KR20210132981A - A Test Device Of Semi-Conductor - Google Patents

Abstract

The present invention relates to a semiconductor test device including: a probe unit having an upper opening and provided with a chucking mechanism therein; a test head connected to the probe unit by a connecting member and provided with a TIU on one side to be inserted into the opening; a connecting member connected to the probe unit on one side, connected to the test head on the other side, and operating such that the TIU of the test head can be inserted into the opening; and a latch portion including first latch portions provided at the test head around the TIU and second latch portions provided around the opening of the probe unit and detachably coupled to the first latch portion. The first latch portion has a rotatable latch key having a laterally protruding locking protrusion at the lower end thereof. The second latch portion has a key insertion hole having a locking step where the locking protrusion is caught by the latch key being inserted and rotated. The second latch portion includes a latch member having the key insertion hole and an installation member installed in the upper portion of the probe unit. A connecting screw is fastened to the latch member and the installation member, and the latch member is installed at the probe unit by the medium of the installation member.

Description

Semiconductor test device {A Test Device Of Semi-Conductor}

The present invention relates to a semiconductor test apparatus, and more particularly, to a semiconductor test apparatus in which a test head and a main body (prover) are securely coupled and can be separated even in the event of a power failure.

In manufacturing a semiconductor device, a fabrication process for forming a pattern PATTERN on a wafer WAFER and an assembly process for assembling the patterned wafer into each unit chip are performed. Between the above processes, an EDS (Electric Die Sorting: hereinafter referred to as “EDS”) process for inspecting the electrical characteristics of each unit chip constituting the wafer is performed. The EDS process is performed to discriminate defective chips from among the unit chips constituting the wafer. The EDS process mainly uses an inspection device that applies an electrical signal to chips constituting a wafer and determines a defect based on a signal checked from the applied electrical signal. Such an inspection mainly uses an inspection device including a probe card having a needle to which an electrical signal can be applied in contact with the wafer so as to inspect the electrical state of the chips constituting the wafer. A semiconductor device for which a test result using a probe card is judged to be a good product is manufactured as a finished product by a post-packaging process.

In the electrical characteristic inspection of a semiconductor wafer, a needle of a probe card is usually contacted with an electrode pad of a semiconductor wafer, and a measurement current is passed through the needle to measure the electrical characteristic at that time.

1 is a view showing a conventional semiconductor inspection apparatus 10. As shown in the figure, the probe part 15 provided with the probe card 13 installed so as to be raised/lowered through the support ring 11 therein. ), rotates 180° on the upper side of the probe unit 15 to perform an opening/closing operation, and on its lower surface, a TIU (Test Interface) for performing contact with the pogo fixing unit 13a of the probe card 13 Unit; 21) is composed of the installed test head (20).

The probe card 13 is made of a main circuit board on which a conductor wiring pattern is disposed on an insulating board, and a plurality of conductors are formed on the circuit board, and a pogo fixing part 13a is formed on the bottom surface of the wafer electrode pad (not shown). ), a probe needle for measuring the electrical characteristics at that time is provided by passing a current. A plurality of test pins 21a for applying a voltage or signal to the probe card 13 are disposed on the lower surface of the TIU 21 by contacting the pogo fixing part 13a, and the test pins 21a is arranged in a one-to-one correspondence with the pogo fixing part 13a. A plurality of locking projections 21b are provided on the outer periphery of the TIU 21 at predetermined intervals, and the probe part 15 on which the probe card 13 is installed is engaged with the locking projections 21b to perform a locking operation. A locking means 30 for carrying out is installed.

The locking means 30 is disposed on the upper side where the probe card 13 is installed and a fixing ring 31 provided with a seating portion 31a on which the locking jaw 21b of the TIU 21 is seated; It is rotatably installed on the upper side of the fixing ring 31 and consists of a rotating ring 33 provided with a plurality of fixing jaws 33a in a shape corresponding to the locking jaws 21b therein.

In the conventional semiconductor inspection apparatus 10 configured as described above, first, when a driving signal is output by a control unit (not shown), the driving unit is operated so that the test head 20 is lowered or rotated to a predetermined position and thus the TIU ( 21) is seated on the seating portion 31a of the fixing ring 31 . Then, the rotation ring 33 rotates at a predetermined angle so that the fixing jaw 33a provided on the inner periphery of the rotation ring 33 presses the upper surface side of the locking projection 21b to form a fixed state, and the probe card 13 ) is raised, so that the pogo fixing part 13a of the probe card 13 and the test pin 21a provided at the lower end of the TIU 21 come into contact with each other.

