In general, a space in which a semiconductor manufacturing facility is located may be defined as a FAB. Inside the fab, a deposition process to form a film on a semiconductor substrate, a polishing process to planarize the film, a photolithography process to form a photo-resist pattern on the film (photo-resist pattern) lithography process, an etching process for forming a film into a pattern having electrical characteristics by using a photoresist pattern, an ion implantation process for implanting specific ions into a predetermined region of a semiconductor substrate, a source of contamination on a semiconductor substrate A plurality of processes, such as a cleaning process for removing , and an inspection process for inspecting the surface of the patterned semiconductor substrate, may be sequentially performed.

Korean Patent Publication No. 10-2015-0006781 (published on: January 19, 2015)

The back nozzle is composed of a pipe and a nozzle, and is installed on the substrate supporting member to face the bottom of the substrate positioned on the substrate supporting member. Such a back nozzle sprays a chemical (eg, high-temperature chemical), etc., to the bottom surface of the substrate during a cleaning process for the substrate.

However, when high-temperature chemicals are used for a long period of time, pipe expansion due to high-temperature heat during use and pipe shrinkage due to cold air when not in use occurs repeatedly, and this may cause deformation of the pipe and increase the defect rate. .

A problem to be solved by the present invention is a substrate support member for inserting a nozzle tip into a pipe of a bag nozzle and fixing the pipe of the bag nozzle using a Teflon ferrule, and a substrate processing apparatus having the same is to provide

The problems of the present invention are not limited to the problems mentioned above, and other problems not mentioned will be clearly understood by those skilled in the art from the following description.

One side (aspect) of the substrate support member of the present invention for achieving the above object, the body; a plurality of support pins installed on the body and supporting the substrate; and a bag nozzle installed in the body and supplying a first fluid for processing the substrate to a bottom surface of the substrate, wherein the bag nozzle includes: a piping member providing a path through which the first fluid flows; a nozzle member sealing an upper portion of the piping member and having a hole for spraying the first fluid to the substrate; and a fitting member that fixes the pipe member and is coupled to the nozzle member.

The nozzle member may be formed to have a step difference.

The nozzle member may include: a third portion formed at one end of the body and formed to decrease in width in one direction; a second portion formed in the center of the body and having a step portion; a first portion formed at the other end of the body and formed wider than the second portion and the third portion to cover the opening of the piping member; and a hole formed through the first to third portions to allow the first fluid to pass therethrough.

The fitting member may include: a body portion formed to increase in width in one direction; and a hole formed in the body portion and formed to be engaged with the step portion of the nozzle member.

The fitting member may be manufactured using at least one of SUS, PFA, and PTFE as a material.

The substrate support member may include: a fixing member formed to be partially exposed on the support member, the fixing member including a first portion having a variable width and a second portion formed to have a constant width under the first portion; and a fastening member fastened to the second part within the support member.

An elastic member may be installed inside the fastening member.

The back nozzle may spray the first fluid onto the substrate when cleaning or drying the substrate.

The back nozzle injects a first fluid of any one of pure water, chemical liquid, and N2 gas to the substrate, and sprays any one of pure water and chemical liquid to the substrate when cleaning the substrate, and N2 when drying the substrate A gas may be sprayed onto the substrate.

One surface of the substrate processing apparatus of the present invention for achieving the above object, the housing; a substrate support member installed in the housing and supporting a substrate; and a jetting member supplying a second fluid for processing the substrate to an upper surface of the substrate, wherein the substrate supporting member includes: a body; a plurality of support pins installed on the body and supporting the substrate; and a bag nozzle installed in the body and supplying a first fluid for processing the substrate to a bottom surface of the substrate, wherein the bag nozzle includes: a piping member providing a path through which the first fluid flows; a nozzle member sealing an upper portion of the piping member and having a hole for spraying the first fluid to the substrate; and a fitting member that fixes the pipe member and is coupled to the nozzle member.

The details of other embodiments are included in the detailed description and drawings.