In making contact by the above-described operation, when the thickness d of the locking jaw 21b is not constant and becomes thick, it cannot be smoothly engaged with the fixing jaw 33a of the rotating ring 33 and is prevented from being engaged. There is a problem of being fixed, and even if the force is fixed, the contact force between the test pin 21 and the pogo fixing part 13a is not uniform and the force is concentrated locally, so the contact between the test pin 21a and the pogo fixing part 13a There was a problem that hindered it. In addition, there was a problem in that the horizontal maintenance state of the TIU 21 was not accurately maintained, thereby inhibiting the contact between the test pin 21a and the pogo fixing part 13a. ) and the test head 20 were not separated, so there was a problem that maintenance could not be performed.

Korean Patent Laid-Open No. 10-2003-0094489 Republic of Korea Registration No. 10-0821095 Registration Patent Publication

The present invention has been proposed to solve the problems of the prior art as described above, and it provides a semiconductor test device that can be maintained horizontally, can be separated even during a power outage, and can be firmly coupled without being forced and fixed without shaking. intended to provide

A semiconductor test apparatus according to the present invention includes a probe part having an opening formed at the top and having a chucking mechanism inside, a test head connected to the probe part by a connecting member and having a TIU inserted into the opening on one side, and one side is connected to the probe part and the other end is connected to the test head, a connecting member acting to enable the TIU of the test head to be inserted into the opening, and a plurality of first latch units provided in the test head around the TIU. and a latch part provided around the opening of the probe part and comprising a plurality of second latch parts detachably coupled to the first latch part;

The first latch part is rotatable and includes a latch key having a locking protrusion protruding to the side at a lower end thereof, and a key insertion hole is formed in the second latch part having a locking protrusion through which the latch key is inserted and rotated to catch the locking protrusion. ;

the second latch unit includes a latch member having a key insertion hole formed therein, and an installation member installed on an upper portion of the probe unit; The latch member and the installation member are fastened with a connecting screw, and the latch member is installed in the probe unit via the installation member.

In the above, the installation member is provided on both sides of the latch member, a plurality of screw guide holes penetrated laterally are formed in the latch member, and a plurality of connection screw holes penetrated laterally and into which a connection screw is inserted are formed in the installation member. ; The connection screw is sequentially inserted into and fastened into the connection screw hole of the one side installation member, the screw guide hole of the latch member, and the connection screw hole of the other side installation member.

In the above, the screw guide hole is formed in the form of a long hole in the vertical direction, and the connecting screw is inserted into the screw guide hole to be slidable in the vertical direction in the screw guide hole; A plurality of buffer springs pressed between the probe part and the latch member are provided at a lower portion of the latch member and spaced apart from each other in the longitudinal direction of the latch member.

In the above, the installation member is formed with an installation hole penetrating up and down; A fixing screw is coupled to the probe portion through the installation hole, and the installation member is installed in the probe portion.

In the above, the fixing member concave portion is formed concavely on the upper portion of the first latch portion, an extended concave portion is formed concavely from the fixing member concave portion, and a through hole communicating with the extended concave portion is formed. A member, a moving member provided in a space formed between the test plate and the fixing member recess and having a through hole penetrating in the vertical direction, and a recess extending downward of the movable member to press between the movable member and the fixing member and a latch spring which is;

the latch key sequentially passes through the plate latch hole formed in the test plate, the through hole of the moving member, and the through hole of the fixing member, and the locking protrusion is exposed to the lower part of the fixing member; The latch key is coupled to the moving member and moves up and down together with the moving member.

In the above, the thickness of the body portion, which is the plate-shaped portion of the movable member, is smaller than the depth of the fixing member concave portion, so that the movable member is movable up and down in a space formed by the fixing member concave portion and the lower surface of the test plate;

A plate first hole connected between the movable member and the lower surface of the test plate is formed, and a plate second hole connected between the movable member and the upper surface of the fixing member concave portion is formed, and air is supplied to the plate first hole and the plate second hole so that the moving member is It is characterized in that it operates up and down.

In the above, the upper portion of the test plate includes a driving unit, a driving member connected to the driving unit to reciprocate by the operation of the driving unit, and an operating member coupled to the latch key and having one side operated by the driving member to rotate the latch key, ; A long hole-shaped driving member groove is formed in the driving member, and the operating member is provided with an operating member pin spaced apart from the latch key and slidably inserted into the driving member groove, and operates with the latch key by reciprocating motion of the driving member. The member is characterized in that it rotates integrally with the latch key as a rotation center.

In the above, the test plate as a lower portion of the driving member is formed with a notification pin hole penetrating in the vertical direction, the lower portion of the driving member is formed with a concave driving member concave portion having a driving member inclined portion on one side; The notification pin ball is provided with a notification pin that is pressed upward by the notification pin spring to be slidably inserted in the vertical direction; When the notification pin is located in the concave portion of the driving member, it moves upward by the pressing of the notification pin spring, and is pressed downward by the driving member inclined portion due to the movement of the driving member, so that the lower end protrudes to the lower part of the test plate.

The semiconductor test device according to the present invention can keep the latch unit horizontally, can be separated even during a power failure, has a solid locking state, and can be easily separated because the latch member and the installation member are separated by loosening the connecting screw exposed to the side. It is possible, and a notification pin is provided so that the locking state can be directly checked with the naked eye.

1 is a view showing a conventional semiconductor inspection apparatus,
2 is a side view showing a semiconductor test apparatus according to the present invention,
3 is a perspective view showing a part of a test head and a probe part of the semiconductor test apparatus according to the present invention;
4 is a perspective view showing a state in which the test head and the probe unit are overlapped;
Figure 5 is a cross-sectional perspective view in the diagonal direction of Figure 4,
6 is an enlarged view of part "A" of FIG. 5,
7 is an enlarged view of part "A" of FIG. 5, showing the locking state of the latch key;
8 is an enlarged view of part "A" of FIG. 5, showing the unlockable state of the latch key;
9 is an exploded perspective view of a second latch unit;
10 is a perspective view showing a longitudinal direction and a transverse cross-section together for explaining the second latch unit;
11 is a cross-sectional perspective view taken along line AA of FIG. 4 .

Hereinafter, a semiconductor test apparatus according to the present invention will be described in detail with reference to the accompanying drawings.

2 is a side view showing a semiconductor test apparatus according to the present invention, FIG. 3 is a perspective view showing a part of a test head and a probe part of the semiconductor test apparatus according to the present invention, and FIG. 4 is a state in which the test head and the probe part are overlapped is a perspective view showing a, FIG. 5 is a cross-sectional perspective view in the diagonal direction of FIG. 4, FIG. 6 is an enlarged view of part "A" of FIG. 5, and FIG. 7 is an enlarged view of part "A" of FIG. It shows a locked state, and FIG. 8 is an enlarged view of part "A" of FIG. 5, showing a unlockable state of the latch key, FIG. 9 is an exploded perspective view of the second latch part, and FIG. 10 is the second latch For the purpose of explaining the part, it is a perspective view showing longitudinal and transverse cross-sections together, and FIG. 11 is a cross-sectional perspective view taken along line AA of FIG. 4 .

Hereinafter, as shown in FIG. 4 , when the test plate 113 and the probe deck 123 face each other, the facing direction is referred to as “inward or inward”, and the opposite direction is referred to as “outward or outward”.

2 and 3 , the semiconductor test apparatus 100 according to the present invention includes a probe unit 120 , a test head 110 , a connection member 130 , a wafer supply unit 160 , including a latch part.

The probe part 120 includes a probe body 121 , a probe deck 123 , and a chucking mechanism 125 .

The probe body 121 has an opening formed at an upper portion thereof.

A chucking mechanism 125 is provided inside the opening of the probe body 121 . The chucking mechanism 125 is installed to enable lifting and lowering of the wafer at the opening. The chucking mechanism 125 serves to press the wafer in the direction of the probe card (not shown). The probe card is provided between the probe part 120 and the test head 110, and the illustration thereof is omitted.

The probe deck 123 is provided above the probe body 121 , that is, inside the probe body 121 . The probe deck 123 is provided in the shape of a plate in which a hole penetrating in the vertical direction is formed at a position where the chucking mechanism 125 is provided. A support ring part 1231 is formed in the hole of the probe tech 123 by forming a chin facing inward along the edge. The support ring part 1231 is a position where the wafer supplied through the wafer supply part 160 is seated.