1 is a plan view schematically showing an internal structure of a substrate processing system used for cleaning a substrate.
FIG. 2 is a cross-sectional view schematically illustrating an internal structure of a substrate processing apparatus provided in the process chamber of FIG. 1 .
3 is a view illustrating a coupling of a bag nozzle according to an embodiment of the present invention.
4 is an exploded view of a bag nozzle according to an embodiment of the present invention.
5 is a cross-sectional view of a nozzle member constituting a bag nozzle according to an embodiment of the present invention.
6 is a cross-sectional view of a fitting member constituting a bag nozzle according to an embodiment of the present invention.
7 is a view illustrating a coupling of a bag nozzle according to another embodiment of the present invention.
8 is an exploded view of a bag nozzle according to another embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. Advantages and features of the present invention, and a method for achieving them will become apparent with reference to the embodiments described below in detail in conjunction with the accompanying drawings. However, the present invention is not limited to the embodiments published below, but may be implemented in various different forms, and only these embodiments allow the publication of the present invention to be complete, and common knowledge in the technical field to which the present invention pertains It is provided to fully inform the possessor of the scope of the invention, and the present invention is only defined by the scope of the claims. Like reference numerals refer to like elements throughout.

Reference to an element or layer “on” or “on” another element or layer includes not only directly on the other element or layer, but also with other layers or other elements intervening. include all On the other hand, reference to an element "directly on" or "directly on" indicates that no intervening element or layer is interposed.

Spatially relative terms "below", "beneath", "lower", "above", "upper", etc. It can be used to easily describe the correlation between an element or components and other elements or components. The spatially relative terms should be understood as terms including different orientations of the device during use or operation in addition to the orientation shown in the drawings. For example, when an element shown in the figures is turned over, an element described as "beneath" or "beneath" another element may be placed "above" the other element. Accordingly, the exemplary term “below” may include both directions below and above. The device may also be oriented in other orientations, and thus spatially relative terms may be interpreted according to orientation.

It should be understood that although first, second, etc. are used to describe various elements, components, and/or sections, these elements, components, and/or sections are not limited by these terms. These terms are only used to distinguish one element, component, or sections from another. Accordingly, it goes without saying that the first element, the first element, or the first section mentioned below may be the second element, the second element, or the second section within the spirit of the present invention.

The terminology used herein is for the purpose of describing the embodiments and is not intended to limit the present invention. In this specification, the singular also includes the plural unless specifically stated otherwise in the phrase. As used herein, "comprises" and/or "comprising" refers to the presence of one or more other components, steps, operations and/or elements mentioned. or addition is not excluded.

Unless otherwise defined, all terms (including technical and scientific terms) used herein may be used with the meaning commonly understood by those of ordinary skill in the art to which the present invention belongs. In addition, terms defined in a commonly used dictionary are not to be interpreted ideally or excessively unless clearly defined in particular.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings, and in the description with reference to the accompanying drawings, the same or corresponding components are given the same reference numbers regardless of reference numerals, A description will be omitted.

The present invention relates to a substrate support member for inserting a nozzle tip into a pipe of a back nozzle and fixing the pipe of the back nozzle using a Teflon ferrule, and a substrate processing apparatus having the same will be.

Hereinafter, the present invention will be described in detail with reference to drawings and the like.

1 is a plan view schematically showing an internal structure of a substrate processing system used for cleaning a substrate.

Referring to FIG. 1 , the substrate processing system 100 may include an index module 110 and a process processing module 120 .

The index module 110 and the processing module 120 may be sequentially arranged in one direction. In this embodiment, the direction in which the index module 110 and the process processing module 120 are arranged is defined as the first direction 10 . In addition, when viewed from above, a direction perpendicular to the first direction 10 is defined as the second direction 20 , and is perpendicular to a plane including the first direction 10 and the second direction 20 . The direction will be defined as the third direction 30 .

The index module 110 is disposed in front of the process processing module 120 . The index module 110 may be configured to include a load port 111 and a transport frame 112 .

The load port 111 is where the carrier 130 in which the substrate is accommodated is seated. A plurality of such load ports 111 may be provided in front of the transport frame 112 , and the plurality of load ports 111 may be arranged in a line along the second direction 20 .

1 illustrates that the index module 110 is provided with four load ports 111 . However, the present embodiment is not limited thereto. The number of load ports 111 may increase or decrease according to conditions such as process efficiency and foot-print of the process processing module 120 .

The carrier 130 accommodates a plurality of substrates (eg, wafers). The carrier 130 may have a slot (not shown) provided therein to support the edge of the substrate.

A plurality of slots may be provided in the third direction 30 . In this case, the substrates may be stacked in a state spaced apart from each other along the third direction 30 and positioned in the carrier 130 . The carrier 130 may be implemented as, for example, a Front Opening Unified Pod (FOUP).

The transfer frame 112 transfers the substrate between the carrier 130 seated on the load port 111 and the buffer unit 121 . The transport frame 112 may include an index rail 113 and an index robot 114 .

The index rail 113 provides a path for the index robot 114 to move. The index rail 113 may be disposed so that its longitudinal direction is parallel to the second direction 20 .

The index robot 114 directly transports the substrate. The index robot 114 may be installed on the index rail 113 and may move linearly along the second direction 20 on the index rail 113 .

The index robot 114 may include a first base 114a, a first body 114b, and an index arm 114c. Here, the first base 114a may be installed to be movable along the index rail 113 .

The first body 114b may be coupled to the first base 114a. The first body 114b may be provided to be movable along the third direction 30 on the first base 114a. In addition, the first body 114b may be provided to be rotatable on the first base 114a.

The index arm 114c is coupled to the first body 114b and may be provided to be movable forward and backward with respect to the first body 114b. A plurality of such index arms 114c may be provided on the first body 114b to be individually driven.

The plurality of index arms 114c may be stacked and disposed to be spaced apart from each other in the third direction 30 . A part of the plurality of index arms 114c is used to transfer the substrate from the process processing module 120 to the carrier 130 , and the other part is used to transfer the substrate from the carrier 130 to the process processing module 120 . can be used when When the plurality of index arms 114c are configured in this way, the effect of preventing particles generated from the substrate before the process from adhering to the substrate after the process can be obtained in the process of the index robot 114 loading and unloading the substrate. have.

The process processing module 120 may include a buffer unit 121 , a transfer chamber 122 , and a process chamber 125 .

The buffer unit 121 provides a space for the substrate to stay before being transferred between the transfer frame 112 and the transfer chamber 122 . The buffer unit 121 may be disposed between the transfer frame 112 and the transfer chamber 122 for this purpose.

The buffer unit 121 may be provided with a slot (not shown) in which the substrate is seated. A plurality of slots may be provided in the buffer unit 121 , and the plurality of slots may be provided to be spaced apart from each other in the third direction 30 . Meanwhile, in the buffer unit 121 , a surface facing the transfer frame 112 , a surface facing the transfer chamber 122 , and the like may be opened.

The transfer chamber 122 transfers a substrate between the buffer unit 121 and the process chamber 125 . The transfer chamber 122 may include a guide rail 123 and a main robot 124 . Meanwhile, the transfer chamber 122 may transfer a substrate between two different process chambers 125 .

The guide rail 123 provides a path for the main robot 124 to move. The guide rail 123 may be disposed so that its longitudinal direction is parallel to the first direction 10 .

The main robot 124 directly transports the substrate. The main robot 124 may be installed on the guide rail 123 , and may linearly move along the first direction 10 on the guide rail 123 .

The main robot 124 may include a second base 124a, a second body 124b, and a main arm 124c. Here, the second base 124a may be installed to be movable along the guide rail 123 .

The second body 124b may be coupled to the second base 124a. The second body 124b may be provided to be movable along the third direction 30 on the second base 124a. In addition, the second body 124b may be provided to be rotatable on the second base 124a.

The main arm 124c is coupled to the second body 124b, and may be provided to be movable forward and backward with respect to the second body 124b. A plurality of such main arms 124c may be provided on the second body 124b to be individually driven.

The plurality of main arms 124c may be stacked and disposed to be spaced apart from each other in the third direction 30 . A part of the plurality of main arms 124c may be used to transfer a substrate from the buffer unit 121 to the process chamber 125 , and the other part may be used to transfer a substrate from the process chamber 125 to the buffer unit 121 . It can also be used when

The transfer chamber 122 may have a longitudinal direction parallel to the first direction 10 . In this case, a plurality of process chambers 125 may be respectively disposed on both sides of the transfer chamber 122 in the second direction 20 , and a plurality of process chambers 125 may be disposed on each side of the transfer chamber 122 along the first direction 10 . A process chamber 125 may be disposed.