The test head 110 is connected to the probe unit 120 by a connecting member 130 . The test head 110 includes a head body 111 , a test plate 113 , and a TIU 115 .

The head body 111 is provided with an index motor (not shown) for rotating the latch key unit 146 of the latch unit forward and reverse.

The test plate 113 is provided inside the head body 111 when the test head 110 and the probe part 120 face each other. A TIU 115 inserted into the opening of the probe part 120 is provided inside the test plate 113 . The TIU 115 is provided to protrude inside the test plate 113 and is in contact with the probe card.

One side of the connection member 130 is connected to the probe unit 120 , and the other side is connected to the test head 110 . The connection member 130 serves to allow the TIU 115 of the test head 110 to be inserted into the opening of the probe unit 120 .

The wafer supply unit 160 is provided on one side of the probe unit 120 . A plurality of wafers are provided in the wafer supply unit 160 to supply wafers to the opening of the probe unit 120 .

As shown in FIG. 3 , the latch unit includes a plurality of first latch units 140 provided on the test plate 113 around the TIU 115 of the test head 110 , and the probe unit 120 . It consists of a plurality of second latch parts 150 provided in the probe tech 123 around the opening. The first latch unit 140 and the second latch unit 150 are provided in the test head 110 and the probe unit 120, respectively, and are detachably coupled to each other.

The first latch unit 140 may be provided around the opening of the probe unit 120 , and the second latch unit 140 may be provided around the TIU 115 .

The first latch unit 140 is coupled to the test plate 113 of the test head 110 . A plate latch hole 1135 penetrating in the vertical direction is formed in the test plate 113 at a position where the latch key 146 of the first latch unit 140 is installed.

The first latch unit 140 includes a fixing member 149, a moving member 147, a latch spring 142, a latch key 146, a driving unit 141, a driving member 143, It consists of an operation member 145 and a notification pin 148 . A fixing member 149, a moving member 147 and a latch spring 142 are provided under the test plate 113, and the latch key 146 is provided through the test plate 113, and the test plate ( A driving unit 141 , a driving member 143 , an operating member 145 and a notification pin 148 are provided on the upper portion of the 113 .

The fixing member 149 is provided on the lower surface of the test plate 113 . The fixing member 149 is provided in the form of a plate having a thickness, and is provided with a plurality of spaced apart from each other. A fixing member concave portion 1492 concave is formed in the upper portion of the fixing member 149 , and an extension concave portion 1491 concavely extending from the fixing member concave portion 1492 at the center of the fixing member concave portion 1492 . is formed A through hole communicating with the extended concave portion 1491 is formed in the fixing member 149 .

The moving member 147 is provided in a plate shape having a thickness. The moving member 147 is provided in a space formed between the lower surface of the test plate 113 and the fixing member concave portion 1492 . A concave groove is formed on a side surface of the movable member 147 to provide an O-ring 144 . The moving member 147 is provided with an O-ring 144 on the side and in close contact with the fixing member concave portion 1492 .

The moving member 147 is formed with a through hole penetrating in the vertical direction. The through hole formed in the moving member 147 is formed to communicate with the through hole formed in the extended concave portion 1491 of the fixing member 149 and the plate latch hole 1135 formed in the test plate 113 . A concave moving member groove 1475) is formed in a lower portion of the moving member 147 .

The movable member 147 is further provided with a cylindrical movable member guide 1473 extending upwardly upward. An expanded hollow portion into which the moving member guide 1473 is slidably inserted is formed in the lower portion of the plate latch hole 1135 . The moving member guide portion 1473 is provided by being inserted into the expanded hollow formed in the lower portion of the plate latch hole 1135 .

The latch spring 142 is installed in the extended concave portion 1491 of the fixing member 149 as a lower portion of the moving member 147 . The latch spring 142 is pressurized between the moving member 147 and the fixing member 149 .