The plurality of process chambers 125 may be stacked on each other. That is, the plurality of process chambers 125 may be arranged in an X * Y arrangement on one side of the transfer chamber 122 . Here, X is a natural number of 1 or more, meaning the number of process chambers 125 provided in a line along the first direction 10 , and Y is a natural number of 1 or more and provided in a line along the third direction 30 . It means the number of process chambers 125 to be used.

For example, when four process chambers 125 are provided on one side of the transfer chamber 122 , the four process chambers 125 may be arranged in an arrangement of 2 * 2 , and one side of the transfer chamber 122 . In the case where six process chambers 125 are provided, the six process chambers 125 may be arranged in a 3 * 2 arrangement.

Meanwhile, the number of process chambers 125 may increase or decrease. In addition, the process chamber 125 may be provided only on one side of the transfer chamber 122 , or may be provided on one side or both sides of the transfer chamber 122 as a single layer.

A substrate processing apparatus cleans a substrate using a chemical solution. Such a substrate processing apparatus may be provided in the process chamber 125 .

FIG. 2 is a cross-sectional view schematically illustrating an internal structure of a substrate processing apparatus provided in the process chamber of FIG. 1 . The following description refers to FIGS. 1 and 2 .

The substrate processing apparatus 200 may be provided in a plurality of process chambers 125 having the same structure. However, the present embodiment is not limited thereto. The substrate processing apparatus 200 may be provided as having different structures in the plurality of process chambers 125 according to the type of the chemical solution, the type of the process method, and the like.

The plurality of process chambers 125 may be divided into a plurality of groups. In this case, substrate processing apparatuses in process chambers belonging to the same group may have the same structure, and substrate processing apparatuses in process chambers belonging to different groups may have different structures.

For example, when first process chambers belonging to the first group are disposed on one side of the transfer chamber 122 and second process chambers belonging to the second group are disposed on the other side of the transfer chamber 122 , the first process Substrate processing apparatuses in the chambers may have the same structure, and substrate processing apparatuses in the second process chambers may have the same structure. In addition, the substrate processing apparatuses in the first process chambers may have different structures from the substrate processing apparatuses in the second process chambers.

In addition, for example, third process chambers belonging to the third group are disposed on one side and the other side of the transfer chamber 122 on the lower layer, respectively, and the fourth group on the upper layer on the one side and the other side of the transfer chamber 122 , respectively. When the fourth process chambers belonging to , are disposed, substrate processing apparatuses in the third process chambers may have the same structure, and substrate processing apparatuses in the fourth process chambers may have the same structure. In addition, the substrate processing apparatuses in the third process chambers may have different structures from the substrate processing apparatuses in the fourth process chambers.

The substrate processing apparatus 200 may be configured to include, for example, a cup 210 , a support member 220 , a lifting unit 230 , a jetting member 240 , and a controller 250 as shown in FIG. 2 . can

The cup 210 provides a space in which a process for processing the substrate W is performed. The cup 210 may be formed so that its upper portion is open.

The cup 210 may include an internal collection container 211 , an intermediate collection container 212 , and an external collection container 213 . In this case, each of the recovery tubes 211 , 212 , and 213 may recover different treatment liquids from among the treatment liquids used in the process.

The internal recovery container 211 may be provided in an annular ring shape surrounding the support member 220 . In this case, the inner space 214 of the internal recovery container 211 may function as an inlet through which the treatment liquid flows into the internal recovery container 211 .

The intermediate recovery container 212 may be provided in the shape of an annular ring surrounding the inner recovery container 211 . In this case, the space 215 between the internal recovery container 211 and the intermediate recovery container 212 may function as an inlet through which the treatment liquid flows into the intermediate recovery container 212 .

The external collection container 213 may be provided in an annular ring shape surrounding the intermediate collection container 212 . In this case, the space 216 between the intermediate collection container 212 and the external collection container 213 may function as an inlet through which the treatment liquid flows into the external collection container 213 .