The latch key 146 is provided in the form of a rod extending in the vertical direction. The latch key 146 includes a plate latch hole 1135 formed in the test plate 113 , a moving member guide 1473 , a through hole of the moving member 147 , and an extended recessed portion ( It passes through the through-holes formed in 1491 in turn and protrudes to the lower part of the fixing member 149 . The latch key 146 is rotatable in the plate latch hole 1135 , the movable member guide portion 1473 , the through hole of the movable member 147 and the through hole formed in the extended concave portion 1491 of the fixing member 149 . is provided

A locking protrusion 1461 is provided under the latch key 146 . The locking protrusion 1461 is formed to protrude to the side of the latch key 146 .

A laterally concave groove is formed in the latch key 146 , and a base plate 1471 is further coupled to the groove. The latch key 146 is coupled to the moving member 147 by the base plate 1471 to move up and down together with the moving member 147 .

The base plate 1471 is provided in the form of a plate-shaped ring with a part opened. The base plate 1471 is provided as, for example, a snap ring. The base plate 1471 has a concave groove formed on the side surface of the latch key 146 to be inserted into the groove of the latch key 146 .

The base plate 1471 is provided with a base plate 1471 fitted with a latch key 146 inserted into the moving member groove 1475 concavely formed in the lower portion of the moving member 147 . The base plate 1471 may be provided with an interference fit inserted into the movable member groove 1475 . An adhesive may be placed between the base plate 1471 and the moving member groove 1475 so that the base plate 1471 may be adhesively coupled to the moving member 147 .

The movable member 147 is provided with a thickness of the main body, which is a plate-shaped portion, smaller than the depth of the fixing member concave portion 1492 . The movable member 147 is movable up and down in the space formed by the fixing member recessed part 1492 and the lower surface of the test plate 113 because the thickness of the main body is smaller than the depth of the fixing member recessed part 1492 .

The test plate 113 has a plate first hole 1131 connected between the test plate 113 and the upper surface of the fixing member 149 , and a second plate connected between the moving member 147 and the lower surface of the test plate 113 . A ball 1133 is formed.

The fixing member 149 is further formed with a fixing member connection hole 1493 connected between the movable member 147 and the top surface of the fixing member concave portion 1492 from the top surface of the fixing member 147 . The plate first hole 1131 communicates with the fixing member connection hole 1493 and is connected between the movable member 147 and the upper surface of the fixing member concave portion 1492 . The plate first hole 1131 and the plate second hole 1133 are provided with a pressure connector 113a for supplying compressed air is coupled.

The moving member 147 is supplied with air to the first plate hole 1131 and the second plate hole 1133, and operates vertically.

When the latch key 146 is coupled to the second latch unit 150, air is supplied to the plate first hole 1131 connected between the upper surface of the moving member 147 and the fixing member concave portion 1492 to move. When the member 147 is pressed upward, the movable member 147 is upwardly pressed by the latch spring 142 and air, so that the locking protrusion 1461 of the latch key 146 is inserted into the key of the second latch unit 150 . The first latch unit 140 and the second latch unit 150 are firmly coupled to each other by being in close contact with the jaw of the ball 1511 with great force.

When air is supplied to the plate second hole 1133 connected between the movable member 147 and the lower surface of the test plate 113 and the movable member 147 is pressed down, the latch spring 142 is further pressed by air pressure. Compressed, the latch key 146 moves downward together with the moving member 147, and the locking protrusion 1461 of the latch key 146 is spaced apart from the jaw of the key insertion hole 1511 of the second latch unit 150, become rotatable.

3 to 5 , a driving unit 141 , a driving member 143 , and an operation member 145 are provided on the upper portion of the test plate 113 . The upper portion of the test plate 113 is provided with a hollow operating unit cover 1401 that opens downward, and the driving unit 141 , the driving member 143 , and the operating member 145 are disposed within the operating unit cover 1401 . Located.

The driving unit 141 is provided as a cylinder. The driving unit 141 is fixedly provided on the test plate 113 . The driving unit 141 is provided with a cylinder terminal 1411 for adjusting the hydraulic pressure to expand and contract the cylinder rod of the driving unit (141).

The driving member 143 is provided in the form of a rod. The driving member 143 is formed with a driving member installation portion 1435 extending in the longitudinal direction and penetrating in the vertical direction. The driving unit 141 is installed on the driving member installation unit 1435 , and a cylinder rod serving as the driving unit 141 is coupled to the upper surface of the driving member 143 . The driving member 143 is provided with driving member guides 1405 at both ends, and is connected to the cylinder rod of the driving unit 141 to reciprocate by the operation of the driving unit 141 .