Each of the recovery barrels 211 , 212 , and 213 may be connected to recovery lines 217 , 218 , and 219 vertically extending downwardly from the bottom thereof, respectively. Each of the recovery lines 217 , 218 , and 219 may discharge the treatment liquid introduced through each of the recovery troughs 211 , 212 , and 213 to the outside. The treatment liquid discharged to the outside may be treated to be reused through a treatment liquid regeneration system (not shown).

The support member 220 supports the substrate W and rotates the substrate W during the process. The support member 220 may be disposed inside the cup 210 .

The support member 220 may include a body 221 , a support pin 222 , a chuck pin 223 , and a first support shaft 224 .

The body 221 may have an upper surface provided in a generally circular shape when viewed from above. A first support shaft 224 that can be rotated by a motor 225 may be fixedly coupled to the bottom surface of the body 221 .

Meanwhile, a back nozzle 300 may be installed on the upper surface of the body 221 . A more detailed description of the bag nozzle will be described later.

The support pin 222 supports the substrate W on the body 221 . A plurality of such support pins 222 may be provided on the body 221 .

The plurality of support pins 222 may be formed to protrude upward from the upper surface of the body 221 . In addition, the plurality of support pins 222 may be disposed to be spaced apart from each other at a predetermined interval on the edge of the upper surface of the body 221 . The plurality of support pins 222 may be disposed to have an annular ring shape as a whole by a combination with each other, for example. The plurality of support pins 222 may support the rear edge of the substrate W so that the substrate W is spaced a predetermined distance from the upper surface of the body 221 through such a configuration.

The chuck pin 223 supports the side of the substrate W so that the substrate W is not laterally separated from the original position when the support member 220 rotates. A plurality of such chuck pins 223 may be provided on the body 221 like the support pins 222 , and may be formed to protrude upward from the upper surface of the body 221 .

The chuck pin 223 may be disposed farther from the center of the body 221 than the support pin 222 . The chuck pin 223 may be provided to be linearly movable between the standby position and the supporting position along the radial direction of the body 221 . Here, the standby position means a position farther from the center of the body 221 compared to the support position.

The chuck pin 223 may be positioned at a standby position when the substrate W is loaded/unloaded from the support member 220 , and may be positioned at a support position when a process is performed on the substrate W . The chuck pin 223 may be in contact with the side of the substrate W at the supporting position.

The lifting unit 230 linearly moves the cup 210 in the vertical direction. As the cup 210 linearly moves in the vertical direction, the relative height of the cup 210 with respect to the support member 220 may be changed.

The lifting unit 230 may include a bracket 231 , a moving shaft 232 , and a first driver 233 .

The bracket 231 is to be fixedly installed on the outer wall of the cup 210 . The bracket 231 may be coupled to the moving shaft 232 moved in the vertical direction by the first driver 233 .

When the substrate W is placed on or lifted from the support member 220 , the cup 210 may be lowered so that the support member 220 protrudes above the cup 210 . . Also, when the process is in progress, the height of the cup 210 may be adjusted so that the treatment liquid can be introduced into the set collection troughs 211 , 212 , and 213 according to the type of the treatment liquid supplied to the substrate W. .

For example, while the substrate W is treated with the first processing liquid, the substrate W may be positioned at a height corresponding to the inner space 214 of the internal collection container 211 . Also, while the substrate W is treated with the second processing liquid, the substrate W may be positioned at a height corresponding to the space 215 between the internal recovery container 211 and the intermediate recovery container 212 . In addition, while the substrate W is treated with the third processing liquid, the substrate W may be positioned at a height corresponding to the space 216 between the intermediate recovery container 212 and the external recovery container 213 .

Meanwhile, the lifting unit 230 may move the support member 220 in the vertical direction instead of the cup 210 .

The ejection member 240 supplies a processing liquid to the substrate W during a substrate processing process. For this purpose, the spray member 240 may include a nozzle support 241 , a nozzle 242 , a second support shaft 243 , and a second actuator 244 .

One or a plurality of injection members 240 may be provided. When a plurality of spraying members 240 are provided, a chemical solution, a rinse solution, an organic solvent, and the like may be provided through different spraying members 240 . The rinsing liquid may be the first fluid, and the organic solvent may be a mixture of isopropyl alcohol vapor and an inert gas, or an isopropyl alcohol liquid.