The driving member 143 is formed with a long hole-shaped driving member groove 1431 extending in the width direction of the driving member 143 at both ends of the driving member 143 in the longitudinal direction, and one driving member groove 1431 and the driving member installation part 1435 are formed. A driving member guide groove 1433 extending in the longitudinal direction of the driving member 143 is further formed therebetween.

A locking pin 1403 fixed to the test plate 113 is provided in the driving member guide groove 1433 . The locking pin 1403 serves to guide the driving member 143 not to move over a certain range by the driving unit 141 .

The operation member 145 is provided in a plate shape. The operation member 145 is coupled to the upper end of the latch key 146 , and is provided with an operation member pin 1451 spaced apart from the latch key 146 and protruding downwardly to the lower portion of the operation member 145 . The operation member pin 1451 is slidably inserted into the driving member groove 1431 . The operation member 145 is coupled to the latch key 146 , and one side thereof is operated by the driving member 143 to rotate the latch key 146 . Due to the reciprocating motion of the driving member 143 , the latch key 146 and the operation member 145 rotate integrally with the latch key 146 as a rotation center.

11, the test plate 113 is further formed with a notification pin hole 1137 penetrating the lower portion of the driving member 143 in the vertical direction. A concave driving member concave portion 1436 having a driving member inclined portion 1437 on one side is formed at a lower portion of the driving member 143 .

The notification pin hole 1137 is provided with a notification pin 148 extending in the vertical direction. The notification pin 148 is inserted into the notification pin spring 1481 to be slidably inserted in the notification pin hole 1137 in the vertical direction. The notification pin 148 is provided by being pressed upward by the notification pin spring 1481 . The notification pin 148 moves upward by the pressure of the notification pin spring 1481 when the driving member 143 moves and is positioned at the position where the driving member recess 1435 is formed, and by the movement of the driving member 143 . It is pressed downward by the driving member inclined part 1437 and the lower end protrudes to the lower part of the test plate 113 .

That is, when the first latch part 140 and the second latch part 150 are coupled, the lower end of the notification pin 148 protrudes to the lower part of the test plate 113 due to the movement of the driving member 143 , and vice versa, the first When the latch unit 140 and the second latch unit 150 are disconnected from each other, the notification pin 148 is exposed as the driving member concave unit 1436 . Accordingly, the coupling state of the first latch unit 140 and the second latch unit 150 may be known according to whether the notification pin 148 is exposed.

The second latch unit 150 is coupled to the probe deck 123 of the probe unit 120 . The second latch unit 150 is installed on the probe deck 123 . The second latch unit 150 is provided in plurality, and is provided at a position corresponding to the first latch unit 140 . A concave deck concave portion 1233 is formed on the upper surface of the proof portion deck 123 , and a second latch portion 150 is positioned in the deck concave portion 1233 .

9 and 10 , the second latch unit 150 includes a latch member 151 , an installation member 153 , and a connection screw 155 .

The latch member 151 is provided in a bar shape. A key insertion hole 1511 penetrating in the vertical direction is formed in the latch member 151 . The key insertion hole 1511 is formed in the form of a long hole. The key insertion hole 1511 is formed to have a locking jaw on which the latch key 146 is inserted and rotated to engage the locking protrusion 1461 . When the latch key 146 is coupled to the key insertion hole 1511, the latch key 146 is inserted into the key insertion hole 1511 with the locking projection 1461 coincident with the long axis of the key insertion hole 1511. After being inserted, the locking projection 1461 is engaged with the locking jaw of the key insertion hole 1511 by rotating it.

A screw guide hole 1513 penetrating laterally is formed in the latch member 151 . The screw guide hole 1531 is formed in the form of a long hole extending vertically. A plurality of the screw guide holes 1513 are formed to be spaced apart from each other in the longitudinal direction of the latch member 151 .

The installation member 153 is provided in the form of a rod. The installation member 153 is provided on both sides of the latch member 151 . The installation member 153 is formed with a plurality of connection screw holes 1533 penetrated laterally. The connection screw holes 1533 are formed to be spaced apart from each other in the longitudinal direction of the installation member 153 . The connection screw hole 1533 is formed in communication with the screw guide hole 1513 .