The longitudinal direction of the nozzle support 241 may be provided along the second direction 20 . The nozzle support 241 may be coupled to one end of the second support shaft 243 in a direction perpendicular to the longitudinal direction of the second support shaft 243 . The second actuator 244 may be coupled to the other end of the second support shaft 243 .

The nozzle 242 may be installed on the bottom surface of the end of the nozzle support 241 . This nozzle 242 may be moved to the process position and the standby position by the second actuator 244 . Here, the process position refers to a vertically upper area of the support member 220 that allows the nozzle 242 to discharge the processing liquid onto the substrate W, and the standby position refers to a vertically upper area of the support member 220 . The excluded area, that is, an area outside the vertical upper area of the support member 220 .

The second support shaft 243 may be provided in its longitudinal direction along the third direction 30 . The second support shaft 243 may be coupled to the second actuator 244 at the lower end thereof.

The second actuator 244 rotates and elevates the second support shaft 243 . The second driver 244 may be connected to the controller 250 and controlled by the controller 250 .

Meanwhile, in FIG. 2 , the controller 250 is illustrated as being connected to the second driver 244 . However, the present embodiment is not limited thereto. The controller 250 may be connected to the first driver 233 as well as the second driver 244 to control the first driver 233 .

Next, a bag nozzle according to an embodiment of the present invention will be described.

3 is a view showing a coupling of a bag nozzle according to an embodiment of the present invention, and FIG. 4 is an exploded view of the bag nozzle according to an embodiment of the present invention.

3 and 4 , the bag nozzle 300 may include a fixing member 310 , a piping member 320 , a nozzle member 330 , and a fitting member 340 .

The back nozzle 300 sprays a fluid on the bottom surface of the substrate W when cleaning the substrate W. When the back nozzle 300 cleans the substrate W, pure water (eg, de-ionized (DI) water), a chemical solution (eg, high-temperature chemical), etc. It can be sprayed on the bottom. On the other hand, when the back nozzle 300 dries the substrate (W), it is also possible to inject N2 gas to the bottom surface of the substrate (W).

The fixing member 310 is fixed on the body 221 of the support member 220 . The fixing member 310 may have a hole penetrating through the top and bottom so that the pipe member 320 may be inserted thereinto. The piping member 320 inserted through the hole of the fixing member 310 may be coupled to the nozzle member 330 and the fitting member 340 .

The fixing member 310 may be formed to have a variable width. The fixing member 310 may be formed to increase in width in a downward direction, for example.

The piping member 320 may be inserted into the body 221 of the support member 220 through the hole of the fixing member 310 .

Conventionally, the pipe member 320 is fixed to the body 221 of the support member 220 in an interference fit method, and during installation of the bag nozzle 300, abrasion or scratches on the body 221 of the support member 220, etc. There was a problem with this occurring. In addition, if the piping member 320 is not fully inserted into the grooves in the body 221 due to the force fit method, the part exposed to the outside is arbitrarily cut, so the processing surface may become inaccurate and tolerances may occur, which may cause piping There was also a problem that the member 320 is not fixed.

In this embodiment, by inserting the piping member 320 through the fitting member 340 into the body 221 of the support member 220, work convenience can be improved, and the effect of reducing the occurrence of defects and preventing process defects can also be obtained. can

The nozzle member 330 is provided with a hole to spray the fluid flowing in through the pipe member 320 to the bottom surface of the substrate. The nozzle member 330 may be formed to cover an upper portion of the piping member 320 inserted into the body 221 of the support member 220 . The nozzle member 330 may be formed of, for example, a nozzle tip.

The nozzle member 330 may be formed to have a step difference as shown in FIG. 5 in order to efficiently seal the upper portion of the pipe member 320 . 5 is a cross-sectional view of a nozzle member constituting a bag nozzle according to an embodiment of the present invention.

Referring to FIG. 5 , the nozzle member 330 may include a first part 331 , a second part 332 , and a third part 333 .

The first portion 331 is an upper end (head) portion, is formed wider than the second portion 332 and the third portion 333 , and serves to cover the opened portion of the upper portion of the piping member 320 .

The second portion 332 is an intermediate (body) portion, and may be formed to have a step difference. In FIG. 5 , the second part 332 is formed to have two steps, but the present embodiment is not limited thereto. The second portion 332 may be formed to have one step, or to have three or more steps.

The third portion 333 is a lower (tail) portion, and may be formed to have a variable width. The third portion 333 may be formed to decrease in width downward.

Meanwhile, a hole 334 may be formed inside the nozzle member 330 to allow a fluid to pass therethrough.

It will be described again with reference to FIGS. 3 and 4 .

The fitting member 340 fixes the piping member 320 . The fitting member 340 may be disposed inside the fixing member 310 for this purpose. The fitting member 340 may be formed of, for example, a ferrule made of Teflon.

When a cleaning process is performed in the substrate processing apparatus 200 , a high-temperature chemical may be repeatedly discharged several times through the piping member 320 . At this time, deformation due to high-temperature heat and shrinkage due to cold air when not in use may repeatedly appear, so that the height of the bag nozzle 300 is changed and the shape of the discharge part is changed unevenly and goes up to cause process defects. In this case, unreasonableness due to rework such as replacement of the piping member 320 may occur.

In this embodiment, by inserting the nozzle member 330 into the piping member 320 and fixing the piping member 320 using the fitting member 340 , the discharge portion of the bag nozzle 300 is deformed in height during process use or It is possible to prevent the occurrence of defects that are misaligned in the position.

The fitting member 340 may include a body portion 341 and a hole 342 as shown in FIG. 6 . 6 is a cross-sectional view of a fitting member constituting a bag nozzle according to an embodiment of the present invention.

The body portion 341 may be formed to increase in width in a downward direction. The body portion 341 has a hole 342 having a shape engaged with the second portion 332 of the nozzle member 330 therein so as to be fastened with the second portion 332 of the nozzle member 330 . can be

The fitting member 340 may be manufactured using stainless steel (SUS) as a material. However, the present embodiment is not limited thereto. The fitting member 340 may be manufactured using a material that can minimize thermal change (eg, PFA, PTFE, etc.).

On the other hand, in order to further increase the strength of support for the pipe member 320 , a fastening member coupled to the fixing member 310 may be further included in addition to the fitting member 340 .

7 is a view showing a coupling of a bag nozzle according to another embodiment of the present invention, and FIG. 8 is an exploded view of the bag nozzle according to another embodiment of the present invention.

7 and 8 , the bag nozzle 300 may include a fixing member 310 , a piping member 320 , a nozzle member 330 , a fitting member 340 , and a fastening member 350 . .

Since the piping member 320 , the nozzle member 330 , and the fitting member 340 have been described above, a detailed description thereof will be omitted herein.

The fixing member 310 may include a first portion 311 and a second portion 312 .

The first portion 311 may be formed to have a variable width. The first portion 311 may be formed to increase in width in a downward direction, for example.

The second part 312 is formed under the first part 311 . The second portion 312 may be coupled to the lower portion of the first portion 311 through welding or the like, and may be integrally formed with the first portion 311 .

The fastening member 350 is fastened to the second part 312 of the fixing member 310 . In this embodiment, the fitting member 340 primarily fixes the piping member 320 , and the fastening member 350 fastened to the second portion 312 of the fixing member 310 secondarily fixes the piping member 320 . By fixing it, the effect of further increasing the support strength with respect to the piping member 320 can be acquired.

The fastening member 350 may be coupled to the second portion 312 of the fixing member 310 by having an elastic member (eg, a spring) 351 therein. However, the present embodiment is not limited thereto. A screw thread is formed in any one of the outer side of the second part 312 of the fixing member 310 and the inner side of the fastening member 350, and the other screw thread is formed, so it is also possible to be fastened to each other.

The bag nozzle 300 according to various embodiments of the present invention has been described above with reference to FIGS. 3 to 8 . When a high-temperature chemical is repeatedly used, the pipe member 320 may be deformed due to deformation due to high-temperature heat during discharge and pipe shrinkage due to cold air when not in use, which may increase the defect rate. In addition, problems may occur due to the precision of the pipe production method (extrusion method) and tolerances during tip processing. In addition, since the piping member 320 is installed in an interference fit method, work convenience is reduced, the rate of raw material defects increases, and further process defects may occur.