In the latch member 151 and the installation member 153 , the connection screw 155 includes a connection screw hole 1533 of the installation member 153 on one side, a screw guide hole 1513 of the latch member 151 and the installation on the other side. It is sequentially inserted into the connection screw hole 1533 of the member 153 and is fastened. The latch member 151 is installed on the probe part 120 via the installation member 153 to which the connection screw 155 is fastened.

The screw guide hole 1513 is formed in the form of a long hole in the vertical direction. The connecting screw 155 is inserted into the screw guide hole 1513 to be slidably provided in the screw guide hole 1513 in the vertical direction. That is, in a state in which the installation member 153 is fixed, the latch member 151 is provided to be slidable in the vertical direction.

A concave spring groove 1515 is formed in the lower portion of the latch member 151 , and a buffer spring 159 is inserted into the spring groove 1515 . The buffer spring 159 is compressed by being pressed between the latch member 151 and the upper surface of the probe deck 123 . A plurality of the buffer springs 159 are provided to be spaced apart from each other in the longitudinal direction of the latch member 151 . When the buffer spring 159 is provided so that the latch key 146 is inserted into the key insertion hole 1511, the buffer spring 159 presses the latch member 151 upward to engage the first latch unit 140 and the first latch unit 140. 2 The latch unit 150 serves to be firmly coupled.

The installation member 153 has an installation hole 1531 penetrating vertically, and the probe deck 123 has a concave coupling screw hole 1235 formed at a position where the installation hole 1531 is formed. The installation hole 1531 and the coupling screw hole 1235 are formed in communication. A coupling screw 152 having threads formed on the inner and outer diameters is fastened to the coupling screw hole 1235 . The installation member 153 is fixedly installed by screwing a fixing screw 157 to the inner diameter of the coupling screw 152 through the installation hole 1531 and being coupled to the probe deck 123 .

At an outer end of the latch member 151, a pressing screw hole 1517 penetrating in the vertical direction is formed. A pressure screw 154 is fastened to the pressure screw hole 1517 and provided. The pressure screw 154 serves to prevent the latch member 151 from being deflected.

Looking at the installation sequence of the second latch unit 150, after fastening the coupling screw 152 to the coupling screw hole 1235 of the probe deck 123, the spring groove 1515 of the latch member 151. The installation member 153 is positioned on both sides of the latch member 151 with the buffer spring 159 inserted therein. Then, the fixing screw 147 is inserted into the installation hole 153 and fastened to the coupling screw 152 , and the installation member 153 is fixed to the probe deck 123 .

After the fixing screw 147 is fastened, the connection screw 155 passing through the installation member 153 and the latch member 151 is fastened to closely couple the installation member 153 and the latch member 151 . After the installation member 153 and the latch member 151 are coupled, when the latch member 151 is deflected, the pressing screw 154 is tightened to prevent the latch member 151 from being deflected.

So far, the semiconductor test apparatus according to the present invention has been described with reference to the embodiment shown in the drawings, but this is only exemplary, and it will be understood by those skilled in the art that various modifications and equivalent other embodiments are possible therefrom. Accordingly, the true technical protection scope should be determined by the technical spirit of the appended claims.

100: semiconductor test device
110: test head 120: probe part
130: connecting member 140: first latch part
150: second latch unit 160: wafer supply unit

Claims (8)

A probe part 120 having an opening formed in the upper part and having a chucking mechanism 125 on the inside, and a TIU 115 connected to the probe part 120 by a connection member 130 and inserted into the opening on one side. The provided test head 110, one end of which is connected to the probe unit 120 and the other end is connected to the test head 110, so that the TIU 115 of the test head 110 can be inserted into the opening. A plurality of first latch units 140 provided in the test head 110 and a plurality of first latch units 140 provided in the test head 110 around the TIU 115 and the openings of the probe unit 120 are provided around the opening of the first a latch unit comprising a plurality of second latch units 150 detachably coupled to the latch unit 140;
The first latch unit 140 is rotatable and includes a latch key 146 having a locking protrusion 1461 protruding laterally at a lower end thereof, and the latch key 146 is provided at the second latch unit 150 . is inserted and rotated to form a key insertion hole 1511 having a locking jaw on which the locking protrusion 1461 is caught;
The second latch unit 150 includes a latch member 151 having a key insertion hole 1511 formed therein, and an installation member 153 installed on the probe unit 120 ; The latch member (151) and the installation member (153) are fastened with a connection screw (155), and the latch member (151) is installed on the probe unit (120) via the installation member (153). (100). The installation member according to claim 1, wherein the installation member (153) is provided on both sides of the latch member (151), and a plurality of screw guide holes (1513) penetrating laterally are formed in the latch member (151). A plurality of connection screw holes 1533 are formed in the 153, which are laterally penetrated and into which the connection screws 155 are inserted; The connection screw 155 is sequentially connected to the connection screw hole 1533 of the one side installation member 153 , the screw guide hole 1513 of the latch member 151 , and the connection screw hole 1533 of the other side installation member 153 . The semiconductor test apparatus 100, characterized in that it is inserted and fastened. According to claim 1, wherein the screw guide hole (1513) is formed in the form of a long hole in the vertical direction, the connection screw (155) is inserted into the screw guide hole (1513) in the vertical direction within the screw guide hole (1513) slidable; A semiconductor test, characterized in that a plurality of buffer springs 159 pressed between the probe part 120 and the latch member 151 are provided at a lower portion of the latch member 151 spaced apart from each other in the longitudinal direction of the latch member 151 device 100 . According to claim 3, wherein the installation member (153) is formed with an installation hole (1531) penetrating up and down; A semiconductor test apparatus (100), characterized in that a fixing screw (157) is coupled to the probe part (120) through the installation hole (1531), and the installation member (153) is installed in the probe part (120). 4. The method of claim 3, wherein the first latch unit (140) has a fixing member concave portion (1492) concavely formed at an upper portion and a concave portion (1491) extending concavely from the fixing member concave portion (1492). A through hole communicating with the extended concave portion 1491 is formed and the fixing member 149 provided on the lower surface of the test plate 113 of the test head 110, and between the test plate 113 and the fixing member concave portion 1492 A moving member 147 provided in a space formed in the upper and lower direction and having a through hole penetrating in the vertical direction, and installed in a recess 1491 extending to the lower portion of the moving member 147, the moving member 147 and the fixing member 149 a latch spring 142 pressed therebetween;
The latch key 146 sequentially passes through the plate latch hole 1135 formed in the test plate 113, the through hole of the moving member 147, and the through hole of the fixing member 149, and the locking projection 1461 is exposed to the lower part of the fixing member 149; The latch key (146) is coupled to the moving member (147) and moves up and down together with the moving member (147). The method according to claim 5, wherein the thickness of the body portion, which is a plate-shaped portion of the movable member (147), is smaller than the depth of the fixing member concave portion (1492), so that the movable member (147) is formed between the fixing member concave portion (1492) and the test plate ( 113) is movable up and down in the space formed by the lower surface;
A plate second hole 1133 connected between the moving member 147 and the lower surface of the test plate 113 is formed, and a plate first hole 1131 connected between the moving member 147 and the upper surface of the fixing member concave portion 1492 . ) is formed, and air is supplied to the plate first hole 1131 and the plate second hole 1133 so that the moving member 147 moves up and down. 7. The method of claim 6, wherein the upper portion of the test plate (113) includes a driving unit (141), a driving member (143) connected to the driving unit (141) and reciprocating by the operation of the driving unit (141), and a latch key (146). ) coupled to and one side is operated by the driving member 143 to include an operating member 145 for rotating the latch key 146; A long hole-shaped driving member groove 1431 is formed in the driving member 143 , and the operating member 145 is spaced apart from the latch key 146 and slidably inserted into the driving member groove 1431 . A semiconductor test apparatus ( characterized in that a pin 1451 is provided and the latch key 146 and the operation member 145 rotate integrally with the latch key 146 as a rotation center by the reciprocating motion of the driving member 143 ) 100). According to claim 7, wherein the test plate 113 as a lower portion of the driving member 143, a notification pin hole 1137 penetrating in the vertical direction is formed, and the driving member inclined part ( A concave drive member recess 1436 having 1437 is formed; The notification pin hole 1137 has a notification pin 148 that is pressed upward by the notification pin spring 1481 is provided to be slidably inserted in the vertical direction; When the notification pin 148 is located in the driving member concave portion 1436, it moves upward by the pressing of the notification pin spring 1481, and is pressed downward by the driving member inclined portion 1437 by the movement of the driving member 143 to the lower end. The semiconductor test apparatus (100), characterized in that protruding from the lower part of the test plate (113).

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