In the present invention, after the nozzle member 330 is inserted, the piping member 320 may be fixed by the fitting member 340 . That is, the protrusion of the nozzle member 330 and the groove of the fitting member 340 may be mutually fixed. In the present invention, through this, when the high-temperature chemical of the bag nozzle 300 is used, it is possible to prevent the shrinkage of the pipe discharge portion and the rising into the nozzle. In addition, the nozzle member 330 and the fitting member 340 are inserted into the end of the bag nozzle 300 to facilitate the operation, and it is possible to prevent the pipe member 320 from changing the nozzle height and rising inward. That is, in the present invention, by improving the tip portion of the bag nozzle 300, it is possible to obtain the effect of improving work convenience and preventing the occurrence of defects.

Although embodiments of the present invention have been described with reference to the above and the accompanying drawings, those of ordinary skill in the art to which the present invention pertains can practice the present invention in other specific forms without changing its technical spirit or essential features. You can understand that there is Therefore, it should be understood that the embodiments described above are illustrative in all respects and not restrictive.

200: substrate processing device 210: cup
220: support member 221: body
222: support pin 223: chuck pin
224: first support shaft 230: elevating unit
240: injection member 250: controller
300: bag nozzle 310: fixing member
311: first portion of fixing member 312: second portion of fixing member
320: piping member 330: nozzle member
331: first part of nozzle member 332: second part of nozzle member
333: third part of nozzle member 340: fitting member
341: body 342: hole
350: fastening member 351: elastic member

Claims (10)

body;
a plurality of support pins installed on the body and supporting the substrate; and
a bag nozzle installed in the body and supplying a first fluid for processing the substrate to a bottom surface of the substrate;
The bag nozzle is
a piping member providing a path through which the first fluid flows;
a nozzle member sealing an upper portion of the piping member and having a hole for spraying the first fluid to the substrate; and
and a fitting member configured to fix the pipe member and coupled to the nozzle member. The method of claim 1,
The nozzle member is a substrate support member formed to have a step. The method of claim 1,
The nozzle member is
a third portion formed at one end of the body and formed to decrease in width in one direction;
a second portion formed in the center of the body and having a step portion;
a first portion formed at the other end of the body and formed wider than the second portion and the third portion to cover the opening of the piping member; and
and a hole formed through the first to third portions to allow the first fluid to pass therethrough. The method of claim 1,
The fitting member is
a body portion formed to increase in width in one direction; and
The substrate support member including a hole formed inside the body portion and formed to be engaged with the stepped portion of the nozzle member. The method of claim 1,
The fitting member is a substrate support member manufactured by using at least one of SUS, PFA, and PTFE as a material. The method of claim 1,
a fixing member formed to be partially exposed on the support member and including a first portion having a variable width and a second portion formed to have a constant width under the first portion; and
The substrate support member further comprising a fastening member engaged with the second portion in the support member. 7. The method of claim 6,
A substrate support member having an elastic member installed inside the fastening member. The method of claim 1,
The back nozzle is a substrate support member for spraying the first fluid to the substrate when cleaning or drying the substrate. 9. The method of claim 8,
The bag nozzle injects a first fluid of any one of pure water, chemical liquid, and N2 gas to the substrate,
A substrate support member for spraying any one of pure water and a chemical solution to the substrate when cleaning the substrate, and spraying N2 gas to the substrate when drying the substrate. housing;
a substrate support member installed in the housing and supporting a substrate; and
Comprising a spray member for supplying a second fluid for processing the substrate to the upper surface of the substrate,
The substrate support member,
body;
a plurality of support pins installed on the body and supporting the substrate; and
a bag nozzle installed in the body and supplying a first fluid for processing the substrate to a bottom surface of the substrate;
The bag nozzle is
a piping member providing a path through which the first fluid flows;
a nozzle member sealing an upper portion of the piping member and having a hole for spraying the first fluid to the substrate; and
and a fitting member configured to fix the pipe member and coupled to the nozzle member.

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